No Lead Buffer Amplifiers 134

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Part RoHS Manufacturer Amplifier Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Nominal Unity Gain Bandwidth Maximum Negative Supply Voltage Limit Low-Bias Maximum Input Offset Voltage Maximum Average Bias Current (IIB) Surface Mount No. of Functions Minimum Common Mode Reject Ratio Technology Screening Level Nominal Common Mode Reject Ratio Maximum Supply Current Nominal Negative Supply Voltage (Vsup) Architecture Programmable Power Packing Method Nominal Supply Voltage / Vsup (V) Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Slew Rate Sub-Category Nominal Slow Rate Maximum Supply Voltage Limit Terminal Pitch Maximum Operating Temperature Maximum Bias Current (IIB) @25C Frequency Compensation Minimum Voltage Gain Minimum Operating Temperature Terminal Finish Terminal Position Low-Offset JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Minimum Output Current Nominal Bandwidth (3dB) Micropower JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Wideband Power

BUF03G

Analog Devices

Buffer

No Lead

6

DIE

Rectangular

-18 V

15 mV

Yes

1

FET

25 mA

-15 V

15 V

Uncased Chip

180 V/us

18 V

Tin Lead

Upper

R-XUUC-N6

No

e0

AD8570ACP-REEL

Analog Devices

Buffer

Industrial

No Lead

32

VQCCN

Square

10 mV

800 nA

Yes

8

BICMOS

8 mA

Tape And Reel

4.5 V

4.5/16 V

Chip Carrier, Very Thin Profile

LCC32,.2SQ,20

4 V/us

Buffer Amplifiers

6 V/us

18 V

0.02 in (0.5 mm)

85 °C (185 °F)

600 nA

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N32

0.039 in (1 mm)

0.197 in (5 mm)

No

6 MHz

e0

0.197 in (5 mm)

ADCLK905BCPZ-R2

Analog Devices

Buffer

Automotive

No Lead

16

HVQCCN

Square

Yes

1

Tape And Reel

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Buffer Amplifiers

6 V

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N16

3

0.035 in (0.9 mm)

0.118 in (3 mm)

No

35 mA

e3

30 s

260 °C (500 °F)

0.118 in (3 mm)

AD8570ACP-R2

Analog Devices

Buffer

Industrial

No Lead

32

VQCCN

Square

10 mV

800 nA

Yes

8

BICMOS

8 mA

4.5 V

4.5/16 V

Chip Carrier, Very Thin Profile

LCC32,.2SQ,20

4 V/us

Buffer Amplifiers

6 V/us

18 V

0.02 in (0.5 mm)

85 °C (185 °F)

600 nA

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N32

0.039 in (1 mm)

0.197 in (5 mm)

No

6 MHz

e0

0.197 in (5 mm)

ADA4800ACPZ-R2

Analog Devices

Buffer

Industrial

No Lead

6

HVSON

Square

Plastic/Epoxy

41 mV

Yes

1

1.8 mA

Tape And Reel

15 V

15 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC6,.06,20

Buffer Amplifiers

415 V/us

18 V

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N6

0.024 in (0.6 mm)

0.063 in (1.6 mm)

No

400 MHz

0.063 in (1.6 mm)

ADA4800ACPZ-RL

Analog Devices

Buffer

Industrial

No Lead

6

HVSON

Square

Plastic/Epoxy

41 mV

Yes

1

1.8 mA

Tape And Reel

15 V

15 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC6,.06,20

Buffer Amplifiers

415 V/us

18 V

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Nickel PalladiumGold

Dual

S-PDSO-N6

1

0.024 in (0.6 mm)

0.063 in (1.6 mm)

No

400 MHz

e4

30 s

260 °C (500 °F)

0.063 in (1.6 mm)

ADA4800-KGD-WP

Analog Devices

Buffer

Industrial

No Lead

6

DIE

Rectangular

41 mV

Yes

1

1.8 mA

15 V

Uncased Chip

DIE OR CHIP

415 V/us

18 V

85 °C (185 °F)

-40 °C (-40 °F)

Upper

R-XUUC-N6

0.019 in (0.4826 mm)

0.018 in (0.46 mm)

182 MHz

0.021 in (0.525 mm)

LTC6417CUDC#TRPBF

Analog Devices

Buffer

Commercial

No Lead

20

HVQCCN

Rectangular

Plastic/Epoxy

3.2 mV

Yes

1

145 mA

Tape And Reel

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC20,.12X.16,20

10 V/us

5.25 V

0.02 in (0.5 mm)

70 °C (158 °F)

13 uA

0 °C (32 °F)

