Part | RoHS | Manufacturer | Amplifier Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Nominal Unity Gain Bandwidth | Maximum Negative Supply Voltage Limit | Low-Bias | Maximum Input Offset Voltage | Maximum Average Bias Current (IIB) | Surface Mount | No. of Functions | Minimum Common Mode Reject Ratio | Technology | Screening Level | Nominal Common Mode Reject Ratio | Maximum Supply Current | Nominal Negative Supply Voltage (Vsup) | Architecture | Programmable Power | Packing Method | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Slew Rate | Sub-Category | Nominal Slow Rate | Maximum Supply Voltage Limit | Terminal Pitch | Maximum Operating Temperature | Maximum Bias Current (IIB) @25C | Frequency Compensation | Minimum Voltage Gain | Minimum Operating Temperature | Terminal Finish | Terminal Position | Low-Offset | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Minimum Output Current | Nominal Bandwidth (3dB) | Micropower | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Wideband | Power |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices |
Buffer |
No Lead |
6 |
DIE |
Rectangular |
-18 V |
15 mV |
Yes |
1 |
FET |
25 mA |
-15 V |
15 V |
Uncased Chip |
180 V/us |
18 V |
Tin Lead |
Upper |
R-XUUC-N6 |
No |
e0 |
||||||||||||||||||||||||||||||||||||
Analog Devices |
Buffer |
Industrial |
No Lead |
32 |
VQCCN |
Square |
10 mV |
800 nA |
Yes |
8 |
BICMOS |
8 mA |
Tape And Reel |
4.5 V |
4.5/16 V |
Chip Carrier, Very Thin Profile |
LCC32,.2SQ,20 |
4 V/us |
Buffer Amplifiers |
6 V/us |
18 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
600 nA |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-XQCC-N32 |
0.039 in (1 mm) |
0.197 in (5 mm) |
No |
6 MHz |
e0 |
0.197 in (5 mm) |
|||||||||||||||||||||||
|
Analog Devices |
Buffer |
Automotive |
No Lead |
16 |
HVQCCN |
Square |
Yes |
1 |
Tape And Reel |
3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
Buffer Amplifiers |
6 V |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N16 |
3 |
0.035 in (0.9 mm) |
0.118 in (3 mm) |
No |
35 mA |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||||||||||||||
Analog Devices |
Buffer |
Industrial |
No Lead |
32 |
VQCCN |
Square |
10 mV |
800 nA |
Yes |
8 |
BICMOS |
8 mA |
4.5 V |
4.5/16 V |
Chip Carrier, Very Thin Profile |
LCC32,.2SQ,20 |
4 V/us |
Buffer Amplifiers |
6 V/us |
18 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
600 nA |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-XQCC-N32 |
0.039 in (1 mm) |
0.197 in (5 mm) |
No |
6 MHz |
e0 |
0.197 in (5 mm) |
||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
No Lead |
6 |
HVSON |
Square |
Plastic/Epoxy |
41 mV |
Yes |
1 |
1.8 mA |
Tape And Reel |
15 V |
15 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
SOLCC6,.06,20 |
Buffer Amplifiers |
415 V/us |
18 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Dual |
S-PDSO-N6 |
0.024 in (0.6 mm) |
0.063 in (1.6 mm) |
No |
400 MHz |
0.063 in (1.6 mm) |
|||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
No Lead |
6 |
HVSON |
Square |
Plastic/Epoxy |
41 mV |
Yes |
1 |
1.8 mA |
Tape And Reel |
15 V |
15 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
SOLCC6,.06,20 |
Buffer Amplifiers |
415 V/us |
18 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Nickel PalladiumGold |
Dual |
S-PDSO-N6 |
1 |
0.024 in (0.6 mm) |
0.063 in (1.6 mm) |
No |
400 MHz |
e4 |
30 s |
260 °C (500 °F) |
