Part | RoHS | Manufacturer | Amplifier Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Nominal Unity Gain Bandwidth | Maximum Negative Supply Voltage Limit | Low-Bias | Maximum Input Offset Voltage | Maximum Average Bias Current (IIB) | Surface Mount | No. of Functions | Minimum Common Mode Reject Ratio | Technology | Screening Level | Nominal Common Mode Reject Ratio | Maximum Supply Current | Nominal Negative Supply Voltage (Vsup) | Architecture | Programmable Power | Packing Method | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Slew Rate | Sub-Category | Nominal Slow Rate | Maximum Supply Voltage Limit | Terminal Pitch | Maximum Operating Temperature | Maximum Bias Current (IIB) @25C | Frequency Compensation | Minimum Voltage Gain | Minimum Operating Temperature | Terminal Finish | Terminal Position | Low-Offset | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Minimum Output Current | Nominal Bandwidth (3dB) | Micropower | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Wideband | Power |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
24 |
TSSOP |
Rectangular |
Plastic/Epoxy |
20 mV |
50 nA |
Yes |
6 |
CMOS |
Tape And Reel, 7 inch |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
Buffer Amplifiers |
7 V/us |
7 V |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G24 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e0 |
240 °C (464 °F) |
0.307 in (7.8 mm) |
||||||||||||||||||||||||||
Texas Instruments |
Buffer |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
25 mV |
300 nA |
Yes |
8 |
6.5 mA |
Rails |
14.5 V |
Small Outline |
SOP24,.4 |
1.7 V/us |
16 V |
0.05 in (1.27 mm) |
85 °C (185 °F) |
300 nA |
-40 °C (-40 °F) |
Dual |
R-PDSO-G24 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
150 mA |
0.606 in (15.4 mm) |
||||||||||||||||||||||||||||||
Texas Instruments |
Buffer |
Industrial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
25 mV |
300 nA |
Yes |
8 |
6.5 mA |
14.5 V |
Small Outline |
0.85 V/us |
16 V |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Dual |
R-PDSO-G24 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
150 mA |
0.606 in (15.4 mm) |
|||||||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
24 |
TSSOP |
Rectangular |
Plastic/Epoxy |
20 mV |
50 nA |
Yes |
6 |
CMOS |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
Buffer Amplifiers |
7 V/us |
7 V |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G24 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.307 in (7.8 mm) |
|||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
24 |
TSSOP |
Rectangular |
Plastic/Epoxy |
20 mV |
50 nA |
Yes |
6 |
CMOS |
Tape And Reel, 7 inch |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
Buffer Amplifiers |
7 V/us |
7 V |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G24 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.307 in (7.8 mm) |
||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
24 |
TSSOP |
Rectangular |
Plastic/Epoxy |
20 mV |
50 nA |
Yes |
6 |
CMOS |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
Buffer Amplifiers |
7 V/us |
7 V |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G24 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
0.307 in (7.8 mm) |
|||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
24 |
TSSOP |
Rectangular |
Plastic/Epoxy |
20 mV |
50 nA |
Yes |
6 |
CMOS |
Tape And Reel |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
7 V/us |
7 V |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G24 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
260 °C (500 °F) |
0.307 in (7.8 mm) |
||||||||||||||||||||||||||
|
Renesas Electronics |
Buffer |
Industrial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
-9 V |
15 mV |
50 nA |
Yes |
10 |
