Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices |
Digital To Analog Converter |
Industrial |
Gull Wing |
16 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.75 V |
350 kHz |
1 |
CMOS |
24 |
0.0015 % |
5 V |
Binary |
Small Outline, Shrink Pitch |
0.025 in (0.635 mm) |
85 °C (185 °F) |
-50 mV |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Dual |
170 ms |
R-PDSO-G16 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.899 mm) |
e0 |
0.193 in (4.8895 mm) |
||||||||||||||||||
Analog Devices |
Digital To Analog Converter |
Commercial |
Gull Wing |
16 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.75 V |
350 kHz |
1 |
CMOS |
24 |
0.0015 % |
5 V |
Binary |
Small Outline, Shrink Pitch |
0.025 in (0.635 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Tin Lead |
Dual |
170 ms |
R-PDSO-G16 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.899 mm) |
e0 |
0.193 in (4.8895 mm) |
||||||||||||||||||
|
Analog Devices |
Digital To Analog Converter |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
1.064 V |
94.4 kHz |
1 |
BICMOS |
12 |
0.0244 % |
3 V |
2's Complement Binary |
3/3.3 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-1.064 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Track |
Dual |
7.5 µs |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||
|
Analog Devices |
Digital To Analog Converter |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
4 |
Yes |
1.8 V |
94.4 kHz |
1 |
BICMOS |
10 |
0.0977 % |
2's Complement Binary |
3/3.3 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-500 mV |
Serial |
-40 °C (-40 °F) |
Nickel Gold Palladium |
Track |
Dual |
6.8 µs |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||
|
Analog Devices |
Digital To Analog Converter |
Industrial |
Gull Wing |
16 |
SSOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
2.75 V |
188 kHz |
1 |
BICMOS |
8 |
0.3906 % |
5 V |
2's Complement Binary |
5 V |
Small Outline, Shrink Pitch |
SSOP16,.25 |
Analog to Digital Converters |
0.025 in (0.635 mm) |
85 °C (185 °F) |
-2.75 V |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Dual |
6.1 µs |
R-PDSO-G16 |
1 |
0.069 in (1.75 mm) |
0.153 in (3.89 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.193 in (4.9 mm) |
||||||||||
|
Analog Devices |
Digital To Analog Converter |
Industrial |
Gull Wing |
16 |
SSOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
1.8 V |
94.4 kHz |
1 |
BICMOS |
10 |
0.0977 % |
2's Complement Binary |
3/3.3 V |
Small Outline, Shrink Pitch |
SSOP16,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-500 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Dual |
6.8 µs |
R-PDSO-G16 |
1 |
0.069 in (1.75 mm) |
0.153 in (3.89 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.193 in (4.9 mm) |
|||||||||||
|
Analog Devices |
Digital To Analog Converter |
Industrial |
Gull Wing |
16 |
SSOP |
Rectangular |
Plastic/Epoxy |
12 |
Yes |
2.75 V |
94.4 kHz |
1 |
BICMOS |
10 |
0.0977 % |
5 V |
2's Complement Binary |
5 V |
Small Outline, Shrink Pitch |
SSOP16,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-500 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Dual |
6.8 µs |
R-PDSO-G16 |
1 |
0.069 in (1.75 mm) |
0.153 in (3.89 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.193 in (4.9 mm) |
||||||||||
|
Analog Devices |
Digital To Analog Converter |
Industrial |
Gull Wing |
8 |
LSSOP |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
2.75 V |
188 kHz |
1 |
BICMOS |
8 |
0.3906 % |
5 V |
2's Complement Binary |
5 V |
Small Outline, Low Profile, Shrink Pitch |
TSSOP8,.1 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-2.75 V |
Serial |
-40 °C (-40 °F) |
Nickel Gold Palladium |
Track |
Dual |
6.1 µs |
R-PDSO-G8 |
1 |
0.057 in (1.45 mm) |
0.064 in (1.625 mm) |
No |
30 s |
260 °C (500 °F) |
0.114 in (2.9 mm) |
|||||||||||
|
Maxim Integrated |
Digital To Analog Converter |
Industrial |
Ball |
12 |
VFBGA |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
1.8 V |
94.4 kHz |
1 |
BICMOS |
10 |
0.0977 % |
2's Complement Binary |
3/3.3 V |
Grid Array, Very Thin Profile, Fine Pitch |
BGA12,3X4,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-500 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
6.8 µs |
R-PBGA-B12 |
1 |
0.027 in (0.69 mm) |
0.074 in (1.885 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
0.087 in (2.215 mm) |
|||||||||||
|
Maxim Integrated |