Matte Tin

Quad

R-PQCC-N20

1

0.031 in (0.8 mm)

0.118 in (3 mm)

100 mA

1600 MHz

e3

30 s

260 °C (500 °F)

0.157 in (4 mm)

AD8560ACP

Analog Devices

Buffer

Industrial

No Lead

16

HVQCCN

Square

10 mV

800 nA

Yes

4

6 mA

4.5/16 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.16SQ,25

4.5 V/us

Buffer Amplifiers

8 V/us

18 V

0.026 in (0.65 mm)

85 °C (185 °F)

600 nA

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N16

0.039 in (1 mm)

0.157 in (4 mm)

No

8 MHz

e0

0.157 in (4 mm)

ADD8708WCPZ-REEL7

Analog Devices

Buffer

Industrial

No Lead

48

HVQCCN

Rectangular

15 mV

1.5 μA

Yes

18

16 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

6 V/us

18 V

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

R-XQCC-N48

3

0.039 in (1 mm)

0.276 in (7 mm)

No

150 mA

4.5 MHz

e3

0.276 in (7 mm)

BUF03N

Analog Devices

Buffer

No Lead

6

DIE

Rectangular

-18 V

6 mV

Yes

1

FET

25 mA

-15 V

15 V

Uncased Chip

220 V/us

18 V

Tin Lead

Upper

R-XUUC-N6

No

e0

ADD8707WCPZ-REEL7

Analog Devices

Buffer

Industrial

No Lead

48

HVQCCN

Rectangular

15 mV

1.5 μA

Yes

12

15 mA

16 V

16 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC48,.27SQ,20

Buffer Amplifiers

6 V/us

18 V

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Quad

R-XQCC-N48

0.039 in (1 mm)

0.276 in (7 mm)

No

250 mA

4.5 MHz

0.276 in (7 mm)

5962-9556701M2X

Analog Devices

Buffer

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

-18 V

2 mV

5 uA

Yes

1

Bipolar

-5 V

5 V

Chip Carrier

18 V

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N20

No

AD9620CHIPS

Analog Devices

Buffer

Commercial

No Lead

13

DIE

-7 V

8 mV

Yes

1

Bipolar

-5 V

5 V

±5 V

Uncased Chip

DIE OR CHIP

1500 V/us

Buffer Amplifiers

7 V

70 °C (158 °F)

35 uA

0 °C (32 °F)

Upper

X-XUUC-N13

No

600 MHz

LTC6417CUDC#PBF

Analog Devices

Buffer

Commercial

No Lead

20

HVQCCN

Rectangular

Plastic/Epoxy

3.2 mV

Yes

1

145 mA

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC20,.12X.16,20

10 V/us

5.25 V

0.02 in (0.5 mm)

70 °C (158 °F)

13 uA

0 °C (32 °F)

Matte Tin

Quad

R-PQCC-N20

1

0.031 in (0.8 mm)

0.118 in (3 mm)

100 mA

1600 MHz

e3

30 s

260 °C (500 °F)

0.157 in (4 mm)

AD8570ACP

Analog Devices

Buffer

Industrial

No Lead

32

VQCCN

Square

10 mV

800 nA

Yes

8

BICMOS

8 mA

4.5 V

4.5/16 V

Chip Carrier, Very Thin Profile

LCC32,.2SQ,20

4 V/us

Buffer Amplifiers

6 V/us

18 V

0.02 in (0.5 mm)

85 °C (185 °F)

600 nA

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N32

0.035 in (0.9 mm)

0.197 in (5 mm)

No

6 MHz

e0

0.197 in (5 mm)

MAX4206ETE+

Analog Devices

Buffer

Industrial

No Lead

16

HVQCCN

Square

-6 V

5 mV

1 nA

Yes

1

BICMOS

7.5 mA

-5 V

5 V

±5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.16SQ,25

Buffer Amplifiers

12 V/us

12 V

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N16

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0.157 in (4 mm)

MAX4032ELT+

Analog Devices

Buffer

Industrial

No Lead

6

VSON

Square

35 uA

Yes

1

BICMOS

5 V

Small Outline, Very Thin Profile

275 V/us

6 V

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Gold

Dual

S-XDSO-N6

1

0.031 in (0.8 mm)

0.079 in (2 mm)

No

40 mA

45 MHz

e4

0.079 in (2 mm)

MAX4032ELT+T

Analog Devices

Buffer

Industrial

No Lead

6

VSON

Square

35 uA

Yes

1

BICMOS

5 V

Small Outline, Very Thin Profile

275 V/us

6 V

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Gold

Dual

S-XDSO-N6

1

0.031 in (0.8 mm)

