6 A Assembly Products 13

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Part	Manufacturer	Connector Accessory Type	Rated Current	Approvals (V)	Usage	Cross Section Area	Finish Thickness	Minimum Wire Size	Terminal Type	MIL Conformity	Minimum Cable Entry	Maximum Wire Size	Insulator Material	Maximum Operating Temperature	DIN Conformity	Cable Types	Rated AC Voltage	Maximum Cable Entry	Contact Design	IEC Conformity	Minimum Operating Temperature	Wire Gauge (AWG)	Contact Gender	Assembly Item Name	Design	Mounting Style	Contact Style	Additional Features	Material	Terminal Length	Rated DC Voltage
3-1447221-4	TE Connectivity	CONNECTOR ACCESSORY	6 A						CRIMP	NO	.063 inch	20 AWG		130 Cel	NO			.075 inch	STAMPED	NO	-30 Cel	20	FEMALE	CONTACT	POWER	STRAIGHT		TERMINATION: TIN
282403-1	TE Connectivity	CONNECTOR ACCESSORY	6 A		PLUG HOUSING	.5 mm2	236.22	22 AWG	CRIMP	NO	.047 inch	20 AWG		125 Cel	NO	DISCRETE WIRE		.063 inch	STAMPED	NO	-40 Cel	20	FEMALE	CONTACT		STRAIGHT			PHOSPHOR BRONZE		24 V
282404-1	TE Connectivity	CONNECTOR ACCESSORY	6 A		CAP HOUSING	.5 mm2	236.22	22 AWG	CRIMP	NO	.055 inch	20 AWG		125 Cel	NO	DISCRETE WIRE		.067 inch	STAMPED	NO	-40 Cel	20	MALE	CONTACT		STRAIGHT	ROUND PIN-SOCKET		BRASS		24 V
2-1703930-1	TE Connectivity	CONNECTOR ACCESSORY	6 A			.35 mm2		24 AWG	CRIMP		.037 inch	22 AWG		105 Cel				.051 inch	STAMPED		-40 Cel	22	FEMALE
2-1703930-2	TE Connectivity	CONNECTOR ACCESSORY	6 A			.35 mm2		24 AWG	CRIMP		.037 inch	22 AWG		170 Cel				.051 inch	STAMPED		-40 Cel	22	FEMALE
1939351-1	TE Connectivity	CONNECTOR ACCESSORY	6 A			1 mm2		18 AWG	CRIMP		.071 inch	17 AWG		100 Cel				.087 inch	STAMPED		-40 Cel	17
171630-1	TE Connectivity	CONNECTOR ACCESSORY	6 A			.5 mm2		24 AWG	CRIMP	NO	.055 inch	20 AWG		105 Cel	NO			.094 inch	STAMPED	NO	-30 Cel	20	FEMALE	CONTACT	POWER	STRAIGHT
709176001443006	KYOCERA AVX	CONNECTOR ACCESSORY	6 A	UL				28 AWG	SURFACE MOUNT	NO	.039 inch	26 AWG	NYLON	125 Cel	NO	WIRE, STRANDED		.028 inch		NO	-40 Cel			CONTACT	POWER AND SIGNAL		IDC		PHOSPHOR BRONZE
SSM-21T-P1.4	J S T Mfg	CONNECTOR ACCESSORY	6 A	TUV; UL	DAC CONNECTOR			22 AWG	CRIMP	NO	.059 inch	18 AWG		85 Cel	NO		300 V	.098 inch		NO	-25 Cel		MALE	CONTACT	POWER	STRAIGHT	ROUND PIN-SOCKET	TIN PLATED	COPPER ALLOY	.169 inch	300 V
709176001432006	KYOCERA AVX	CONNECTOR ACCESSORY	6 A	UL					SURFACE MOUNT	NO	.059 inch	24 AWG	NYLON	125 Cel	NO	WIRE, STRANDED		.039 inch		NO	-40 Cel			CONTACT	POWER AND SIGNAL		IDC		PHOSPHOR BRONZE
1318332-1	TE Connectivity	CONNECTOR ACCESSORY	6 A			1.25 mm2		18 AWG	CRIMP			16 AWG		120 Cel					STAMPED		-40 Cel	16	FEMALE
171630-5	TE Connectivity	CONNECTOR ACCESSORY	6 A			.5 mm2		24 AWG	CRIMP	NO	.055 inch	20 AWG		105 Cel	NO			.094 inch	STAMPED	NO	-30 Cel	20	FEMALE	CONTACT	POWER	STRAIGHT
282374-1	TE Connectivity	CONNECTOR ACCESSORY	6 A			.5 mm2		22 AWG	CRIMP	NO	.055 inch	20 AWG		105 Cel	NO			.067 inch	STAMPED	NO	-30 Cel	20	FEMALE	CONTACT	POWER	STRAIGHT

Assembly Products

Assembly products refer to the components that are used to assemble and connect semiconductor devices, such as integrated circuits (ICs) and transistors. These components are critical in the manufacturing and assembly of electronic systems and are designed to provide a reliable and secure connection between the semiconductor device and other electronic components.

Some common assembly products in semiconductor connector accessories include:

Socket connectors: These connectors are used to provide a temporary or permanent connection between the semiconductor device and a circuit board. They are typically designed with a precision contact system that ensures a secure and reliable connection.

Adapters: Adapters are used to enable compatibility between different types of connectors, so that a semiconductor device can be connected to a different type of connector than the one it was originally designed for.

Interface connectors: These connectors are designed to provide a high-speed data transfer between semiconductor devices and other electronic components. They are typically used in high-performance applications, such as data centers, supercomputers, and high-speed communication systems.

Wire bonding products: Wire bonding products are used to connect the semiconductor device to the lead frame or substrate. These products include wire bonders, bond wires, and bonding materials.

Thermal management products: These products are designed to manage the heat generated by the semiconductor device, and ensure that it operates within safe temperature limits. Thermal management products include heat sinks, thermal interface materials, and thermal pads.