Digital To Analog Converter |
Industrial |
No Lead |
10 |
HVSON |
Square |
Plastic/Epoxy |
1 |
Yes |
1.825 V |
416 kHz |
1 |
BICMOS |
8 |
0.0781 % |
1.6 V |
2's Complement Binary |
1.8/3.3 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
SOLCC10,.12,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-300 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
S-PDSO-N10 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||
|
Analog Devices |
Digital To Analog Converter |
Industrial |
Gull Wing |
16 |
SSOP |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
2.048 V |
50 kHz |
1 |
CMOS |
AEC-Q100 |
8 |
0.195313 % |
2's Complement Binary |
3/5 V |
Small Outline, Shrink Pitch |
SSOP16,.25 |
Analog to Digital Converters |
0.025 in (0.635 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Dual |
55 µs |
R-PDSO-G16 |
1 |
0.069 in (1.75 mm) |
0.153 in (3.89 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.193 in (4.9 mm) |
||||||||||
|
Analog Devices |
Digital To Analog Converter |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
2.128 V |
94.4 kHz |
1 |
BICMOS |
12 |
0.0244 % |
5 V |
2's Complement Binary |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-2.128 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Track |
Dual |
7.5 µs |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||
|
Analog Devices |
Digital To Analog Converter |
Industrial |
Gull Wing |
8 |
LSSOP |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
1.8 V |
188 kHz |
1 |
BICMOS |
8 |
0.3906 % |
2's Complement Binary |
3/3.3 V |
Small Outline, Low Profile, Shrink Pitch |
TSSOP8,.1 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-1.8 V |
Serial |
-40 °C (-40 °F) |
Nickel Gold Palladium |
Track |
Dual |
6.1 µs |
R-PDSO-G8 |
1 |
0.057 in (1.45 mm) |
0.064 in (1.625 mm) |
No |
30 s |
260 °C (500 °F) |
0.114 in (2.9 mm) |
||||||||||||
Texas Instruments |
Digital To Analog Converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic |
11 |
No |
5 V |
CMOS |
38535Q/M;38534H;883B |
10 |
0.1 % |
5 V |
Binary |
5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T20 |
No |
||||||||||||||||||||||||
Texas Instruments |
Digital To Analog Converter |
Military |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
11 |
Yes |
5 V |
CMOS |
10 |
0.1 % |
5 V |
Binary |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Quad |
S-PQCC-J20 |
||||||||||||||||||||||||||
Texas Instruments |
Digital To Analog Converter |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic |
8 |
No |
0 mV |
CMOS |
8 |
5 V |
Binary |
5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T28 |
No |
||||||||||||||||||||||||||
Texas Instruments |
Digital To Analog Converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
11 |
No |
5 V |
CMOS |
38535Q/M;38534H;883B |
10 |
0.1 % |
5 V |
Binary |
5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-PDIP-T20 |
No |
||||||||||||||||||||||||
Texas Instruments |
Digital To Analog Converter |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic |
8 |
No |
0 mV |
1 |
CMOS |
38535Q/M;38534H;883B |
8 |
5 V |
Binary |
5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Dual |
R-XDIP-T28 |
No |
|||||||||||||||||||||||
Texas Instruments |
Digital To Analog Converter |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic |
8 |
No |
0 mV |
CMOS |
38535Q/M;38534H;883B |
8 |
5 V |
Binary |
5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T28 |
No |
|||||||||||||||||||||||||
Texas Instruments |
Digital To Analog Converter |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic |
11 |
Yes |
5 V |
CMOS |
38535Q/M;38534H;883B |
10 |
0.1 % |
5 V |
Binary |
5 V |
Chip Carrier |
LCC20,.35SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Quad |
S-XQCC-N20 |
No |
||||||||||||||||||||||||
Texas Instruments |
Digital To Analog Converter |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic |
8 |
No |
0 mV |
CMOS |
38535Q/M;38534H;883B |
8 |
5 V |
Binary |
5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T28 |
No |
|||||||||||||||||||||||||
Texas Instruments |
Digital To Analog Converter |
Military |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
11 |
Yes |
5 V |
CMOS |
38535Q/M;38534H;883B |
10 |
0.1 % |
5 V |
Binary |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Quad |
S-PQCC-J20 |
No |
||||||||||||||||||||||||
Texas Instruments |
