Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
Analog To Digital Converter Subsystem |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
8 |
Yes |
2 V |
65 MHz |
1 |
CMOS |
12 |
0.0366 % |
3.3 V |
Offset Binary, 2's Complement Binary |
1.8,3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Sample |
Quad |
S-PQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||
|
Texas Instruments |
Analog To Digital Converter Subsystem |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
8 |
Yes |
2 V |
65 MHz |
1 |
CMOS |
12 |
0.0366 % |
3.3 V |
Offset Binary, 2's Complement Binary |
1.8,3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Sample |
Quad |
S-PQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||
Texas Instruments |
Analog To Digital Converter Subsystem |
Industrial |
Gull Wing |
48 |
TFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
3.6 V |
65 MHz |
2 |
CMOS |
10 |
0.0977 % |
3.3 V |
Binary, Offset Binary, 2's Complement Binary |
3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP64,.47SQ |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
3 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Quad |
107 ns |
S-PQFP-G48 |
3 |
0.047 in (1.2 mm) |
0.394 in (10 mm) |
No |
e0 |
260 °C (500 °F) |
0.394 in (10 mm) |
||||||||||||
|
Texas Instruments |
Analog To Digital Converter Subsystem |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
8 |
Yes |
2 V |
65 MHz |
1 |
CMOS |
12 |
0.0415 % |
3.3 V |
Offset Binary, 2's Complement Binary |
1.8,3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Sample |
Quad |
S-PQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||
Texas Instruments |
Analog To Digital Converter Subsystem |
Military |
Through-Hole |
40 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
2 V |
10 MHz |
1 |
Hybrid |
MIL-PRF-38534 Class H |
12 |
0.0977 % |
5 V |
Binary |
-5.2 V |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-2 V |
Parallel, Word |
-55 °C (-67 °F) |
Dual |
100 ns |
R-CDIP-T40 |
0.252 in (6.4 mm) |
0.6 in (15.24 mm) |
2.095 in (53.213 mm) |
|||||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter Subsystem |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
8 |
Yes |
2 V |
65 MHz |
1 |
CMOS |
12 |
0.0415 % |
3.3 V |
Offset Binary, 2's Complement Binary |
1.8,3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Sample |
Quad |
S-PQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||
Texas Instruments |
Analog To Digital Converter Subsystem |
Industrial |
Gull Wing |
48 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.048 V |
65 MHz |
1 |
CMOS |
12 |
5 V |
2's Complement Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.048 V |
Parallel, Word |
-40 °C (-40 °F) |
Track |
Dual |
19.2 ns |
R-PDSO-G48 |
0.043 in (1.1 mm) |
0.24 in (6.1 mm) |
0.492 in (12.5 mm) |
|||||||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter Subsystem |
Industrial |
Gull Wing |
64 |
TFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
2 V |
65 MHz |
1 |
CMOS |
10 |
111 mA |
0.0977 % |
3.3 V |
Offset Binary, 2's Complement Binary |
3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP64,.47SQ |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
460 ns |
S-PQFP-G64 |
3 |
0.047 in (1.2 mm) |
0.394 in (10 mm) |
No |
Peak-to-peak input voltage range: 2 V |
e3 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
||||||||
Texas Instruments |
Analog To Digital Converter Subsystem |
Offset Binary |
||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
Analog To Digital Converter Subsystem |
Industrial |
Gull Wing |
48 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.048 V |
65 MHz |
1 |
CMOS |
12 |
5 V |
2's Complement Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.048 V |
Parallel, Word |
-40 °C (-40 °F) |
Track |
Dual |
19.2 ns |
R-PDSO-G48 |
0.043 in (1.1 mm) |
0.24 in (6.1 mm) |
0.492 in (12.5 mm) |
|||||||||||||||||||||
Texas Instruments |
Analog To Digital Converter Subsystem |
Industrial |
Gull Wing |
80 |
HTFQFP |
Square |
Plastic/Epoxy |
8 |
Yes |
2 V |
65 MHz |
1 |
CMOS |
12 |
0.0366 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Sample |
Quad |
S-PQFP-G80 |
0.047 in (1.2 mm) |
0.472 in (12 mm) |
No |
e4 |
0.472 in (12 mm) |
||||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter Subsystem |
Industrial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
10 |
Yes |
2.5 V |
1 |
