Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Commercial |
Gull Wing |
12 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
1.253 V |
1 |
CMOS |
16 |
0.0183 % |
Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
4.8 ms |
R-PDSO-G12 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.159 in (4.039 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Commercial |
No Lead |
12 |
HVSON |
Square |
Plastic/Epoxy |
1 |
Yes |
1.253 V |
1 |
CMOS |
16 |
0.0183 % |
Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.018 in (0.45 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
4.8 ms |
S-PDSO-N12 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Gull Wing |
12 |
TSSOP |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
1.253 V |
250 Hz |
1 |
CMOS |
16 |
0.013 % |
Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
4.8 ms |
R-PDSO-G12 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.159 in (4.039 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Commercial |
Gull Wing |
12 |
TSSOP |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
1.253 V |
250 Hz |
1 |
CMOS |
16 |
0.013 % |
Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
4.8 ms |
R-PDSO-G12 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.159 in (4.039 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
No Lead |
12 |
HVSON |
Square |
Plastic/Epoxy |
1 |
Yes |
5.0048 V |
250 kHz |
1 |
16 |
0.0031 % |
5 V |
Binary |
5 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
SOLCC12,.12,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
4.9951 V |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Dual |
3 µs |
S-PDSO-N12 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Gull Wing |
12 |
TSSOP |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
1.253 V |
250 Hz |
1 |
CMOS |
16 |
0.013 % |
Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
4.8 ms |
R-PDSO-G12 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.159 in (4.039 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Commercial |
Gull Wing |
12 |
TSSOP |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
1.25 V |
1 kHz |
1 |
CMOS |
16 |
0.0183 % |
Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
-1.25 V |
Serial |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
4.8 ms |
R-PDSO-G12 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.159 in (4.039 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Commercial |
No Lead |
12 |
HVSON |
Square |
Plastic/Epoxy |
2 |
Yes |
1.253 V |
250 Hz |
1 |
CMOS |
16 |
0.013 % |
Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.018 in (0.45 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
4.8 ms |
S-PDSO-N12 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Gull Wing |
12 |
TSSOP |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
1.25 V |
1 kHz |
1 |
CMOS |
16 |
0.0183 % |
Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-1.25 V |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
4.8 ms |
R-PDSO-G12 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.159 in (4.039 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
No Lead |
12 |
HVSON |
Square |
2 |
Yes |
1.25 V |
1 |
16 |
0.0122 % |
Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.018 in (0.45 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
23 ms |
S-XDSO-N12 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
12 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.048 V |
14 kHz |
1 |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-2.048 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
1.6 µs |
R-PDSO-G12 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.159 in (4.039 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
No Lead |
12 |
HVSON |
Square |
Plastic/Epoxy |
2 |
Yes |
1.253 V |
250 Hz |
1 |
CMOS |
16 |
0.013 % |
Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.018 in (0.45 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
4.8 ms |
S-PDSO-N12 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
No Lead |
12 |
HVSON |
Square |
Plastic/Epoxy |
2 |
Yes |
1.253 V |
250 Hz |
1 |
CMOS |
16 |
0.013 % |
Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.018 in (0.45 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
4.8 ms |
S-PDSO-N12 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Gull Wing |
12 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
1.253 V |
1 |
CMOS |
16 |
0.0183 % |
Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
4.8 ms |
R-PDSO-G12 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.159 in (4.039 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Commercial |
No Lead |
12 |
HVSON |
Square |
Plastic/Epoxy |
2 |
Yes |
1.253 V |
250 Hz |
1 |
CMOS |
16 |
0.013 % |
Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.018 in (0.45 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
4.8 ms |
S-PDSO-N12 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Commercial |
No Lead |
12 |
HVSON |
Square |
Plastic/Epoxy |
1 |
Yes |
1.253 V |
1 |
CMOS |
16 |
0.0183 % |
Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.018 in (0.45 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
4.8 ms |
S-PDSO-N12 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||
|
Microchip Technology |
Analog To Digital Converter, Delta-Sigma |
Automotive |
No Lead |
12 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
3.6 V |
153.6 kHz |
1 |
16 |
2.2 mA |
0.0032 % |
3.3 V |
Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC12,.08,16 |
