Part | RoHS | Manufacturer | Capacitor Type | Mounting Feature | Capacitance | Rated DC Voltage (URdc) | Maximum Operating Temperature | Dielectric Material | Minimum Operating Temperature | Temperature Coef (ppm/Cel) | Terminal Finish | No. of Functions | Technology | Package Shape | Maximum Seated Height | No. of Elements | Manufacturer Series | Height | Package Code | Width | Multi-layer | Additional Features | Packing Method | Size Code | JESD-609 Code | Network Type | Series | No. of Terminals | Package Style (Meter) | Rated AC Voltage (URac) | Length | Terminal Shape | Positive Tolerance | Temperature Characteristics Code | Reference Standard | Negative Tolerance | Terminal Pitch |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TDK |
ARRAY/NETWORK CAPACITOR |
SURFACE MOUNT |
.00022 uF |
50 V |
125 Cel |
-55 Cel |
15% |
MATTE TIN OVER NICKEL |
4 |
RECTANGULAR PACKAGE |
.85 mm |
1 |
CHIP |
1.25 mm |
TR, 7 INCH |
e3 |
ISOLATED C NETWORK |
8 |
2 mm |
WRAPAROUND |
20 % |
X7R |
20 % |
.5 mm |
||||||||||||
|
TDK |
ARRAY/NETWORK CAPACITOR |
SURFACE MOUNT |
.1 uF |
16 V |
125 Cel |
-55 Cel |
15% |
MATTE TIN OVER NICKEL |
4 |
RECTANGULAR PACKAGE |
1 mm |
1 |
CHIP |
1.6 mm |
TR, 7 INCH |
ISOLATED C NETWORK |
8 |
3.2 mm |
WRAPAROUND |
20 % |
X7R |
20 % |
.8 mm |
|||||||||||||
|
TDK |
ARRAY/NETWORK CAPACITOR |
SURFACE MOUNT |
1 uF |
6.3 V |
85 Cel |
-55 Cel |
15% |
MATTE TIN OVER NICKEL |
4 |
RECTANGULAR PACKAGE |
1 mm |
1 |
CHIP |
1.6 mm |
TR, 7 INCH |
e3 |
ISOLATED C NETWORK |
8 |
3.2 mm |
WRAPAROUND |
20 % |
X5R |
20 % |
.8 mm |
||||||||||||
|
TDK |
ARRAY/NETWORK CAPACITOR |
SURFACE MOUNT |
1 uF |
16 V |
85 Cel |
-55 Cel |
15% |
Tin (Sn) - with Nickel (Ni) barrier |
2 |
RECTANGULAR PACKAGE |
.85 mm |
1 |
CHIP |
1.25 mm |
e3 |
ISOLATED C NETWORK |
4 |
2 mm |
WRAPAROUND |
20 % |
X5R |
20 % |
1 mm |
|||||||||||||
|
TDK |
ARRAY/NETWORK CAPACITOR |
SURFACE MOUNT |
.01 uF |
25 V |
125 Cel |
-55 Cel |
15% |
MATTE TIN OVER NICKEL |
4 |
RECTANGULAR PACKAGE |
.85 mm |
1 |
CHIP |
1.25 mm |
TR, 7 INCH |
e3 |
ISOLATED C NETWORK |
8 |
2 mm |
WRAPAROUND |
20 % |
X7R |
20 % |
.5 mm |
||||||||||||
|
TDK |
ARRAY/NETWORK CAPACITOR |
SURFACE MOUNT |
.001 uF |
50 V |
125 Cel |
-55 Cel |
15% |
MATTE TIN OVER NICKEL |
4 |
RECTANGULAR PACKAGE |
.85 mm |
1 |
CHIP |
1.25 mm |
TR, 7 INCH |
e3 |
ISOLATED C NETWORK |
8 |
2 mm |
WRAPAROUND |
20 % |
X7R |
20 % |
.5 mm |
||||||||||||
|
TDK |
ARRAY/NETWORK CAPACITOR |
SURFACE MOUNT |
.000047 uF |
50 V |
125 Cel |
CERAMIC |
-55 Cel |
30ppm/Cel |
MATTE TIN OVER NICKEL |
4 |
RECTANGULAR PACKAGE |
1 mm |
1 |
1 mm |
CHIP |
3.2 mm |
TR, 7 INCH |
0612 |
e3 |
ISOLATED C NETWORK |
8 |
SMT |
1.6 mm |
WRAPAROUND |
10 % |
C0G |
10 % |
|||||||||
|
TDK |
ARRAY/NETWORK CAPACITOR |
SURFACE MOUNT |
.000033 uF |
50 V |
125 Cel |
-55 Cel |
30ppm/Cel |
MATTE TIN OVER NICKEL |
4 |
RECTANGULAR PACKAGE |
1 mm |
1 |
CHIP |
1.6 mm |
TR, 7 INCH |
e3 |
ISOLATED C NETWORK |
8 |
3.2 mm |
WRAPAROUND |
10 % |
C0G |
10 % |
.8 mm |
||||||||||||
|
TDK |
ARRAY/NETWORK CAPACITOR |
SURFACE MOUNT |
.01 uF |
25 V |
125 Cel |
-55 Cel |
15% |