CMOS |
2.1 mA |
-5 V |
5 V |
5/±5/15 V |
Small Outline |
TSSOP24,.25 |
0.9 V/us |
Buffer Amplifiers |
9 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
50 nA |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G24 |
3 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
2.5 MHz |
e3 |
30 s |
260 °C (500 °F) |
0.307 in (7.8 mm) |
||||||||||||||||||
|
Renesas Electronics |
Buffer |
Industrial |
Gull Wing |
24 |
HTSSOP |
Rectangular |
Plastic/Epoxy |
14 mV |
50 nA |
Yes |
8 |
CMOS |
15 V |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
Buffer Amplifiers |
15 V/us |
18 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G24 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
12 MHz |
e3 |
0.307 in (7.8 mm) |
||||||||||||||||||||||||||||
Renesas Electronics |
Buffer |
Industrial |
Gull Wing |
24 |
HTSSOP |
Rectangular |
Plastic/Epoxy |
14 mV |
50 nA |
Yes |
8 |
CMOS |
15 V |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
Buffer Amplifiers |
15 V/us |
18 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Dual |
R-PDSO-G24 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
12 MHz |
0.307 in (7.8 mm) |
|||||||||||||||||||||||||||||||
Renesas Electronics |
Buffer |
Industrial |
No Lead |
24 |
HVQCCN |
Rectangular |
-9 V |
15 mV |
50 nA |
Yes |
1 |
CMOS |
2 mA |
-5 V |
Tape And Reel |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC24,.16X.2,20 |
0.9 V/us |
Buffer Amplifiers |
2.2 V/us |
9 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
50 nA |
-40 °C (-40 °F) |
Quad |
R-XQCC-N24 |
0.039 in (1 mm) |
0.157 in (4 mm) |
2.5 MHz |
0.197 in (5 mm) |
|||||||||||||||||||||||||
|
Renesas Electronics |
Buffer |
Industrial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
-9 V |
15 mV |
50 nA |
Yes |
10 |
CMOS |
2.1 mA |
-5 V |
5 V |
5/±5/15 V |
Small Outline |
TSSOP24,.25 |
0.9 V/us |
Buffer Amplifiers |
9 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
50 nA |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G24 |
3 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
2.5 MHz |
e3 |
30 s |
260 °C (500 °F) |
0.307 in (7.8 mm) |
||||||||||||||||||
|
Renesas Electronics |
Buffer |
Industrial |
Gull Wing |
24 |
HTSSOP |
Rectangular |
Plastic/Epoxy |
14 mV |
50 nA |
Yes |
8 |
CMOS |
15 V |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
Buffer Amplifiers |
15 V/us |
18 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G24 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
12 MHz |
e3 |
0.307 in (7.8 mm) |
||||||||||||||||||||||||||||
Renesas Electronics |
Buffer |
Industrial |
No Lead |
24 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
-9 V |
12 mV |
50 nA |
Yes |
8 |
CMOS |
-5 V |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
Buffer Amplifiers |
15 V/us |
9 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Quad |
R-PQCC-N24 |
0.039 in (1 mm) |
0.157 in (4 mm) |
12 MHz |
0.197 in (5 mm) |
|||||||||||||||||||||||||||||
|
Renesas Electronics |
Buffer |
Industrial |
No Lead |
24 |
HVQCCN |
Rectangular |
-9 V |
15 mV |
50 nA |
Yes |
1 |
CMOS |
1.4 mA |
-5 V |
Tape And Reel |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC24,.16X.2,20 |
0.9 V/us |
Buffer Amplifiers |
2.2 V/us |
9 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
50 nA |
-40 °C (-40 °F) |
Matte Tin |
Quad |
R-XQCC-N24 |
0.039 in (1 mm) |
0.157 in (4 mm) |
2.5 MHz |
e3 |
0.197 in (5 mm) |
||||||||||||||||||||||
Renesas Electronics |
Buffer |
Industrial |
No Lead |
24 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
-9 V |
12 mV |
50 nA |
Yes |
10 |
CMOS |
-5 V |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
Buffer Amplifiers |
15 V/us |
9 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Quad |
R-PQCC-N24 |
0.039 in (1 mm) |
0.157 in (4 mm) |
