28 Analog-to-Digital Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

MAX118CPI+

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

8

No

5.25 V

1 MHz

1

BICMOS

8

5 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-5.25 V

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

865 ns

R-PDIP-T28

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

1.45 in (36.83 mm)

MAX1497EAI+T

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

1

Yes

2.2 V

1

BICMOS

3.3 V

2's Complement Binary

3/5 V

Small Outline, Shrink Pitch

SSOP28,.3

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

-2.2 V

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G28

1

0.078 in (1.99 mm)

0.209 in (5.3 mm)

No

e3

0.402 in (10.2 mm)

MAX174BEWI+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

1

BICMOS

12

10 mA

0.012 %

15 V

Binary, Offset Binary

5,±12/±15 V

-15 V

Small Outline

SOP28,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Dual

8 µs

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

0.705 in (17.9 mm)

MAX1090BEEI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

8

Yes

1.25 V

400 MHz

1

10

0.0977 %

5 V

Binary, 2's Complement Binary

5 V

Small Outline, Shrink Pitch

SSOP24,.24

Analog to Digital Converters

0.025 in (0.635 mm)

85 °C (185 °F)

-1.25 V

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin - annealed

Track

Dual

4 µs

R-PDSO-G28

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

0.389 in (9.89 mm)

MAX1491CAI+

Analog Devices

Analog To Digital Converter, Delta-Sigma

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

1

Yes

2.2 V

1

BICMOS

3.3 V

Binary

3/5 V

Small Outline, Shrink Pitch

SSOP28,.3

Analog to Digital Converters

0.026 in (0.65 mm)

70 °C (158 °F)

-2.2 V

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G28

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e3

30 s

260 °C (500 °F)

0.402 in (10.2 mm)

MAX1270ACAI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

8

Yes

4.096 V

9 kHz

1

CMOS

12

0.0122 %

5 V

Binary, 2's Complement Binary

5 V

Small Outline, Shrink Pitch

SSOP28,.3

Analog to Digital Converters

0.026 in (0.65 mm)

70 °C (158 °F)

-4.096 V

Serial

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

11 µs

R-PDSO-G28

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e3

30 s

260 °C (500 °F)

0.402 in (10.2 mm)

MAX161ACWI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

8

Yes

5 V

1

CMOS

8

0.7324 %

5 V

Binary, Offset Binary, Complementary Binary

5 V

Small Outline

SOP28,.5

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-5 V

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.705 in (17.9 mm)

MAX1294AEEI+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

6

Yes

1.25 V

420 kHz

1

12

0.0122 %

5 V

Binary, 2's Complement Binary

5 V

Small Outline, Shrink Pitch

SSOP28,.25

Analog to Digital Converters

0.025 in (0.635 mm)

85 °C (185 °F)

-1.25 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Dual

4 µs

R-PDSO-G28

1

0.068 in (1.73 mm)

0.154 in (3.9 mm)

No

e3

0.389 in (9.89 mm)

5962-9169201QXC

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

4.5 V

20 kHz

1

CMOS

MIL-PRF-38535 Class Q

16

0.0046 %

5 V

Binary, 2's Complement Binary

-5 V

In-Line

125 °C (257 °F)

-4.5 V

Serial

-55 °C (-67 °F)

Gold

Sample

Dual

40.63 µs

R-GDIP-T28

No

e4

MAX161AEWI+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

8

Yes

5 V

1

CMOS

8

0.7324 %

5 V

Binary, Offset Binary, Complementary Binary

5 V

Small Outline

SOP28,.5

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-5 V

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

0.705 in (17.9 mm)

MAX1265AEEI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

6

Yes

3.6 V

256 kHz

1

12

0.0122 %

3 V

Binary

3/3.3 V

Small Outline, Shrink Pitch

SSOP28,.25

Analog to Digital Converters

0.025 in (0.635 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Dual

4.1 µs

R-PDSO-G28

1

0.068 in (1.73 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

0.389 in (9.89 mm)

MAX1290AEEI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

8

Yes

1.25 V

400 kHz

1

12

0.0122 %

5 V

Binary, 2's Complement Binary

5 V

Small Outline, Shrink Pitch

SSOP28,.25

Analog to Digital Converters

0.025 in (0.635 mm)

85 °C (185 °F)

-1.25 V

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin - annealed

Track

Dual

4 µs

R-PDSO-G28

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

0.389 in (9.89 mm)

MAX1189CEUI+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

135 kHz

1

BICMOS

16

0.0061 %

5 V

Offset Binary

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Dual

4.7 µs

R-PDSO-G28

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e3

0.382 in (9.7 mm)

