Analog Devices Buffer Amplifiers 250
| Part | RoHS | Manufacturer | Amplifier Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Nominal Unity Gain Bandwidth | Maximum Negative Supply Voltage Limit | Low-Bias | Maximum Input Offset Voltage | Maximum Average Bias Current (IIB) | Surface Mount | No. of Functions | Minimum Common Mode Reject Ratio | Technology | Screening Level | Nominal Common Mode Reject Ratio | Maximum Supply Current | Nominal Negative Supply Voltage (Vsup) | Architecture | Programmable Power | Packing Method | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Slew Rate | Sub-Category | Nominal Slow Rate | Maximum Supply Voltage Limit | Terminal Pitch | Maximum Operating Temperature | Maximum Bias Current (IIB) @25C | Frequency Compensation | Minimum Voltage Gain | Minimum Operating Temperature | Terminal Finish | Terminal Position | Low-Offset | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Minimum Output Current | Nominal Bandwidth (3dB) | Micropower | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Wideband | Power |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
Buffer |
Automotive |
No Lead |
16 |
HVQCCN |
Square |
Yes |
1 |
3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
Buffer Amplifiers |
6 V |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N16 |
3 |
0.035 in (0.9 mm) |
0.118 in (3 mm) |
No |
35 mA |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||||||||||||||||
|
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
10 uA |
Yes |
1 |
Bipolar |
7.4 mA |
3 V |
3/5 V |
Small Outline, Low Profile, Shrink Pitch |
TSOP6,.11,37 |
Buffer Amplifiers |
7 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G6 |
1 |
0.057 in (1.45 mm) |
0.064 in (1.625 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.114 in (2.9 mm) |
||||||||||||||||||||||||
|
|
Analog Devices |
Buffer |
Automotive |
No Lead |
16 |
HVQCCN |
Square |
Yes |
1 |
Tape And Reel |
3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
Buffer Amplifiers |
6 V |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N16 |
3 |
0.035 in (0.9 mm) |
0.118 in (3 mm) |
No |
35 mA |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||||||||||||||
|
|
Analog Devices |
Buffer |
Automotive |
No Lead |
16 |
HVQCCN |
Square |
Yes |
1 |
3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
Buffer Amplifiers |
6 V |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N16 |
3 |
0.035 in (0.9 mm) |
0.118 in (3 mm) |
No |
35 mA |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||||||||||||||||
|
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
5 |
LSSOP |
Rectangular |
Plastic/Epoxy |
-6 V |
15 mV |
10 uA |
Yes |
1 |
Bipolar |
4 mA |
-5 V |
5 V |
±5 V |
Small Outline, Low Profile, Shrink Pitch |
TSOP5/6,.11,37 |
Buffer Amplifiers |
4200 V/us |
6 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
10 uA |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G5 |
1 |
0.057 in (1.45 mm) |
0.064 in (1.625 mm) |
No |
660 MHz |
e3 |
30 s |
260 °C (500 °F) |
0.114 in (2.9 mm) |
||||||||||||||||||
|
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
-18 V |
350 µV |
2 pA |
Yes |
4 |
Bipolar |
1.2 mA |
-5 V |
Tape And Reel, 7 inch |
5 V |
±5/±15 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
Buffer Amplifiers |
0.8 V/us |
18 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
3 pA |
-40 °C (-40 °F) |
Matte Tin |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
3.3 MHz |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||||
|
|
Analog Devices |
Buffer |
Other |
No Lead |
8 |
HVSON |
Square |
Plastic/Epoxy |
-22 V |
800 uA |
Yes |
1 |
Bipolar |
10 mA |
-10 V |
10 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
SOLCC8,.11,20 |
75 V/us |
Buffer Amplifiers |
22 V |
0.02 in (0.5 mm) |
100 °C (212 °F) |
500 uA |
0 °C (32 °F) |
Matte Tin |
Dual |
S-PDSO-N8 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||||||||
|
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
10 uA |
Yes |
1 |
Bipolar |
7.4 mA |
3 V |
3/5 V |
Small Outline, Low Profile, Shrink Pitch |
TSOP6,.11,37 |
Buffer Amplifiers |