0.063 in (1.6 mm) |
||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
No Lead |
6 |
DIE |
Rectangular |
41 mV |
Yes |
1 |
1.8 mA |
15 V |
Uncased Chip |
DIE OR CHIP |
415 V/us |
18 V |
85 °C (185 °F) |
-40 °C (-40 °F) |
Upper |
R-XUUC-N6 |
0.019 in (0.4826 mm) |
0.018 in (0.46 mm) |
182 MHz |
0.021 in (0.525 mm) |
|||||||||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Commercial |
No Lead |
20 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
3.2 mV |
Yes |
1 |
145 mA |
Tape And Reel |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC20,.12X.16,20 |
10 V/us |
5.25 V |
0.02 in (0.5 mm) |
70 °C (158 °F) |
13 uA |
0 °C (32 °F) |
Matte Tin |
Quad |
R-PQCC-N20 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
100 mA |
1600 MHz |
e3 |
30 s |
260 °C (500 °F) |
0.157 in (4 mm) |
||||||||||||||||||||||||
Analog Devices |
Buffer |
Industrial |
No Lead |
16 |
HVQCCN |
Square |
10 mV |
800 nA |
Yes |
4 |
6 mA |
4.5/16 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC16,.16SQ,25 |
4.5 V/us |
Buffer Amplifiers |
8 V/us |
18 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
600 nA |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-XQCC-N16 |
0.039 in (1 mm) |
0.157 in (4 mm) |
No |
8 MHz |
e0 |
0.157 in (4 mm) |
||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
No Lead |
48 |
HVQCCN |
Rectangular |
15 mV |
1.5 μA |
Yes |
18 |
16 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
6 V/us |
18 V |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
R-XQCC-N48 |
3 |
0.039 in (1 mm) |
0.276 in (7 mm) |
No |
150 mA |
4.5 MHz |
e3 |
0.276 in (7 mm) |
||||||||||||||||||||||||||||
Analog Devices |
Buffer |
No Lead |
6 |
DIE |
Rectangular |
-18 V |
6 mV |
Yes |
1 |
FET |
25 mA |
-15 V |
15 V |
Uncased Chip |
220 V/us |
18 V |
Tin Lead |
Upper |
R-XUUC-N6 |
No |
e0 |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
No Lead |
48 |
HVQCCN |
Rectangular |
15 mV |
1.5 μA |
Yes |
12 |
15 mA |
16 V |
16 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Buffer Amplifiers |
6 V/us |
18 V |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Quad |
R-XQCC-N48 |
0.039 in (1 mm) |
0.276 in (7 mm) |
No |
250 mA |
4.5 MHz |
0.276 in (7 mm) |
|||||||||||||||||||||||||||
Analog Devices |
Buffer |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
-18 V |
2 mV |
5 uA |
Yes |
1 |
Bipolar |
-5 V |
5 V |
Chip Carrier |
18 V |
125 °C (257 °F) |
-55 °C (-67 °F) |
Quad |
S-CQCC-N20 |
No |
|||||||||||||||||||||||||||||||||||
Analog Devices |
Buffer |
Commercial |
No Lead |
13 |
DIE |
-7 V |
8 mV |
Yes |
1 |
Bipolar |
-5 V |
5 V |
±5 V |
Uncased Chip |
DIE OR CHIP |
1500 V/us |
Buffer Amplifiers |
7 V |
70 °C (158 °F) |
35 uA |
0 °C (32 °F) |
Upper |
X-XUUC-N13 |
No |
600 MHz |
||||||||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Commercial |
No Lead |
20 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
3.2 mV |
Yes |
1 |
145 mA |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC20,.12X.16,20 |
10 V/us |
5.25 V |
0.02 in (0.5 mm) |
70 °C (158 °F) |
13 uA |
0 °C (32 °F) |
Matte Tin |
Quad |
R-PQCC-N20 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
100 mA |
1600 MHz |
e3 |
30 s |
260 °C (500 °F) |
0.157 in (4 mm) |
|||||||||||||||||||||||||
Analog Devices |
Buffer |
Industrial |
No Lead |
32 |
VQCCN |
Square |
10 mV |
800 nA |
Yes |
8 |
BICMOS |
8 mA |
4.5 V |
4.5/16 V |
Chip Carrier, Very Thin Profile |
LCC32,.2SQ,20 |