0.079 in (2 mm)

No

40 mA

45 MHz

e4

30 s

260 °C (500 °F)

0.079 in (2 mm)

TSH340IQT

STMicroelectronics

Buffer

Industrial

No Lead

SON

Square

16 uA

Yes

1

5 V

Small Outline

Buffer Amplifiers

6 V

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-XDSO-N

1

No

87 mA

320 MHz

e3

30 s

260 °C (500 °F)

MAX467C/D

Maxim Integrated

Buffer

Commercial

No Lead

DIE

-6 V

15 mV

5 uA

Yes

3

Bipolar

100 mA

-5 V

5 V

Uncased Chip

Buffer Amplifiers

200 V/us

6 V

70 °C (158 °F)

0 °C (32 °F)

Upper

X-XUUC-N

1

No

20 mA

100 MHz

MAX469C/D

Maxim Integrated

Buffer

Commercial

No Lead

DIE

-6 V

15 mV

5 uA

Yes

3

Bipolar

100 mA

-5 V

5 V

Uncased Chip

Buffer Amplifiers

300 V/us

6 V

70 °C (158 °F)

0 °C (32 °F)

Upper

X-XUUC-N

1

No

20 mA

90 MHz

MAX4032ELT-T

Maxim Integrated

Buffer

Industrial

No Lead

6

VSON

Square

35 uA

Yes

1

BICMOS

5 V

Small Outline, Very Thin Profile

Buffer Amplifiers

275 V/us

6 V

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Dual

S-XDSO-N6

0.031 in (0.8 mm)

0.079 in (2 mm)

No

40 mA

45 MHz

0.079 in (2 mm)

MAX405C/D

Maxim Integrated

Buffer

Commercial

No Lead

8

DIE

Rectangular

-6 V

6.5 mV

4 uA

Yes

1

Bipolar

-5 V

5 V

Uncased Chip

650 V/us

6 V

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N8

No

60 mA

180 MHz

e0

MAX496C/D

Maxim Integrated

Buffer

Commercial

No Lead

16

DIE

Rectangular

-6 V

3 mV

5 uA

Yes

4

CMOS

-5 V

5 V

Uncased Chip

Buffer Amplifiers

1600 V/us

6 V

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N16

1

No

66 mA

375 MHz

e0

MAX468C/D

Maxim Integrated

Buffer

Commercial

No Lead

DIE

-6 V

15 mV

5 uA

Yes

4

Bipolar

120 mA

-5 V

5 V

Uncased Chip

Buffer Amplifiers

200 V/us

6 V

70 °C (158 °F)

0 °C (32 °F)

Upper

X-XUUC-N

1

No

20 mA

100 MHz

MAX4032ELT

Maxim Integrated

Buffer

Industrial

No Lead

6

VSON

Square

35 uA

Yes

1

BICMOS

5 V

Small Outline, Very Thin Profile

Buffer Amplifiers

275 V/us

6 V

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Gold

Dual

S-XDSO-N6

1

0.031 in (0.8 mm)

0.079 in (2 mm)

No

40 mA

45 MHz

e4

0.079 in (2 mm)

MAX497C/D

Maxim Integrated

Buffer

Commercial

No Lead

16

DIE

Rectangular

-6 V

3 mV

5 uA

Yes

4

CMOS

-5 V

5 V

Uncased Chip

Buffer Amplifiers

1500 V/us

6 V

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N16

1

No

66 mA

275 MHz

e0

MAX470C/D

Maxim Integrated

Buffer

Commercial

No Lead

DIE

-6 V

15 mV

5 uA

Yes

4

Bipolar

120 mA

-5 V

5 V

Uncased Chip

Buffer Amplifiers

300 V/us

6 V

70 °C (158 °F)

0 °C (32 °F)

Upper

X-XUUC-N

1

No

20 mA

90 MHz

EL5423CLZ-T13

Renesas Electronics

Buffer

Industrial

No Lead

32

HVQCCN

Rectangular

Plastic/Epoxy

-9 V

12 mV

50 nA

Yes

12

CMOS

-5 V

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Buffer Amplifiers

15 V/us

9 V

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

R-PQCC-N32

0.039 in (1 mm)

0.197 in (5 mm)

12 MHz

e3

0.236 in (6 mm)

EL5424ILZ

Renesas Electronics

Buffer

Industrial

No Lead

32

HVQCCN

Rectangular

Plastic/Epoxy

14 mV

50 nA

Yes

12

CMOS

15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Buffer Amplifiers

15 V/us

18 V

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

R-PQCC-N32

0.039 in (1 mm)

0.197 in (5 mm)

12 MHz

e3

0.236 in (6 mm)