12 |
0.0488 % |
5 V |
2's Complement Binary |
±5 V |
-5 V |
Chip Carrier |
LDCC68,1.0SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-2.5 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
10.4 µs |
S-PQCC-J68 |
3 |
0.18 in (4.57 mm) |
0.954 in (24.23 mm) |
No |
e3 |
30 s |
245 °C (473 °F) |
0.954 in (24.23 mm) |
|||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Other |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
3 V |
1 |
BICMOS |
18 |
5 V |
2's Complement Binary |
-5 V |
In-Line |
70 °C (158 °F) |
-3 V |
Serial |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-PDIP-T28 |
No |
e0 |
||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
10 V |
1 |
CMOS |
12 |
10 mA |
0.012 % |
5 V |
2's Complement Binary |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-10 V |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
10 µs |
R-PDIP-T24 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e0 |
1.199 in (30.45 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Military |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
1 |
Yes |
10 V |
1 |
CMOS |
12 |
10 mA |
0.024 % |
5 V |
Binary |
Flatpack |
0.031 in (0.8 mm) |
125 °C (257 °F) |
-10 V |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Quad |
10 µs |
S-PQFP-G44 |
0.096 in (2.44 mm) |
0.394 in (10 mm) |
No |
e0 |
0.394 in (10 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Other |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
3 V |
1 |
BICMOS |
16 |
5 V |
2's Complement Binary |
-5 V |
In-Line |
70 °C (158 °F) |
-3 V |
Serial |
-25 °C (-13 °F) |
Tin Lead |
Dual |
400 µs |
R-PDIP-T28 |
No |
e0 |
|||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
1 |
BICMOS |
10 |
5 V |
2's Complement Binary |
Small Outline |
0.05 in (1.27 mm) |
Parallel, Word |
Tin Lead |
Track |
Dual |
R-PDSO-G24 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
0.606 in (15.4 mm) |
|||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Industrial |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
1 |
Yes |
10 V |
1 |
CMOS |
12 |
10 mA |
0.024 % |
5 V |
Binary |
Flatpack |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-10 V |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
10 µs |
S-PQFP-G44 |
0.096 in (2.44 mm) |
0.394 in (10 mm) |
No |
e0 |
0.394 in (10 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Commercial |
Pin/Peg |
32 |
Rectangular |
1 |
No |
10 V |
20 kHz |
1 |
15 |
0.003 % |
15 V |
Binary, Offset Binary, 2's Complement Binary |
-15 V |
Microelectronic Assembly |
70 °C (158 °F) |
-10 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
35 µs |
R-XXMA-P32 |
No |
e0 |
||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
No Lead |
28 |
DIE |
Rectangular |
1 |
Yes |
25 V |
500 kHz |
1 |
0.024 % |
15 V |
Binary |
-15 V |
Uncased Chip |
-25 V |
Parallel, Word |
Tin Lead |
Upper |
R-XUUC-N28 |
No |
e0 |
||||||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Other |
Pin/Peg |
32 |
Rectangular |
1 |
No |
10 V |
18 kHz |
1 |
CMOS |
14 |
0.005 % |
15 V |
Binary, Offset Binary, 2's Complement Binary |
-15 V |
Microelectronic Assembly |
85 °C (185 °F) |
-10 V |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Sample |
50 µs |
R-XXMA-P32 |
No |
e0 |
|||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Industrial |
No Lead |
44 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
10 V |
1 |
CMOS |
12 |
10 mA |
0.024 % |
5 V |
Binary |
Chip Carrier |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-10 V |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
10 µs |
S-CQCC-N44 |
0.1 in (2.54 mm) |
0.651 in (16.5354 mm) |
No |
e0 |
0.651 in (16.5354 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Military |
No Lead |
44 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
10 V |
1 |
CMOS |
12 |
10 mA |
0.024 % |
5 V |
Binary |
Chip Carrier |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-10 V |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Quad |
10 µs |
S-CQCC-N44 |
0.1 in (2.54 mm) |
0.651 in (16.5354 mm) |
No |
e0 |
0.651 in (16.5354 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Military |
Through-Hole |
40 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
5 V |
125 kHz |
1 |
Hybrid |
38535Q/M;38534H;883B |
12 |
57 mA |
0.024 % |
15 V |
Offset Binary |
5,±15 V |
-15 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-5 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Sample |