12 MHz |
0.197 in (5 mm) |
|||||||||||||||||||||||||||||
Renesas Electronics |
Buffer |
Industrial |
No Lead |
24 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
-9 V |
12 mV |
50 nA |
Yes |
10 |
CMOS |
-5 V |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
Buffer Amplifiers |
15 V/us |
9 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Quad |
R-PQCC-N24 |
0.039 in (1 mm) |
0.157 in (4 mm) |
12 MHz |
0.197 in (5 mm) |
|||||||||||||||||||||||||||||
|
Renesas Electronics |
Buffer |
Industrial |
Gull Wing |
24 |
HTSSOP |
Rectangular |
Plastic/Epoxy |
14 mV |
50 nA |
Yes |
8 |
CMOS |
15 V |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
Buffer Amplifiers |
15 V/us |
18 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G24 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
12 MHz |
e3 |
0.307 in (7.8 mm) |
||||||||||||||||||||||||||||
Renesas Electronics |
Buffer |
Industrial |
No Lead |
24 |
HVQCCN |
Rectangular |
-9 V |
15 mV |
50 nA |
Yes |
1 |
CMOS |
1.4 mA |
-5 V |
Tape And Reel |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC24,.16X.2,20 |
0.9 V/us |
Buffer Amplifiers |
2.2 V/us |
9 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
50 nA |
-40 °C (-40 °F) |
Quad |
R-XQCC-N24 |
0.039 in (1 mm) |
0.157 in (4 mm) |
2.5 MHz |
0.197 in (5 mm) |
|||||||||||||||||||||||||
|
Renesas Electronics |
Buffer |
Industrial |
Gull Wing |
24 |
HTSSOP |
Rectangular |
Plastic/Epoxy |
14 mV |
50 nA |
Yes |
8 |
CMOS |
15 V |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
Buffer Amplifiers |
15 V/us |
18 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G24 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
12 MHz |
e3 |
0.307 in (7.8 mm) |
||||||||||||||||||||||||||||
Renesas Electronics |
Buffer |
Industrial |
Gull Wing |
24 |
TSSOP |
Rectangular |
Plastic/Epoxy |
-9 V |
12 mV |
50 nA |
Yes |
10 |
CMOS |
-5 V |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
Buffer Amplifiers |
15 V/us |
9 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Dual |
R-PDSO-G24 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
12 MHz |
0.307 in (7.8 mm) |
|||||||||||||||||||||||||||||
Renesas Electronics |
Buffer |
Industrial |
Gull Wing |
24 |
TSSOP |
Rectangular |
Plastic/Epoxy |
-9 V |
15 mV |
50 nA |
Yes |
1 |
CMOS |
2 mA |
-5 V |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP24,.25 |
0.9 V/us |
Buffer Amplifiers |
2.2 V/us |
9 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
50 nA |
-40 °C (-40 °F) |
Dual |
R-PDSO-G24 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
2.5 MHz |
0.307 in (7.8 mm) |
|||||||||||||||||||||||||
Renesas Electronics |
Buffer |
Industrial |
Gull Wing |
24 |
HTSSOP |
Rectangular |
Plastic/Epoxy |
14 mV |
50 nA |
Yes |
8 |
CMOS |
15 V |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
Buffer Amplifiers |
15 V/us |
18 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Dual |
R-PDSO-G24 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
12 MHz |
0.307 in (7.8 mm) |
|||||||||||||||||||||||||||||||
Renesas Electronics |
Buffer |
Industrial |
No Lead |
24 |
HVQCCN |
Rectangular |
-9 V |
15 mV |
50 nA |
Yes |
1 |
CMOS |
1.4 mA |
-5 V |
Tape And Reel |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC24,.16X.2,20 |
0.9 V/us |
Buffer Amplifiers |
2.2 V/us |
9 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
50 nA |
-40 °C (-40 °F) |
Quad |
R-XQCC-N24 |
0.039 in (1 mm) |
0.157 in (4 mm) |
2.5 MHz |
0.197 in (5 mm) |
|||||||||||||||||||||||||
Renesas Electronics |
Buffer |
Industrial |
No Lead |
24 |
HVQCCN |
Rectangular |
-9 V |
15 mV |
50 nA |
Yes |
1 |
CMOS |
2 mA |
-5 V |
Tape And Reel |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC24,.16X.2,20 |
0.9 V/us |
Buffer Amplifiers |
2.2 V/us |