EL5327CL-T7

Renesas Electronics

Buffer

Industrial

No Lead

24

HVQCCN

Rectangular

-9 V

15 mV

50 nA

Yes

1

CMOS

2 mA

-5 V

Tape And Reel

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC24,.16X.2,20

0.9 V/us

Buffer Amplifiers

2.2 V/us

9 V

0.02 in (0.5 mm)

85 °C (185 °F)

50 nA

-40 °C (-40 °F)

Quad

R-XQCC-N24

0.039 in (1 mm)

0.157 in (4 mm)

2.5 MHz

0.197 in (5 mm)

EL5223CL

Renesas Electronics

Buffer

Industrial

No Lead

24

HVQCCN

Rectangular

Plastic/Epoxy

-9 V

12 mV

50 nA

Yes

8

CMOS

-5 V

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Buffer Amplifiers

15 V/us

9 V

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Quad

R-PQCC-N24

0.039 in (1 mm)

0.157 in (4 mm)

12 MHz

0.197 in (5 mm)

EL5227CLZ-T13

Renesas Electronics

Buffer

Industrial

No Lead

24

HVQCCN

Rectangular

-9 V

15 mV

50 nA

Yes

1

CMOS

1.4 mA

-5 V

Tape And Reel

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC24,.16X.2,20

0.9 V/us

Buffer Amplifiers

2.2 V/us

9 V

0.02 in (0.5 mm)

85 °C (185 °F)

50 nA

-40 °C (-40 °F)

Matte Tin

Quad

R-XQCC-N24

0.039 in (1 mm)

0.157 in (4 mm)

2.5 MHz

e3

0.197 in (5 mm)

5962-89636012X

Renesas Electronics

Buffer

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

-22 V

20 mV

7 uA

Yes

1

Bipolar

-15 V

15 V

Chip Carrier

Buffer Amplifiers

1300 V/us

22 V

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

Yes

100 mA

0.35 in (8.89 mm)

EL5424ILZ-T7

Renesas Electronics

Buffer

Industrial

No Lead

32

HVQCCN

Rectangular

Plastic/Epoxy

14 mV

50 nA

Yes

12

CMOS

15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Buffer Amplifiers

15 V/us

18 V

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

R-PQCC-N32

0.039 in (1 mm)

0.197 in (5 mm)

12 MHz

e3

0.236 in (6 mm)

EL5323CL

Renesas Electronics

Buffer

Industrial

No Lead

24

HVQCCN

Rectangular

Plastic/Epoxy

-9 V

12 mV

50 nA

Yes

10

CMOS

-5 V

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Buffer Amplifiers

15 V/us

9 V

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Quad

R-PQCC-N24

0.039 in (1 mm)

0.157 in (4 mm)

12 MHz

0.197 in (5 mm)

EL5323CL-T13

Renesas Electronics

Buffer

Industrial

No Lead

24

HVQCCN

Rectangular

Plastic/Epoxy

-9 V

12 mV

50 nA

Yes

10

CMOS

-5 V

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Buffer Amplifiers

15 V/us

9 V

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Quad

R-PQCC-N24

0.039 in (1 mm)

0.157 in (4 mm)

12 MHz

0.197 in (5 mm)

EL5423CLZ-T7

Renesas Electronics

Buffer

Industrial

No Lead

32

HVQCCN

Rectangular

Plastic/Epoxy

-9 V

12 mV

50 nA

Yes

12

CMOS

-5 V

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Buffer Amplifiers

15 V/us

9 V

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

R-PQCC-N32

0.039 in (1 mm)

0.197 in (5 mm)

12 MHz

e3

0.236 in (6 mm)

EL5227CL-T7

Renesas Electronics

Buffer

Industrial

No Lead

24

HVQCCN

Rectangular

-9 V

15 mV

50 nA

Yes

1

CMOS

1.4 mA

-5 V

Tape And Reel

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC24,.16X.2,20

0.9 V/us

Buffer Amplifiers

2.2 V/us

9 V

0.02 in (0.5 mm)

85 °C (185 °F)

50 nA

-40 °C (-40 °F)

Quad

R-XQCC-N24

0.039 in (1 mm)

0.157 in (4 mm)

2.5 MHz

0.197 in (5 mm)

EL5324ILZ

Renesas Electronics

Buffer

Industrial

No Lead

32

HVQCCN

Rectangular

Plastic/Epoxy

14 mV

50 nA

Yes

10

CMOS

15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Buffer Amplifiers

15 V/us

18 V

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

R-PQCC-N32

0.039 in (1 mm)

0.197 in (5 mm)

