Hirose Electric Assembly Products 166

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Part RoHS Manufacturer Connector Accessory Type Rated Voltage Rated Current Shielding Approvals (V) Contact Type Usage Cross Section Area Finish Thickness Mating Contacts Shell Sizes Construction Minimum Wire Size Jacket Material Terminal Type MIL Conformity Minimum Cable Entry Maximum Wire Size Insulator Material Maximum Operating Temperature DIN Conformity Application Tool and Machinery Name Cable Types Rated AC Voltage Maximum Cable Entry Contact Design IEC Conformity Minimum Operating Temperature Wire Gauge (AWG) Removal Tools Contact Gender Assembly Item Name Manufacturer Series Contact Resistance Design MIL-Connector Accessory Name Diameter No. of Conductors Mounting Style Contact Style Additional Features Material Mounting Option-2 Terminal Length Mounting Option-1 Associated Military - Specifications Rated DC Voltage

DF62-EP22PCFA

Hirose Electric

CONNECTOR ACCESSORY

7.9

CRIMP

NO

22 AWG

NO

NO

MALE

CONTACT

STRAIGHT

SQUARE PIN-SOCKET

CONTACT FINISH: GOLD (7.9)

PHOSPHOR BRONZE

.106 inch

DF62-EP2428PCA

Hirose Electric

CONNECTOR ACCESSORY

DF63-1618SCA

Hirose Electric

CONNECTOR ACCESSORY

DF63-1618SCF

Hirose Electric

CONNECTOR ACCESSORY

15 A

CUL; TUV; UL

SOCKET

22 AWG

CRIMP

NO

16 AWG

105 Cel

NO

WIRE, STRANDED

630 V

NO

-55 Cel

FEMALE

CONTACT

POWER

STRAIGHT

COPPER ALLOY

630 V

DX-50-CV

Hirose Electric

CONNECTOR ACCESSORY

DX-50-CV3

Hirose Electric

CONNECTOR ACCESSORY

FX15-3032PCFA

Hirose Electric

CONNECTOR ACCESSORY

FX15-3032PCFB

Hirose Electric

CONNECTOR ACCESSORY

.5 A

UL

32 AWG

CRIMP

NO

30 AWG

80 Cel

NO

300 V

STAMPED, STRIP

NO

-55 Cel

FEMALE

CONTACT

60 mohm

SIGNAL

STRAIGHT

ROUND PIN-SOCKET

ROHS COMPLIANT

PHOSPHOR BRONZE

.079 inch

GT32-2428SCF

Hirose Electric

CONNECTOR ACCESSORY

HIF3-T2226HC

Hirose Electric

CONNECTOR ACCESSORY

HR10-PC-111

Hirose Electric

CONNECTOR ACCESSORY

HR12-SC-112

Hirose Electric

CONNECTOR ACCESSORY

2 A

30 AWG

CRIMP

NO

26 AWG

60 Cel

NO

.039 inch

NO

-15 Cel

FEMALE

CONTACT

STRAIGHT

SQ PIN-SKT

PHOSPHOR BRONZE

.094 inch

HR34B-12WR-C1

Hirose Electric

HSC-C5

Hirose Electric

CONNECTOR ACCESSORY

JR13WRC3

Hirose Electric

CONNECTOR ACCESSORY

JR16WCC-6(71)

Hirose Electric

CONNECTOR ACCESSORY

UL

NO

NO

NO

CLAMPING ITEM

NITRILE RUBBER

MDF6-1618SCF

Hirose Electric

CONNECTOR ACCESSORY

18 AWG

CRIMP

NO

16 AWG

NO

NO

FEMALE

CONTACT

STRAIGHT

SQUARE PIN-SOCKET

CONTACT FINISH: TIN

PHOSPHOR BRONZE

.193 inch

PQ50-20P-PC

Hirose Electric

CONNECTOR ACCESSORY

RDG-LNA-W1(01)

Hirose Electric

CONNECTOR ACCESSORY

NO

NO

NO

SCREWLOCK

SCREW

M2.6X0.45

RP17-SC-112

Hirose Electric

CONNECTOR ACCESSORY

RP19-SC-121

Hirose Electric

CONNECTOR ACCESSORY

RP34-SC-112

Hirose Electric

CONNECTOR ACCESSORY

Assembly Products

Assembly products refer to the components that are used to assemble and connect semiconductor devices, such as integrated circuits (ICs) and transistors. These components are critical in the manufacturing and assembly of electronic systems and are designed to provide a reliable and secure connection between the semiconductor device and other electronic components.

Some common assembly products in semiconductor connector accessories include:

Socket connectors: These connectors are used to provide a temporary or permanent connection between the semiconductor device and a circuit board. They are typically designed with a precision contact system that ensures a secure and reliable connection.

Adapters: Adapters are used to enable compatibility between different types of connectors, so that a semiconductor device can be connected to a different type of connector than the one it was originally designed for.

Interface connectors: These connectors are designed to provide a high-speed data transfer between semiconductor devices and other electronic components. They are typically used in high-performance applications, such as data centers, supercomputers, and high-speed communication systems.

Wire bonding products: Wire bonding products are used to connect the semiconductor device to the lead frame or substrate. These products include wire bonders, bond wires, and bonding materials.

Thermal management products: These products are designed to manage the heat generated by the semiconductor device, and ensure that it operates within safe temperature limits. Thermal management products include heat sinks, thermal interface materials, and thermal pads.