MX7828LP+

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

8

Yes

5.25 V

1

CMOS

8

5 V

Complementary Offset Binary

5 V

Chip Carrier

LDCC28,.5SQ

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin - annealed

Track

Quad

2.4 µs

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e3

30 s

260 °C (500 °F)

0.453 in (11.505 mm)

MX7672KP03+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

J Bend

28

HQCCJ

Square

Plastic/Epoxy

2

Yes

210 kHz

1

BICMOS

12

0.0244 %

5 V

Binary

-12 V

Chip Carrier, Heat Sink/Slug

0.05 in (1.27 mm)

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Quad

3.125 µs

S-PQCC-J28

0.18 in (4.57 mm)

0.453 in (11.505 mm)

0.453 in (11.505 mm)

MAX161AEWI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

8

Yes

5 V

1

CMOS

8

0.7324 %

5 V

Binary, Offset Binary, Complementary Binary

5 V

Small Outline

SOP28,.5

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-5 V

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.705 in (17.9 mm)

MAX156BEWI+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

4

Yes

6.25 V

278 kHz

1

8

0.3906 %

5 V

Binary

5,GND/-5 V

-5 V

Small Outline

SOP28,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-300 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin - annealed

Track

Dual

3.8 µs

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

0.705 in (17.9 mm)

MAX1400CAI+T

Analog Devices

Analog To Digital Converter, Delta-Sigma

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

5

Yes

2.5 V

1

CMOS

18

0.0015 %

5 V

Binary

3/5 V

Small Outline, Shrink Pitch

SSOP28,.3

Analog to Digital Converters

0.026 in (0.65 mm)

70 °C (158 °F)

-2.5 V

Serial

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G28

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e3

30 s

260 °C (500 °F)

0.402 in (10.2 mm)

MAX11142ATI+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

8

Yes

3.65 V

500 kHz

1

8

0.0586 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1271BEAI+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

8

Yes

4.096 V

9.1 kHz

1

CMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

5 V

Small Outline, Shrink Pitch

SSOP28,.3

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

-4.096 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Dual

11 µs

R-PDSO-G28

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e3

30 s

260 °C (500 °F)

0.402 in (10.2 mm)

MX574AKEWI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

1

BICMOS

12

0.0122 %

15 V

Binary, Offset Binary

-15 V

Small Outline

0.05 in (1.27 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Dual

25 µs

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.705 in (17.9 mm)

MX7672TE05+

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

HQCCN

Square

2

Yes

125 kHz

1

BICMOS

12

0.0244 %

5 V

Binary

-12 V

Chip Carrier, Heat Sink/Slug

0.05 in (1.27 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Quad

5 µs

S-XQCC-N28

0.1 in (2.54 mm)

0.451 in (11.455 mm)

0.451 in (11.455 mm)

MX674AJN+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

1

BICMOS

12

0.0244 %

15 V

Binary, Offset Binary

-15 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Dual

15 µs

R-PDIP-T28

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

1.45 in (36.83 mm)

MAX11142ATI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

8

Yes

3.65 V

500 kHz

1

8

0.0586 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX182BEWI+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

4

Yes

5 V

1

CMOS

12

10 mA

1 %

15 V

Binary, Offset Binary

±5,15 V

-5 V

Small Outline

SOP28,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-5 V

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin - annealed

Track

Dual

140 µs

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.705 in (17.9 mm)

MAX11125ATI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

8

Yes

3.65 V

1 MHz

1

12

2.5 μA

0.024414063 %

3 V

2's Complement Binary

2.5/3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-300 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11139ATI+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

8

Yes

3.65 V

500 kHz

1

10

0.0391 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX158BMJI/883

Analog Devices

Military

Through-Hole

28

DIP

Rectangular

Ceramic

8

No

5 V

CMOS

38535Q/M;38534H;883B

8

5 V

Binary, Offset Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T28

No

e0

MAX11128ATI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

16

Yes

3.65 V

1 MHz

1

12

2.5 μA

0.024414063 %

3 V

2's Complement Binary

2.5/3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-300 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1401CAI+

Analog Devices

Analog To Digital Converter, Delta-Sigma

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

5

Yes

1.25 V

1

18

0.0015 %

3.3 V

Binary

3/3.3 V

Small Outline, Shrink Pitch

SSOP28,.3

Analog to Digital Converters

0.026 in (0.65 mm)

70 °C (158 °F)

-1.25 V

Serial

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G28

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e3

30 s

260 °C (500 °F)

0.402 in (10.2 mm)

