Analog To Digital Converter Subsystem Analog-to-Digital Converters 59

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

ADS5281IRGCRG4

Texas Instruments

Analog To Digital Converter Subsystem

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

8

Yes

2 V

65 MHz

1

CMOS

12

0.0366 %

3.3 V

Offset Binary, 2's Complement Binary

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Nickel Palladium Gold

Sample

Quad

S-PQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e4

30 s

260 °C (500 °F)

0.354 in (9 mm)

ADS5281IRGCTG4

Texas Instruments

Analog To Digital Converter Subsystem

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

8

Yes

2 V

65 MHz

1

CMOS

12

0.0366 %

3.3 V

Offset Binary, 2's Complement Binary

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Nickel Palladium Gold

Sample

Quad

S-PQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e4

30 s

260 °C (500 °F)

0.354 in (9 mm)

ADC10DL065CIVS

Texas Instruments

Analog To Digital Converter Subsystem

Industrial

Gull Wing

48

TFQFP

Square

Plastic/Epoxy

2

Yes

3.6 V

65 MHz

2

CMOS

10

0.0977 %

3.3 V

Binary, Offset Binary, 2's Complement Binary

3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP64,.47SQ

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

3 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

107 ns

S-PQFP-G48

3

0.047 in (1.2 mm)

0.394 in (10 mm)

No

e0

260 °C (500 °F)

0.394 in (10 mm)

ADS5282IRGCTG4

Texas Instruments

Analog To Digital Converter Subsystem

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

8

Yes

2 V

65 MHz

1

CMOS

12

0.0415 %

3.3 V

Offset Binary, 2's Complement Binary

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Nickel Palladium Gold

Sample

Quad

S-PQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e4

30 s

260 °C (500 °F)

0.354 in (9 mm)

5962-9099501HXC

Texas Instruments

Analog To Digital Converter Subsystem

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

2 V

10 MHz

1

Hybrid

MIL-PRF-38534 Class H

12

0.0977 %

5 V

Binary

-5.2 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-2 V

Parallel, Word

-55 °C (-67 °F)

Dual

100 ns

R-CDIP-T40

0.252 in (6.4 mm)

0.6 in (15.24 mm)

2.095 in (53.213 mm)

ADS5282IRGCRG4

Texas Instruments

Analog To Digital Converter Subsystem

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

8

Yes

2 V

65 MHz

1

CMOS

12

0.0415 %

3.3 V

Offset Binary, 2's Complement Binary

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Nickel Palladium Gold

Sample

Quad

S-PQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e4

30 s

260 °C (500 °F)

0.354 in (9 mm)

CLC5956IMTDX

Texas Instruments

Analog To Digital Converter Subsystem

Industrial

Gull Wing

48

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

2.048 V

65 MHz

1

CMOS

12

5 V

2's Complement Binary

Small Outline, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-2.048 V

Parallel, Word

-40 °C (-40 °F)

Track

Dual

19.2 ns

R-PDSO-G48

0.043 in (1.1 mm)

0.24 in (6.1 mm)

0.492 in (12.5 mm)

ADC10DL065CIVS/NOPB

Texas Instruments

Analog To Digital Converter Subsystem

Industrial

Gull Wing

64

TFQFP

Square

Plastic/Epoxy

2

Yes

2 V

65 MHz

1

CMOS

10

111 mA

0.0977 %

3.3 V

Offset Binary, 2's Complement Binary

3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP64,.47SQ

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

460 ns

S-PQFP-G64

3

0.047 in (1.2 mm)

0.394 in (10 mm)

No

Peak-to-peak input voltage range: 2 V

e3

30 s

260 °C (500 °F)

0.394 in (10 mm)

CLC5956PCASM

Texas Instruments

Analog To Digital Converter Subsystem

Offset Binary

CLC5956IMTD

Texas Instruments

Analog To Digital Converter Subsystem

Industrial

Gull Wing

48

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

2.048 V

65 MHz

1

CMOS

12

5 V

2's Complement Binary

Small Outline, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-2.048 V

Parallel, Word

-40 °C (-40 °F)

Track

Dual

19.2 ns

R-PDSO-G48

0.043 in (1.1 mm)

0.24 in (6.1 mm)

0.492 in (12.5 mm)

ADS5281PFPR

Texas Instruments

Analog To Digital Converter Subsystem

Industrial

Gull Wing

80

HTFQFP

Square

Plastic/Epoxy

8

Yes

2 V

65 MHz

1

CMOS

12

0.0366 %

3.3 V

Offset Binary, 2's Complement Binary

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Nickel Palladium Gold

Sample

Quad

S-PQFP-G80

0.047 in (1.2 mm)