4 V/us |
Buffer Amplifiers |
6 V/us |
18 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
600 nA |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-XQCC-N32 |
0.035 in (0.9 mm) |
0.197 in (5 mm) |
No |
6 MHz |
e0 |
0.197 in (5 mm) |
||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
No Lead |
16 |
HVQCCN |
Square |
-6 V |
5 mV |
1 nA |
Yes |
1 |
BICMOS |
7.5 mA |
-5 V |
5 V |
±5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC16,.16SQ,25 |
Buffer Amplifiers |
12 V/us |
12 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Quad |
S-XQCC-N16 |
1 |
0.031 in (0.8 mm) |
0.157 in (4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.157 in (4 mm) |
|||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
No Lead |
6 |
VSON |
Square |
35 uA |
Yes |
1 |
BICMOS |
5 V |
Small Outline, Very Thin Profile |
275 V/us |
6 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
Dual |
S-XDSO-N6 |
1 |
0.031 in (0.8 mm) |
0.079 in (2 mm) |
No |
40 mA |
45 MHz |
e4 |
0.079 in (2 mm) |
||||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
No Lead |
6 |
VSON |
Square |
35 uA |
Yes |
1 |
BICMOS |
5 V |
Small Outline, Very Thin Profile |
275 V/us |
6 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
Dual |
S-XDSO-N6 |
1 |
0.031 in (0.8 mm) |
0.079 in (2 mm) |
No |
40 mA |
45 MHz |
e4 |
30 s |
260 °C (500 °F) |
0.079 in (2 mm) |
||||||||||||||||||||||||||
|
STMicroelectronics |
Buffer |
Industrial |
No Lead |
SON |
Square |
16 uA |
Yes |
1 |
5 V |
Small Outline |
Buffer Amplifiers |
6 V |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
S-XDSO-N |
1 |
No |
87 mA |
320 MHz |
e3 |
30 s |
260 °C (500 °F) |
||||||||||||||||||||||||||||||||
Maxim Integrated |
Buffer |
Commercial |
No Lead |
DIE |
-6 V |
15 mV |
5 uA |
Yes |
3 |
Bipolar |
100 mA |
-5 V |
5 V |
Uncased Chip |
Buffer Amplifiers |
200 V/us |
6 V |
70 °C (158 °F) |
0 °C (32 °F) |
Upper |
X-XUUC-N |
1 |
No |
20 mA |
100 MHz |
||||||||||||||||||||||||||||||||
Maxim Integrated |
Buffer |
Commercial |
No Lead |
DIE |
-6 V |
15 mV |
5 uA |
Yes |
3 |
Bipolar |
100 mA |
-5 V |
5 V |
Uncased Chip |
Buffer Amplifiers |
300 V/us |
6 V |
70 °C (158 °F) |
0 °C (32 °F) |
Upper |
X-XUUC-N |
1 |
No |
20 mA |
90 MHz |
||||||||||||||||||||||||||||||||
Maxim Integrated |
Buffer |
Industrial |
No Lead |
6 |
VSON |
Square |
35 uA |
Yes |
1 |
BICMOS |
5 V |
Small Outline, Very Thin Profile |
Buffer Amplifiers |
275 V/us |
6 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Dual |
S-XDSO-N6 |
0.031 in (0.8 mm) |
0.079 in (2 mm) |
No |
40 mA |
45 MHz |
0.079 in (2 mm) |
|||||||||||||||||||||||||||||||
Maxim Integrated |
Buffer |
Commercial |
No Lead |
8 |
DIE |
Rectangular |
-6 V |
6.5 mV |
4 uA |
Yes |
1 |
Bipolar |
-5 V |
5 V |
Uncased Chip |
650 V/us |
6 V |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Upper |
R-XUUC-N8 |
No |
60 mA |
180 MHz |
e0 |
|||||||||||||||||||||||||||||||
Maxim Integrated |
Buffer |
Commercial |
No Lead |
16 |
DIE |
Rectangular |
-6 V |
3 mV |
5 uA |
Yes |
4 |
CMOS |
-5 V |
5 V |
Uncased Chip |
Buffer Amplifiers |
1600 V/us |
6 V |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Upper |
R-XUUC-N16 |
1 |
No |
66 mA |
375 MHz |
e0 |
|||||||||||||||||||||||||||||
Maxim Integrated |
Buffer |
Commercial |
No Lead |
DIE |
-6 V |
15 mV |
5 uA |
Yes |
4 |
Bipolar |
120 mA |
-5 V |
5 V |
Uncased Chip |
Buffer Amplifiers |
200 V/us |
6 V |
70 °C (158 °F) |
0 °C (32 °F) |