9 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
50 nA |
-40 °C (-40 °F) |
Quad |
R-XQCC-N24 |
0.039 in (1 mm) |
0.157 in (4 mm) |
2.5 MHz |
0.197 in (5 mm) |
|||||||||||||||||||||||||
|
Renesas Electronics |
Buffer |
Industrial |
No Lead |
24 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
14 mV |
50 nA |
Yes |
8 |
CMOS |
15 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
Buffer Amplifiers |
15 V/us |
18 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
R-PQCC-N24 |
0.039 in (1 mm) |
0.157 in (4 mm) |
12 MHz |
e3 |
0.197 in (5 mm) |
||||||||||||||||||||||||||||
Renesas Electronics |
Buffer |
Industrial |
No Lead |
24 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
-9 V |
12 mV |
50 nA |
Yes |
10 |
CMOS |
-5 V |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
Buffer Amplifiers |
15 V/us |
9 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Quad |
R-PQCC-N24 |
0.039 in (1 mm) |
0.157 in (4 mm) |
12 MHz |
0.197 in (5 mm) |
|||||||||||||||||||||||||||||
|
Renesas Electronics |
Buffer |
Industrial |
Gull Wing |
24 |
HTSSOP |
Rectangular |
Plastic/Epoxy |
14 mV |
50 nA |
Yes |
8 |
CMOS |
15 V |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
Buffer Amplifiers |
15 V/us |
18 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G24 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
12 MHz |
e3 |
0.307 in (7.8 mm) |
||||||||||||||||||||||||||||
|
Renesas Electronics |
Buffer |
Industrial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
-9 V |
15 mV |
50 nA |
Yes |
10 |
CMOS |
2.1 mA |
-5 V |
5 V |
5/±5/15 V |
Small Outline |
TSSOP24,.25 |
0.9 V/us |
Buffer Amplifiers |
9 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
50 nA |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G24 |
3 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
2.5 MHz |
e3 |
30 s |
260 °C (500 °F) |
0.307 in (7.8 mm) |
||||||||||||||||||
Renesas Electronics |
Buffer |
Industrial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
-9 V |
15 mV |
50 nA |
Yes |
10 |
CMOS |
2.1 mA |
-5 V |
5 V |
5/±5/15 V |
Small Outline |
TSSOP24,.25 |
0.9 V/us |
Buffer Amplifiers |
2.2 V/us |
9 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
50 nA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G24 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
2.5 MHz |
e0 |
0.307 in (7.8 mm) |
||||||||||||||||||||
Renesas Electronics |
Buffer |
Industrial |
No Lead |
24 |
HVQCCN |
Rectangular |
-9 V |
15 mV |
50 nA |
Yes |
1 |
CMOS |
1.4 mA |
-5 V |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC24,.16X.2,20 |
0.9 V/us |
Buffer Amplifiers |
2.2 V/us |
9 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
50 nA |
-40 °C (-40 °F) |
Quad |
R-XQCC-N24 |
0.039 in (1 mm) |
0.157 in (4 mm) |
2.5 MHz |
0.197 in (5 mm) |
||||||||||||||||||||||||||
|
Renesas Electronics |
Buffer |
Industrial |
No Lead |
24 |
HVQCCN |
Rectangular |
-9 V |
15 mV |
50 nA |
Yes |
1 |
CMOS |
1.4 mA |
-5 V |
Tape And Reel |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC24,.16X.2,20 |
0.9 V/us |
Buffer Amplifiers |
2.2 V/us |
9 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
50 nA |
-40 °C (-40 °F) |
Matte Tin |
Quad |
R-XQCC-N24 |
0.039 in (1 mm) |
0.157 in (4 mm) |
2.5 MHz |
e3 |
0.197 in (5 mm) |
||||||||||||||||||||||
|
Renesas Electronics |
Buffer |
Industrial |
No Lead |
24 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
-9 V |
12 mV |
50 nA |
Yes |
8 |
CMOS |
-5 V |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
Buffer Amplifiers |
15 V/us |
9 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
R-PQCC-N24 |
0.039 in (1 mm) |
0.157 in (4 mm) |
12 MHz |
e3 |
0.197 in (5 mm) |
||||||||||||||||||||||||||
|
Renesas Electronics |
Buffer |
Industrial |
No Lead |
