Part | RoHS | Manufacturer | Amplifier Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Nominal Unity Gain Bandwidth | Maximum Negative Supply Voltage Limit | Low-Bias | Maximum Input Offset Voltage | Maximum Average Bias Current (IIB) | Surface Mount | No. of Functions | Minimum Common Mode Reject Ratio | Technology | Screening Level | Nominal Common Mode Reject Ratio | Maximum Supply Current | Nominal Negative Supply Voltage (Vsup) | Architecture | Programmable Power | Packing Method | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Slew Rate | Sub-Category | Nominal Slow Rate | Maximum Supply Voltage Limit | Terminal Pitch | Maximum Operating Temperature | Maximum Bias Current (IIB) @25C | Frequency Compensation | Minimum Voltage Gain | Minimum Operating Temperature | Terminal Finish | Terminal Position | Low-Offset | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Minimum Output Current | Nominal Bandwidth (3dB) | Micropower | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Wideband | Power |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Maxim Integrated |
Buffer |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
10 uA |
Yes |
1 |
Bipolar |
7.4 mA |
3 V |
3/5 V |
Small Outline, Low Profile, Shrink Pitch |
TSOP6,.11,37 |
Buffer Amplifiers |
7 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G6 |
1 |
0.057 in (1.45 mm) |
0.064 in (1.625 mm) |
No |
e0 |
0.114 in (2.9 mm) |
|||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
10 uA |
Yes |
1 |
Bipolar |
7.4 mA |
3 V |
3/5 V |
Small Outline, Low Profile, Shrink Pitch |
TSOP6,.11,37 |
Buffer Amplifiers |
7 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G6 |
1 |
0.057 in (1.45 mm) |
0.064 in (1.625 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.114 in (2.9 mm) |
||||||||||||||||||||||||
|
Texas Instruments |
Buffer |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
280 MHz |
-6.5 V |
2.5 mV |
Yes |
1 |
Bipolar |
5.1 mA |
-5 V |
Tape And Reel |
5 V |
Small Outline, Low Profile, Shrink Pitch |
Buffer Amplifiers |
2100 V/us |
6.5 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
45 uA |
-40 °C (-40 °F) |
Nickel PalladiumGold |
Dual |
R-PDSO-G6 |
2 |
0.057 in (1.45 mm) |
0.063 in (1.6 mm) |
No |
10 A |
280 MHz |
e4 |
30 s |
260 °C (500 °F) |
0.114 in (2.9 mm) |
||||||||||||||||||
|
Texas Instruments |
Buffer |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
-6.5 V |
2 mV |
Yes |
1 |
Bipolar |
13 mA |
-5 V |
Tape And Reel |
5 V |
Small Outline, Low Profile, Shrink Pitch |
Buffer Amplifiers |
2500 V/us |
6.5 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
45 uA |
-40 °C (-40 °F) |
Nickel PalladiumGold |
Dual |
R-PDSO-G6 |
2 |
0.057 in (1.45 mm) |
0.063 in (1.6 mm) |
No |
70 A |
e4 |
30 s |
260 °C (500 °F) |
0.114 in (2.9 mm) |
||||||||||||||||||||
|
Texas Instruments |
Buffer |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
280 MHz |
-6.5 V |
2.5 mV |
Yes |
1 |
Bipolar |
5.1 mA |
-5 V |
Tape And Reel |
5 V |
Small Outline, Low Profile, Shrink Pitch |
Buffer Amplifiers |
2100 V/us |
6.5 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
45 uA |
-40 °C (-40 °F) |
Nickel PalladiumGold |
Dual |
R-PDSO-G6 |
2 |
0.057 in (1.45 mm) |
0.063 in (1.6 mm) |
No |
10 A |
280 MHz |
e4 |
30 s |
260 °C (500 °F) |
0.114 in (2.9 mm) |
||||||||||||||||||
Maxim Integrated |
Buffer |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
10 uA |
Yes |
1 |
Bipolar |
7.4 mA |
3 V |
3/5 V |
Small Outline, Low Profile, Shrink Pitch |
TSOP6,.11,37 |
Buffer Amplifiers |