Dual |
R-CDIP-T40 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
|||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Industrial |
Through-Hole |
40 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
5 V |
125 kHz |
1 |
Hybrid |
12 |
57 mA |
0.024 % |
15 V |
Offset Binary |
5,±15 V |
-15 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-5 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Dual |
R-CDIP-T40 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Industrial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
10 V |
1 |
CMOS |
12 |
10 mA |
0.012 % |
5 V |
2's Complement Binary |
Small Outline |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-10 V |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
10 µs |
R-PDSO-G24 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
0.606 in (15.4 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
1 |
BICMOS |
10 |
5 V |
2's Complement Binary |
Small Outline |
0.05 in (1.27 mm) |
Parallel, Word |
Tin Lead |
Track |
Dual |
R-PDSO-G28 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
0.705 in (17.9 mm) |
|||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Industrial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
10 V |
1 |
CMOS |
12 |
10 mA |
0.024 % |
5 V |
2's Complement Binary |
Small Outline |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-10 V |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
10 µs |
R-PDSO-G24 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
0.606 in (15.4 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Commercial |
Pin/Peg |
32 |
Rectangular |
1 |
No |
10 V |
25 kHz |
1 |
14 |
0.005 % |
15 V |
Binary, Offset Binary, 2's Complement Binary |
-15 V |
Microelectronic Assembly |
70 °C (158 °F) |
-10 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
35 µs |
R-XXMA-P32 |
No |
e0 |
||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Commercial |
Gull Wing |
100 |
QFP |
Square |
Ceramic, Metal-Sealed Cofired |
16 |
Yes |
10 V |
150 kHz |
1 |
BICMOS |
16 |
56 mA |
0.0015 % |
15 V |
Binary, 2's Complement Binary |
5,±15 V |
-15 V |
Flatpack |
QFP100,1.7SQ,50 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-10 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Quad |
S-CQFP-G100 |
0.243 in (6.17 mm) |
1.35 in (34.29 mm) |
No |
e0 |
1.35 in (34.29 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Other |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
3 V |
1 |
CMOS |
16 |
5 V |
2's Complement Binary |
-5 V |
Small Outline |
70 °C (158 °F) |
-3 V |
Serial |
-25 °C (-13 °F) |
Dual |
R-PDSO-G28 |
No |
||||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Industrial |
No Lead |
44 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
10 V |
1 |
CMOS |
12 |
10 mA |
0.012 % |
5 V |
Binary |
Chip Carrier |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-10 V |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
10 µs |
S-CQCC-N44 |
0.1 in (2.54 mm) |
0.651 in (16.5354 mm) |
No |
e0 |
0.651 in (16.5354 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Industrial |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
1 |
Yes |
10 V |
1 |
CMOS |
12 |
10 mA |
0.012 % |
5 V |
Binary |
Flatpack |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-10 V |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
10 µs |
S-PQFP-G44 |
0.096 in (2.44 mm) |
0.394 in (10 mm) |
No |
e0 |
0.394 in (10 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
3 V |
1 |
BICMOS |
12 |
25 mA |
5 V |
Offset Binary |
-5 V |
Chip Carrier |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-3 V |
Serial |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
0.18 in (4.57 mm) |
0.453 in (11.5062 mm) |
No |
e0 |
0.453 in (11.5062 mm) |
|||||||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
10 V |
1 |
CMOS |
12 |
10 mA |
0.024 % |
5 V |
2's Complement Binary |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Serial |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
10 µs |
R-GDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
10 V |
1 |
CMOS |
12 |
10 mA |
0.024 % |
5 V |
2's Complement Binary |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Serial |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
10 µs |
R-PDIP-T24 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e0 |
