MT8LSDT864HG-662B3 by Micron Technology | Memory ICs

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Manufacturer	Micron Technology
Manufacturer's Part Number	MT8LSDT864HG-662B3
Description	SYNCHRONOUS DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: DIMM; Refresh Cycles: 4096; Package Shape: RECTANGULAR;
Datasheet	MT8LSDT864HG-662B3 Datasheet
In Stock	1,344

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.024 Amp
Organization:	8MX64
Output Characteristics:	3-STATE
Maximum Time At Peak Reflow Temperature (s):	NOT SPECIFIED
Maximum Seated Height:	26.67 mm
Sub-Category:	DRAMs
Surface Mount:	NO
Maximum Supply Current:	1360 mA
No. of Terminals:	144
Maximum Clock Frequency (fCLK):	100 MHz
No. of Words:	8388608 words
Terminal Position:	DUAL
Package Style (Meter):	MICROELECTRONIC ASSEMBLY
Technology:	CMOS
JESD-30 Code:	R-PDMA-N144
Package Shape:	RECTANGULAR
Terminal Form:	NO LEAD
Maximum Operating Temperature:	70 Cel
Package Code:	DIMM
Input/Output Type:	COMMON
Memory Density:	536870912 bit
Memory IC Type:	SYNCHRONOUS DRAM MODULE
Minimum Operating Temperature:	0 Cel
Memory Width:	64
Qualification:	Not Qualified
Package Equivalence Code:	DIMM144,32
Refresh Cycles:	4096
Maximum Access Time:	7 ns
No. of Words Code:	8M
Nominal Supply Voltage / Vsup (V):	3.3
Peak Reflow Temperature (C):	NOT SPECIFIED
Terminal Pitch:	.8 mm
Temperature Grade:	COMMERCIAL
Power Supplies (V):	3.3

Pricing (USD)

Qty.	Unit Price	Ext. Price
1,344	-	-

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