Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5.25 V |
333 kHz |
1 |
CMOS |
14 |
0.0122 % |
5 V |
Binary, 2's Complement Binary |
5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
2.78 µs |
R-PDIP-T24 |
0.18 in (4.57 mm) |
0.3 in (7.62 mm) |
No |
e0 |
1.165 in (29.59 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
24 |
DIE |
4 |
Yes |
5 V |
1 |
CMOS |
8 |
0.3906 % |
5 V |
Binary, Complementary Offset Binary |
5 V |
Uncased Chip |
DIE OR CHIP |
Analog to Digital Converters |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Track |
Upper |
2.5 µs |
X-XUUC-N24 |
No |
||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
5 V |
1 |
BICMOS |
12 |
0.012 % |
Offset Binary |
5,-15 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Dual |
R-PDIP-T24 |
1 |
No |
|||||||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
No Lead |
24 |
QCCN |
Rectangular |
1 |
Yes |
1 V |
1 MHz |
1 |
16 |
0.002 % |
5 V |
Binary |
Chip Carrier |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-1 V |
Serial |
-55 °C (-67 °F) |
Quad |
800 ns |
R-XQCC-N24 |
3 |
0.082 in (2.08 mm) |
0.157 in (4 mm) |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
|||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
3 V |
83 kHz |
1 |
CMOS |
14 |
22 mA |
0.0122 % |
5 V |
Binary |
-5 V |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-3 V |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
10 µs |
R-GDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
10 V |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
±5 V |
-5 V |
Small Outline |
SOP24,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-10 V |
Serial, Parallel, 8 Bits, Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
9 µs |
R-PDSO-G24 |
3 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
240 °C (464 °F) |
0.606 in (15.4 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5 V |
1 |
BICMOS |
12 |
0.024 % |
Offset Binary |
5,-12/-15 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin/Lead |
Dual |
R-PDIP-T24 |
No |
e0 |
|||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
5 V |
1 |
Hybrid |
12 |
0.0122 % |
15 V |
Binary |
5,±15 V |
-15 V |
In-Line |
DIP24,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-5 V |
Serial, Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Sample |
Dual |
13 µs |
R-CDIP-T24 |
No |
e0 |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Gull Wing |
24 |
TSSOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
2.5 V |
11.84 kHz |
1 |
24 |
16 mA |
0.0015 % |
5 V |
Binary |
3/5,5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP24,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-2.5 V |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Dual |
250 µs |
R-PDSO-G24 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e0 |
240 °C (464 °F) |
0.307 in (7.8 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
1.25 MHz |
1 |
CMOS |
12 |
0.0366 % |
5 V |
Binary |
3/5 V |
Small Outline |
SOP24,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
680 ns |
R-PDSO-G24 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
260 °C (500 °F) |
0.606 in (15.4 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
15 V |
250 kHz |
1 |
BICMOS |
12 |
0.0122 % |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-300 mV |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
3 ms |
R-PDIP-T24 |
1 |
0.15 in (3.81 mm) |
0.3 in (7.62 mm) |
No |
e3 |
||||||||||||||||
Analog Devices |
Analog To Digital Converter |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5 V |
1 |
CMOS |
MIL-STD-883 Class B |
12 |
0.0122 % |
5 V |
Complementary Offset Binary |
5,-15 V |
-15 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 mV |
Parallel, Word |
0 °C (32 °F) |
Sample |
Dual |
12.5 µs |
R-PDIP-T24 |
0.3 in (7.62 mm) |
No |
1.227 in (31.165 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
33.3 kHz |
1 |
CMOS |
12 |
0.0244 % |
5 V |
2's Complement Binary |
-5 V |
Small Outline |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-2.5 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
2.3 µs |
R-PDSO-G24 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.606 in (15.4 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
24 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
1.25 MHz |
1 |
CMOS |
12 |
0.0366 % |
5 V |
Binary |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP24,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
680 ns |
R-PDSO-G24 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e0 |
0.307 in (7.8 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
1 |
CMOS |
MIL-STD-883 |
12 |
0.0244 % |
5 V |
Binary |
±5 V |
-5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Serial, Parallel, 8 Bits, Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
9 µs |
R-CDIP-T24 |
Yes |
e0 |
||||||||||||||||
Analog Devices |
Analog To Digital Converter |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
5 V |
1 |
BICMOS |
12 |
0.024 % |
Offset Binary |
5,-12/-15 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Dual |
R-PDIP-T24 |
1 |
No |
|||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5 V |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Binary |
5,-15 V |