7 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G6 |
1 |
0.057 in (1.45 mm) |
0.064 in (1.625 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.114 in (2.9 mm) |
||||||||||||||||||||||||
|
|
Analog Devices |
Buffer |
Automotive |
No Lead |
16 |
HVQCCN |
Square |
Yes |
1 |
BICMOS |
Tape And Reel |
3.3 V |
Chip Carrier |
Buffer Amplifiers |
6 V |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N16 |
3 |
0.035 in (0.9 mm) |
0.118 in (3 mm) |
No |
e3 |
40 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||||||||||||||
|
|
Analog Devices |
Buffer |
Other |
No Lead |
8 |
HVSON |
Square |
Plastic/Epoxy |
-22 V |
800 uA |
Yes |
1 |
Bipolar |
10 mA |
-10 V |
Tape And Reel |
10 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
SOLCC8,.11,20 |
75 V/us |
Buffer Amplifiers |
22 V |
0.02 in (0.5 mm) |
100 °C (212 °F) |
500 uA |
0 °C (32 °F) |
Matte Tin |
Dual |
S-PDSO-N8 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||||||
|
|
Analog Devices |
Buffer |
Other |
Through-Hole |
5 |
Rectangular |
Plastic/Epoxy |
-22 V |
800 uA |
No |
1 |
Bipolar |
10 mA |
-10 V |
10 V |
Flange Mount |
ZIP5,.15,.17,67TB |
75 V/us |
Buffer Amplifiers |
22 V |
100 °C (212 °F) |
500 uA |
0 °C (32 °F) |
Matte Tin Over Nickel |
Zig-Zag |
R-PZFM-T5 |
1 |
No |
e3 |
||||||||||||||||||||||||||||
|
|
Analog Devices |
Buffer |
Automotive |
No Lead |
16 |
HVQCCN |
Square |
Yes |
1 |
3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
Buffer Amplifiers |
6 V |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N16 |
3 |
0.035 in (0.9 mm) |
0.118 in (3 mm) |
No |
35 mA |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||||||||||||||||
|
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
-6 V |
15 mV |
10 uA |
Yes |
2 |
Bipolar |
4 mA |
-5 V |
5 V |
±5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Buffer Amplifiers |
4200 V/us |
6 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
10 uA |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
720 MHz |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||||
|
|
Analog Devices |
Buffer |
Automotive |
No Lead |
16 |
HVQCCN |
Square |
Yes |
1 |
3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
Buffer Amplifiers |
6 V |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N16 |
3 |
0.035 in (0.9 mm) |
0.118 in (3 mm) |
No |
35 mA |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||||||||||||||||
|
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
-18 V |
600 µV |
10 pA |
Yes |
4 |
Bipolar |
1.2 mA |
-5 V |
Tape And Reel, 7 inch |
5 V |
±5/±15 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
Buffer Amplifiers |
0.8 V/us |
18 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
10 pA |
-40 °C (-40 °F) |
Matte Tin |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
3.3 MHz |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||||
|
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
-6 V |
27 mV |
9.5 uA |
Yes |
3 |
30 mA |
-5 V |
5 V |
±5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP16,.25 |
Buffer Amplifiers |
1600 V/us |
6 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
9.5 uA |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G16 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
600 MHz |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
|||||||||||||||||||
|
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
0 V |
15 mV |
12 uA |
Yes |
1 |
Bipolar |
7 mA |
0 V |
5 V |
3.3/5/±5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Buffer Amplifiers |
600 V/us |
12 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
60 mA |
230 MHz |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
-6 V |
40 mV |
10 uA |
Yes |
3 |
30 mA |
-5 V |
Tape And Reel, 7 inch |
5 V |
±5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP16,.25 |
Buffer Amplifiers |
1350 V/us |
6 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
10 uA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G16 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
550 MHz |
e0 |
240 °C (464 °F) |
0.197 in (5 mm) |
||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
