Samsung - M312L2923FH3-B30

M312L2923FH3-B30 by Samsung

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Manufacturer Samsung
Manufacturer's Part Number M312L2923FH3-B30
Description DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 184; Package Code: DIMM; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.3 V;
Datasheet M312L2923FH3-B30 Datasheet
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
Organization: 128MX72
Maximum Seated Height: 28.725 mm
Access Mode: DUAL BANK PAGE BURST
Minimum Supply Voltage (Vsup): 2.3 V
Surface Mount: NO
No. of Terminals: 184
No. of Words: 134217728 words
Terminal Position: DUAL
Package Style (Meter): MICROELECTRONIC ASSEMBLY
Technology: CMOS
JESD-30 Code: R-XDMA-N184
Package Shape: RECTANGULAR
Terminal Form: NO LEAD
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: DIMM
Width: 3.99 mm
No. of Ports: 1
Memory Density: 9663676416 bit
Self Refresh: YES
Memory IC Type: DDR DRAM MODULE
Minimum Operating Temperature: 0 Cel
Memory Width: 72
No. of Functions: 1
Length: 133.35 mm
Maximum Access Time: .7 ns
No. of Words Code: 128M
Nominal Supply Voltage / Vsup (V): 2.5
Additional Features: AUTO/SELF REFRESH; WD-MAX
Terminal Pitch: 1.27 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 2.7 V
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