50 A Assembly Products 13

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Part	Manufacturer	Connector Accessory Type	Rated Voltage	Rated Current	Approvals (V)	Usage	Cross Section Area	Finish Thickness	Construction	Minimum Wire Size	Terminal Type	MIL Conformity	Maximum Wire Size	Maximum Operating Temperature	DIN Conformity	Cable Types	Rated AC Voltage	Maximum Cable Entry	Contact Design	IEC Conformity	Minimum Operating Temperature	Wire Gauge (AWG)	Contact Gender	Assembly Item Name	Manufacturer Series	Design	Mounting Style	Contact Style	Additional Features	Material	Rated DC Voltage
647878-1	TE Connectivity	CONNECTOR ACCESSORY	600 V	50 A	UL		8.5 mm2	50	STRANDED		CRIMP	NO	8 AWG	105 Cel	NO	DISCRETE WIRE				NO	-40 Cel	8	MALE	CONTACT		POWER	STRAIGHT		UNDERPLATING THICKNESS (50)	COPPER ALLOY	600 V
213841-3	TE Connectivity	CONNECTOR ACCESSORY	600 V	50 A		CPC CONNECTORS	8 mm2	200		10 AWG	CRIMP		8 AWG	105 Cel							-55 Cel	8	MALE			POWER	STRAIGHT			COPPER ALLOY	600 V
647877-1	TE Connectivity	CONNECTOR ACCESSORY	600 V	50 A	UL		14 mm2	50	STRANDED		CRIMP	NO	6 AWG	105 Cel	NO	DISCRETE WIRE				NO	-40 Cel	6	MALE	CONTACT		POWER	STRAIGHT		UNDERPLATING THICKNESS (50)	COPPER ALLOY	600 V
992G5	Anderson Power Products	CONNECTOR ACCESSORY		50 A	CSA; CUL; UL					16 AWG		NO	6 AWG	105 Cel	NO					NO	-20 Cel			HOUSING	SB					POLYCARBONATE	12 V
42817-0011	Molex	CONNECTOR ACCESSORY		50 A		43818, 43938		100		12 AWG	CRIMP	NO	10 AWG		NO			.209 inch		NO			MALE	CONTACT		POWER	STRAIGHT		CONTACT FINISH: TIN	COPPER ALLOY
1766484-1	TE Connectivity	CONNECTOR ACCESSORY	250 V	50 A				30			CRIMP		6 AWG									6				POWER				COPPER ALLOY
213845-3	TE Connectivity	CONNECTOR ACCESSORY	600 V	50 A		ECONOSEAL METRIMATE SQUARE GRID	3 mm2	200		14 AWG	CRIMP		12 AWG	105 Cel							-55 Cel	12	MALE			POWER	STRAIGHT			COPPER ALLOY	600 V
213845-1	TE Connectivity	CONNECTOR ACCESSORY	600 V	50 A		CPC CONNECTORS	3 mm2	200		14 AWG	CRIMP		12 AWG	105 Cel							-55 Cel	12	MALE			POWER	STRAIGHT			COPPER ALLOY	600 V
0428150012	Molex	CONNECTOR ACCESSORY		50 A		MINI-FIT SR. RECEPTACLE HOUSING 42816		30		10 AWG	CRIMP	NO	12 AWG		NO			.209 inch		NO			FEMALE	CONTACT		POWER		COMPRESSION	TERMINATION: TIN(100) OVER NICKEL
213843-1	TE Connectivity	CONNECTOR ACCESSORY	600 V	50 A			8 mm2	200		10 AWG	CRIMP	NO	8 AWG	105 Cel	NO					NO	-55 Cel	8	FEMALE	CONTACT		POWER	STRAIGHT			COPPER ALLOY	600 V
213843-3	TE Connectivity	CONNECTOR ACCESSORY	600 V	50 A			8 mm2	200		10 AWG	CRIMP		8 AWG	105 Cel							-55 Cel	8	FEMALE			POWER	STRAIGHT			COPPER ALLOY	600 V
213847-2	TE Connectivity	CONNECTOR ACCESSORY	600 V	50 A		ECONOSEAL METRIMATE SQUARE GRID	3 mm2	30	STRANDED	14 AWG	CRIMP	NO	12 AWG	105 Cel	NO		600 V		STAMPED	NO	-55 Cel	12	FEMALE	CONTACT		POWER	STRAIGHT	RND PIN-SKT		COPPER ALLOY	600 V
0913184	Phoenix Contact	TERMINAL BLOCK ACCESSORY		50 A	EAC							NO			NO					NO				SLEEVE

Assembly Products

Assembly products refer to the components that are used to assemble and connect semiconductor devices, such as integrated circuits (ICs) and transistors. These components are critical in the manufacturing and assembly of electronic systems and are designed to provide a reliable and secure connection between the semiconductor device and other electronic components.

Some common assembly products in semiconductor connector accessories include:

Socket connectors: These connectors are used to provide a temporary or permanent connection between the semiconductor device and a circuit board. They are typically designed with a precision contact system that ensures a secure and reliable connection.

Adapters: Adapters are used to enable compatibility between different types of connectors, so that a semiconductor device can be connected to a different type of connector than the one it was originally designed for.

Interface connectors: These connectors are designed to provide a high-speed data transfer between semiconductor devices and other electronic components. They are typically used in high-performance applications, such as data centers, supercomputers, and high-speed communication systems.

Wire bonding products: Wire bonding products are used to connect the semiconductor device to the lead frame or substrate. These products include wire bonders, bond wires, and bonding materials.

Thermal management products: These products are designed to manage the heat generated by the semiconductor device, and ensure that it operates within safe temperature limits. Thermal management products include heat sinks, thermal interface materials, and thermal pads.