7 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G6 |
1 |
0.057 in (1.45 mm) |
0.064 in (1.625 mm) |
No |
e0 |
0.114 in (2.9 mm) |
|||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
10 uA |
Yes |
1 |
Bipolar |
7.4 mA |
3 V |
3/5 V |
Small Outline, Low Profile, Shrink Pitch |
TSOP6,.11,37 |
Buffer Amplifiers |
7 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G6 |
1 |
0.057 in (1.45 mm) |
0.064 in (1.625 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.114 in (2.9 mm) |
||||||||||||||||||||||||
|
Texas Instruments |
Buffer |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
-6.5 V |
2 mV |
Yes |
1 |
Bipolar |
13 mA |
-5 V |
Tape And Reel |
5 V |
Small Outline, Low Profile, Shrink Pitch |
Buffer Amplifiers |
2500 V/us |
6.5 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
45 uA |
-40 °C (-40 °F) |
Nickel PalladiumGold |
Dual |
R-PDSO-G6 |
2 |
0.057 in (1.45 mm) |
0.063 in (1.6 mm) |
No |
70 A |
e4 |
30 s |
260 °C (500 °F) |
0.114 in (2.9 mm) |
||||||||||||||||||||
|
Texas Instruments |
Buffer |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
280 MHz |
-6.5 V |
2.5 mV |
Yes |
1 |
Bipolar |
5.1 mA |
-5 V |
Tape And Reel |
5 V |
Small Outline, Low Profile, Shrink Pitch |
Buffer Amplifiers |
2100 V/us |
6.5 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
45 uA |
-40 °C (-40 °F) |
Nickel PalladiumGold |
Dual |
R-PDSO-G6 |
2 |
0.057 in (1.45 mm) |
0.063 in (1.6 mm) |
No |
10 A |
280 MHz |
e4 |
30 s |
260 °C (500 °F) |
0.114 in (2.9 mm) |
||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
No Lead |
6 |
HVSON |
Square |
Plastic/Epoxy |
41 mV |
Yes |
1 |
1.8 mA |
15 V |
15 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
SOLCC6,.06,20 |
Buffer Amplifiers |
415 V/us |
18 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Nickel PalladiumGold |
Dual |
S-PDSO-N6 |
1 |
0.024 in (0.6 mm) |
0.063 in (1.6 mm) |
No |
400 MHz |
e4 |
30 s |
260 °C (500 °F) |
0.063 in (1.6 mm) |
|||||||||||||||||||||||
Texas Instruments |
Buffer |
Gull Wing |
6 |
TSSOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
520 μA |
Tape And Reel |
2.8 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP6,.08 |
18 V/us |
3.6 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Dual |
R-PDSO-G6 |
0.043 in (1.1 mm) |
0.049 in (1.25 mm) |
50 μA |
0.079 in (2 mm) |
|||||||||||||||||||||||||||||||||
Texas Instruments |
Buffer |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
-6.5 V |
7.5 mV |
Yes |
1 |
Bipolar |
6.6 mA |
-5 V |
5 V |
±5 V |
Small Outline, Low Profile, Shrink Pitch |
TSOP6,.11,37 |
570 V/us |
Buffer Amplifiers |
2100 V/us |
6.5 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G6 |
0.057 in (1.45 mm) |
0.063 in (1.6 mm) |
No |
80 mA |
220 MHz |
e0 |
0.114 in (2.9 mm) |
||||||||||||||||||||||
Texas Instruments |
Buffer |
Gull Wing |
6 |
TSSOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
520 μA |
Tape And Reel |
2.8 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP6,.08 |
18 V/us |
3.6 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Dual |
R-PDSO-G6 |
0.043 in (1.1 mm) |
0.049 in (1.25 mm) |
50 μA |
0.079 in (2 mm) |
|||||||||||||||||||||||||||||||||
Texas Instruments |
Buffer |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
-6.5 V |
7.5 mV |
Yes |
1 |
Bipolar |
6.6 mA |
-5 V |
5 V |
±5 V |
Small Outline, Low Profile, Shrink Pitch |
TSOP6,.11,37 |
570 V/us |
Buffer Amplifiers |
2100 V/us |
6.5 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G6 |
0.057 in (1.45 mm) |
0.063 in (1.6 mm) |
No |
80 mA |
220 MHz |
e0 |
0.114 in (2.9 mm) |
||||||||||||||||||||||