0.472 in (12 mm)

No

e4

0.472 in (12 mm)

VECANA01

Texas Instruments

Analog To Digital Converter Subsystem

Industrial

J Bend

68

QCCJ

Square

Plastic/Epoxy

10

Yes

2.5 V

1

12

0.0488 %

5 V

2's Complement Binary

±5 V

-5 V

Chip Carrier

LDCC68,1.0SQ

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-2.5 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

10.4 µs

S-PQCC-J68

3

0.18 in (4.57 mm)

0.954 in (24.23 mm)

No

e3

30 s

245 °C (473 °F)

0.954 in (24.23 mm)

AD1879

Analog Devices

Analog To Digital Converter Subsystem

Other

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

3 V

1

BICMOS

18

5 V

2's Complement Binary

-5 V

In-Line

70 °C (158 °F)

-3 V

Serial

-25 °C (-13 °F)

Tin Lead

Dual

R-PDIP-T28

No

e0

AD7890BN

Analog Devices

Analog To Digital Converter Subsystem

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

1

CMOS

12

10 mA

0.012 %

5 V

2's Complement Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

10 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.199 in (30.45 mm)

AD7891SP

Analog Devices

Analog To Digital Converter Subsystem

Military

Gull Wing

44

QFP

Square

Plastic/Epoxy

1

Yes

10 V

1

CMOS

12

10 mA

0.024 %

5 V

Binary

Flatpack

0.031 in (0.8 mm)

125 °C (257 °F)

-10 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Quad

10 µs

S-PQFP-G44

0.096 in (2.44 mm)

0.394 in (10 mm)

No

e0

0.394 in (10 mm)

AD1878

Analog Devices

Analog To Digital Converter Subsystem

Other

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

3 V

1

BICMOS

16

5 V

2's Complement Binary

-5 V

In-Line

70 °C (158 °F)

-3 V

Serial

-25 °C (-13 °F)

Tin Lead

Dual

400 µs

R-PDIP-T28

No

e0

AD7776R

Analog Devices

Analog To Digital Converter Subsystem

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

1

BICMOS

10

5 V

2's Complement Binary

Small Outline

0.05 in (1.27 mm)

Parallel, Word

Tin Lead

Track

Dual

R-PDSO-G24

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.606 in (15.4 mm)

AD7891AP

Analog Devices

Analog To Digital Converter Subsystem

Industrial

Gull Wing

44

QFP

Square

Plastic/Epoxy

1

Yes

10 V

1

CMOS

12

10 mA

0.024 %

5 V

Binary

Flatpack

0.031 in (0.8 mm)

85 °C (185 °F)

-10 V

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Track

Quad

10 µs

S-PQFP-G44

0.096 in (2.44 mm)

0.394 in (10 mm)

No

e0

0.394 in (10 mm)

DAS1153

Analog Devices

Analog To Digital Converter Subsystem

Commercial

Pin/Peg

32

Rectangular

1

No

10 V

20 kHz

1

15

0.003 %

15 V

Binary, Offset Binary, 2's Complement Binary

-15 V

Microelectronic Assembly

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

35 µs

R-XXMA-P32

No

e0

ADC922G

Analog Devices

Analog To Digital Converter Subsystem

No Lead

28

DIE

Rectangular

1

Yes

25 V

500 kHz

1

0.024 %

15 V

Binary

-15 V

Uncased Chip

-25 V

Parallel, Word

Tin Lead

Upper

R-XUUC-N28

No

e0

DAS1157

Analog Devices

Analog To Digital Converter Subsystem

Other

Pin/Peg

32

Rectangular

1

No

10 V

18 kHz

1

CMOS

14

0.005 %

15 V

Binary, Offset Binary, 2's Complement Binary

-15 V

Microelectronic Assembly

85 °C (185 °F)

-10 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Sample

50 µs

R-XXMA-P32

No

e0

AD7891AE

Analog Devices

Analog To Digital Converter Subsystem

Industrial

No Lead

44

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

10 V

1

CMOS

12

10 mA

0.024 %

5 V

Binary

Chip Carrier

0.05 in (1.27 mm)

85 °C (185 °F)

-10 V

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Track

Quad

10 µs

S-CQCC-N44

0.1 in (2.54 mm)

0.651 in (16.5354 mm)

No

e0

0.651 in (16.5354 mm)