-15 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 mV |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
13 µs |
R-PDIP-T24 |
0.3 in (7.62 mm) |
No |
e0 |
1.227 in (31.165 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5 V |
300 kHz |
1 |
BICMOS |
12 |
0.0244 % |
5 V |
Binary |
-5 V |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits, Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
2.7 ms |
R-PDSO-G24 |
1 |
0.104 in (2.642 mm) |
0.295 in (7.493 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.606 in (15.395 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
24 |
TSSOP |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
10 V |
1.12 MHz |
2 |
CMOS |
12 |
0.0244 % |
5 V |
2's Complement Binary |
5,±5/±15 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP24,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-10 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
610 ns |
R-PDSO-G24 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
0.307 in (7.8 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
10 V |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
±5 V |
-5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-10 V |
Serial, Parallel, 8 Bits, Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
9 µs |
R-PDIP-T24 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e3 |
1.25 in (31.75 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
1.25 V |
200 kHz |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
3.3/5 V |
Small Outline |
SOP24,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-1.25 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
18 µs |
R-PDSO-G24 |
1 |
0.089 in (2.26 mm) |
0.295 in (7.5 mm) |
No |
e3 |
260 °C (500 °F) |
0.602 in (15.29 mm) |
|||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5 V |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Binary |
-12 V |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-5 V |
Parallel, Word |
0 °C (32 °F) |
Dual |
5.2 µs |
R-PDIP-T24 |
0.3 in (7.62 mm) |
No |
1.227 in (31.165 mm) |
|||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
2 |
No |
2.5 V |
1 |
CMOS |
24 |
0.003 % |
5 V |
Binary, Offset Binary |
±5/10 V |
-5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-2.5 V |
Serial |
-55 °C (-67 °F) |
Tin Lead |
Sample |
Dual |
R-GDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
24 |
TSSOP |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
5.5 V |
2 MHz |
1 |
CMOS |
8 |
0.293 % |
3 V |
Binary |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP24,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
420 ns |
R-PDSO-G24 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e0 |
0.307 in (7.8 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
1.25 MHz |
1 |
CMOS |
12 |
0.0366 % |
5 V |
Binary |
3/5 V |
Small Outline |
SOP24,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
680 ns |
R-PDSO-G24 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
240 °C (464 °F) |
0.606 in (15.4 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
2.5 V |
117 kHz |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Binary |
5 V |
Small Outline |
SOP24,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
5.9 µs |
R-PDSO-G24 |
3 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
240 °C (464 °F) |
0.606 in (15.4 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
2.5 V |
600 kHz |
1 |
CMOS |
12 |
0.0244 % |
5 V |
2's Complement Binary |
5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-2.5 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
1.47 µs |
R-PDIP-T24 |
0.3 in (7.62 mm) |
No |
e3 |
1.227 in (31.165 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
1.25 V |
200 kHz |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
3.3/5 V |
Small Outline |
SOP24,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-1.25 V |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
18 µs |
R-PDSO-G24 |
1 |
0.089 in (2.26 mm) |
0.295 in (7.5 mm) |
No |
e0 |
240 °C (464 °F) |
0.602 in (15.29 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
2.5 V |
600 kHz |
1 |
CMOS |
12 |
0.0366 % |
5 V |
2's Complement Binary |
5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-2.5 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
1.47 µs |
R-PDIP-T24 |
0.3 in (7.62 mm) |
No |
e0 |
1.227 in (31.165 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5 V |
300 kHz |
1 |
BICMOS |
12 |
0.0244 % |
5 V |
Binary |
-5 V |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits, Parallel, Word |
0 °C (32 °F) |
Matte Tin - annealed |
Sample |
Dual |
2.7 ms |
R-PDIP-T24 |
1 |
0.3 in (7.62 mm) |
No |
e3 |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
24 |
TSSOP |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
5.5 V |
2 MHz |
1 |
CMOS |
8 |
0.293 % |
3 V |
Binary |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP24,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
420 ns |
R-PDSO-G24 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e0 |
0.307 in (7.8 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
24 |
TSSOP |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
10 V |
1.12 MHz |
2 |
CMOS |
12 |
0.0244 % |
5 V |
2's Complement Binary |
5,±5/±15 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP24,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-10 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