Analog Devices |
Buffer |
Industrial |
No Lead |
6 |
DIE |
Rectangular |
-18 V |
1 mV |
5 uA |
Yes |
1 |
Bipolar |
8.5 mA |
-15 V |
15 V |
±5/±15 V |
Uncased Chip |
DIE OR CHIP |
2000 V/us |
Buffer Amplifiers |
3000 V/us |
18 V |
85 °C (185 °F) |
5 uA |
-40 °C (-40 °F) |
Tin Lead |
Upper |
R-XUUC-N6 |
No |
110 MHz |
e0 |
||||||||||||||||||||||||||
Analog Devices |
Buffer |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
10 mV |
800 nA |
Yes |
2 |
BICMOS |
1 mA |
4.5 V |
4.5/16 V |
Small Outline, Low Profile, Shrink Pitch |
TSOP6,.11,37 |
4 V/us |
Buffer Amplifiers |
6 V/us |
18 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
600 nA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G6 |
0.057 in (1.45 mm) |
0.065 in (1.65 mm) |
No |
6 MHz |
e0 |
0.114 in (2.9 mm) |
|||||||||||||||||||||||
Analog Devices |
Buffer |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
10 mV |
800 nA |
Yes |
2 |
BICMOS |
1 mA |
4.5 V |
4.5/16 V |
Small Outline, Low Profile, Shrink Pitch |
TSOP6,.11,37 |
4 V/us |
Buffer Amplifiers |
6 V/us |
18 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
600 nA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G6 |
0.057 in (1.45 mm) |
0.063 in (1.6 mm) |
No |
6 MHz |
e0 |
0.114 in (2.9 mm) |
|||||||||||||||||||||||
Analog Devices |
Buffer |
No Lead |
6 |
DIE |
Rectangular |
-18 V |
15 mV |
Yes |
1 |
FET |
25 mA |
-15 V |
15 V |
Uncased Chip |
180 V/us |
18 V |
Tin Lead |
Upper |
R-XUUC-N6 |
No |
e0 |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
No Lead |
6 |
HVSON |
Square |
Plastic/Epoxy |
41 mV |
Yes |
1 |
1.8 mA |
Tape And Reel |
15 V |
15 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
SOLCC6,.06,20 |
Buffer Amplifiers |
415 V/us |
18 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Dual |
S-PDSO-N6 |
0.024 in (0.6 mm) |
0.063 in (1.6 mm) |
No |
400 MHz |
0.063 in (1.6 mm) |
|||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
No Lead |
6 |
HVSON |
Square |
Plastic/Epoxy |
41 mV |
Yes |
1 |
1.8 mA |
Tape And Reel |
15 V |
15 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
SOLCC6,.06,20 |
Buffer Amplifiers |
415 V/us |
18 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Nickel PalladiumGold |
Dual |
S-PDSO-N6 |
1 |
0.024 in (0.6 mm) |
0.063 in (1.6 mm) |
No |
400 MHz |
e4 |
30 s |
260 °C (500 °F) |
0.063 in (1.6 mm) |
||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
No Lead |
6 |
DIE |
Rectangular |
41 mV |
Yes |
1 |
1.8 mA |
15 V |
Uncased Chip |
DIE OR CHIP |
415 V/us |
18 V |
85 °C (185 °F) |
-40 °C (-40 °F) |
Upper |
R-XUUC-N6 |
0.019 in (0.4826 mm) |
0.018 in (0.46 mm) |
182 MHz |
0.021 in (0.525 mm) |
|||||||||||||||||||||||||||||||||
Analog Devices |
Buffer |
No Lead |
6 |
DIE |
Rectangular |
-18 V |
6 mV |
Yes |
1 |
FET |
25 mA |
-15 V |
15 V |
Uncased Chip |
220 V/us |
18 V |
Tin Lead |
Upper |
R-XUUC-N6 |
No |
e0 |
||||||||||||||||||||||||||||||||||||
Analog Devices |
Buffer |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
10 mV |
800 nA |
Yes |
2 |
BICMOS |
1 mA |
Tape And Reel, 7 inch |
4.5 V |
4.5/16 V |
Small Outline, Low Profile, Shrink Pitch |
TSOP6,.11,37 |
4 V/us |
Buffer Amplifiers |
6 V/us |
18 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
600 nA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G6 |
0.057 in (1.45 mm) |
0.063 in (1.6 mm) |
No |
6 MHz |
e0 |
0.114 in (2.9 mm) |
||||||||||||||||||||||
Analog Devices |
Buffer |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
10 mV |
800 nA |
Yes |
2 |
BICMOS |
1 mA |
Tape And Reel |
4.5 V |
4.5/16 V |
