Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
46.5 kHz |
1 |
CMOS |
12 |
0.0122 % |
5 V |
Binary |
-5 V |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
Serial |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
R-PDSO-G20 |
1 |
0.116 in (2.95 mm) |
0.295 in (7.493 mm) |
No |
e0 |
0.524 in (13.3 mm) |
||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
5.05 V |
46.5 kHz |
1 |
CMOS |
12 |
0.0183 % |
5 V |
Binary |
-5 V |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-5.05 V |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
12 µs |
R-PDIP-T20 |
1 |
0.15 in (3.81 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
2.5 V |
16 kHz |
1 |
CMOS |
16 |
0.003 % |
5 V |
Binary, Offset Binary |
±5 V |
-5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-2.5 V |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Dual |
R-PDIP-T20 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.992 in (25.2 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
2 |
No |
1.27 V |
1 |
Bipolar |
8 |
45 mA |
0.39 % |
5 V |
Binary |
5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-1.28 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Dual |
10 µs |
R-PDIP-T20 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.992 in (25.2 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
5 V |
50 kHz |
1 |
Bipolar |
8 |
0.1953 % |
5 V |
Binary, Offset Binary |
5,-12/-15 V |
-15 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-5 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
30 µs |
R-CDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5 V |
1 |
CMOS |
8 |
0.3906 % |
5 V |
Binary |
5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
1.36 µs |
R-PDIP-T20 |
0.3 in (7.62 mm) |
No |
e0 |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
2.5 V |
16 kHz |
1 |
CMOS |
20 |
0.003 % |
5 V |
Binary, Offset Binary |
±5 V |
-5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-2.5 V |
Serial |
-55 °C (-67 °F) |
Sample |
Dual |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
2.46 V |
1 |
CMOS |
8 |
0.3906 % |
5 V |
Offset Binary |
5 V |
Chip Carrier |
LCC20,.35SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
0 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Quad |
15 µs |
S-CQCC-N20 |
0.1 in (2.54 mm) |
0.35 in (8.89 mm) |
No |
e0 |
0.35 in (8.89 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
2 |
Yes |
1.27 V |
1 |
Bipolar |
8 |
45 mA |
0.39 % |
5 V |
Binary |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-1.28 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Quad |
10 µs |
S-PQCC-J20 |
1 |
0.18 in (4.57 mm) |
0.353 in (8.965 mm) |
No |
e0 |
225 °C (437 °F) |
0.353 in (8.965 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
2.46 V |
1 |
CMOS |
8 |
0.1953 % |
5 V |
Offset Binary |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Matte Tin |
Track |
Quad |
15 µs |
S-PQCC-J20 |
1 |
0.18 in (4.573 mm) |
0.353 in (8.966 mm) |
No |
e3 |
260 °C (500 °F) |
0.353 in (8.966 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
5.05 V |
50 kHz |
1 |
CMOS |
12 |
0.0122 % |
5 V |
2's Complement Binary |
-5 V |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-5.05 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
13 µs |
R-PDIP-T20 |
1 |
0.155 in (3.937 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5.25 V |
400 kHz |
1 |
8 |
0.3906 % |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
3.75 µs |
R-PDIP-T20 |
0.155 in (3.937 mm) |
0.3 in (7.62 mm) |
No |
e3 |
||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
5 V |
1 MHz |
1 |
12 |
0.0244 % |
3 V |
Binary, 2's Complement Binary |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP20,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
800 ns |
R-PDSO-G20 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e0 |
240 °C (464 °F) |
0.256 in (6.5 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
1 MHz |
1 |
CMOS |
8 |
0.39 % |
5 V |
Binary, Offset Binary |
5,GND/-5 V |
-5 V |
Small Outline |
SOP20,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-2.5 V |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
660 ns |
R-PDSO-G20 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
0.504 in (12.8 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
3 |
No |
200 kHz |
1 |
16 |
0.0038 % |
5 V |
Binary |
In-Line |
125 °C (257 °F) |
Serial |
-55 °C (-67 °F) |
Dual |
4 µs |
R-CDIP-T20 |
||||||||||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
5.05 V |
50 kHz |
1 |
CMOS |
12 |
0.0183 % |
5 V |
2's Complement Binary |
-5 V |
Small Outline |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-5.05 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
13 µs |
R-PDSO-G20 |
1 |
0.104 in (2.642 mm) |
0.295 in (7.493 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.504 in (12.8015 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5.25 V |
1 |
8 |
5 V |
Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
3.75 µs |
R-PDSO-G20 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
0.504 in (12.8 mm) |
||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
5.05 V |
46.5 kHz |
1 |
CMOS |
12 |
12 mA |
0.0122 % |
5 V |
Binary, 2's Complement Binary |