-6.3 V |
20 mV |
10 uA |
Yes |
2 |
11.5 mA |
-5 V |
Tape And Reel |
5 V |
±5 V |
Small Outline |
SOP8,.25 |
Buffer Amplifiers |
800 V/us |
6.3 V |
0.05 in (1.27 mm) |
85 °C (185 °F) |
6 uA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
260 MHz |
e0 |
240 °C (464 °F) |
0.193 in (4.9 mm) |
||||||||||||||||||||
|
Analog Devices |
Buffer |
Other |
Through-Hole |
12 |
QIP |
Square |
Metal |
25 mV |
No |
1 |
Hybrid |
25 mA |
-15 V |
15 V |
±15 V |
In-Line |
QUAD12,.4SQ |
1000 V/us |
Buffer Amplifiers |
0.1 in (2.54 mm) |
85 °C (185 °F) |
5 nA |
-25 °C (-13 °F) |
Tin/Lead |
Quad |
S-MQIP-T12 |
No |
100 MHz |
e0 |
||||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
-6 V |
40 mV |
10 uA |
Yes |
3 |
30 mA |
-5 V |
5 V |
±5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP16,.25 |
Buffer Amplifiers |
1350 V/us |
6 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
10 uA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G16 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
550 MHz |
e0 |
240 °C (464 °F) |
0.197 in (5 mm) |
|||||||||||||||||||||
|
|
Analog Devices |
Buffer |
Automotive |
No Lead |
16 |
HVQCCN |
Square |
Yes |
2 |
Tape And Reel |
3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
Buffer Amplifiers |
6 V |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N16 |
3 |
0.035 in (0.9 mm) |
0.118 in (3 mm) |
No |
35 mA |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||||||||||||||
|
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
-6 V |
15 mV |
10 uA |
Yes |
2 |
Bipolar |
4 mA |
-5 V |
5 V |
±5 V |
Small Outline |
SOP8,.25 |
Buffer Amplifiers |
4200 V/us |
6 V |
0.05 in (1.27 mm) |
85 °C (185 °F) |
10 uA |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
720 MHz |
e3 |
30 s |
260 °C (500 °F) |
0.193 in (4.9 mm) |
||||||||||||||||||
|
Analog Devices |
Buffer |
Military |
Flat |
16 |
DFP |
Rectangular |
100k Rad(Si) |
Ceramic, Metal-Sealed Cofired |
Yes |
1 |
MIL-PRF-38535 Class V |
3.3 V |
Flatpack |
Buffer Amplifiers |
6 V |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-CDFP-F16 |
Yes |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
24 |
TSSOP |
Rectangular |
Plastic/Epoxy |
20 mV |
50 nA |
Yes |
6 |
CMOS |
Tape And Reel, 7 inch |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
Buffer Amplifiers |
7 V/us |
7 V |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G24 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e0 |
240 °C (464 °F) |
0.307 in (7.8 mm) |
||||||||||||||||||||||||||
|
|
Analog Devices |
Buffer |
Other |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
-22 V |
800 uA |
No |
1 |
Bipolar |
10 mA |
-10 V |
10 V |
In-Line |
DIP8,.3 |
75 V/us |
Buffer Amplifiers |
22 V |
0.1 in (2.54 mm) |
100 °C (212 °F) |
500 uA |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDIP-T8 |
1 |
0.155 in (3.937 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.4 in (10.16 mm) |
|||||||||||||||||||||
|
|
Analog Devices |
Buffer |
Automotive |
Gull Wing |
8 |
TSSOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
BICMOS |
2.3 mA |
5 V |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Buffer Amplifiers |
0.025 in (0.635 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G8 |
1 |
No |
e3 |
30 s |
260 °C (500 °F) |
|||||||||||||||||||||||||||||
|
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
-6 V |
27 mV |
9.5 uA |
Yes |
3 |
30 mA |
-5 V |
Tape And Reel, 7 inch |
5 V |
±5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP16,.25 |
Buffer Amplifiers |
1600 V/us |
6 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
9.5 uA |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G16 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
600 MHz |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||||||
|
|
Analog Devices |
Buffer |
Automotive |
No Lead |
16 |
HVQCCN |
Square |
Yes |
2 |
3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
Buffer Amplifiers |
6 V |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N16 |
3 |
0.035 in (0.9 mm) |
0.118 in (3 mm) |
No |
35 mA |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Other |
