Broadcom Assembly Products 4

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Part RoHS Manufacturer Connector Accessory Type Rated Voltage Rated Current Shielding Approvals (V) Contact Type Usage Cross Section Area Finish Thickness Mating Contacts Shell Sizes Construction Minimum Wire Size Jacket Material Terminal Type MIL Conformity Minimum Cable Entry Maximum Wire Size Insulator Material Maximum Operating Temperature DIN Conformity Application Tool and Machinery Name Cable Types Rated AC Voltage Maximum Cable Entry Contact Design IEC Conformity Minimum Operating Temperature Wire Gauge (AWG) Removal Tools Contact Gender Assembly Item Name Manufacturer Series Contact Resistance Design MIL-Connector Accessory Name Diameter No. of Conductors Mounting Style Contact Style Additional Features Material Mounting Option-2 Terminal Length Mounting Option-1 Associated Military - Specifications Rated DC Voltage

HFBR-4522Z

Broadcom

CONNECTOR ACCESSORY

HFBR-4525Z

Broadcom

CONNECTOR ACCESSORY

HFBR-4526Z

Broadcom

CONNECTOR ACCESSORY

HFBR-4594Z

Broadcom

CONNECTOR ACCESSORY

Assembly Products

Assembly products refer to the components that are used to assemble and connect semiconductor devices, such as integrated circuits (ICs) and transistors. These components are critical in the manufacturing and assembly of electronic systems and are designed to provide a reliable and secure connection between the semiconductor device and other electronic components.

Some common assembly products in semiconductor connector accessories include:

Socket connectors: These connectors are used to provide a temporary or permanent connection between the semiconductor device and a circuit board. They are typically designed with a precision contact system that ensures a secure and reliable connection.

Adapters: Adapters are used to enable compatibility between different types of connectors, so that a semiconductor device can be connected to a different type of connector than the one it was originally designed for.

Interface connectors: These connectors are designed to provide a high-speed data transfer between semiconductor devices and other electronic components. They are typically used in high-performance applications, such as data centers, supercomputers, and high-speed communication systems.

Wire bonding products: Wire bonding products are used to connect the semiconductor device to the lead frame or substrate. These products include wire bonders, bond wires, and bonding materials.

Thermal management products: These products are designed to manage the heat generated by the semiconductor device, and ensure that it operates within safe temperature limits. Thermal management products include heat sinks, thermal interface materials, and thermal pads.