-5 V |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-5.05 V |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
12 µs |
R-PDIP-T20 |
1 |
0.15 in (3.81 mm) |
0.3 in (7.62 mm) |
No |
e3 |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
46.5 kHz |
1 |
CMOS |
12 |
0.0183 % |
5 V |
Binary |
-5 V |
Small Outline |
0.05 in (1.27 mm) |
85 °C (185 °F) |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
R-PDSO-G20 |
1 |
0.116 in (2.95 mm) |
0.295 in (7.493 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.524 in (13.3 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
5 V |
1 |
CMOS |
MIL-STD-883 Class B |
8 |
20 mA |
0.3906 % |
5 V |
Binary |
5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
0 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
2.5 µs |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
20 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
512 mV |
100 MHz |
1 |
CMOS |
8 |
0.4883 % |
3 V |
Offset Binary |
Small Outline, Shrink Pitch |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-512 mV |
Serial |
-40 °C (-40 °F) |
Track |
Dual |
10 ns |
R-PDSO-G20 |
0.078 in (1.98 mm) |
0.208 in (5.295 mm) |
0.283 in (7.2 mm) |
||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
3.05 V |
15 kHz |
1 |
CMOS |
10 |
0.0488 % |
3 V |
Binary, 2's Complement Binary |
-3 V |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-3.05 V |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
R-PDIP-T20 |
0.155 in (3.937 mm) |
0.3 in (7.62 mm) |
No |
e3 |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
5.05 V |
50 kHz |
1 |
CMOS |
12 |
0.0183 % |
5 V |
2's Complement Binary |
-5 V |
Small Outline |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-5.05 V |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Dual |
13 µs |
R-PDSO-G20 |
1 |
0.104 in (2.642 mm) |
0.295 in (7.493 mm) |
No |
e0 |
0.504 in (12.8015 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
5 V |
50 kHz |
1 |
Bipolar |
10 |
0.0488 % |
5 V |
Binary, Offset Binary |
5,-12/-15 V |
-15 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-5 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
30 µs |
R-CDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
1 in (25.4 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter |
Industrial |
No Lead |
20 |
QCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
5.5 V |
1 |
CMOS |
14 |
0.0061 % |
Binary |
3/5 V |
Chip Carrier |
LCC20,.16SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Quad |
S-PQCC-N20 |
No |
||||||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
2 |
No |
1.27 V |
1 |
Bipolar |
8 |
45 mA |
0.39 % |
5 V |
Binary |
5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-1.28 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Matte Tin |
Dual |
10 µs |
R-PDIP-T20 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e3 |
0.992 in (25.2 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5 V |
50 kHz |
1 |
Bipolar |
10 |
0.0488 % |
5 V |
Binary, Offset Binary |
5,-12/-15 V |
-15 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-5 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
30 µs |
R-PDIP-T20 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e3 |
1.07 in (27.18 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
2.46 V |
1 |
BICMOS |
8 |
7 mA |
5 V |
Binary |
Chip Carrier |
0.05 in (1.27 mm) |
125 °C (257 °F) |
0 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Gold |
Track |
Quad |
15 µs |
S-CQCC-N20 |
0.1 in (2.54 mm) |
0.35 in (8.89 mm) |
No |
e4 |
0.35 in (8.89 mm) |
||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
7.3 V |
1 |
CMOS |
8 |
20 mA |
0.195 % |
5 V |
Binary |
5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-300 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
1.36 µs |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
5.05 V |
50 kHz |
1 |
CMOS |
12 |
0.0183 % |
5 V |
2's Complement Binary |
-5 V |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-5.05 V |
Serial |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
13 µs |
R-PDSO-G20 |
1 |
0.104 in (2.642 mm) |
0.295 in (7.493 mm) |
No |
e0 |
0.504 in (12.8015 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
2.46 V |
1 |
CMOS |
8 |
0.1953 % |
5 V |
Binary |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Quad |
20 µs |
S-PQCC-J20 |
0.18 in (4.57 mm) |
0.353 in (8.965 mm) |
No |
e0 |
0.353 in (8.965 mm) |
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|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
1 MHz |
1 |
CMOS |
8 |
0.39 % |
5 V |
Binary, Offset Binary |
-5 V |
Chip Carrier |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-2.5 V |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin |
Track |
Quad |
660 ns |
S-PQCC-J20 |
1 |
0.173 in (4.39 mm) |
0.352 in (8.93 mm) |
No |
e3 |
260 °C (500 °F) |
0.352 in (8.93 mm) |
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|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
2 |
Yes |
1.27 V |
1 |
Bipolar |
8 |
45 mA |
0.39 % |
5 V |
Binary |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-1.28 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Matte Tin |
Quad |
10 µs |
S-PQCC-J20 |
1 |
0.18 in (4.57 mm) |
0.353 in (8.965 mm) |
No |
e3 |
