Xilinx - XC2VP50-5FFG1152C

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XC2VP50-5FFG1152C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC2VP50-5FFG1152C
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;
Datasheet XC2VP50-5FFG1152C Datasheet
In Stock120
NAME DESCRIPTION
Minimum Supply Voltage: 1.425 V
Package Body Material: Plastic/Epoxy
Organization: 5904 CLBS
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 0.36 ns
Maximum Seated Height: 3.4 mm
No. of Inputs: 852
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 852
Position Of Terminal: Bottom
No. of Terminals: 1152
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B1152
Maximum Clock Frequency: 1050 MHz
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: BGA
Width: 35 mm
Moisture Sensitivity Level (MSL): 4
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.575 V
Nominal Supply Voltage (V): 1.5
Technology Used: CMOS
No. of Logic Cells: 53136
No. of CLBs: 5904
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Package Equivalence Code: BGA1152,34X34,40
Finishing Of Terminal Used: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Length: 35 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 245 °C (473 °F)
Power Supplies (V): 1.5,1.5/3.3,2/2.5,2.5 V
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Pricing (USD)

Qty. Unit Price Ext. Price
120 $105.000 $12,600.000

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