32 Analog-to-Digital Converters 1,184

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

LTC2239IUH#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

80 MHz

1

CMOS

10

0.0488 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

0.197 in (5 mm)

AD364SD

Analog Devices

Digital To Analog Converter

Military

Through-Hole

32

DIP

Rectangular

Ceramic

16

No

10 V

12

0.024 %

Binary, Offset Binary

5,±15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T32

No

LTC2226CUH#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.9 V

25 MHz

1

CMOS

12

0.0244 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

1 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

HAS-1002M

Analog Devices

Analog To Digital Converter

Military

Through-Hole

32

DIP

Rectangular

Metal

1

No

1

Bipolar

10

Offset Binary

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-MDIP-T32

No

e0

LTC2227CUH#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.9 V

40 MHz

1

CMOS

12

0.0244 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

1 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

LTC2372CUH-18#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

8

Yes

4.104 V

500 kHz

1

CMOS

18

0.001 %

5 V

Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-4.088 V

Serial

0 °C (32 °F)

Matte Tin

Quad

1.5 µs

S-PQCC-N32

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

0.197 in (5 mm)

AD579ZJN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

Hybrid

10

0.0488 %

12 V

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±12/±15 V

-12 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

2.4 µs

R-CDIP-T32

0.275 in (6.98 mm)

0.6 in (15.24 mm)

No

e0

ADADC85Z-12

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

12

0.012 %

12 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±12/±15 V

-12 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Dual

10 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

5962-8865802XX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

12

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Dual

R-CDIP-T32

0.28 in (7.112 mm)

0.6 in (15.24 mm)

No

1.62 in (41.15 mm)

AD579TD/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

Hybrid

MIL-STD-883 Class B

10

0.0732 %

15 V

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

2 µs

R-CDIP-T32

0.275 in (6.98 mm)

0.6 in (15.24 mm)

No

e0

1.612 in (40.945 mm)

DAS1157

Analog Devices

Analog To Digital Converter Subsystem

Other

Pin/Peg

32

Rectangular

1

No

10 V

18 kHz

1

CMOS

14

0.005 %

15 V

Binary, Offset Binary, 2's Complement Binary

-15 V

Microelectronic Assembly

85 °C (185 °F)

-10 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Sample

50 µs

R-XXMA-P32

No

e0

LTC2386CUH-16#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

4.102 V

10 MHz

1

CMOS

16

0.0008 %

2.5 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-4.09 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Quad

78 ns

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

260 °C (500 °F)

0.197 in (5 mm)

ADADC84-10

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

10

0.048 %

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Serial, Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

8.4 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

AD7490BCP

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

32

VQCCN

Square

16

Yes

5 V

1 MHz

1

12

0.0244 %

3 V

Binary, 2's Complement Binary

3/5 V

Chip Carrier, Very Thin Profile

LCC32,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Lead

Track

Quad

800 ns

S-XQCC-N32

3

0.039 in (1 mm)

0.197 in (5 mm)

No

e0

240 °C (464 °F)

0.197 in (5 mm)

LTC2237IUH#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

40 MHz

1

CMOS

10

0.0488 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

AD1378TD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

25 V

63 kHz

1

Hybrid

16

40 mA

0.003 %

15 V

Complementary Binary, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-25 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

17 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

AD579KN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

Hybrid

MIL-STD-883 Class B

10

0.0732 %

15 V

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

2 µs

R-CDIP-T32

0.275 in (6.98 mm)

0.6 in (15.24 mm)

No

e0

1.612 in (40.945 mm)

HAS-0802M

Analog Devices

Analog To Digital Converter

Military

Through-Hole

32

DIP

Rectangular

Metal

1

No

1

Bipolar

8

Offset Binary

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-MDIP-T32

No

e0

AD9642BCPZ-170

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

32

HVQCCN

Square

1

Yes

1.75 V

170 MHz

1

CMOS

14

0.0079 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-1.75 V

Serial

-40 °C (-40 °F)

Matte Tin

Quad

5.8 ns

S-XQCC-N32

3

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

LTC2351IUH-14#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

6

Yes

1.25 V

1.5 MHz

1

14

0.0183 %

3 V

Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1.25 V

Serial

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

0.197 in (5 mm)

LTC2344CUH-18#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

4

Yes

4.101 V

400 kHz

1

CMOS

18

0.0015 %

5 V

Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-4.091 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Quad

2.08 µs

S-PQCC-N32

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

0.197 in (5 mm)

ADADC84-12

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

12

0.012 %

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Serial, Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

10 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

AD9215BCP-65

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

32

VQCCN

Square

1

Yes

2 V

65 MHz

1

CMOS

10

0.1172 %

3 V

Offset Binary, 2's Complement Binary

2.5,3 V

Chip Carrier

LCC32,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-XQCC-N32

3

0.039 in (1 mm)

0.197 in (5 mm)

No

e0

240 °C (464 °F)

0.197 in (5 mm)

LTC2344HUH-18#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

Plastic/Epoxy

4

Yes

4.101 V

400 kHz

1

CMOS

18

0.0015 %

5 V

Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-4.091 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

2.08 µs

S-PQCC-N32

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

0.197 in (5 mm)