260 °C (500 °F) |
0.353 in (8.965 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
1 V |
100 kHz |
1 |
CMOS |
16 |
5 V |
Binary |
5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-1 V |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
5.05 V |
50 kHz |
1 |
CMOS |
12 |
0.0122 % |
5 V |
2's Complement Binary |
-5 V |
Small Outline |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-5.05 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
13 µs |
R-PDSO-G20 |
1 |
0.104 in (2.642 mm) |
0.295 in (7.493 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.504 in (12.8015 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
10 V |
76 kHz |
1 |
BICMOS |
12 |
0.0244 % |
5 V |
Binary, Offset Binary, Comp Binary, 2's Complement Binary, Comp 2's Complement, Comp Offset Binary |
5,-15 V |
-15 V |
Chip Carrier |
LDCC20,.4SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-10 V |
Serial |
0 °C (32 °F) |
Tin Lead |
Quad |
10.2 µs |
S-PQCC-J20 |
0.18 in (4.57 mm) |
0.353 in (8.9662 mm) |
No |
e0 |
0.353 in (8.9662 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
3.6 V |
350 kHz |
1 |
CMOS |
10 |
0.0977 % |
3 V |
Binary |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP20,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
105 °C (221 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
2.3 µs |
R-PDSO-G20 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.256 in (6.5 mm) |
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Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
5.05 V |
46.5 kHz |
1 |
CMOS |
12 |
0.0122 % |
5 V |
Binary |
-5 V |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-5.05 V |
Serial |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
12 µs |
R-PDIP-T20 |
1 |
0.15 in (3.81 mm) |
0.3 in (7.62 mm) |
No |
e0 |
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|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
No Lead |
20 |
HVQCCN |
Square |
1 |
Yes |
4.111 V |
2.5 MHz |
1 |
CMOS |
16 |
0.0023 % |
2.5 V |
Binary |
2.5,5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC20,.16SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Track |
Quad |
400 ns |
S-XQCC-N20 |
3 |
0.039 in (1 mm) |
0.157 in (4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.157 in (4 mm) |
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Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
5.05 V |
50 kHz |
1 |
CMOS |
12 |
0.0122 % |
5 V |
2's Complement Binary |
-5 V |
Small Outline |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-5.05 V |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Dual |
13 µs |
R-PDSO-G20 |
1 |
0.104 in (2.642 mm) |
0.295 in (7.493 mm) |
No |
e0 |
0.504 in (12.8015 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
7.3 V |
1 |
CMOS |
8 |
15 mA |
0.39 % |
5 V |
Binary |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-300 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin |
Track |
Quad |
1.36 µs |
S-PQCC-J20 |
1 |
0.18 in (4.57 mm) |
0.353 in (8.9662 mm) |
No |
e3 |
260 °C (500 °F) |
0.353 in (8.9662 mm) |
|||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
5 V |
50 kHz |
1 |
Bipolar |
10 |
0.0488 % |
5 V |
Binary, Offset Binary |
5,-12/-15 V |
-15 V |
Chip Carrier |
LDCC20,.4SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-5 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Quad |
30 µs |
S-PQCC-J20 |
0.18 in (4.57 mm) |
0.353 in (8.965 mm) |
No |
e0 |
0.353 in (8.965 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
1 |
CMOS |
8 |
25 mA |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Dual |
975 ns |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
5.05 V |
50 kHz |
1 |
CMOS |
12 |
0.0183 % |
5 V |
2's Complement Binary |
-5 V |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-5.05 V |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
13 µs |
R-PDSO-G20 |
1 |
0.104 in (2.642 mm) |
0.295 in (7.493 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.504 in (12.8015 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
1 |
CMOS |
8 |
25 mA |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Dual |
975 ns |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
Yes |
e0 |
||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
5 V |
1 |
CMOS |
8 |
20 mA |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
0 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
2.5 µs |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
|||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
5 V |
1 |
CMOS |
MIL-STD-883 |
8 |
20 mA |
0.3906 % |
5 V |
Binary |
5 V |
Chip Carrier |
LCC20,.35SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
0 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Track |
Quad |
2.5 µs |
S-CQCC-N20 |
0.1 in (2.54 mm) |
0.35 in (8.89 mm) |
Yes |
0.35 in (8.89 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
16 kHz |
1 |
CMOS |
20 |
0.0015 % |
5 V |
Binary, Offset Binary |
-5 V |
Small Outline |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-2.5 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
R-PDSO-G20 |
3 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.504 in (12.8 mm) |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.