24 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
-9 V |
12 mV |
50 nA |
Yes |
10 |
CMOS |
-5 V |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
Buffer Amplifiers |
15 V/us |
9 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
R-PQCC-N24 |
0.039 in (1 mm) |
0.157 in (4 mm) |
12 MHz |
e3 |
0.197 in (5 mm) |
||||||||||||||||||||||||||
|
Renesas Electronics |
Buffer |
Industrial |
No Lead |
24 |
HVQCCN |
Rectangular |
-9 V |
15 mV |
50 nA |
Yes |
1 |
CMOS |
1.4 mA |
-5 V |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC24,.16X.2,20 |
0.9 V/us |
Buffer Amplifiers |
2.2 V/us |
9 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
50 nA |
-40 °C (-40 °F) |
Matte Tin |
Quad |
R-XQCC-N24 |
0.039 in (1 mm) |
0.157 in (4 mm) |
2.5 MHz |
e3 |
0.197 in (5 mm) |
|||||||||||||||||||||||
Renesas Electronics |
Buffer |
Industrial |
Gull Wing |
24 |
HTSSOP |
Rectangular |
Plastic/Epoxy |
14 mV |
50 nA |
Yes |
8 |
CMOS |
15 V |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
Buffer Amplifiers |
15 V/us |
18 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Dual |
R-PDSO-G24 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
12 MHz |
0.307 in (7.8 mm) |
|||||||||||||||||||||||||||||||
|
Renesas Electronics |
Buffer |
Industrial |
No Lead |
24 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
-9 V |
12 mV |
50 nA |
Yes |
10 |
CMOS |
-5 V |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
Buffer Amplifiers |
15 V/us |
9 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
R-PQCC-N24 |
0.039 in (1 mm) |
0.157 in (4 mm) |
12 MHz |
e3 |
0.197 in (5 mm) |
||||||||||||||||||||||||||
|
Renesas Electronics |
Buffer |
Industrial |
No Lead |
24 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
-9 V |
12 mV |
50 nA |
Yes |
10 |
CMOS |
-5 V |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
Buffer Amplifiers |
15 V/us |
9 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
R-PQCC-N24 |
0.039 in (1 mm) |
0.157 in (4 mm) |
12 MHz |
e3 |
0.197 in (5 mm) |
||||||||||||||||||||||||||
Renesas Electronics |
Buffer |
Industrial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
-9 V |
15 mV |
50 nA |
Yes |
10 |
CMOS |
2.1 mA |
-5 V |
5 V |
5/±5/15 V |
Small Outline |
TSSOP24,.25 |
0.9 V/us |
Buffer Amplifiers |
2.2 V/us |
9 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
50 nA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G24 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
2.5 MHz |
e0 |
0.307 in (7.8 mm) |
||||||||||||||||||||
|
Renesas Electronics |
Buffer |
Industrial |
No Lead |
24 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
-9 V |
12 mV |
50 nA |
Yes |
8 |
CMOS |
-5 V |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
Buffer Amplifiers |
15 V/us |
9 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
R-PQCC-N24 |
0.039 in (1 mm) |
0.157 in (4 mm) |
12 MHz |
e3 |
0.197 in (5 mm) |
||||||||||||||||||||||||||
|
Renesas Electronics |
Buffer |
Industrial |
No Lead |
24 |
HVQCCN |
Rectangular |
-9 V |
15 mV |
50 nA |
Yes |
1 |
CMOS |
2 mA |
-5 V |
Tape And Reel |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC24,.16X.2,20 |
0.9 V/us |
Buffer Amplifiers |
2.2 V/us |
9 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
50 nA |
-40 °C (-40 °F) |
Matte Tin |
Quad |
R-XQCC-N24 |
0.039 in (1 mm) |
0.157 in (4 mm) |
2.5 MHz |
e3 |
0.197 in (5 mm) |
||||||||||||||||||||||
Renesas Electronics |
Buffer |
Industrial |
Gull Wing |
24 |
TSSOP |
Rectangular |
Plastic/Epoxy |
-9 V |
12 mV |
50 nA |
Yes |
10 |
CMOS |
-5 V |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
Buffer Amplifiers |
15 V/us |
9 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Dual |
R-PDSO-G24 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
12 MHz |
0.307 in (7.8 mm) |
