32 A Assembly Products 16

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Part	Manufacturer	Connector Accessory Type	Rated Current	Approvals (V)	Usage	Cross Section Area	Finish Thickness	Minimum Wire Size	Terminal Type	MIL Conformity	Maximum Wire Size	Insulator Material	Maximum Operating Temperature	DIN Conformity	Cable Types	Rated AC Voltage	Maximum Cable Entry	IEC Conformity	Minimum Operating Temperature	Wire Gauge (AWG)	Contact Gender	Assembly Item Name	Manufacturer Series	Design	Mounting Style	Contact Style	Additional Features	Material	Rated DC Voltage
193841-1	TE Connectivity	CONNECTOR ACCESSORY	32 A	CSA; UL; VDE	193842-1		400		CRIMP	NO			105 Cel	NO	DISCRETE WIRE			NO	-55 Cel		MALE	CONTACT		POWER	STRAIGHT		UNDERPLATING THICKNESS (80), TERMINATION: SILVER (200) OVER NICKEL	COPPER ALLOY	600 V
193842-1	TE Connectivity	CONNECTOR ACCESSORY	32 A	CSA; UL; VDE			200	14 AWG	CRIMP	NO	12 AWG		105 Cel	NO		600 V		NO	-55 Cel		FEMALE	CONTACT		POWER	STRAIGHT	ROUND PIN-SOCKET		COPPER ALLOY
212008-1	TE Connectivity	CONNECTOR ACCESSORY	32 A		AMPLIMITE	3.31 mm2	50	14 AWG	CRIMP	NO	12 AWG		125 Cel	NO			.006 inch	NO	-55 Cel	12	FEMALE	CONTACT		POWER	STRAIGHT			COPPER ALLOY
1SNK905310R0000	TE Connectivity	TERMINAL BLOCK ACCESSORY	32 A	CSA; IEC; UL						NO	0 AWG	POLYAMIDE	110 Cel	NO		600 V		NO	-55 Cel	0		JUMPER ITEM						POLYAMIDE	600 V
193796-1	TE Connectivity	CONNECTOR ACCESSORY	32 A	CSA; UL; VDE	193797-1		200		CRIMP	NO	10 AWG		105 Cel	NO		600 V		NO	-55 Cel		MALE	CONTACT		POWER	STRAIGHT	ROUND PIN-SOCKET	UNDERPLATING THICKNESS: (40)	COPPER ALLOY
3030271	Phoenix Contact	TERMINAL BLOCK ACCESSORY	32 A							NO				NO				NO				PLUG-IN BRIDGE	3030271
1SNK905302R0000	TE Connectivity	TERMINAL BLOCK ACCESSORY	32 A								0 AWG	POLYAMIDE	110 Cel			600 V			-55 Cel	0									600 V
212014-1	TE Connectivity	CONNECTOR ACCESSORY	32 A		AMPLIMITE	1.4 mm2	50	18 AWG	CRIMP	NO	16 AWG		125 Cel	NO			.004 inch	NO	-55 Cel	16	FEMALE	CONTACT		POWER	STRAIGHT		TERMINATION: GOLD	COPPER ALLOY
1SNK905303R0000	TE Connectivity	CONNECTOR ACCESSORY	32 A								0 AWG	POLYAMIDE	110 Cel			600 V			-55 Cel	0									600 V
1SNK905305R0000	TE Connectivity	CONNECTOR ACCESSORY	32 A								0 AWG	POLYAMIDE	110 Cel			600 V			-55 Cel	0									600 V
3030365	Phoenix Contact	TERMINAL BLOCK ACCESSORY	32 A							NO				NO				NO				BLOCK
3030255	Phoenix Contact	TERMINAL BLOCK ACCESSORY	32 A							NO				NO				NO				PLUG-IN BRIDGE
211161-1	TE Connectivity	CONNECTOR ACCESSORY	32 A		AMPLIMITE		50		CRIMP	NO	8 AWG		125 Cel	NO			.009 inch	NO	-55 Cel	8	FEMALE	CONTACT		POWER	STRAIGHT			COPPER ALLOY
212013-1	TE Connectivity	CONNECTOR ACCESSORY	32 A		AMPLIMITE	1.4 mm2	50	18 AWG	CRIMP	NO	16 AWG		125 Cel	NO			.004 inch	NO	-55 Cel	16	MALE	CONTACT		POWER	STRAIGHT			COPPER ALLOY
FBS10-6	Phoenix Contact	TERMINAL BLOCK ACCESSORY	32 A							NO				NO				NO				PLUG-IN BRIDGE	FBS10-6
FBS4-6	Phoenix Contact	TERMINAL BLOCK ACCESSORY	32 A							NO				NO				NO				PLUG-IN BRIDGE

Assembly Products

Assembly products refer to the components that are used to assemble and connect semiconductor devices, such as integrated circuits (ICs) and transistors. These components are critical in the manufacturing and assembly of electronic systems and are designed to provide a reliable and secure connection between the semiconductor device and other electronic components.

Some common assembly products in semiconductor connector accessories include:

Socket connectors: These connectors are used to provide a temporary or permanent connection between the semiconductor device and a circuit board. They are typically designed with a precision contact system that ensures a secure and reliable connection.

Adapters: Adapters are used to enable compatibility between different types of connectors, so that a semiconductor device can be connected to a different type of connector than the one it was originally designed for.

Interface connectors: These connectors are designed to provide a high-speed data transfer between semiconductor devices and other electronic components. They are typically used in high-performance applications, such as data centers, supercomputers, and high-speed communication systems.

Wire bonding products: Wire bonding products are used to connect the semiconductor device to the lead frame or substrate. These products include wire bonders, bond wires, and bonding materials.

Thermal management products: These products are designed to manage the heat generated by the semiconductor device, and ensure that it operates within safe temperature limits. Thermal management products include heat sinks, thermal interface materials, and thermal pads.