Upper |
X-XUUC-N |
1 |
No |
20 mA |
100 MHz |
||||||||||||||||||||||||||||||||
Maxim Integrated |
Buffer |
Industrial |
No Lead |
6 |
VSON |
Square |
35 uA |
Yes |
1 |
BICMOS |
5 V |
Small Outline, Very Thin Profile |
Buffer Amplifiers |
275 V/us |
6 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
Dual |
S-XDSO-N6 |
1 |
0.031 in (0.8 mm) |
0.079 in (2 mm) |
No |
40 mA |
45 MHz |
e4 |
0.079 in (2 mm) |
||||||||||||||||||||||||||||
Maxim Integrated |
Buffer |
Commercial |
No Lead |
16 |
DIE |
Rectangular |
-6 V |
3 mV |
5 uA |
Yes |
4 |
CMOS |
-5 V |
5 V |
Uncased Chip |
Buffer Amplifiers |
1500 V/us |
6 V |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Upper |
R-XUUC-N16 |
1 |
No |
66 mA |
275 MHz |
e0 |
|||||||||||||||||||||||||||||
Maxim Integrated |
Buffer |
Commercial |
No Lead |
DIE |
-6 V |
15 mV |
5 uA |
Yes |
4 |
Bipolar |
120 mA |
-5 V |
5 V |
Uncased Chip |
Buffer Amplifiers |
300 V/us |
6 V |
70 °C (158 °F) |
0 °C (32 °F) |
Upper |
X-XUUC-N |
1 |
No |
20 mA |
90 MHz |
||||||||||||||||||||||||||||||||
|
Renesas Electronics |
Buffer |
Industrial |
No Lead |
32 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
-9 V |
12 mV |
50 nA |
Yes |
12 |
CMOS |
-5 V |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
Buffer Amplifiers |
15 V/us |
9 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
R-PQCC-N32 |
0.039 in (1 mm) |
0.197 in (5 mm) |
12 MHz |
e3 |
0.236 in (6 mm) |
||||||||||||||||||||||||||
|
Renesas Electronics |
Buffer |
Industrial |
No Lead |
32 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
14 mV |
50 nA |
Yes |
12 |
CMOS |
15 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
Buffer Amplifiers |
15 V/us |
18 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
R-PQCC-N32 |
0.039 in (1 mm) |
0.197 in (5 mm) |
12 MHz |
e3 |
0.236 in (6 mm) |
||||||||||||||||||||||||||||
Renesas Electronics |
Buffer |
Industrial |
No Lead |
24 |
HVQCCN |
Rectangular |
-9 V |
15 mV |
50 nA |
Yes |
1 |
CMOS |
2 mA |
-5 V |
Tape And Reel |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC24,.16X.2,20 |
0.9 V/us |
Buffer Amplifiers |
2.2 V/us |
9 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
50 nA |
-40 °C (-40 °F) |
Quad |
R-XQCC-N24 |
0.039 in (1 mm) |
0.157 in (4 mm) |
2.5 MHz |
0.197 in (5 mm) |
|||||||||||||||||||||||||
Renesas Electronics |
Buffer |
Industrial |
No Lead |
24 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
-9 V |
12 mV |
50 nA |
Yes |
8 |
CMOS |
-5 V |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
Buffer Amplifiers |
15 V/us |
9 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Quad |
R-PQCC-N24 |
0.039 in (1 mm) |
0.157 in (4 mm) |
12 MHz |
0.197 in (5 mm) |
|||||||||||||||||||||||||||||
|
Renesas Electronics |
Buffer |
Industrial |
No Lead |
24 |
HVQCCN |
Rectangular |
-9 V |
15 mV |
50 nA |
Yes |
1 |
CMOS |
1.4 mA |
-5 V |
Tape And Reel |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC24,.16X.2,20 |
0.9 V/us |
Buffer Amplifiers |
2.2 V/us |
9 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
50 nA |
-40 °C (-40 °F) |
Matte Tin |
Quad |
R-XQCC-N24 |
0.039 in (1 mm) |
0.157 in (4 mm) |
2.5 MHz |
e3 |
0.197 in (5 mm) |
||||||||||||||||||||||
Renesas Electronics |
Buffer |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
-22 V |
20 mV |
7 uA |
Yes |
1 |
Bipolar |
-15 V |
15 V |
Chip Carrier |
Buffer Amplifiers |
1300 V/us |