LTC2239CUH

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

80 MHz

1

CMOS

10

0.0488 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

0.197 in (5 mm)

LTC2254CUH#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

105 MHz

1

CMOS

14

0.0336 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

0.197 in (5 mm)

ADADC85C-12

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

12

0.012 %

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Serial, Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

10 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

5962-8865803XX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

12

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Dual

R-CDIP-T32

0.28 in (7.112 mm)

0.6 in (15.24 mm)

No

1.62 in (41.15 mm)

5962-01-113-3262

Analog Devices

Analog To Digital Converter

Military

Through-Hole

32

DIP

Rectangular

Ceramic

No

10 V

1

Hybrid

38535Q/M;38534H;883B

12

0.012 %

Offset Binary

5,±15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T32

No

AD7939BCP-REEL7

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

32

HVQCCN

Square

8

Yes

5 V

1.5 MHz

1

Bipolar

10

0.0488 %

3 V

Binary, 2's Complement Binary

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Quad

S-XQCC-N32

3

0.035 in (0.9 mm)

0.197 in (5 mm)

No

e0

240 °C (464 °F)

0.197 in (5 mm)

LTC2385IUH-18#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

4.176 V

5 MHz

1

CMOS

18

0.0006 %

2.5 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-4.016 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

260 °C (500 °F)

0.197 in (5 mm)

LTC2255CUH

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

125 MHz

1

CMOS

14

0.0305 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

0.197 in (5 mm)

LTC2344IUH-16#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

4

Yes

4.101 V

400 kHz

1

CMOS

16

0.0019 %

5 V

Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-4.091 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

2.08 µs

S-PQCC-N32

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

0.197 in (5 mm)

LTC2248IUH#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.9 V

65 MHz

1

CMOS

14

0.0244 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

1 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

0.197 in (5 mm)

AD7938

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

32

VQCCN

Square

8

Yes

2.5 V

1.5 MHz

1

12

0.0244 %

3 V

Binary, 2's Complement Binary

3/5 V

Chip Carrier, Very Thin Profile

LCC32,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Quad

S-XQCC-N32

0.035 in (0.9 mm)

0.197 in (5 mm)

No

e0

0.197 in (5 mm)

LTC2236CUH

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

25 MHz

1

CMOS

10

0.0488 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

0.197 in (5 mm)

ADADC85S-12

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

Hybrid

12

0.0003 %

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Gold

Dual

10 µs

R-CDIP-T32

0.23 in (5.84 mm)

0.9 in (22.86 mm)

No

e4

1.62 in (41.15 mm)

AD5240KD

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

12

0.012 %

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Serial, Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

5 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

ADADC80Z-10

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

Hybrid

10

0.048 %

12 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±12/±15 V

-12 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Dual

21 µs

R-CDIP-T32

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

1.2 in (30.48 mm)

AD7938-6BSU

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

32

TQFP

Square

Plastic/Epoxy

8

Yes

5 V

625 kHz

1

12

0.0244 %

3 V

Binary, 2's Complement Binary

3/5 V

Flatpack, Thin Profile

TQFP32,.35SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Quad

S-PQFP-G32

0.047 in (1.2 mm)

0.276 in (7 mm)

No

e0

0.276 in (7 mm)

LTC2239IUH#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

80 MHz

1

CMOS

10

0.0488 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

AD9629BCPZRL7-20

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

32

HVQCCN

Square

1

Yes

2 V

20 MHz

1

CMOS

12

0.0098 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

50 ns

S-XQCC-N32

3

0.039 in (1 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

AD9237BCPZRL7-65

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

1

Yes

4 V

65 MHz

1

CMOS

12

0.0488 %

3 V

Offset Binary, 2's Complement Binary

2.5,3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-XQCC-N32

3

0.035 in (0.9 mm)

0.197 in (5 mm)

No

e3

260 °C (500 °F)

0.197 in (5 mm)

AD9245BCP-80

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

32

HVQCCN

Square

1

Yes

2 V

80 MHz

1

CMOS

14

0.0314 %

3 V

Offset Binary, 2's Complement Binary

2.5,3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

1 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-XQCC-N32

0.039 in (1 mm)

0.197 in (5 mm)

No

e0

0.197 in (5 mm)

AD9215BCP-105

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

32

VQCCN

Square

1

Yes

2 V

105 MHz

1

CMOS

10

0.1172 %

3 V

Offset Binary, 2's Complement Binary

2.5,3 V

Chip Carrier

LCC32,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-XQCC-N32

3

0.039 in (1 mm)

0.197 in (5 mm)

No

e0

240 °C (464 °F)

0.197 in (5 mm)

LTC2341IUH-18#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

2

Yes

4.101 V

666 kHz

1

CMOS

18

0.0015 %

5 V

Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-4.091 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

1.06 µs

S-PQCC-N32

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

0.197 in (5 mm)

LTC2344IUH-18#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

4

Yes

4.101 V

400 kHz

1

CMOS

18

0.0015 %

5 V

Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-4.091 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

2.08 µs

S-PQCC-N32

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

0.197 in (5 mm)

ADADC85CZ-10

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

10

0.048 %

12 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±12/±15 V

-12 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Serial, Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

8.4 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.