32 Analog-to-Digital Converters 1,184

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

TDA8793HL

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

32

LFQFP

Square

Plastic/Epoxy

1

Yes

1.02 V

100 MHz

1

8

0.6641 %

3 V

Binary

Flatpack, Low Profile, Fine Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

900 mV

Parallel, 8 Bits

0 °C (32 °F)

Track

Quad

S-PQFP-G32

0.063 in (1.6 mm)

0.197 in (5 mm)

No

0.197 in (5 mm)

935263897557

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

32

LFQFP

Square

Plastic/Epoxy

1

Yes

60 MHz

1

10

0.1953 %

5 V

Binary, 2's Complement Binary

Flatpack, Low Profile, Fine Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Tin

Quad

S-PQFP-G32

0.063 in (1.6 mm)

0.197 in (5 mm)

No

e3

0.197 in (5 mm)

TDA8755TD-T

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

32

SOP

Rectangular

Plastic/Epoxy

3

Yes

20 MHz

1

Bipolar

8

0.3906 %

5 V

Binary, 2's Complement Binary

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

Parallel, 8 Bits

0 °C (32 °F)

Track

Dual

R-PDSO-G32

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

0.807 in (20.5 mm)

TDA8764AHL/6

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

32

LFQFP

Square

Plastic/Epoxy

1

Yes

60 MHz

1

10

0.1953 %

5 V

Binary, 2's Complement Binary

Flatpack, Low Profile, Fine Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Tin

Quad

S-PQFP-G32

0.063 in (1.6 mm)

0.197 in (5 mm)

No

e3

0.197 in (5 mm)

TDA8766G/C1,118

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

32

LFQFP

Square

Plastic/Epoxy

1

Yes

20 MHz

1

10

10 mA

0.1953 %

3.3 V

Binary

Flatpack, Low Profile, Fine Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Tin

Quad

S-PQFP-G32

1

0.063 in (1.6 mm)

0.197 in (5 mm)

No

e3

0.197 in (5 mm)

TDA8755TD

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

32

SOP

Rectangular

Plastic/Epoxy

3

Yes

20 MHz

1

Bipolar

8

0.3906 %

5 V

Binary, 2's Complement Binary

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

Parallel, 8 Bits

0 °C (32 °F)

Track

Dual

R-PDSO-G32

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

0.807 in (20.5 mm)

ADC1613S065HN/C1

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

2 V

65 MHz

1

16

0.0076 %

3 V

Offset Binary, 2's Complement Binary, Gray Code

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.026 in (0.65 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Track

Quad

S-PQCC-N32

0.035 in (0.9 mm)

0.276 in (7 mm)

No

0.276 in (7 mm)

ADC1113S125HN/C1

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

2 V

125 MHz

1

11

0.2441 %

3 V

Offset Binary, 2's Complement Binary, Gray Code

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.026 in (0.65 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Sample

Quad

S-PQCC-N32

0.035 in (0.9 mm)

0.276 in (7 mm)

No

0.276 in (7 mm)

TDA8755

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

32

SOP

Rectangular

Plastic/Epoxy

3

Yes

2.5 MHz

1

Bipolar

8

0.3906 %

5 V

Binary, 2's Complement Binary

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Track

Dual

R-PDSO-G32

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

0.807 in (20.5 mm)

TDA8793HLB

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

32

LFQFP

Square

Plastic/Epoxy

1

Yes

100 MHz

1

8

3 V

Binary

Flatpack, Low Profile, Fine Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

Parallel, 8 Bits

0 °C (32 °F)

Track

Quad

S-PQFP-G32

0.063 in (1.6 mm)

0.197 in (5 mm)

No

0.197 in (5 mm)

ADC1413S080HN/C1

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

2 V

80 MHz

1

14

0.0305 %

3 V

Offset Binary, 2's Complement Binary, Gray Code

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.026 in (0.65 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Track

Quad

S-PQCC-N32

0.035 in (0.9 mm)

0.276 in (7 mm)

No

0.276 in (7 mm)

ADC1613S125HN/C1,5

NXP Semiconductors

Analog To Digital Converter

Industrial

No Lead

32

QCCN

Square

Plastic/Epoxy

1

Yes

2 V

1

16

0.0076 %

Offset Binary, 2's Complement Binary, Gray Code

1.8,3 V

Chip Carrier

LCC32,.27SQ,25

Analog to Digital Converters

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N32

No

ADC1113S125HN/C1,5

NXP Semiconductors

Analog To Digital Converter

Industrial

No Lead

32

QCCN

Square

Plastic/Epoxy

1

Yes

2 V

1

11

0.24 %

Offset Binary

1.8,3 V

Chip Carrier

LCC32,.27SQ,25

Analog to Digital Converters

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-N32

1

No

e3

TDA8766G

NXP Semiconductors

Analog To Digital Converter, Resistance Ladder

Commercial Extended

Gull Wing

32

LFQFP

Square

Plastic/Epoxy

1

Yes

2.35 V

20 MHz

1

BICMOS

10

0.1953 %

3.3 V

Binary

3/5 V

Flatpack, Low Profile, Fine Pitch

QFP32,.28SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

75 °C (167 °F)

