Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.048 V |
5 MHz |
1 |
CMOS |
12 |
0.0244 % |
5 V |
2's Complement Binary |
-5 V |
Small Outline, Shrink Pitch |
0.025 in (0.635 mm) |
85 °C (185 °F) |
-2.048 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
180 ns |
R-PDSO-G28 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.899 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.39 in (9.9 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
28 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2 V |
80 MHz |
1 |
CMOS |
12 |
0.0293 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP28,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
1 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Dual |
R-PDSO-G28 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e0 |
240 °C (464 °F) |
0.382 in (9.7 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2 V |
20 MHz |
1 |
CMOS |
10 |
5 V |
Binary |
3.3,5 V |
Small Outline, Shrink Pitch |
SSOP28,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Dual |
50 ns |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e0 |
240 °C (464 °F) |
0.402 in (10.2 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
10 V |
100 kHz |
1 |
16 |
0.0046 % |
5 V |
2's Complement Binary |
Small Outline, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
-10 V |
Parallel, Word |
0 °C (32 °F) |
Tin/Lead |
Sample |
Dual |
8 µs |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e0 |
20 s |
235 °C (455 °F) |
0.402 in (10.2 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
16 |
No |
10 V |
1 |
12 |
15 V |
Binary, Offset Binary, 2's Complement Binary |
-15 V |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-10 V |
Parallel, Word |
0 °C (32 °F) |
Sample |
Dual |
32 µs |
R-PDIP-T28 |
0.23 in (5.84 mm) |
0.6 in (15.24 mm) |
1.49 in (37.85 mm) |
||||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
1.25 V |
468 kHz |
1 |
CMOS |
16 |
28.5 mA |
0.1953 % |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-1.25 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDIP-T28 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e3 |
1.472 in (37.4 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
2 |
Yes |
9.8 V |
400 kHz |
1 |
CMOS |
8 |
0.3906 % |
12 V |
Offset Binary |
Chip Carrier |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Track |
Quad |
3.11 µs |
S-PQCC-J28 |
0.178 in (4.51 mm) |
0.453 in (11.5062 mm) |
No |
e0 |
0.453 in (11.5062 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic |
1 |
Yes |
100 mV |
1 |
Bipolar |
38535Q/M;38534H;883B |
8 |
0.47 % |
Offset Binary |
5,-5.2 V |
Chip Carrier |
LCC28,.45SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin/Lead - hot dipped |
Quad |
S-XQCC-N28 |
No |
e0 |
||||||||||||||||||||||
|
Analog Devices |
Digital To Analog Converter |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.048 V |
10 MHz |
1 |
CMOS |
12 |
0.0244 % |
5 V |
2's Complement Binary |
-5 V |
Small Outline, Shrink Pitch |
0.025 in (0.635 mm) |
85 °C (185 °F) |
-2.048 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
90 ns |
R-PDSO-G28 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.899 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.389 in (9.893 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
1 |
MIL-STD-883 |
12 |
0.0244 % |
15 V |
Binary |
-15 V |
In-Line |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Dual |
25 µs |
R-CDIP-T28 |
No |
||||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
5 V |
128 kHz |
1 |
BICMOS |
14 |
34 mA |
0.0122 % |
12 V |
Binary, 2's Complement Binary |
5,±12 V |
-12 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-5 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Sample |
Dual |
6.3 µs |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
2 |
Yes |
15 V |
1 |
CMOS |
12 |
12 mA |
0.012 % |
5 V |
Binary |
5,-12 V |
-12 V |
Chip Carrier |
LCC28,.45SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-15 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Sample |
Quad |
5.2 µs |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
No |
e0 |
0.45 in (11.43 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
10 |
Yes |
2.56 V |
1 |
CMOS |
16 |
0.0015 % |
3 V |
Binary, Offset Binary |
3/5 V |
Small Outline |
SOP28,.4 |
Other Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-2.56 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G28 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
260 °C (500 °F) |
0.705 in (17.9 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
3 V |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
±5 V |
-5 V |
Chip Carrier |
LDCC28,.5SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-3 V |
Serial, Parallel, 8 Bits, Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Track |
Quad |
9 µs |
S-PQCC-J28 |
1 |
0.18 in (4.57 mm) |
0.453 in (11.5062 mm) |
No |
e0 |
225 °C (437 °F) |
0.453 in (11.5062 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
800 kHz |
1 |
CMOS |
14 |
0.0076 % |
5 V |
2's Complement Binary |
-5 V |
Small Outline, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
-2.5 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
1.15 µs |
R-PDSO-G28 |