Small Outline, Low Profile, Shrink Pitch |
TSOP6,.11,37 |
4 V/us |
Buffer Amplifiers |
6 V/us |
18 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
600 nA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G6 |
0.057 in (1.45 mm) |
0.063 in (1.6 mm) |
No |
6 MHz |
e0 |
0.114 in (2.9 mm) |
||||||||||||||||||||||
Analog Devices |
Buffer |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
Small Outline, Low Profile, Shrink Pitch |
Buffer Amplifiers |
0.037 in (0.95 mm) |
Tin Lead |
Dual |
R-PDSO-G6 |
1 |
0.057 in (1.45 mm) |
0.064 in (1.625 mm) |
No |
e0 |
0.114 in (2.9 mm) |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
0 V |
12 mV |
35 uA |
Yes |
1 |
0 V |
3 V |
Small Outline, Low Profile, Shrink Pitch |
350 V/us |
6.5 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G6 |
1 |
0.057 in (1.45 mm) |
0.064 in (1.625 mm) |
No |
106 mA |
150 MHz |
e3 |
30 s |
260 °C (500 °F) |
0.114 in (2.9 mm) |
|||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
No Lead |
6 |
VSON |
Square |
35 uA |
Yes |
1 |
BICMOS |
5 V |
Small Outline, Very Thin Profile |
275 V/us |
6 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
Dual |
S-XDSO-N6 |
1 |
0.031 in (0.8 mm) |
0.079 in (2 mm) |
No |
40 mA |
45 MHz |
e4 |
0.079 in (2 mm) |
||||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
7.4 mA |
3 V |
Small Outline, Low Profile, Shrink Pitch |
TSOP6,.11,37 |
Buffer Amplifiers |
7 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
10 uA |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G6 |
1 |
0.057 in (1.45 mm) |
0.064 in (1.625 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.114 in (2.9 mm) |
||||||||||||||||||||||||||||
Analog Devices |
Buffer |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
Small Outline, Low Profile, Shrink Pitch |
Buffer Amplifiers |
0.037 in (0.95 mm) |
Tin Lead |
Dual |
R-PDSO-G6 |
1 |
0.057 in (1.45 mm) |
0.064 in (1.625 mm) |
No |
e0 |
0.114 in (2.9 mm) |
|||||||||||||||||||||||||||||||||||||
Analog Devices |
Buffer |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
Small Outline, Low Profile, Shrink Pitch |
Buffer Amplifiers |
0.037 in (0.95 mm) |
Tin Lead |
Dual |
R-PDSO-G6 |
1 |
0.057 in (1.45 mm) |
0.064 in (1.625 mm) |
No |
e0 |
0.114 in (2.9 mm) |
|||||||||||||||||||||||||||||||||||||
Analog Devices |
Buffer |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
Small Outline, Low Profile, Shrink Pitch |
Buffer Amplifiers |
0.037 in (0.95 mm) |
Tin Lead |
Dual |
R-PDSO-G6 |
1 |
0.057 in (1.45 mm) |
0.064 in (1.625 mm) |
No |
e0 |
0.114 in (2.9 mm) |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
10 uA |
Yes |
1 |
3 V |
Small Outline, Low Profile, Shrink Pitch |
Buffer Amplifiers |
7 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G6 |
1 |
0.057 in (1.45 mm) |
0.064 in (1.625 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.114 in (2.9 mm) |
||||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
35 uA |
Yes |
1 |
BICMOS |
5 V |
Small Outline, Low Profile, Shrink Pitch |
Buffer Amplifiers |
275 V/us |
6 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Nickel PalladiumGold |
Dual |
R-PDSO-G6 |
1 |
0.057 in (1.45 mm) |
0.064 in (1.625 mm) |
No |
40 mA |
45 MHz |
e4 |
30 s |
260 °C (500 °F) |
0.114 in (2.9 mm) |
||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
35 uA |
Yes |
1 |
BICMOS |
5 V |
Small Outline, Low Profile, Shrink Pitch |
275 V/us |
6 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Nickel PalladiumGold |
Dual |
R-PDSO-G6 |
1 |
0.057 in (1.45 mm) |
0.064 in (1.625 mm) |
No |
40 mA |
