32 Analog-to-Digital Converters 1,184

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

LTC2254CUH

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

105 MHz

1

CMOS

14

0.0336 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

0.197 in (5 mm)

AD4696BCBZ-RL7

Analog Devices

Analog To Digital Converter, Successive Approximation

Ball

32

VFBGA

Square

Plastic/Epoxy

16

Yes

5.75 V

1 MHz

1

16

0.003814697 %

5 V

Binary, 2's Complement Binary

Grid Array, Very Thin Profile, Fine Pitch

BGA36,6X6,20

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Bottom

415 ns

S-PBGA-B36

0.022 in (0.56 mm)

0.117 in (2.96 mm)

0.117 in (2.96 mm)

AD4695BCBZ-RL7

Analog Devices

Analog To Digital Converter, Successive Approximation

Ball

32

VFBGA

Square

Plastic/Epoxy

16

Yes

5.75 V

500 kHz

1

16

0.003814697 %

5 V

Binary, 2's Complement Binary

Grid Array, Very Thin Profile, Fine Pitch

BGA36,6X6,20

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Bottom

415 ns

S-PBGA-B36

0.022 in (0.56 mm)

0.117 in (2.96 mm)

0.117 in (2.96 mm)

MAX11322ATJ+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

4

Yes

3.65 V

1 MHz

1

12

0.0244 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11328ATJ+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

16

Yes

3.65 V

1 MHz

1

12

0.0244 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1493CCJ+

Analog Devices

Analog To Digital Converter, Delta-Sigma

Commercial

Gull Wing

32

LQFP

Square

Plastic/Epoxy

1

Yes

2.2 V

1

BICMOS

3.3 V

Binary

3/5 V

Flatpack, Low Profile

QFP32,.35SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

70 °C (158 °F)

-2.2 V

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQFP-G32

2

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

MAX11340ATJ+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

16

Yes

3.65 V

500 kHz

1

BICMOS

10

0.039 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1446EHJ+T

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

32

TFQFP

Square

Plastic/Epoxy

1

Yes

1 V

60 MHz

1

CMOS

10

0.1855 %

3 V

Offset Binary

2.7,3 V

Flatpack, Thin Profile, Fine Pitch

TQFP32,.28SQ

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-PQFP-G32

1

0.047 in (1.2 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1444EHJ+T

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

32

HTFQFP

Square

Plastic/Epoxy

1

Yes

1 V

40 MHz

1

CMOS

10

0.1855 %

3 V

Offset Binary

3 V

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

TQFP32,.28SQ

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-PQFP-G32

1

0.047 in (1.2 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1446EHJ+

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

32

TFQFP

Square

Plastic/Epoxy

1

Yes

1 V

60 MHz

1

CMOS

10

0.1855 %

3 V

Offset Binary

2.7,3 V

Flatpack, Thin Profile, Fine Pitch

TQFP32,.28SQ

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

16 ns

S-PQFP-G32

1

0.047 in (1.2 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11325ATJ+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

8

Yes

3.65 V

1 MHz

1

12

0.0244 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11328ATJ+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

16

Yes

3.65 V

1 MHz

1

12

0.0244 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1444EHJ/V+

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

32

TFQFP

Square

Plastic/Epoxy

10

Yes

3.6 V

40 MHz

1

CMOS

AEC-Q100

10

0.1855 %

3 V

Offset Binary

3 V

Flatpack, Thin Profile, Fine Pitch

TQFP32,.28SQ

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

2.7 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-PQFP-G32

1

0.047 in (1.2 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1498ECJ+T

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

32

LQFP

Square

Plastic/Epoxy

1

Yes

2 V

1

BICMOS

3.3 V

Binary

3/5 V

Flatpack, Low Profile

QFP32,.35SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQFP-G32

2

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

MAX11331ATJ+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

8

Yes

3.65 V

3 MHz

1

BICMOS

12

6.5 mA

0.0244140625 %

3 V

Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1448EHJ+T

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

32

TFQFP

Square

Plastic/Epoxy

1

Yes

1 V

80 MHz

1

CMOS

10

0.2148 %

3 V

Offset Binary

Flatpack, Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-PQFP-G32

1

0.047 in (1.2 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11322ATJ+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