Digital To Analog Converter |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic |
8 |
Yes |
0 mV |
CMOS |
38535Q/M;38534H;883B |
8 |
5 V |
Binary |
5 V |
Chip Carrier |
LCC28,.45SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Quad |
S-XQCC-N28 |
No |
|||||||||||||||||||||||||
|
Analog Devices |
Digital To Analog Converter |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
3.75 V |
1 MHz |
1 |
14 |
0.0183 % |
5 V |
2's Complement Binary |
3/5,5 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
105 °C (221 °F) |
1.25 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Track |
Quad |
559 ns |
S-PQFP-G48 |
3 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||
Analog Devices |
Digital To Analog Converter |
Industrial |
Gull Wing |
16 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.75 V |
1 |
CMOS |
20 |
0.002 % |
Binary |
Small Outline, Shrink Pitch |
0.025 in (0.635 mm) |
85 °C (185 °F) |
-50 mV |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Dual |
68.3 ms |
R-PDSO-G16 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.899 mm) |
e0 |
0.193 in (4.8895 mm) |
||||||||||||||||||||
|
Analog Devices |
Digital To Analog Converter |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
2 |
Yes |
3.75 V |
500 kHz |
1 |
14 |
0.0183 % |
5 V |
2's Complement Binary |
3/5,5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
105 °C (221 °F) |
1.25 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Track |
Quad |
0.95 ns |
S-XQCC-N48 |
1 |
0.039 in (1 mm) |
0.276 in (7 mm) |
No |
e3 |
0.276 in (7 mm) |
||||||||||||||
|
Analog Devices |
Digital To Analog Converter |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.048 V |
10 MHz |
1 |
CMOS |
12 |
0.0244 % |
5 V |
2's Complement Binary |
-5 V |
Small Outline, Shrink Pitch |
0.025 in (0.635 mm) |
85 °C (185 °F) |
-2.048 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
90 ns |
R-PDSO-G28 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.899 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.389 in (9.893 mm) |
|||||||||||||
Analog Devices |
Digital To Analog Converter |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
6.05 V |
1 MHz |
1 |
CMOS |
8 |
0.3906 % |
5 V |
Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
900 ns |
R-PDSO-G8 |
1 |
0.069 in (1.752 mm) |
0.154 in (3.899 mm) |
e0 |
0.193 in (4.9025 mm) |
|||||||||||||||||
Analog Devices |
Digital To Analog Converter |
Military |
Through-Hole |
32 |
DIP |
Rectangular |
Ceramic |
16 |
No |
10 V |
12 |
0.024 % |
Binary, Offset Binary |
5,±15 V |
In-Line |
DIP32,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T32 |
No |
|||||||||||||||||||||||||||
Analog Devices |
Digital To Analog Converter |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
6.05 V |
1 MHz |
1 |
CMOS |
8 |
0.1953 % |
5 V |
Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
710 ns |
R-PDSO-G8 |
1 |
0.069 in (1.752 mm) |
0.154 in (3.899 mm) |
e0 |
0.193 in (4.9025 mm) |
|||||||||||||||||
Analog Devices |
Digital To Analog Converter |
Commercial |
Gull Wing |
16 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.75 V |
1 |
CMOS |
20 |
0.002 % |
Binary |
Small Outline, Shrink Pitch |
0.025 in (0.635 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Tin Lead |
Dual |
68.3 ms |
R-PDSO-G16 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.899 mm) |
e0 |
0.193 in (4.8895 mm) |
||||||||||||||||||||
Analog Devices |
Digital To Analog Converter |
Commercial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.048 V |
10 MHz |
1 |
CMOS |
12 |
0.0244 % |
5 V |
2's Complement Binary |
-5 V |
Small Outline, Shrink Pitch |
0.025 in (0.635 mm) |
70 °C (158 °F) |
-2.048 V |
Parallel, Word |
0 °C (32 °F) |
Tin/Lead |
Sample |
Dual |
90 ns |
R-PDSO-G28 |
0.069 in (1.75 mm) |
0.154 in (3.899 mm) |
e0 |
0.389 in (9.893 mm) |
|||||||||||||||||
Analog Devices |
Digital To Analog Converter |
Military |
Through-Hole |
32 |
DIP |
Rectangular |
Ceramic |
16 |
No |
10 V |
12 |
0.012 % |
Binary, Offset Binary |
5,±15 V |
In-Line |
DIP32,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T32 |
No |
|||||||||||||||||||||||||||
Analog Devices |
Digital To Analog Converter |
Military |
Through-Hole |
32 |
DIP |
Rectangular |
Ceramic |
16 |
No |
10 V |
38535Q/M;38534H;883B |
12 |
0.024 % |
Binary, Offset Binary |
5,±15 V |
In-Line |
DIP32,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T32 |