0.016 in (0.4 mm) |
125 °C (257 °F) |
-2.7 V |
Serial |
-40 °C (-40 °F) |
Sample |
Quad |
S-PQCC-N12 |
0.024 in (0.6 mm) |
0.079 in (2 mm) |
0.079 in (2 mm) |
|||||||||||||||||||
|
Semtech |
Analog To Digital Converter, Proprietary Method |
Automotive |
No Lead |
12 |
HVSON |
Square |
Plastic/Epoxy |
4 |
Yes |
2.42 V |
1.88 kHz |
1 |
CMOS |
16 |
3 V |
2's Complement Binary |
2.5/5 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
SOLCC12,.16,20 |
Other Converters |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-2.42 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Dual |
S-PDSO-N12 |
0.031 in (0.8 mm) |
0.157 in (4 mm) |
No |
0.157 in (4 mm) |
||||||||||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
12 |
VFBGA |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
2.128 V |
94.4 kHz |
1 |
BICMOS |
10 |
0.0977 % |
3 V |
Binary, 2's Complement Binary |
3/3.3 V |
Grid Array, Very Thin Profile, Fine Pitch |
BGA12,3X4,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
6.8 µs |
R-PBGA-B12 |
1 |
0.027 in (0.69 mm) |
0.074 in (1.885 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
0.087 in (2.215 mm) |
||||||||||
|
Maxim Integrated |
Digital To Analog Converter |
Industrial |
Ball |
12 |
VFBGA |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
1.8 V |
94.4 kHz |
1 |
BICMOS |
10 |
0.0977 % |
2's Complement Binary |
3/3.3 V |
Grid Array, Very Thin Profile, Fine Pitch |
BGA12,3X4,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-500 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
6.8 µs |
R-PBGA-B12 |
1 |
0.027 in (0.69 mm) |
0.074 in (1.885 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
0.087 in (2.215 mm) |
|||||||||||
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Industrial |
No Lead |
12 |
HVQCCN |
Square |
1 |
Yes |
4.106 V |
1.8 MHz |
1 |
BICMOS |
12 |
0.0305 % |
5 V |
Binary, 2's Complement Binary |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC12,.16SQ,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
556 ns |
S-XQCC-N12 |
1 |
0.031 in (0.8 mm) |
0.157 in (4 mm) |
No |
e0 |
0.157 in (4 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
No Lead |
12 |
HVQCCN |
Square |
1 |
Yes |
4.106 V |
1.8 MHz |
1 |
BICMOS |
12 |
0.0305 % |
5 V |
Binary |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC12,.16SQ,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Quad |
556 ns |
S-XQCC-N12 |
1 |
0.031 in (0.8 mm) |
0.157 in (4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.157 in (4 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
No Lead |
12 |
HVSON |
Square |
Plastic/Epoxy |
1 |
Yes |
1.253 V |
1 |
CMOS |
16 |
0.0183 % |
Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.018 in (0.45 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
4.8 ms |
S-PDSO-N12 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
No Lead |
12 |
HVSON |
Square |
Plastic/Epoxy |
1 |
Yes |
5.188 V |
1 |
18 |
0.0023 % |
5 V |
Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Dual |
1.5 µs |
S-PDSO-N12 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
12 |
VFBGA |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
1.064 V |
51 kHz |
1 |
BICMOS |
12 |
0.0244 % |
3 V |
Binary, 2's Complement Binary |
3/3.3 V |
Grid Array, Very Thin Profile, Fine Pitch |
BGA12,3X4,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
7.5 µs |
R-PBGA-B12 |
1 |
0.027 in (0.69 mm) |
0.074 in (1.885 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
0.087 in (2.215 mm) |
||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
12 |
VFBGA |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
1.8 V |
1 |
BICMOS |
12 |
0.0244 % |
3 V |
2's Complement Binary |
Grid Array, Very Thin Profile, Fine Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
7.5 µs |
R-PBGA-B12 |
1 |
0.027 in (0.69 mm) |
0.074 in (1.885 mm) |
e1 |
30 s |
260 °C (500 °F) |
0.087 in (2.215 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
No Lead |
12 |
HVSON |
Square |
Plastic/Epoxy |
1 |
Yes |
1.253 V |
1 |
CMOS |
16 |
0.0183 % |
Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.018 in (0.45 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
4.8 ms |
S-PDSO-N12 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
No Lead |
12 |
HVSON |
Square |
2 |
Yes |
1.25 V |
1 |
16 |
0.0122 % |
Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.018 in (0.45 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
23 ms |
S-XDSO-N12 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Gull Wing |
12 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
1.25 V |
60 Hz |
1 |
16 |
0.0153 % |
Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
23 ms |
R-PDSO-G12 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.159 in (4.039 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Commercial |
Gull Wing |
12 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
1.253 V |
1 |
CMOS |
16 |
0.0183 % |
Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
4.8 ms |
R-PDSO-G12 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.159 in (4.039 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Ball |
12 |
VFBGA |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
3.6 V |
105 kHz |
1 |
12 |
0.0732 % |
2.6 V |
Binary |
Grid Array, Very Thin Profile, Fine Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
R-PBGA-B12 |
1 |
0.026 in (0.65 mm) |
0.059 in (1.505 mm) |
No |
30 s |
260 °C (500 °F) |
0.079 in (2.005 mm) |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Ball |