4

Yes

3.65 V

1 MHz

1

12

0.0244 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1446GHJ+T

Analog Devices

Analog To Digital Converter

Industrial

Gull Wing

32

TFQFP

Square

Plastic/Epoxy

1

Yes

1 V

60 MHz

1

10

0.1855 %

3 V

Offset Binary

2.7,3 V

Flatpack, Thin Profile, Fine Pitch

TQFP32,.28SQ

Analog to Digital Converters

0.02 in (0.5 mm)

105 °C (221 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-PQFP-G32

1

0.047 in (1.2 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1499ECJ+T

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

32

LQFP

Square

Plastic/Epoxy

1

Yes

2.2 V

1

3.3 V

2's Complement Binary

Flatpack, Low Profile

0.031 in (0.8 mm)

85 °C (185 °F)

-2.2 V

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQFP-G32

1

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e3

0.276 in (7 mm)

MAX11335ATJ+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

4

Yes

3.65 V

500 kHz

1

BICMOS

12

0.0244 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1170CDJ

Analog Devices

Analog To Digital Converter, Flash/Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

2 V

10 MHz

1

CMOS

12

150 mA

5 V

Binary

-5.2 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-2 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

R-CDIP-T32

0.21 in (5.33 mm)

0.6 in (15.24 mm)

No

e0

MAX11338ATJ+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

4

Yes

3.65 V

500 kHz

1

BICMOS

10

0.039 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11340ATJ+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

16

Yes

3.65 V

500 kHz

1

BICMOS

10

0.039 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1446GHJ+

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

32

TFQFP

Square

Plastic/Epoxy

1

Yes

1 V

60 MHz

1

CMOS

10

0.1855 %

3 V

Offset Binary

2.7,3 V

Flatpack, Thin Profile, Fine Pitch

TQFP32,.28SQ

Analog to Digital Converters

0.02 in (0.5 mm)

105 °C (221 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

16 ns

S-PQFP-G32

1

0.047 in (1.2 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1448EHJ+

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

32

TFQFP

Square

Plastic/Epoxy

1

Yes

1 V

80 MHz

1

CMOS

10

0.2148 %

3 V

Offset Binary

Flatpack, Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-PQFP-G32

1

0.047 in (1.2 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1493CCJ+T

Analog Devices

Analog To Digital Converter, Delta-Sigma

Commercial

Gull Wing

32

LQFP

Square

Plastic/Epoxy

1

Yes

2.2 V

1

BICMOS

3.3 V

Binary

3/5 V

Flatpack, Low Profile

QFP32,.35SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

70 °C (158 °F)

-2.2 V

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQFP-G32

1

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e3

0.276 in (7 mm)

MAX1499ECJ+

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

32

LQFP

Square

Plastic/Epoxy

1

Yes

2.2 V

1

3.3 V

2's Complement Binary

Flatpack, Low Profile

0.031 in (0.8 mm)

85 °C (185 °F)

-2.2 V

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQFP-G32

2

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

MAX1494CCJ+T

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

32

LQFP

Square

Plastic/Epoxy

1

Yes

2.2 V

1

BICMOS

3.3 V

2's Complement Binary

3/5 V

Flatpack, Low Profile

QFP32,.35SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

70 °C (158 °F)

-2.2 V

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQFP-G32

1

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e3

0.276 in (7 mm)

MAX1449EHJ+T

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

32

TFQFP

Square

Plastic/Epoxy

1

Yes

1 V

105 MHz

1

CMOS

10

0.2344 %

3.3 V

Offset Binary

Flatpack, Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-PQFP-G32

1

0.047 in (1.2 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1494CCJ+

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

32

LQFP

Square

Plastic/Epoxy

1

Yes

2.2 V

1

BICMOS

3.3 V

2's Complement Binary

3/5 V

Flatpack, Low Profile

QFP32,.35SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

70 °C (158 °F)