|||||||||||||||||||||||||||||
|
Renesas Electronics |
Buffer |
Industrial |
Gull Wing |
24 |
HTSSOP |
Rectangular |
Plastic/Epoxy |
14 mV |
50 nA |
Yes |
8 |
CMOS |
15 V |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
Buffer Amplifiers |
15 V/us |
18 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Dual |
R-PDSO-G24 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
12 MHz |
0.307 in (7.8 mm) |
||||||||||||||||||||||||||||||
|
Renesas Electronics |
Buffer |
Industrial |
No Lead |
24 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
-9 V |
12 mV |
50 nA |
Yes |
8 |
CMOS |
-5 V |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
Buffer Amplifiers |
15 V/us |
9 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
R-PQCC-N24 |
0.039 in (1 mm) |
0.157 in (4 mm) |
12 MHz |
e3 |
0.197 in (5 mm) |
||||||||||||||||||||||||||
|
Renesas Electronics |
Buffer |
Industrial |
No Lead |
24 |
HVQCCN |
Rectangular |
-9 V |
15 mV |
50 nA |
Yes |
1 |
CMOS |
2 mA |
-5 V |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC24,.16X.2,20 |
0.9 V/us |
Buffer Amplifiers |
2.2 V/us |
9 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
50 nA |
-40 °C (-40 °F) |
Matte Tin |
Quad |
R-XQCC-N24 |
0.039 in (1 mm) |
0.157 in (4 mm) |
2.5 MHz |
e3 |
0.197 in (5 mm) |
|||||||||||||||||||||||
|
Renesas Electronics |
Buffer |
Industrial |
Gull Wing |
24 |
TSSOP |
Rectangular |
Plastic/Epoxy |
-9 V |
12 mV |
50 nA |
Yes |
10 |
CMOS |
-5 V |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
Buffer Amplifiers |
15 V/us |
9 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G24 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
12 MHz |
e3 |
0.307 in (7.8 mm) |
||||||||||||||||||||||||||
|
Renesas Electronics |
Buffer |
Industrial |
No Lead |
24 |
HVQCCN |
Rectangular |
-9 V |
15 mV |
50 nA |
Yes |
1 |
CMOS |
2 mA |
-5 V |
Tape And Reel |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC24,.16X.2,20 |
0.9 V/us |
Buffer Amplifiers |
2.2 V/us |
9 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
50 nA |
-40 °C (-40 °F) |
Matte Tin |
Quad |
R-XQCC-N24 |
0.039 in (1 mm) |
0.157 in (4 mm) |
2.5 MHz |
e3 |
0.197 in (5 mm) |
||||||||||||||||||||||
Renesas Electronics |
Buffer |
Industrial |
No Lead |
24 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
-9 V |
12 mV |
50 nA |
Yes |
8 |
CMOS |
-5 V |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
Buffer Amplifiers |
15 V/us |
9 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Quad |
R-PQCC-N24 |
0.039 in (1 mm) |
0.157 in (4 mm) |
12 MHz |
0.197 in (5 mm) |
Buffer amplifiers are electronic circuits that are designed to provide a high input impedance and a low output impedance. They are used to isolate one part of a circuit from another, preventing changes in one part of the circuit from affecting the other.
The primary function of a buffer amplifier is to prevent loading effects, which occur when a device with a low input impedance is connected to a device with a high output impedance. In this scenario, the high output impedance of the first device may cause a decrease in signal strength or distortion in the second device.
By using a buffer amplifier, the high output impedance of the first device is isolated from the second device, ensuring that the signal is transferred with minimal distortion. The buffer amplifier acts as a bridge between the two devices, allowing them to operate independently.
Buffer amplifiers are commonly used in audio applications, such as preamplifiers, where they can be used to isolate a sensitive input signal from a power amplifier that requires a low impedance input. They are also used in other applications, such as instrumentation, signal conditioning, and data acquisition, where signal integrity is critical.