.7 A Assembly Products 3

Reset All

Part	Manufacturer	Connector Accessory Type	Rated Current	Approvals (V)	Usage	Minimum Wire Size	Terminal Type	MIL Conformity	Minimum Cable Entry	Maximum Wire Size	Maximum Operating Temperature	DIN Conformity	Rated AC Voltage	Maximum Cable Entry	IEC Conformity	Minimum Operating Temperature	Contact Gender	Assembly Item Name	Contact Resistance	Mounting Style	Additional Features	Material	Terminal Length	Rated DC Voltage
DF20F-3032SCFA(41)	Hirose Electric	CONNECTOR ACCESSORY	.7 A			32 AWG	CRIMP	NO	.0236 inch	30 AWG	85 Cel	NO	100 V	.0197 inch	NO	-35 Cel	FEMALE	CONTACT	30 mohm	STRAIGHT	CONTACT FINISH - GOLD	PHOSPHOR BRONZE	.079 inch
SMM-003T-P0.5	J S T Mfg	CONNECTOR ACCESSORY	.7 A	CSA; UL	ZM CONNECTOR	30 AWG	CRIMP	NO	.028 inch	28 AWG	85 Cel	NO	50 V	.035 inch	NO	-25 Cel	MALE	CONTACT	30 mohm	STRAIGHT	CONTACT FINISH: TIN	PHOSPHOR BRONZE	.087 inch	50 V
SZN-002T-P0.7K	J S T Mfg	CONNECTOR ACCESSORY	.7 A	CSA; UL	SZN CONNECTOR	28 AWG	CRIMP	NO	.031 inch	26 AWG	85 Cel	NO	50 V	.043 inch	NO	-25 Cel	MALE	CONTACT		STRAIGHT	CONTACT FINISH: TIN	PHOSPHOR BRONZE	.087 inch	50 V

Assembly Products

Assembly products refer to the components that are used to assemble and connect semiconductor devices, such as integrated circuits (ICs) and transistors. These components are critical in the manufacturing and assembly of electronic systems and are designed to provide a reliable and secure connection between the semiconductor device and other electronic components.

Some common assembly products in semiconductor connector accessories include:

Socket connectors: These connectors are used to provide a temporary or permanent connection between the semiconductor device and a circuit board. They are typically designed with a precision contact system that ensures a secure and reliable connection.

Adapters: Adapters are used to enable compatibility between different types of connectors, so that a semiconductor device can be connected to a different type of connector than the one it was originally designed for.

Interface connectors: These connectors are designed to provide a high-speed data transfer between semiconductor devices and other electronic components. They are typically used in high-performance applications, such as data centers, supercomputers, and high-speed communication systems.

Wire bonding products: Wire bonding products are used to connect the semiconductor device to the lead frame or substrate. These products include wire bonders, bond wires, and bonding materials.

Thermal management products: These products are designed to manage the heat generated by the semiconductor device, and ensure that it operates within safe temperature limits. Thermal management products include heat sinks, thermal interface materials, and thermal pads.