45 MHz |
e4 |
30 s |
260 °C (500 °F) |
0.114 in (2.9 mm) |
|||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
No Lead |
6 |
VSON |
Square |
35 uA |
Yes |
1 |
BICMOS |
5 V |
Small Outline, Very Thin Profile |
275 V/us |
6 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
Dual |
S-XDSO-N6 |
1 |
0.031 in (0.8 mm) |
0.079 in (2 mm) |
No |
40 mA |
45 MHz |
e4 |
30 s |
260 °C (500 °F) |
0.079 in (2 mm) |
||||||||||||||||||||||||||
|
Maxim Integrated |
Buffer |
Industrial |
Gull Wing |
6 |
TSSOP |
Rectangular |
Plastic/Epoxy |
35 uA |
Yes |
1 |
BICMOS |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
Buffer Amplifiers |
275 V/us |
6 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Nickel PalladiumGold |
Dual |
R-PDSO-G6 |
1 |
0.043 in (1.1 mm) |
0.049 in (1.25 mm) |
No |
40 mA |
45 MHz |
e4 |
30 s |
260 °C (500 °F) |
0.079 in (2 mm) |
||||||||||||||||||||||||
|
Maxim Integrated |
Buffer |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
0 V |
12 mV |
35 uA |
Yes |
1 |
0 V |
3 V |
Small Outline, Low Profile, Shrink Pitch |
Buffer Amplifiers |
350 V/us |
6.5 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G6 |
1 |
0.057 in (1.45 mm) |
0.064 in (1.625 mm) |
No |
106 mA |
250 MHz |
e3 |
30 s |
260 °C (500 °F) |
0.114 in (2.9 mm) |
||||||||||||||||||||||
Maxim Integrated |
Buffer |
Industrial |
No Lead |
6 |
VSON |
Square |
35 uA |
Yes |
1 |
BICMOS |
5 V |
Small Outline, Very Thin Profile |
Buffer Amplifiers |
275 V/us |
6 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Dual |
S-XDSO-N6 |
0.031 in (0.8 mm) |
0.079 in (2 mm) |
No |
40 mA |
45 MHz |
0.079 in (2 mm) |
|||||||||||||||||||||||||||||||
Maxim Integrated |
Buffer |
Industrial |
Gull Wing |
6 |
TSSOP |
Rectangular |
Plastic/Epoxy |
35 uA |
Yes |
1 |
BICMOS |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
Buffer Amplifiers |
275 V/us |
6 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G6 |
1 |
0.043 in (1.1 mm) |
0.049 in (1.25 mm) |
No |
40 mA |
45 MHz |
e0 |
0.079 in (2 mm) |
|||||||||||||||||||||||||||
Maxim Integrated |
Buffer |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
35 uA |
Yes |
1 |
BICMOS |
5 V |
Small Outline, Low Profile, Shrink Pitch |
Buffer Amplifiers |
275 V/us |
6 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G6 |
1 |
0.057 in (1.45 mm) |
0.064 in (1.625 mm) |
No |
40 mA |
45 MHz |
e0 |
0.114 in (2.9 mm) |
|||||||||||||||||||||||||||
Maxim Integrated |
Buffer |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
0 V |
No |
12 mV |
35 uA |
Yes |
1 |
Bipolar |
28 mA |
0 V |
Voltage Feedback |
No |
3 V |
±1.425/±3.25/2.85/6.5 V |
Small Outline, Low Profile, Shrink Pitch |
TSOP6,.11,37 |
Buffer Amplifiers |
350 V/us |
6.5 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
Yes |
1000 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
No |
R-PDSO-G6 |
1 |
0.057 in (1.45 mm) |
0.064 in (1.625 mm) |
No |
106 mA |
250 MHz |
No |
e0 |
0.114 in (2.9 mm) |
Yes |
No |
||||||||||||
|
Maxim Integrated |
Buffer |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
12 mV |
35 uA |
Yes |
1 |
28 mA |
3 V |
Small Outline, Low Profile, Shrink Pitch |
TSOP5/6,.11,37 |
Buffer Amplifiers |
385 V/us |
7.5 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
35 uA |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G6 |
1 |
0.057 in (1.45 mm) |
0.064 in (1.625 mm) |
250 MHz |
e3 |
30 s |
260 °C (500 °F) |
0.114 in (2.9 mm) |
||||||||||||||||||||||||
Maxim Integrated |
Buffer |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
0 V |
No |
12 mV |
35 uA |
Yes |
1 |
Bipolar |