12 |
VFBGA |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
3.6 V |
105 kHz |
1 |
12 |
0.0732 % |
2.6 V |
Binary |
Grid Array, Very Thin Profile, Fine Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Track |
Bottom |
R-PBGA-B12 |
0.026 in (0.65 mm) |
0.059 in (1.505 mm) |
0.079 in (2.005 mm) |
||||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
No Lead |
12 |
HVSON |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.048 V |
14 kHz |
1 |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.048 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
1.6 µs |
R-PDSO-N12 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.157 in (4 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Commercial |
Gull Wing |
12 |
TSSOP |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
1.25 V |
1 |
16 |
0.0122 % |
Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
23 ms |
R-PDSO-G12 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.159 in (4.039 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Commercial |
No Lead |
12 |
HVSON |
Square |
Plastic/Epoxy |
2 |
Yes |
1.25 V |
1 kHz |
1 |
CMOS |
16 |
0.0183 % |
Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.018 in (0.45 mm) |
70 °C (158 °F) |
-1.25 V |
Serial |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
4.8 ms |
S-PDSO-N12 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Commercial |
Gull Wing |
12 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
1.253 V |
1 |
CMOS |
16 |
0.0183 % |
Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
4.8 ms |
R-PDSO-G12 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.159 in (4.039 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Commercial |
Gull Wing |
12 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
1.253 V |
1 |
CMOS |
16 |
0.0183 % |
Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
4.8 ms |
R-PDSO-G12 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.159 in (4.039 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Commercial |
No Lead |
12 |
HVSON |
Square |
2 |
Yes |
1.25 V |
1 |
16 |
0.0122 % |
Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.018 in (0.45 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
23 ms |
S-XDSO-N12 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
No Lead |
12 |
HVSON |
Square |
Plastic/Epoxy |
1 |
Yes |
1.25 V |
60 Hz |
1 |
16 |
0.0153 % |
Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.018 in (0.45 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
23 ms |
S-PDSO-N12 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
No Lead |
12 |
HVSON |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
2.048 V |
14 kHz |
1 |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-2.048 V |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
1.6 µs |
R-PDSO-N12 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.157 in (4 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
No Lead |
12 |
HVSON |
Square |
Plastic/Epoxy |
1 |
Yes |
1.25 V |
60 Hz |
1 |
16 |
0.0153 % |
Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.018 in (0.45 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
23 ms |
S-PDSO-N12 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
No Lead |
12 |
HVSON |
Square |
Plastic/Epoxy |
2 |
Yes |
1.25 V |
1 kHz |
1 |
CMOS |
16 |
0.0183 % |
Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.018 in (0.45 mm) |
85 °C (185 °F) |
-1.25 V |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
4.8 ms |
S-PDSO-N12 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Gull Wing |
12 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
1.253 V |
1 |
CMOS |
16 |
0.0183 % |
Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
4.8 ms |
R-PDSO-G12 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.159 in (4.039 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Ball |
12 |
VFBGA |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
3.6 V |
105 kHz |
1 |
12 |
0.0732 % |
2.6 V |
Binary |
Grid Array, Very Thin Profile, Fine Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Track |
Bottom |
R-PBGA-B12 |
1 |
0.026 in (0.65 mm) |
0.063 in (1.61 mm) |
No |
e3 |
0.079 in (2.01 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
No Lead |
12 |
HVSON |
Square |
Plastic/Epoxy |
2 |
Yes |
1.25 V |
1 kHz |
1 |
CMOS |
16 |
0.0183 % |
Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.018 in (0.45 mm) |
85 °C (185 °F) |
-1.25 V |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
4.8 ms |
S-PDSO-N12 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Commercial |
No Lead |
12 |
HVSON |
Square |
Plastic/Epoxy |
1 |
Yes |
1.25 V |
60 Hz |
1 |
16 |
0.0153 % |
Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.018 in (0.45 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
23 ms |
S-PDSO-N12 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Commercial |
No Lead |
12 |
HVSON |
Square |
2 |
Yes |
1.25 V |
1 |
16 |
0.0122 % |
Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.018 in (0.45 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
23 ms |
S-XDSO-N12 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
No Lead |
12 |
HVSON |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.048 V |
14 kHz |
1 |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-2.048 V |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
1.6 µs |
R-PDSO-N12 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.157 in (4 mm) |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.