No Lead |
8 |
HVSON |
Square |
Plastic/Epoxy |
-22 V |
800 uA |
Yes |
1 |
Bipolar |
10 mA |
-10 V |
10 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
SOLCC8,.11,20 |
75 V/us |
Buffer Amplifiers |
22 V |
0.02 in (0.5 mm) |
100 °C (212 °F) |
500 uA |
0 °C (32 °F) |
Tin Lead |
Dual |
S-PDSO-N8 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e0 |
0.118 in (3 mm) |
||||||||||||||||||||||||
|
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
16 |
SSOP |
Rectangular |
Plastic/Epoxy |
70 mV |
Yes |
3 |
Bipolar |
-5 V |
5 V |
Small Outline, Shrink Pitch |
Buffer Amplifiers |
2500 V/us |
6.6 V |
0.025 in (0.635 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G16 |
1 |
0.068 in (1.727 mm) |
0.154 in (3.899 mm) |
No |
650 MHz |
e3 |
30 s |
260 °C (500 °F) |
0.193 in (4.89 mm) |
||||||||||||||||||||||||
|
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
-6 V |
15 mV |
10 uA |
Yes |
1 |
Bipolar |
4 mA |
-5 V |
5 V |
±5 V |
Small Outline |
SOP8,.25 |
Buffer Amplifiers |
4200 V/us |
6 V |
0.05 in (1.27 mm) |
85 °C (185 °F) |
10 uA |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
660 MHz |
e3 |
30 s |
260 °C (500 °F) |
0.193 in (4.9 mm) |
||||||||||||||||||
|
Analog Devices |
Buffer |
Commercial |
Wire |
8 |
Round |
Metal |
-18 V |
14 mV |
5 nA |
No |
1 |
25 mA |
-15 V |
15 V |
±15 V |
Cylindrical |
CAN8,.2 |
220 V/us |
Buffer Amplifiers |
240 V/us |
18 V |
70 °C (158 °F) |
400 pA |
0 °C (32 °F) |
Tin Lead |
Bottom |
O-MBCY-W8 |
No |
83 MHz |
e0 |
|||||||||||||||||||||||||||
|
|
Analog Devices |
Buffer |
Automotive |
No Lead |
16 |
HVQCCN |
Square |
Yes |
1 |
BICMOS |
3.3 V |
Chip Carrier |
Buffer Amplifiers |
6 V |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N16 |
3 |
0.035 in (0.9 mm) |
0.118 in (3 mm) |
No |
e3 |
40 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||||||||||||||||
|
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
5 |
LSSOP |
Rectangular |
Plastic/Epoxy |
0 V |
20 mV |
20 uA |
Yes |
1 |
0 V |
5 V |
Small Outline, Low Profile, Shrink Pitch |
Buffer Amplifiers |
600 V/us |
12 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G5 |
1 |
0.057 in (1.45 mm) |
0.064 in (1.625 mm) |
No |
60 mA |
140 MHz |
e3 |
30 s |
260 °C (500 °F) |
0.114 in (2.9 mm) |
||||||||||||||||||||||
|
|
Analog Devices |
Buffer |
Industrial |
No Lead |
16 |
HVQCCN |
Square |
-6 V |
5 mV |
1 nA |
Yes |
1 |
BICMOS |
7.5 mA |
-5 V |
5 V |
±5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC16,.16SQ,25 |
Buffer Amplifiers |
12 V/us |
12 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Quad |
S-XQCC-N16 |
1 |
0.031 in (0.8 mm) |
0.157 in (4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.157 in (4 mm) |
|||||||||||||||||||||
|
|
Analog Devices |
Buffer |
Automotive |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
60 µV |
Yes |
1 |
BICMOS |
2.3 mA |
0 V |
5 V |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Buffer Amplifiers |
80000 V/us |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||||||||||
|
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
5 |
LSSOP |
Rectangular |
Plastic/Epoxy |
0 V |
15 mV |
12 uA |
Yes |
1 |
Bipolar |
7 mA |
0 V |
5 V |
3.3/5/±5 V |
Small Outline, Low Profile, Shrink Pitch |
TSOP5/6,.11,37 |
Buffer Amplifiers |
600 V/us |
12 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G5 |
1 |
0.057 in (1.45 mm) |
0.064 in (1.625 mm) |
No |
60 mA |
230 MHz |
e3 |
30 s |
260 °C (500 °F) |
0.114 in (2.9 mm) |
||||||||||||||||||
|
|
Analog Devices |
Buffer |
Industrial |
No Lead |
6 |
HVSON |
Square |
Plastic/Epoxy |
41 mV |
Yes |
1 |
1.8 mA |
15 V |
15 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
SOLCC6,.06,20 |
Buffer Amplifiers |
415 V/us |
18 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Nickel PalladiumGold |
Dual |
S-PDSO-N6 |
1 |
0.024 in (0.6 mm) |
0.063 in (1.6 mm) |
No |
400 MHz |
e4 |
30 s |
260 °C (500 °F) |
0.063 in (1.6 mm) |
|||||||||||||||||||||||
|
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
-6.3 V |
20 mV |
10 uA |
Yes |
2 |
-5 V |
5 V |
Small Outline |
Buffer Amplifiers |
800 V/us |