MATTE TIN OVER NICKEL |
2 |
RECTANGULAR PACKAGE |
.6 mm |
1 |
CHIP |
1 mm |
e3 |
ISOLATED C NETWORK |
4 |
1.37 mm |
WRAPAROUND |
20 % |
X7R |
20 % |
.64 mm |
|||||||||||||
|
TDK |
ARRAY/NETWORK CAPACITOR |
SURFACE MOUNT |
.01 uF |
25 V |
125 Cel |
-55 Cel |
15% |
Tin (Sn) - with Nickel (Ni) barrier |
2 |
RECTANGULAR PACKAGE |
.6 mm |
1 |
CHIP |
1 mm |
e3 |
ISOLATED C NETWORK |
4 |
1.37 mm |
WRAPAROUND |
20 % |
X7R |
20 % |
.64 mm |
|||||||||||||
|
TDK |
ARRAY/NETWORK CAPACITOR |
SURFACE MOUNT |
.01 uF |
25 V |
125 Cel |
-55 Cel |
15% |
Matte Tin (Sn) - with Nickel (Ni) barrier |
2 |
RECTANGULAR PACKAGE |
.6 mm |
1 |
CHIP |
1 mm |
e3 |
ISOLATED C NETWORK |
4 |
1.37 mm |
WRAPAROUND |
20 % |
X7R |
AEC-Q200 |
20 % |
.64 mm |
||||||||||||
|
TDK |
ARRAY/NETWORK CAPACITOR |
SURFACE MOUNT |
.1 uF |
6.3 V |
85 Cel |
-55 Cel |
15% |
MATTE TIN OVER NICKEL |
4 |
RECTANGULAR PACKAGE |
.85 mm |
1 |
CHIP |
1.25 mm |
TR, 7 INCH |
e3 |
ISOLATED C NETWORK |
8 |
2 mm |
WRAPAROUND |
20 % |
X5R |
20 % |
.5 mm |
||||||||||||
|
TDK |
ARRAY/NETWORK CAPACITOR |
SURFACE MOUNT |
.00022 uF |
50 V |
125 Cel |
-55 Cel |
30ppm/Cel |
MATTE TIN OVER NICKEL |
4 |
RECTANGULAR PACKAGE |
1 mm |
1 |
CHIP |
1.6 mm |
TR, 7 INCH |
e3 |
ISOLATED C NETWORK |
8 |
3.2 mm |
WRAPAROUND |
10 % |
C0G |
10 % |
.8 mm |
||||||||||||
|
TDK |
ARRAY/NETWORK CAPACITOR |
SURFACE MOUNT |
.01 uF |
50 V |
125 Cel |
-55 Cel |
15% |
MATTE TIN OVER NICKEL |
2 |
RECTANGULAR PACKAGE |
.85 mm |
1 |
CHIP |
1.25 mm |
e3 |
ISOLATED C NETWORK |
4 |
2 mm |
WRAPAROUND |
20 % |
X7R |
20 % |
1 mm |
Capacitor arrays and networks are electronic components that are used to provide multiple capacitors in a single package or integrated circuit. They are used in a variety of electronic circuits and applications, where multiple capacitors of different values and types are required.
Capacitor arrays and networks consist of a group of capacitors that are connected together in a specific configuration. The individual capacitors within the array or network can be connected in parallel, series, or a combination of both, depending on the desired capacitance and voltage ratings.
Capacitor arrays and networks are commonly used in applications where space is limited or where a high density of capacitance is required. They are frequently used in filter circuits, oscillators, and timing circuits, where multiple capacitors of different values are required to set the frequency or time constant of the circuit.
One of the advantages of capacitor arrays and networks is that they provide a compact and cost-effective solution for providing multiple capacitors in a single package. They also provide a high level of consistency and precision in their capacitance values, which can be important for many electronic applications.
Capacitor arrays and networks can be made using a variety of capacitor technologies, including ceramic, tantalum, aluminum electrolytic, and film capacitors. The choice of technology depends on the specific requirements of the application, such as operating voltage, temperature range, and stability.