No |
||||||||||||||||||||||||||
Analog Devices |
Digital To Analog Converter |
Commercial |
Through-Hole |
32 |
DIP |
Rectangular |
Ceramic |
16 |
No |
10 V |
Hybrid |
12 |
Binary, Offset Binary, 2's Complement, Offset 2's Complement |
5,±15 V |
In-Line |
DIP32,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin/Lead |
Dual |
R-XDIP-T32 |
No |
e0 |
|||||||||||||||||||||||||
Analog Devices |
Digital To Analog Converter |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
6.05 V |
1 MHz |
1 |
CMOS |
8 |
0.1953 % |
5 V |
Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
900 ns |
R-PDSO-G8 |
1 |
0.069 in (1.752 mm) |
0.154 in (3.899 mm) |
e0 |
0.193 in (4.9025 mm) |
|||||||||||||||||
Analog Devices |
Digital To Analog Converter |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
6.05 V |
1 MHz |
1 |
CMOS |
8 |
0.3906 % |
5 V |
Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
710 ns |
R-PDSO-G8 |
1 |
0.069 in (1.752 mm) |
0.154 in (3.899 mm) |
e0 |
0.193 in (4.9025 mm) |
|||||||||||||||||
Analog Devices |
Digital To Analog Converter |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
6.05 V |
750 kHz |
1 |
CMOS |
8 |
0.1953 % |
5 V |
Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
710 ns |
R-PDSO-G8 |
1 |
0.069 in (1.752 mm) |
0.154 in (3.899 mm) |
e0 |
0.193 in (4.9025 mm) |
|||||||||||||||||
Analog Devices |
Digital To Analog Converter |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
6.05 V |
750 kHz |
1 |
CMOS |
8 |
0.1953 % |
5 V |
Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
900 ns |
R-PDSO-G8 |
1 |
0.069 in (1.752 mm) |
0.154 in (3.899 mm) |
e0 |
0.193 in (4.9025 mm) |
|||||||||||||||||
Analog Devices |
Digital To Analog Converter |
Commercial |
Gull Wing |
16 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.75 V |
1 |
CMOS |
20 |
0.002 % |
Binary |
Small Outline, Shrink Pitch |
0.025 in (0.635 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Tin Lead |
Dual |
75 ms |
R-PDSO-G16 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.899 mm) |
e0 |
0.193 in (4.8895 mm) |
||||||||||||||||||||
Analog Devices |
Digital To Analog Converter |
Automotive |
Gull Wing |
16 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.75 V |
1 |
CMOS |
20 |
0.002 % |
Binary |
Small Outline, Shrink Pitch |
0.025 in (0.635 mm) |
125 °C (257 °F) |
-50 mV |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Dual |
75 ms |
R-PDSO-G16 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.899 mm) |
e0 |
0.193 in (4.8895 mm) |
||||||||||||||||||||
Analog Devices |
Digital To Analog Converter |
Commercial |
Through-Hole |
32 |
DIP |
Rectangular |
Ceramic |
16 |
No |
10 V |
12 |
0.012 % |
Binary, Offset Binary |
5,±15 V |
In-Line |
DIP32,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Dual |
R-XDIP-T32 |
No |
|||||||||||||||||||||||||||
Analog Devices |
Digital To Analog Converter |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
6.05 V |
750 kHz |
1 |
CMOS |
8 |
0.3906 % |
5 V |
Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Sample |
Dual |
710 ns |
R-PDSO-G8 |
1 |
0.069 in (1.752 mm) |
0.154 in (3.899 mm) |
0.193 in (4.9025 mm) |
|||||||||||||||||||
Analog Devices |
Digital To Analog Converter |
Military |
Through-Hole |
32 |
DIP |
Rectangular |
Ceramic |
16 |
No |
10 V |
Hybrid |
12 |
Binary, Offset Binary, 2's Complement, Offset 2's Complement |
5,±15 V |
In-Line |
DIP32,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin/Lead |
Dual |
R-XDIP-T32 |
No |
e0 |
|||||||||||||||||||||||||
Analog Devices |
Digital To Analog Converter |
Offset Binary |
Tin Lead |
No |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
Digital To Analog Converter |
Military |
Through-Hole |
32 |
DIP |
Rectangular |
Ceramic |
16 |
No |
10 V |
MIL-STD-883 Class B (Modified) |
12 |
0.012 % |
Binary, Offset Binary |
5,±15 V |
In-Line |
DIP32,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T32 |
No |
||||||||||||||||||||||||||
Analog Devices |
Digital To Analog Converter |
Offset Binary |
No |
|||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
Digital To Analog Converter |
Military |
Through-Hole |
32 |
DIP |
Rectangular |
Ceramic |
16 |
No |
10 V |
38535Q/M;38534H;883B |
12 |
0.012 % |
Binary, Offset Binary |
5,±15 V |
In-Line |
DIP32,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T32 |
No |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.