6.3 V |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
260 MHz |
e3 |
30 s |
260 °C (500 °F) |
0.193 in (4.9 mm) |
|||||||||||||||||||||||
|
|
Analog Devices |
Buffer |
No Lead |
16 |
Square |
Plastic/Epoxy |
Yes |
Chip Carrier |
Buffer Amplifiers |
Matte Tin |
Quad |
S-PQCC-N16 |
1 |
No |
e3 |
||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Military |
Gull Wing |
8 |
SOP |
Rectangular |
Ceramic |
8 mV |
Yes |
1 |
Bipolar |
26 mA |
-5 V |
5 V |
±5 V |
Small Outline |
SOP8,.45 |
800 V/us |
Buffer Amplifiers |
0.05 in (1.27 mm) |
125 °C (257 °F) |
25 uA |
-55 °C (-67 °F) |
Tin/Lead |
Dual |
R-XDSO-G8 |
No |
550 MHz |
e0 |
||||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Military |
Through-Hole |
8 |
DIP |
Rectangular |
Ceramic |
8 mV |
No |
1 |
Bipolar |
26 mA |
-5 V |
5 V |
±5 V |
In-Line |
DIP8,.3 |
800 V/us |
Buffer Amplifiers |
0.1 in (2.54 mm) |
125 °C (257 °F) |
25 uA |
-55 °C (-67 °F) |
Tin/Lead |
Dual |
R-XDIP-T8 |
No |
550 MHz |
e0 |
||||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
16 |
SSOP |
Rectangular |
Plastic/Epoxy |
70 mV |
Yes |
3 |
Bipolar |
-5 V |
Tape And Reel |
5 V |
Small Outline, Shrink Pitch |
Buffer Amplifiers |
2500 V/us |
6.6 V |
0.025 in (0.635 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G16 |
1 |
0.068 in (1.727 mm) |
0.154 in (3.899 mm) |
No |
650 MHz |
e0 |
0.193 in (4.89 mm) |
||||||||||||||||||||||||||
|
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
24 |
TSSOP |
Rectangular |
Plastic/Epoxy |
20 mV |
50 nA |
Yes |
6 |
CMOS |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
Buffer Amplifiers |
7 V/us |
7 V |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G24 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.307 in (7.8 mm) |
|||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
-7 V |
8 mV |
25 uA |
Yes |
1 |
Bipolar |
26 mA |
-5 V |
5 V |
±5 V |
Small Outline |
SOP8,.25 |
0.7 V/us |
Buffer Amplifiers |
1200 V/us |
7 V |
0.05 in (1.27 mm) |
85 °C (185 °F) |
25 uA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G8 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
50 mA |
120 MHz |
e0 |
0.193 in (4.9 mm) |
||||||||||||||||||||
|
Analog Devices |
Buffer |
Commercial |
Gull Wing |
16 |
SSOP |
Rectangular |
Plastic/Epoxy |
70 mV |
Yes |
3 |
Bipolar |
-5 V |
Tape And Reel |
5 V |
Small Outline, Shrink Pitch |
Buffer Amplifiers |
2500 V/us |
6.6 V |
0.025 in (0.635 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G16 |
1 |
0.068 in (1.727 mm) |
0.154 in (3.899 mm) |
No |
650 MHz |
e0 |
0.193 in (4.89 mm) |
||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
No Lead |
6 |
DIE |
Rectangular |
-18 V |
1 mV |
5 uA |
Yes |
1 |
Bipolar |
8.5 mA |
-15 V |
15 V |
±5/±15 V |
Uncased Chip |
DIE OR CHIP |
2000 V/us |
Buffer Amplifiers |
3000 V/us |
18 V |
85 °C (185 °F) |
5 uA |
-40 °C (-40 °F) |
Tin Lead |
Upper |
R-XUUC-N6 |
No |
110 MHz |
e0 |
Buffer amplifiers are electronic circuits that are designed to provide a high input impedance and a low output impedance. They are used to isolate one part of a circuit from another, preventing changes in one part of the circuit from affecting the other.
The primary function of a buffer amplifier is to prevent loading effects, which occur when a device with a low input impedance is connected to a device with a high output impedance. In this scenario, the high output impedance of the first device may cause a decrease in signal strength or distortion in the second device.
By using a buffer amplifier, the high output impedance of the first device is isolated from the second device, ensuring that the signal is transferred with minimal distortion. The buffer amplifier acts as a bridge between the two devices, allowing them to operate independently.
Buffer amplifiers are commonly used in audio applications, such as preamplifiers, where they can be used to isolate a sensitive input signal from a power amplifier that requires a low impedance input. They are also used in other applications, such as instrumentation, signal conditioning, and data acquisition, where signal integrity is critical.