12 MHz

e3

0.236 in (6 mm)

EL2004L

Renesas Electronics

Buffer

Military

No Lead

52

QCCN

Square

Ceramic

Yes

1

Hybrid

24 mA

±5/±15 V

Chip Carrier

LCC52,.75SQ

900 V/us

Buffer Amplifiers

0.05 in (1.27 mm)

125 °C (257 °F)

2.5 nA

-55 °C (-67 °F)

Quad

S-XQCC-N52

No

350 MHz

ISL24211IRTZ-T13

Renesas Electronics

Buffer

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

15 mV

1 μA

Yes

1

Tape And Reel

18 V

Small Outline, Heat Sink/Slug, Very Thin Profile

Buffer Amplifiers

116 V/us

20 V

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-N10

1

0.033 in (0.85 mm)

0.118 in (3 mm)

60 MHz

e3

30 s

260 °C (500 °F)

0.118 in (3 mm)

ISL24003IRZ-T7

Renesas Electronics

Buffer

Industrial

No Lead

44

HVQCCN

Square

0 V

20 mV

50 nA

Yes

1

CMOS

15.5 mA

0 V

15 V

15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC44,.28SQ,20

4.5 V/us

Buffer Amplifiers

9 V/us

18 V

0.02 in (0.5 mm)

85 °C (185 °F)

50 nA

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N44

3

0.035 in (0.9 mm)

0.276 in (7 mm)

No

10 MHz

e3

0.276 in (7 mm)

ISL24211IRTZ-T

Renesas Electronics

Buffer

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

15 mV

1 μA

Yes

1

18 V

Small Outline, Heat Sink/Slug, Very Thin Profile

Buffer Amplifiers

116 V/us

20 V

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-N10

1

0.033 in (0.85 mm)

0.118 in (3 mm)

60 MHz

e3

30 s

260 °C (500 °F)

0.118 in (3 mm)

EL5427CL-T13

Renesas Electronics

Buffer

Industrial

No Lead

32

HVQCCN

Rectangular

-9 V

15 mV

50 nA

Yes

12

CMOS

2.4 mA

-5 V

5 V

5/±5/15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2X.24,20

0.9 V/us

Buffer Amplifiers

2.2 V/us

9 V

0.02 in (0.5 mm)

85 °C (185 °F)

50 nA

-40 °C (-40 °F)

Tin Lead

Quad

R-XQCC-N32

1

0.039 in (1 mm)

0.197 in (5 mm)

No

2.5 MHz

e0

0.236 in (6 mm)

EL5427CLZ-T13

Renesas Electronics

Buffer

Industrial

No Lead

32

HVQCCN

Rectangular

-9 V

15 mV

50 nA

Yes

12

CMOS

2.4 mA

-5 V

5 V

5/±5/15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2X.24,20

0.9 V/us

Buffer Amplifiers

9 V

0.02 in (0.5 mm)

85 °C (185 °F)

50 nA

-40 °C (-40 °F)

Matte Tin

Quad

R-XQCC-N32

3

0.039 in (1 mm)

0.197 in (5 mm)

No

2.5 MHz

e3

0.236 in (6 mm)

EL5227CL-T13

Renesas Electronics

Buffer

Industrial

No Lead

24

HVQCCN

Rectangular

-9 V

15 mV

50 nA

Yes

1

CMOS

1.4 mA

-5 V

Tape And Reel

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC24,.16X.2,20

0.9 V/us

Buffer Amplifiers

2.2 V/us

9 V

0.02 in (0.5 mm)

85 °C (185 °F)

50 nA

-40 °C (-40 °F)

Quad

R-XQCC-N24

0.039 in (1 mm)

0.157 in (4 mm)

2.5 MHz

0.197 in (5 mm)

Buffer Amplifiers

Buffer amplifiers are electronic circuits that are designed to provide a high input impedance and a low output impedance. They are used to isolate one part of a circuit from another, preventing changes in one part of the circuit from affecting the other.

The primary function of a buffer amplifier is to prevent loading effects, which occur when a device with a low input impedance is connected to a device with a high output impedance. In this scenario, the high output impedance of the first device may cause a decrease in signal strength or distortion in the second device.

By using a buffer amplifier, the high output impedance of the first device is isolated from the second device, ensuring that the signal is transferred with minimal distortion. The buffer amplifier acts as a bridge between the two devices, allowing them to operate independently.

Buffer amplifiers are commonly used in audio applications, such as preamplifiers, where they can be used to isolate a sensitive input signal from a power amplifier that requires a low impedance input. They are also used in other applications, such as instrumentation, signal conditioning, and data acquisition, where signal integrity is critical.