-2.2 V

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQFP-G32

2

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

MAX11338ATJ+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

4

Yes

3.65 V

500 kHz

1

BICMOS

10

0.039 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11325ATJ+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

8

Yes

3.65 V

1 MHz

1

12

0.0244 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1444EHJ+

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

32

TFQFP

Square

Plastic/Epoxy

10

Yes

3.6 V

40 MHz

1

CMOS

10

0.1855 %

3 V

Offset Binary

3 V

Flatpack, Thin Profile, Fine Pitch

TQFP32,.28SQ

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

2.7 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-PQFP-G32

1

0.047 in (1.2 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1498ECJ+

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

32

LQFP

Square

Plastic/Epoxy

1

Yes

2 V

1

BICMOS

3.3 V

Binary

3/5 V

Flatpack, Low Profile

QFP32,.35SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQFP-G32

2

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

MAX11337ATJ+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

16

Yes

3.65 V

500 kHz

1

BICMOS

12

0.0244 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Track

Quad

S-XQCC-N32

0.031 in (0.8 mm)

0.197 in (5 mm)

0.197 in (5 mm)

MAX11253ATJ+T

Analog Devices

Analog To Digital Converter, Delta-Sigma

Automotive

No Lead

32

HVQCCN

Square

6

Yes

3.6 V

64 kHz

1

CMOS

16

0 %

3.6 V

2's Complement Binary

0 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1.5 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1444EHJ/V+T

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

32

TFQFP

Square

Plastic/Epoxy

1

Yes

1 V

40 MHz

1

CMOS

AEC-Q100

10

0.1855 %

3 V

Offset Binary

Flatpack, Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-PQFP-G32

1

0.047 in (1.2 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1171CDJ

Analog Devices

Analog To Digital Converter, Flash/Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

2 V

20 MHz

1

CMOS

12

150 mA

5 V

Binary

-5.2 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-2 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

R-CDIP-T32

0.21 in (5.33 mm)

0.6 in (15.24 mm)

No

e0

MAX1447ECJ+T

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

32

LQFP

Square

Plastic/Epoxy

1

Yes

2 V

1

BICMOS

3.3 V

Binary

Flatpack, Low Profile

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQFP-G32

1

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e3

0.276 in (7 mm)

MAX11335ATJ+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

4

Yes

3.65 V

500 kHz

1

BICMOS

12

0.0244 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

LTC2238CUH#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

65 MHz

1

CMOS

10

0.0488 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

0.197 in (5 mm)

AD7490BCP-REEL7

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

32

VQCCN

Square

16

Yes

5 V

1 MHz

1

12

0.0244 %

3 V

Binary, 2's Complement Binary

3/5 V

Chip Carrier, Very Thin Profile

LCC32,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Lead

Track

Quad

800 ns

S-XQCC-N32

3

0.039 in (1 mm)

0.197 in (5 mm)

No

e0

240 °C (464 °F)

0.197 in (5 mm)

ADADC80-10

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

Hybrid

10

0.048 %

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Dual

21 µs

R-CDIP-T32

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

1.2 in (30.48 mm)

LTC2226IUH#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.9 V

25 MHz

1

CMOS

12

0.0244 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

LTC2351IUH-14

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

6

Yes

1.25 V

1.5 MHz

1

14

0.0183 %

3 V

Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1.25 V

Serial

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

0.197 in (5 mm)

LTC2238CUH

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

65 MHz

1

CMOS

10

0.0488 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

0.197 in (5 mm)

LTC2237IUH

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

40 MHz

1

CMOS

10

0.0488 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

0.197 in (5 mm)

LTC2228CUH

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.9 V

65 MHz

1

CMOS

12

0.0269 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

0.197 in (5 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.