22 V |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Quad |
S-CQCC-N20 |
0.1 in (2.54 mm) |
0.35 in (8.89 mm) |
Yes |
100 mA |
0.35 in (8.89 mm) |
||||||||||||||||||||||||||||
|
Renesas Electronics |
Buffer |
Industrial |
No Lead |
32 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
14 mV |
50 nA |
Yes |
12 |
CMOS |
15 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
Buffer Amplifiers |
15 V/us |
18 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
R-PQCC-N32 |
0.039 in (1 mm) |
0.197 in (5 mm) |
12 MHz |
e3 |
0.236 in (6 mm) |
||||||||||||||||||||||||||||
Renesas Electronics |
Buffer |
Industrial |
No Lead |
24 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
-9 V |
12 mV |
50 nA |
Yes |
10 |
CMOS |
-5 V |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
Buffer Amplifiers |
15 V/us |
9 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Quad |
R-PQCC-N24 |
0.039 in (1 mm) |
0.157 in (4 mm) |
12 MHz |
0.197 in (5 mm) |
|||||||||||||||||||||||||||||
Renesas Electronics |
Buffer |
Industrial |
No Lead |
24 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
-9 V |
12 mV |
50 nA |
Yes |
10 |
CMOS |
-5 V |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
Buffer Amplifiers |
15 V/us |
9 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Quad |
R-PQCC-N24 |
0.039 in (1 mm) |
0.157 in (4 mm) |
12 MHz |
0.197 in (5 mm) |
|||||||||||||||||||||||||||||
|
Renesas Electronics |
Buffer |
Industrial |
No Lead |
32 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
-9 V |
12 mV |
50 nA |
Yes |
12 |
CMOS |
-5 V |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
Buffer Amplifiers |
15 V/us |
9 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
R-PQCC-N32 |
0.039 in (1 mm) |
0.197 in (5 mm) |
12 MHz |
e3 |
0.236 in (6 mm) |
||||||||||||||||||||||||||
Renesas Electronics |
Buffer |
Industrial |
No Lead |
24 |
HVQCCN |
Rectangular |
-9 V |
15 mV |
50 nA |
Yes |
1 |
CMOS |
1.4 mA |
-5 V |
Tape And Reel |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC24,.16X.2,20 |
0.9 V/us |
Buffer Amplifiers |
2.2 V/us |
9 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
50 nA |
-40 °C (-40 °F) |
Quad |
R-XQCC-N24 |
0.039 in (1 mm) |
0.157 in (4 mm) |
2.5 MHz |
0.197 in (5 mm) |
|||||||||||||||||||||||||
|
Renesas Electronics |
Buffer |
Industrial |
No Lead |
32 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
14 mV |
50 nA |
Yes |
10 |
CMOS |
15 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
Buffer Amplifiers |
15 V/us |
18 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
R-PQCC-N32 |
0.039 in (1 mm) |
0.197 in (5 mm) |
12 MHz |
e3 |
0.236 in (6 mm) |
||||||||||||||||||||||||||||
Renesas Electronics |
Buffer |
Military |
No Lead |
52 |
QCCN |
Square |
Ceramic |
Yes |
1 |
Hybrid |
24 mA |
±5/±15 V |
Chip Carrier |
LCC52,.75SQ |
900 V/us |
Buffer Amplifiers |
0.05 in (1.27 mm) |
125 °C (257 °F) |
2.5 nA |
-55 °C (-67 °F) |
Quad |
S-XQCC-N52 |
No |
350 MHz |
|||||||||||||||||||||||||||||||||
|
Renesas Electronics |
Buffer |
Industrial |
No Lead |
10 |
HVSON |
Square |
Plastic/Epoxy |
15 mV |
1 μA |
Yes |
1 |
Tape And Reel |
18 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
Buffer Amplifiers |
116 V/us |
20 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
S-PDSO-N10 |
1 |
0.033 in (0.85 mm) |
0.118 in (3 mm) |
60 MHz |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||||||||||||
|
Renesas Electronics |
Buffer |