28 mA |
0 V |
Voltage Feedback |
No |
3 V |
±1.425/±3.25/2.85/6.5 V |
Small Outline, Low Profile, Shrink Pitch |
TSOP6,.11,37 |
Buffer Amplifiers |
350 V/us |
6.5 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
Yes (AVCL >= 5) |
1000 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
No |
R-PDSO-G6 |
1 |
0.057 in (1.45 mm) |
0.064 in (1.625 mm) |
No |
106 mA |
150 MHz |
No |
e0 |
0.114 in (2.9 mm) |
Yes |
No |
||||||||||||
Maxim Integrated |
Buffer |
Industrial |
Gull Wing |
6 |
TSSOP |
Rectangular |
Plastic/Epoxy |
35 uA |
Yes |
1 |
BICMOS |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
Buffer Amplifiers |
275 V/us |
6 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G6 |
1 |
0.043 in (1.1 mm) |
0.049 in (1.25 mm) |
No |
40 mA |
45 MHz |
e0 |
0.079 in (2 mm) |
|||||||||||||||||||||||||||
|
Maxim Integrated |
Buffer |
Industrial |
Gull Wing |
6 |
TSSOP |
Rectangular |
Plastic/Epoxy |
35 uA |
Yes |
1 |
BICMOS |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
Buffer Amplifiers |
275 V/us |
6 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Nickel/Palladium/Gold |
Dual |
R-PDSO-G6 |
1 |
0.043 in (1.1 mm) |
0.049 in (1.25 mm) |
No |
40 mA |
45 MHz |
e4 |
30 s |
260 °C (500 °F) |
0.079 in (2 mm) |
||||||||||||||||||||||||
Maxim Integrated |
Buffer |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
35 uA |
Yes |
1 |
BICMOS |
5 V |
Small Outline, Low Profile, Shrink Pitch |
Buffer Amplifiers |
275 V/us |
6 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G6 |
1 |
0.057 in (1.45 mm) |
0.064 in (1.625 mm) |
No |
40 mA |
45 MHz |
e0 |
0.114 in (2.9 mm) |
|||||||||||||||||||||||||||
Maxim Integrated |
Buffer |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
10 uA |
Yes |
1 |
Bipolar |
7.4 mA |
3 V |
3/5 V |
Small Outline, Low Profile, Shrink Pitch |
TSOP6,.11,37 |
Buffer Amplifiers |
7 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G6 |
1 |
0.057 in (1.45 mm) |
0.064 in (1.625 mm) |
No |
e0 |
0.114 in (2.9 mm) |
|||||||||||||||||||||||||||
Maxim Integrated |
Buffer |
Industrial |
No Lead |
6 |
VSON |
Square |
35 uA |
Yes |
1 |
BICMOS |
5 V |
Small Outline, Very Thin Profile |
Buffer Amplifiers |
275 V/us |
6 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
Dual |
S-XDSO-N6 |
1 |
0.031 in (0.8 mm) |
0.079 in (2 mm) |
No |
40 mA |
45 MHz |
e4 |
0.079 in (2 mm) |
Buffer amplifiers are electronic circuits that are designed to provide a high input impedance and a low output impedance. They are used to isolate one part of a circuit from another, preventing changes in one part of the circuit from affecting the other.
The primary function of a buffer amplifier is to prevent loading effects, which occur when a device with a low input impedance is connected to a device with a high output impedance. In this scenario, the high output impedance of the first device may cause a decrease in signal strength or distortion in the second device.
By using a buffer amplifier, the high output impedance of the first device is isolated from the second device, ensuring that the signal is transferred with minimal distortion. The buffer amplifier acts as a bridge between the two devices, allowing them to operate independently.
Buffer amplifiers are commonly used in audio applications, such as preamplifiers, where they can be used to isolate a sensitive input signal from a power amplifier that requires a low impedance input. They are also used in other applications, such as instrumentation, signal conditioning, and data acquisition, where signal integrity is critical.