1.199 in (30.45 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
10 V |
1 |
CMOS |
12 |
10 mA |
0.024 % |
5 V |
2's Complement Binary |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-10 V |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
10 µs |
R-PDIP-T24 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e0 |
1.199 in (30.45 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Other |
Pin/Peg |
32 |
Rectangular |
1 |
No |
10 V |
1 |
CMOS |
15 |
0.003 % |
15 V |
Binary, Offset Binary, 2's Complement Binary |
-15 V |
Microelectronic Assembly |
85 °C (185 °F) |
-10 V |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Sample |
50 µs |
R-XXMA-P32 |
No |
e0 |
||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Other |
Pin/Peg |
32 |
DIP |
Rectangular |
1 |
No |
10 V |
1 |
CMOS |
16 |
0.003 % |
15 V |
Binary, Offset Binary, 2's Complement Binary |
5,±15 V |
-15 V |
Microelectronic Assembly |
DIP34,1.8 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-10 V |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Sample |
50 µs |
R-XXMA-P32 |
No |
e0 |
|||||||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Military |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
10 V |
1 |
CMOS |
12 |
10 mA |
0.024 % |
5 V |
2's Complement Binary |
Small Outline |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-10 V |
Serial |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
10 µs |
R-PDSO-G24 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
0.606 in (15.4 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
10 V |
1 |
CMOS |
12 |
10 mA |
0.012 % |
5 V |
2's Complement Binary |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-10 V |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
10 µs |
R-GDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
10 V |
1 |
CMOS |
12 |
10 mA |
0.024 % |
5 V |
2's Complement Binary |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-10 V |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
10 µs |
R-GDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
1 |
Yes |
1 |
BICMOS |
10 |
5 V |
2's Complement Binary |
Flatpack |
0.031 in (0.8 mm) |
Parallel, Word |
Tin Lead |
Track |
Quad |
S-PQFP-G44 |
0.096 in (2.44 mm) |
0.394 in (10 mm) |
No |
e0 |
0.394 in (10 mm) |
|||||||||||||||||||||||||
STMicroelectronics |
Analog To Digital Converter Subsystem |
Military |
Gull Wing |
48 |
SSOP |
Rectangular |
300k Rad(Si) |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
650 mV |
50 MHz |
1 |
MIL-PRF-38535 Class V |
12 |
0.0488 % |
2.5 V |
Binary |
Small Outline, Shrink Pitch |
0.025 in (0.635 mm) |
125 °C (257 °F) |
400 mV |
Parallel, Word |
-55 °C (-67 °F) |
Dual |
R-CDSO-G48 |
0.114 in (2.9 mm) |
0.38 in (9.65 mm) |
Yes |
0.62 in (15.745 mm) |
||||||||||||||||||||
|
STMicroelectronics |
Analog To Digital Converter Subsystem |
Military |
Gull Wing |
48 |
SSOP |
Rectangular |
300k Rad(Si) |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
650 mV |
50 MHz |
1 |
CMOS |
MIL-PRF-38535 Class V |
12 |
0.0488 % |
2.5 V |
Binary |
2.5 V |
Small Outline, Shrink Pitch |
SSOP48,.48 |
Analog to Digital Converters |
0.025 in (0.635 mm) |
125 °C (257 °F) |
400 mV |
Parallel, Word |
-55 °C (-67 °F) |
Dual |
R-CDSO-G48 |
0.114 in (2.9 mm) |
0.38 in (9.65 mm) |
Yes |
0.62 in (15.745 mm) |
|||||||||||||||
NXP Semiconductors |
Analog To Digital Converter Subsystem |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5 V |
75 MHz |
1 |
8 |
0.293 % |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Dual |
R-PDIP-T24 |
0.201 in (5.1 mm) |
0.6 in (15.24 mm) |
No |
1.248 in (31.7 mm) |
||||||||||||||||||||||
NXP Semiconductors |
Analog To Digital Converter Subsystem |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
0 mV |
600 MHz |
1 |
Bipolar |
8 |
Binary |
-4.5 V |
Chip Carrier |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-4.5 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Quad |
S-PQCC-J28 |
0.18 in (4.57 mm) |
0.453 in (11.5062 mm) |
No |
0.453 in (11.5062 mm) |
||||||||||||||||||||||
NXP Semiconductors |
Analog To Digital Converter Subsystem |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5 V |
75 MHz |
1 |
8 |
0.293 % |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Dual |
R-PDIP-T24 |
0.201 in (5.1 mm) |
0.6 in (15.24 mm) |
No |
1.248 in (31.7 mm) |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.