610 ns |
R-PDSO-G24 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
0.307 in (7.8 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
15 V |
250 kHz |
1 |
BICMOS |
12 |
0.0122 % |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-300 mV |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
8 ms |
R-PDIP-T24 |
1 |
0.15 in (3.81 mm) |
0.3 in (7.62 mm) |
No |
e3 |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
15 V |
250 kHz |
1 |
BICMOS |
12 |
0.0122 % |
5 V |
Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-300 mV |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
3 ms |
R-PDSO-G24 |
1 |
0.104 in (2.642 mm) |
0.295 in (7.493 mm) |
No |
e0 |
0.606 in (15.395 mm) |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
1.5 MHz |
1 |
CMOS |
12 |
0.0488 % |
3 V |
Binary |
3/5 V |
Small Outline |
SOP24,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
538 ns |
R-PDSO-G24 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
240 °C (464 °F) |
0.606 in (15.4 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
5 V |
1 |
CMOS |
12 |
12 mA |
0.0244 % |
5 V |
Binary |
-12 V |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-5 V |
Parallel, Word |
-55 °C (-67 °F) |
Gold |
Sample |
Dual |
10.4 µs |
R-GDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e4 |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
100 kHz |
1 |
BIMOS |
16 |
12 mA |
0.0015 % |
12 V |
Binary |
-12 V |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-10 V |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Sample |
Dual |
10 µs |
R-CDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
24 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
1.5 MHz |
1 |
CMOS |
12 |
0.0244 % |
3 V |
Binary |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP24,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
538 ns |
R-PDSO-G24 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e0 |
240 °C (464 °F) |
0.307 in (7.8 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
No Lead |
24 |
DIE |
Rectangular |
5 |
Yes |
2.5 V |
1 |
CMOS |
24 |
0.0015 % |
5 V |
Binary, Offset Binary |
Uncased Chip |
85 °C (185 °F) |
-2.5 V |
Serial |
-40 °C (-40 °F) |
Upper |
R-XUUC-N |
3 |
No |
30 s |
260 °C (500 °F) |
|||||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
5.25 V |
285 kHz |
1 |
CMOS |
14 |
0.0122 % |
5 V |
Binary |
5 V |
Small Outline |
SOP24,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
105 °C (221 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Track |
Dual |
5.25 µs |
R-PDSO-G24 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
260 °C (500 °F) |
0.606 in (15.4 mm) |
|||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
5.5 V |
200 kHz |
1 |
CMOS |
12 |
0.0244 % |
3 V |
Binary |
3.3/5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
4.6 µs |
R-PDIP-T24 |
0.3 in (7.62 mm) |
No |
e0 |
1.227 in (31.165 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
4 |
No |
5.5 V |
2 MHz |
1 |
CMOS |
8 |
0.293 % |
3 V |
Binary |
3/5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
420 ns |
R-PDIP-T24 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e0 |
1.25 in (31.75 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
50 kHz |
1 |
CMOS |
12 |
5 V |
Binary |
-5 V |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-2.5 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
1.4 µs |
R-PDSO-G24 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
0.606 in (15.4 mm) |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
10 V |
1 |
CMOS |
12 |
0.0122 % |
5 V |
Binary, 2's Complement Binary |
±5 V |
-5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-10 V |
Serial, Parallel, 8 Bits, Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
9 µs |
R-PDIP-T24 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e0 |
1.25 in (31.75 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
1 MHz |
1 |
CMOS |
12 |
0.0366 % |
3 V |
Binary |
3/5 V |
Small Outline |
SOP24,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
880 ns |
R-PDSO-G24 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
0.606 in (15.4 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
5 V |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Binary |
5,-12/-15 V |
-15 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Sample |
Dual |
13 µs |
R-GDIP-T24 |
0.225 in (5.715 mm) |
0.3 in (7.62 mm) |
No |
e0 |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
3.3 V |
50 kHz |
1 |
BICMOS |
12 |
4 mA |
0.0488 % |
3.3 V |
Binary |
3.3 V |
Small Outline |
SOP24,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-3.3 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
15 µs |
R-PDSO-G24 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
0.606 in (15.4 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5 V |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
±5 V |
-5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 mV |
Serial, Parallel, 8 Bits, Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Track |
Dual |
9 µs |
R-PDIP-T24 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e0 |
1.25 in (31.75 mm) |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.