YES Assembly Products 115

Reset All

Part	Manufacturer	Connector Accessory Type	Shielding	Approvals (V)	Usage	Shell Sizes	MIL Conformity	Minimum Cable Entry	Maximum Operating Temperature	DIN Conformity	Maximum Cable Entry	IEC Conformity	Minimum Operating Temperature	Assembly Item Name	Additional Features	Material	Mounting Option-2	Mounting Option-1
1-2308346-3	TE Connectivity	CONNECTOR ACCESSORY	YES	UL		5	NO		90 Cel	NO	.551 inch	NO	-40 Cel	BACKSHELL		STEEL	SCREW	#4-40 UNC
1478763-9	TE Connectivity	CONNECTOR ACCESSORY	YES			1	NO			NO		NO		BACKSHELL	SHIELDED	ZINC ALLOY	SCREW	#4-40
176793-8	TE Connectivity	CONNECTOR ACCESSORY	YES						85 Cel				-55 Cel			STEEL
3-1478762-7	TE Connectivity	CONNECTOR ACCESSORY	YES			4	NO			NO		NO		BACKSHELL	SHIELDED	ZINC ALLOY	SCREW	#4-40
5-1478762-3	TE Connectivity	CONNECTOR ACCESSORY	YES			3	NO		105 Cel	NO		NO	-55 Cel	BACKSHELL	SHIELDED	ZINC
5745171-2	TE Connectivity	CONNECTOR ACCESSORY	YES			1	NO	.19 inch		NO	.53 inch	NO		BACKSHELL	ROHS COMPLIANT, SHIELDED	DIE CAST	SCREW	#4-40
5745172-3	TE Connectivity	CONNECTOR ACCESSORY	YES			2	NO		85 Cel	NO	.225 inch	NO	-55 Cel	BACKSHELL	ROHS COMPLIANT, SHIELDED	DIE CAST	SCREW	#4-40
5745174-2	TE Connectivity	CONNECTOR ACCESSORY	YES			4	NO		85 Cel	NO		NO	-55 Cel	CABLE CLAMP		ZINC ALLOY	SCREW	#4-40
5745175-3	TE Connectivity	CONNECTOR ACCESSORY	YES		PLUG/RECEPTACLE	5	NO		85 Cel	NO	.6 inch	NO	-55 Cel	BACKSHELL	ROHS COMPLIANT, SHIELDED	DIE CAST	SCREW	#4-40
5745653-3	TE Connectivity	CONNECTOR ACCESSORY	YES		PLUG/RECEPTACLE	3	NO	.25 inch	105 Cel	NO	.55 inch	NO	-55 Cel	BACKSHELL	ROHS COMPLIANT, SHIELDED	ZINC ALLOY	SCREW	#4-40
5745919-2	TE Connectivity	CONNECTOR ACCESSORY	YES			2	NO	.255 inch		NO	.47 inch	NO		BACKSHELL	ROHS COMPLIANT, SHIELDED	ZINC ALLOY	SCREW	#4-40
5747099-7	TE Connectivity	CONNECTOR ACCESSORY	YES		PLUG/RECEPTACLE	2	NO		85 Cel	NO	.225 inch	NO	-55 Cel	BACKSHELL	ROHS COMPLIANT, SHIELDED	POLYETHYLENE	SCREW	#4-40
5748677-4	TE Connectivity	CONNECTOR ACCESSORY	YES		PLUG/RECEPTACLE	4	NO	.255 inch	85 Cel	NO	.47 inch	NO	-55 Cel	BACKSHELL	ROHS COMPLIANT, SHIELDED	POLYETHYLENE	SCREW	#4-40
5749080-1	TE Connectivity	CONNECTOR ACCESSORY	YES	UL	AMPLIMITE		NO			NO	.4 inch	NO		BACKSHELL KIT		ZINC ALLOY
5787191-1	TE Connectivity	CONNECTOR ACCESSORY	YES						105 Cel							STEEL
7-745129-5	TE Connectivity	CONNECTOR ACCESSORY	YES				NO			NO		NO		FERRULE-STEPPED		BRASS
7-745129-8	TE Connectivity	CONNECTOR ACCESSORY	YES				NO			NO		NO		FERRULE-STEPPED		BRASS
745508-3	TE Connectivity	CONNECTOR ACCESSORY	YES				NO	.185 inch		NO	.225 inch	NO		FERRULE-SPLIT RING	ROHS COMPLIANT
745508-9	TE Connectivity	CONNECTOR ACCESSORY	YES				NO	.49 inch		NO	.53 inch	NO		FERRULE-SPLIT RING	ROHS COMPLIANT

Assembly Products

Assembly products refer to the components that are used to assemble and connect semiconductor devices, such as integrated circuits (ICs) and transistors. These components are critical in the manufacturing and assembly of electronic systems and are designed to provide a reliable and secure connection between the semiconductor device and other electronic components.

Some common assembly products in semiconductor connector accessories include:

Socket connectors: These connectors are used to provide a temporary or permanent connection between the semiconductor device and a circuit board. They are typically designed with a precision contact system that ensures a secure and reliable connection.

Adapters: Adapters are used to enable compatibility between different types of connectors, so that a semiconductor device can be connected to a different type of connector than the one it was originally designed for.

Interface connectors: These connectors are designed to provide a high-speed data transfer between semiconductor devices and other electronic components. They are typically used in high-performance applications, such as data centers, supercomputers, and high-speed communication systems.

Wire bonding products: Wire bonding products are used to connect the semiconductor device to the lead frame or substrate. These products include wire bonders, bond wires, and bonding materials.

Thermal management products: These products are designed to manage the heat generated by the semiconductor device, and ensure that it operates within safe temperature limits. Thermal management products include heat sinks, thermal interface materials, and thermal pads.