AD7891SE

Analog Devices

Analog To Digital Converter Subsystem

Military

No Lead

44

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

10 V

1

CMOS

12

10 mA

0.024 %

5 V

Binary

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

-10 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Quad

10 µs

S-CQCC-N44

0.1 in (2.54 mm)

0.651 in (16.5354 mm)

No

e0

0.651 in (16.5354 mm)

AD1332TD/883B

Analog Devices

Analog To Digital Converter Subsystem

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

125 kHz

1

Hybrid

38535Q/M;38534H;883B

12

57 mA

0.024 %

15 V

Offset Binary

5,±15 V

-15 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

R-CDIP-T40

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD1332BD

Analog Devices

Analog To Digital Converter Subsystem

Industrial

Through-Hole

40

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

125 kHz

1

Hybrid

12

57 mA

0.024 %

15 V

Offset Binary

5,±15 V

-15 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Dual

R-CDIP-T40

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD7890BR

Analog Devices

Analog To Digital Converter Subsystem

Industrial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

1

CMOS

12

10 mA

0.012 %

5 V

2's Complement Binary

Small Outline

0.05 in (1.27 mm)

85 °C (185 °F)

-10 V

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

10 µs

R-PDSO-G24

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.606 in (15.4 mm)

AD7777R

Analog Devices

Analog To Digital Converter Subsystem

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1

Yes

1

BICMOS

10

5 V

2's Complement Binary

Small Outline

0.05 in (1.27 mm)

Parallel, Word

Tin Lead

Track

Dual

R-PDSO-G28

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.705 in (17.9 mm)

AD7890AR

Analog Devices

Analog To Digital Converter Subsystem

Industrial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

1

CMOS

12

10 mA

0.024 %

5 V

2's Complement Binary

Small Outline

0.05 in (1.27 mm)

85 °C (185 °F)

-10 V

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

10 µs

R-PDSO-G24

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.606 in (15.4 mm)

DAS1152

Analog Devices

Analog To Digital Converter Subsystem

Commercial

Pin/Peg

32

Rectangular

1

No

10 V

25 kHz

1

14

0.005 %

15 V

Binary, Offset Binary, 2's Complement Binary

-15 V

Microelectronic Assembly

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

35 µs

R-XXMA-P32

No

e0

AD1341KZ

Analog Devices

Analog To Digital Converter Subsystem

Commercial

Gull Wing

100

QFP

Square

Ceramic, Metal-Sealed Cofired

16

Yes

10 V

150 kHz

1

BICMOS

16

56 mA

0.0015 %

15 V

Binary, 2's Complement Binary

5,±15 V

-15 V

Flatpack

QFP100,1.7SQ,50

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-CQFP-G100

0.243 in (6.17 mm)

1.35 in (34.29 mm)

No

e0

1.35 in (34.29 mm)

AD1885

Analog Devices

Analog To Digital Converter Subsystem

Other

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1

Yes

3 V

1

CMOS

16

5 V

2's Complement Binary

-5 V

Small Outline

70 °C (158 °F)

-3 V

Serial

-25 °C (-13 °F)

Dual

R-PDSO-G28

No

AD7891BE

Analog Devices

Analog To Digital Converter Subsystem

Industrial

No Lead

44

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

10 V

1

CMOS

12

10 mA

0.012 %

5 V

Binary

Chip Carrier

0.05 in (1.27 mm)

85 °C (185 °F)

-10 V

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Track

Quad

10 µs

S-CQCC-N44

0.1 in (2.54 mm)

0.651 in (16.5354 mm)

No

e0

0.651 in (16.5354 mm)

AD7891BP

Analog Devices

Analog To Digital Converter Subsystem

Industrial

Gull Wing

44

QFP

Square

Plastic/Epoxy

1

Yes

10 V

1

CMOS

12

10 mA

0.012 %

5 V

Binary

Flatpack

0.031 in (0.8 mm)

85 °C (185 °F)

-10 V

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Track

Quad

10 µs

S-PQFP-G44

0.096 in (2.44 mm)

0.394 in (10 mm)

No

e0

0.394 in (10 mm)

AD79015

Analog Devices

Analog To Digital Converter Subsystem

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

1

Yes

3 V

1

BICMOS

12

25 mA

5 V

Offset Binary

-5 V

Chip Carrier

0.05 in (1.27 mm)

70 °C (158 °F)

-3 V

Serial

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

0.453 in (11.5062 mm)

AD7890SD

Analog Devices

Analog To Digital Converter Subsystem

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

CMOS

12

10 mA

0.024 %

5 V

2's Complement Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

10 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7890SN

Analog Devices

Analog To Digital Converter Subsystem

Military

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

1

CMOS

12

10 mA

0.024 %

5 V

2's Complement Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

10 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.199 in (30.45 mm)