1 |
0.078 in (1.99 mm) |
0.209 in (5.3 mm) |
No |
e0 |
0.402 in (10.2 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
No Lead |
28 |
DIE |
Rectangular |
1 |
Yes |
31 MHz |
1 |
Bipolar |
12 |
258 mA |
5 V |
Offset Binary |
-5.2 V |
Uncased Chip |
Parallel, Word |
Tin Lead |
Track |
Upper |
R-XUUC-N28 |
No |
e0 |
|||||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
10 |
Yes |
2.56 V |
1 |
16 |
0.0015 % |
3 V |
Binary, Offset Binary |
3/5 V |
Small Outline |
SOP28,.4 |
Other Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-2.56 V |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G28 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
240 °C (464 °F) |
0.705 in (17.9 mm) |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
4 |
No |
10 V |
29 kHz |
1 |
CMOS |
MIL-STD-883 Class B |
12 |
5 V |
2's Complement Binary |
-5 V |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-10 V |
Parallel, Word |
-40 °C (-40 °F) |
Track |
Dual |
35 µs |
R-GDIP-T28 |
0.22 in (5.59 mm) |
0.6 in (15.24 mm) |
1.49 in (37.84 mm) |
|||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
525 mV |
60 MHz |
2 |
6 |
1.5625 % |
5 V |
Offset Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
475 mV |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDSO-G28 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
0.705 in (17.9 mm) |
|||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
5 |
Yes |
1.25 V |
1 |
CMOS |
24 |
0.0015 % |
3 V |
Binary, Offset Binary |
3 V |
Small Outline, Shrink Pitch |
SSOP28,.3 |
Other Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-1.25 V |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G28 |
1 |
0.078 in (1.993 mm) |
0.208 in (5.29 mm) |
No |
e0 |
240 °C (464 °F) |
0.402 in (10.21 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
15 V |
1 |
Bipolar |
10 |
60 mA |
0.049 % |
5 V |
Binary |
±5 V |
-5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Dual |
12 µs |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5 V |
25 MHz |
1 |
CMOS |
12 |
0.061 % |
5 V |
Binary |
3/5,5 V |
Small Outline, Shrink Pitch |
SSOP28,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Dual |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e0 |
240 °C (464 °F) |
0.402 in (10.2 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
2 |
No |
9.8 V |
400 kHz |
1 |
CMOS |
8 |
0.3906 % |
12 V |
Offset Binary |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Track |
Dual |
3.11 µs |
R-PDIP-T28 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.445 in (36.703 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
10 V |
1 |
Bipolar |
12 |
45 mA |
0.0244 % |
15 V |
Binary |
-15 V |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
|||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
5 V |
50 kHz |
1 |
CMOS |
8 |
0.3906 % |
5 V |
Binary, Complementary Offset Binary |
Small Outline |
0.05 in (1.27 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
2.4 µs |
R-PDSO-G28 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.705 in (17.9 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
10 V |
100 kHz |
1 |
BICMOS |
16 |
0.0031 % |
5 V |
2's Complement Binary |
Small Outline |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-10 V |
Parallel, Word |
-40 °C (-40 °F) |
Sample |
Dual |
8 µs |
R-PDSO-G28 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
0.705 in (17.9 mm) |
||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
28 |
TSSOP |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
5.25 V |
1.5 MHz |
1 |
10 |
0.0488 % |
3 V |
Binary, 2's Complement Binary |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP28,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
R-PDSO-G28 |
1 |
0.043 in (1.1 mm) |
0.173 in (4.4 mm) |
No |
e0 |
240 °C (464 °F) |
0.382 in (9.7 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
10 V |
6.25 kHz |
1 |
CMOS |
16 |
0.0031 % |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-10 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Dual |
8 µs |
R-PDIP-T28 |
1 |
0.155 in (3.937 mm) |
0.3 in (7.62 mm) |
No |
e0 |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.048 V |
10 MHz |
1 |
CMOS |
12 |
0.0244 % |
5 V |
2's Complement Binary |
-5 V |
Small Outline, Shrink Pitch |
0.025 in (0.635 mm) |
70 °C (158 °F) |
-2.048 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
90 ns |
R-PDSO-G28 |
1 |
0.069 in (1.748 mm) |
0.154 in (3.899 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.389 in (9.893 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
2 |
No |
2.5 V |
3 MHz |
1 |
12 |
0.061 % |
5 V |
Binary |
In-Line |
125 °C (257 °F) |
-2.5 V |
Parallel, Word |
-55 °C (-67 °F) |
Dual |
R-GDIP-T28 |
|||||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
800 kHz |
1 |
CMOS |
14 |
0.0076 % |
5 V |
2's Complement Binary |
-5 V |
Small Outline, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
-2.5 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
1.15 µs |
R-PDSO-G28 |
1 |
0.078 in (1.99 mm) |
0.209 in (5.3 mm) |
No |
e0 |
0.402 in (10.2 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
5 V |
1.1 MHz |
1 |
BICMOS |
12 |
35 mA |
0.0488 % |
5 V |
Binary |
±5 V |
-5 V |