MX674AK/D

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

28

DIE

Rectangular

1

Yes

10 V

1

BICMOS

12

0.0122 %

15 V

Binary, Offset Binary

5,±12/±15 V

-15 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Upper

15 µs

R-XUUC-N28

1

No

e0

MAX182AEPI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

4

No

5 V

1

CMOS

12

10 mA

1 %

15 V

Binary, Offset Binary

±5,15 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin - annealed

Track

Dual

140 µs

R-PDIP-T28

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

1.45 in (36.83 mm)

MAX1065BCUI+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

4.096 V

165 kHz

1

BICMOS

14

0.0122 %

5 V

Binary

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Analog to Digital Converters

0.026 in (0.65 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

4.7 µs

R-PDSO-G28

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

0.382 in (9.7 mm)

MX574AKEQI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

1

Yes

10 V

1

BICMOS

12

0.012 %

15 V

Binary, Offset Binary

-15 V

Chip Carrier

0.05 in (1.27 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Quad

25 µs

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e3

245 °C (473 °F)

0.453 in (11.5062 mm)

MAX1159BEUI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

135 kHz

1

BICMOS

14

0.0122 %

5 V

Offset Binary

3/5,5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Dual

4.7 µs

R-PDSO-G28

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e3

0.382 in (9.7 mm)

MAX1231BETI+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

28

HVQCCN

Square

16

Yes

1.26 V

300 kHz

1

BICMOS

12

0.0244 %

2.7 V

Binary, 2's Complement Binary

3/3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-1.24 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1295BEEI+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

6

Yes

1.25 V

265 kHz

1

12

0.0244 %

3 V

Binary, 2's Complement Binary

3/3.3 V

Small Outline, Shrink Pitch

SSOP28,.25

Analog to Digital Converters

0.025 in (0.635 mm)

85 °C (185 °F)

-1.25 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Dual

4.1 µs

R-PDSO-G28

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

0.389 in (9.89 mm)

MAX1231BETI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

28

HVQCCN

Square

16

Yes

1.26 V

300 kHz

1

BICMOS

12

0.0244 %

3 V

Binary, 2's Complement Binary

3/3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-1.24 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1231BCTI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

28

HVQCCN

Square

16

Yes

1.26 V

300 kHz

1

BICMOS

12

0.0244 %

3 V

Binary, 2's Complement Binary

3/3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

70 °C (158 °F)

-1.24 V

Serial

0 °C (32 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX161BMJI

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

5 V

1

CMOS

8

5 mA

0.293 %

5 V

Binary, Offset Binary, Complementary Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

245 °C (473 °F)

MAX1065BCUI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

4.096 V

165 kHz

1

BICMOS

14

0.0122 %

5 V

Binary

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Analog to Digital Converters

0.026 in (0.65 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

4.7 µs

R-PDSO-G28

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

0.382 in (9.7 mm)

MX574ALEWI+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

1

BICMOS

12

0.012 %

15 V

Binary, Offset Binary

-15 V

Small Outline

0.05 in (1.27 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Dual

25 µs

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

0.705 in (17.9 mm)

MAX117EAI+

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

8

Yes

3 V

400 kHz

1

CMOS

8

6 mA

3.6 V

Binary

3.3 V

Small Outline, Shrink Pitch

SSOP28,.3

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin - annealed

Track

Dual

2.4 µs

R-PDSO-G28

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e3

30 s

260 °C (500 °F)

0.402 in (10.2 mm)

MAC1403CAI

Analog Devices

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

5

Yes

1.25 V

Bipolar

18

0.0015 %

Offset Binary

3/3.3 V

Small Outline, Shrink Pitch

SSOP28,.3

Analog to Digital Converters

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G28

No

e0

MX674AKEWI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

1

BICMOS

12

0.0122 %

15 V

Binary, Offset Binary

-15 V

Small Outline

0.05 in (1.27 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Dual

15 µs

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.705 in (17.9 mm)

MAX1189ACUI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

135 kHz

1

BICMOS

16

0.0031 %

5 V

Offset Binary

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Analog to Digital Converters

0.026 in (0.65 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

4.7 µs

R-PDSO-G28

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

0.382 in (9.7 mm)

MAX11131ATI+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

16

Yes

3.65 V

3 MHz

1

12

0.0244 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX135EWI+T

Analog Devices

Analog To Digital Converter, Multi-Slope

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1

Yes

6 V

1

CMOS

15

125 μA

0.006 %

5 V

2's Complement Binary

±5 V

-5 V

Small Outline

SOP28,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-9 V

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

0.705 in (17.9 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.