AD7890AN

Analog Devices

Analog To Digital Converter Subsystem

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

1

CMOS

12

10 mA

0.024 %

5 V

2's Complement Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

10 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.199 in (30.45 mm)

DAS1158

Analog Devices

Analog To Digital Converter Subsystem

Other

Pin/Peg

32

Rectangular

1

No

10 V

1

CMOS

15

0.003 %

15 V

Binary, Offset Binary, 2's Complement Binary

-15 V

Microelectronic Assembly

85 °C (185 °F)

-10 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Sample

50 µs

R-XXMA-P32

No

e0

DAS1159

Analog Devices

Analog To Digital Converter Subsystem

Other

Pin/Peg

32

DIP

Rectangular

1

No

10 V

1

CMOS

16

0.003 %

15 V

Binary, Offset Binary, 2's Complement Binary

5,±15 V

-15 V

Microelectronic Assembly

DIP34,1.8

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Sample

50 µs

R-XXMA-P32

No

e0

AD7890SR

Analog Devices

Analog To Digital Converter Subsystem

Military

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

1

CMOS

12

10 mA

0.024 %

5 V

2's Complement Binary

Small Outline

0.05 in (1.27 mm)

125 °C (257 °F)

-10 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

10 µs

R-PDSO-G24

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.606 in (15.4 mm)

AD7890BD

Analog Devices

Analog To Digital Converter Subsystem

Industrial

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

CMOS

12

10 mA

0.012 %

5 V

2's Complement Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

10 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7890AD

Analog Devices

Analog To Digital Converter Subsystem

Industrial

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

CMOS

12

10 mA

0.024 %

5 V

2's Complement Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

10 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7778S

Analog Devices

Analog To Digital Converter Subsystem

Gull Wing

44

QFP

Square

Plastic/Epoxy

1

Yes

1

BICMOS

10

5 V

2's Complement Binary

Flatpack

0.031 in (0.8 mm)

Parallel, Word

Tin Lead

Track

Quad

S-PQFP-G44

0.096 in (2.44 mm)

0.394 in (10 mm)

No

e0

0.394 in (10 mm)

5962F0521701VXX

STMicroelectronics

Analog To Digital Converter Subsystem

Military

Gull Wing

48

SSOP

Rectangular

300k Rad(Si)

Ceramic, Metal-Sealed Cofired

1

Yes

650 mV

50 MHz

1

MIL-PRF-38535 Class V

12

0.0488 %

2.5 V

Binary

Small Outline, Shrink Pitch

0.025 in (0.635 mm)

125 °C (257 °F)

400 mV

Parallel, Word

-55 °C (-67 °F)

Dual

R-CDSO-G48

0.114 in (2.9 mm)

0.38 in (9.65 mm)

Yes

0.62 in (15.745 mm)

5962F0521701VXC

STMicroelectronics

Analog To Digital Converter Subsystem

Military

Gull Wing

48

SSOP

Rectangular

300k Rad(Si)

Ceramic, Metal-Sealed Cofired

1

Yes

650 mV

50 MHz

1

CMOS

MIL-PRF-38535 Class V

12

0.0488 %

2.5 V

Binary

2.5 V

Small Outline, Shrink Pitch

SSOP48,.48

Analog to Digital Converters

0.025 in (0.635 mm)

125 °C (257 °F)

400 mV

Parallel, Word

-55 °C (-67 °F)

Dual

R-CDSO-G48

0.114 in (2.9 mm)

0.38 in (9.65 mm)

Yes

0.62 in (15.745 mm)

TDA8714/7

NXP Semiconductors

Analog To Digital Converter Subsystem

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

75 MHz

1

8

0.293 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Dual

R-PDIP-T24

0.201 in (5.1 mm)

0.6 in (15.24 mm)

No

1.248 in (31.7 mm)

TDA8718WP

NXP Semiconductors

Analog To Digital Converter Subsystem

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

1

Yes

0 mV

600 MHz

1

Bipolar

8

Binary

-4.5 V

Chip Carrier

0.05 in (1.27 mm)

70 °C (158 °F)

-4.5 V

Parallel, 8 Bits

0 °C (32 °F)

Quad

S-PQCC-J28

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

0.453 in (11.5062 mm)

TDA8714/4

NXP Semiconductors

Analog To Digital Converter Subsystem

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

75 MHz

1

8

0.293 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Dual

R-PDIP-T24

0.201 in (5.1 mm)

0.6 in (15.24 mm)

No

1.248 in (31.7 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.