Industrial |
No Lead |
44 |
HVQCCN |
Square |
0 V |
20 mV |
50 nA |
Yes |
1 |
CMOS |
15.5 mA |
0 V |
15 V |
15 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC44,.28SQ,20 |
4.5 V/us |
Buffer Amplifiers |
9 V/us |
18 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
50 nA |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N44 |
3 |
0.035 in (0.9 mm) |
0.276 in (7 mm) |
No |
10 MHz |
e3 |
0.276 in (7 mm) |
||||||||||||||||||||
|
Renesas Electronics |
Buffer |
Industrial |
No Lead |
10 |
HVSON |
Square |
Plastic/Epoxy |
15 mV |
1 μA |
Yes |
1 |
18 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
Buffer Amplifiers |
116 V/us |
20 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
S-PDSO-N10 |
1 |
0.033 in (0.85 mm) |
0.118 in (3 mm) |
60 MHz |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||||||||||||
Renesas Electronics |
Buffer |
Industrial |
No Lead |
32 |
HVQCCN |
Rectangular |
-9 V |
15 mV |
50 nA |
Yes |
12 |
CMOS |
2.4 mA |
-5 V |
5 V |
5/±5/15 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2X.24,20 |
0.9 V/us |
Buffer Amplifiers |
2.2 V/us |
9 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
50 nA |
-40 °C (-40 °F) |
Tin Lead |
Quad |
R-XQCC-N32 |
1 |
0.039 in (1 mm) |
0.197 in (5 mm) |
No |
2.5 MHz |
e0 |
0.236 in (6 mm) |
|||||||||||||||||||||
|
Renesas Electronics |
Buffer |
Industrial |
No Lead |
32 |
HVQCCN |
Rectangular |
-9 V |
15 mV |
50 nA |
Yes |
12 |
CMOS |
2.4 mA |
-5 V |
5 V |
5/±5/15 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2X.24,20 |
0.9 V/us |
Buffer Amplifiers |
9 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
50 nA |
-40 °C (-40 °F) |
Matte Tin |
Quad |
R-XQCC-N32 |
3 |
0.039 in (1 mm) |
0.197 in (5 mm) |
No |
2.5 MHz |
e3 |
0.236 in (6 mm) |
|||||||||||||||||||||
Renesas Electronics |
Buffer |
Industrial |
No Lead |
24 |
HVQCCN |
Rectangular |
-9 V |
15 mV |
50 nA |
Yes |
1 |
CMOS |
1.4 mA |
-5 V |
Tape And Reel |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC24,.16X.2,20 |
0.9 V/us |
Buffer Amplifiers |
2.2 V/us |
9 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
50 nA |
-40 °C (-40 °F) |
Quad |
R-XQCC-N24 |
0.039 in (1 mm) |
0.157 in (4 mm) |
2.5 MHz |
0.197 in (5 mm) |
Buffer amplifiers are electronic circuits that are designed to provide a high input impedance and a low output impedance. They are used to isolate one part of a circuit from another, preventing changes in one part of the circuit from affecting the other.
The primary function of a buffer amplifier is to prevent loading effects, which occur when a device with a low input impedance is connected to a device with a high output impedance. In this scenario, the high output impedance of the first device may cause a decrease in signal strength or distortion in the second device.
By using a buffer amplifier, the high output impedance of the first device is isolated from the second device, ensuring that the signal is transferred with minimal distortion. The buffer amplifier acts as a bridge between the two devices, allowing them to operate independently.
Buffer amplifiers are commonly used in audio applications, such as preamplifiers, where they can be used to isolate a sensitive input signal from a power amplifier that requires a low impedance input. They are also used in other applications, such as instrumentation, signal conditioning, and data acquisition, where signal integrity is critical.