Chip Carrier |
LDCC28,.5SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-5 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Track |
Quad |
100 ns |
S-PQCC-J28 |
5 |
0.18 in (4.57 mm) |
0.453 in (11.5062 mm) |
No |
e0 |
0.453 in (11.5062 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
66.6 kHz |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Binary |
-5 V |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-2.5 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
1.25 µs |
R-PDSO-G28 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.705 in (17.9 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
5.5 V |
2 MHz |
1 |
CMOS |
8 |
0.293 % |
3 V |
Binary |
3/5 V |
Small Outline |
SOP28,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
420 ns |
R-PDSO-G28 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
0.705 in (17.9 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
2 |
No |
5 V |
166 kHz |
1 |
CMOS |
16 |
0.0075 % |
5 V |
2's Complement Binary |
±5 V |
-5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-5 V |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin/Lead (Sn63Pb37) |
Sample |
Dual |
5.3 µs |
R-GDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
10 V |
100 kHz |
1 |
BICMOS |
16 |
0.0031 % |
5 V |
2's Complement Binary |
5 V |
Small Outline, Shrink Pitch |
SSOP28,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-10 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
8 µs |
R-PDSO-G28 |
3 |
0.078 in (1.98 mm) |
0.208 in (5.295 mm) |
No |
e3 |
0.402 in (10.21 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter |
Other |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic |
1 |
No |
10 V |
1 |
CMOS |
8 |
0.05 % |
Binary, Offset Binary |
5,15 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin/Lead |
Dual |
R-XDIP-T28 |
No |
e0 |
|||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
1 |
Bipolar |
12 |
0.0244 % |
15 V |
Binary |
-15 V |
Chip Carrier |
0.05 in (1.27 mm) |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Quad |
35 µs |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
Yes |
e0 |
0.45 in (11.43 mm) |
||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2 V |
105 MHz |
1 |
CMOS |
10 |
0.2441 % |
3 V |
Offset Binary, 2's Complement Binary |
3 V |
Small Outline, Shrink Pitch |
SSOP28,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e0 |
240 °C (464 °F) |
0.402 in (10.2 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
No Lead |
28 |
DIE |
Rectangular |
1 |
Yes |
25 V |
500 kHz |
1 |
0.024 % |
15 V |
Binary |
-15 V |
Uncased Chip |
-25 V |
Parallel, Word |
Tin Lead |
Upper |
R-XUUC-N28 |
No |
e0 |
||||||||||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
10 V |
1 |
BIMOS |
12 |
0.0244 % |
12 V |
Binary |
5,±12/±15 V |
-12 V |
Small Outline |
SOP28,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-10 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Dual |
15 µs |
R-PDSO-G28 |
3 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
260 °C (500 °F) |
0.705 in (17.9 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
10 V |
200 kHz |
1 |
BICMOS |
16 |
0.0031 % |
5 V |
2's Complement Binary |
5 V |
Small Outline, Shrink Pitch |
SSOP28,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-10 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
4 µs |
R-PDSO-G28 |
3 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e3 |
260 °C (500 °F) |
0.402 in (10.2 mm) |
|||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
10 V |
100 kHz |
1 |
16 |
0.0031 % |
5 V |
2's Complement Binary |
Small Outline, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
-10 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
8 µs |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e0 |
0.402 in (10.2 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
7 V |
1 |
10 |
0.098 % |
5 V |
Offset Binary |
-5 V |
Chip Carrier |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-7 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Track |
Quad |
25 ns |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
No |
e0 |
0.45 in (11.43 mm) |
||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
10 V |
1 |
Bipolar |
12 |
45 mA |
0.0122 % |
15 V |
Binary |
-15 V |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
|||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
Flat |
28 |
QFF |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
41 MHz |
1 |
12 |
5 V |
2's Complement Binary |
Flatpack |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDFP-F28 |
No |
e0 |
|||||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
3 V |
8.3 kHz |
1 |
CMOS |
12 |
5 V |
Binary |
±5 V |
-5 V |
Chip Carrier |
LDCC28,.5SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-3 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Track |
Quad |
7.125 µs |
S-PQCC-J28 |
1 |
0.18 in (4.57 mm) |
0.453 in (11.5062 mm) |
No |
e0 |
0.453 in (11.5062 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
2 |
No |
10 V |
250 kHz |
1 |
CMOS |
12 |
0.0244 % |
5 V |
2's Complement Binary |
5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
3.6 µs |
R-GDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.