1.66 V

Parallel, Word

-20 °C (-4 °F)

Quad

S-PQFP-G32

0.063 in (1.6 mm)

0.197 in (5 mm)

No

40 s

260 °C (500 °F)

0.197 in (5 mm)

TDA8793

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

32

LFQFP

Square

Plastic/Epoxy

1

Yes

1.05 V

100 MHz

1

8

3 V

Binary

Flatpack, Low Profile, Fine Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

950 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin

Track

Quad

S-PQFP-G32

0.063 in (1.6 mm)

0.197 in (5 mm)

No

e3

0.197 in (5 mm)

ADC1613S105HN/C1

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

2 V

105 MHz

1

16

0.0076 %

3 V

Offset Binary, 2's Complement Binary, Gray Code

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.026 in (0.65 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Track

Quad

S-PQCC-N32

0.035 in (0.9 mm)

0.276 in (7 mm)

No

0.276 in (7 mm)

ADC1613S065HN/C1,5

NXP Semiconductors

Analog To Digital Converter

Industrial

No Lead

32

QCCN

Square

Plastic/Epoxy

1

Yes

2 V

1

16

0.0076 %

Offset Binary, 2's Complement Binary, Gray Code

1.8,3 V

Chip Carrier

LCC32,.27SQ,25

Analog to Digital Converters

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N32

No

ADC1213S065HN/C1,5

NXP Semiconductors

Analog To Digital Converter

Industrial

No Lead

32

QCCN

Square

Plastic/Epoxy

1

Yes

2 V

1

12

0.12 %

Offset Binary, 2's Complement Binary, Gray Code

1.8,3 V

Chip Carrier

LCC32,.27SQ,25

Analog to Digital Converters

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N32

No

TDA8755T

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

32

SOP

Rectangular

Plastic/Epoxy

3

Yes

1.07 V

20 MHz

1

Bipolar

8

0.3906 %

5 V

Binary

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

930 mV

Parallel, 8 Bits

0 °C (32 °F)

Track

Dual

R-PDSO-G32

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

0.807 in (20.5 mm)

TDA8793HLB-T

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

32

LFQFP

Square

Plastic/Epoxy

1

Yes

100 MHz

1

8

3 V

Binary

Flatpack, Low Profile, Fine Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

Parallel, 8 Bits

0 °C (32 °F)

Track

Quad

S-PQFP-G32

0.063 in (1.6 mm)

0.197 in (5 mm)

No

0.197 in (5 mm)

935263897518

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

32

LFQFP

Square

Plastic/Epoxy

1

Yes

60 MHz

1

10

0.1953 %

5 V

Binary, 2's Complement Binary

Flatpack, Low Profile, Fine Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Tin

Quad

S-PQFP-G32

0.063 in (1.6 mm)

0.197 in (5 mm)

No

e3

0.197 in (5 mm)

ADC1002S020HL/C1:1

NXP Semiconductors

Analog To Digital Converter, Resistance Ladder

Commercial

Gull Wing

32

LFQFP

Square

Plastic/Epoxy

1

Yes

2.35 V

20 MHz

1

CMOS

10

0.1953 %

3.3 V

Binary

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP32,.28SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

70 °C (158 °F)

1.66 V

Parallel, Word

0 °C (32 °F)

Tin

Quad

S-PQFP-G32

1

0.063 in (1.6 mm)

0.197 in (5 mm)

No

e3

0.197 in (5 mm)

TDA8766GB

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

32

LFQFP

Square

Plastic/Epoxy

1

Yes

20 MHz

1

10

10 mA

0.1953 %

3.3 V

Binary

Flatpack, Low Profile, Fine Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Quad

S-PQFP-G32

0.063 in (1.6 mm)

0.197 in (5 mm)

No

0.197 in (5 mm)

TDA8764HL/4

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

32

LFQFP

Square

Plastic/Epoxy

1

Yes

0 mV

4 MHz

1

BICMOS

10

5 V

Binary, 2's Complement Binary

3.3,5 V

Flatpack, Low Profile, Fine Pitch

QFP32,.28SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

Parallel, Word

-40 °C (-40 °F)

Quad

S-PQFP-G32

0.063 in (1.6 mm)

0.197 in (5 mm)

No

0.197 in (5 mm)

MX578TN

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

BICMOS

12

80 mA

0.0183 %

15 V

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

R-CDIP-T32

No

e0

MX578JN

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

BICMOS

12

80 mA

0.0122 %

15 V

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Serial, Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

R-CDIP-T32

No

e0

MX578ZKN

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

BICMOS

12

80 mA

0.0122 %

12 V

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±12/±15 V

-12 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Serial, Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

R-CDIP-T32

No

e0

MAX1499EVC16

Maxim Integrated

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

32

LQFP

Square

Plastic/Epoxy

1

Yes

2.2 V

1

BICMOS

3.3 V

2's Complement Binary

Flatpack, Low Profile

0.031 in (0.8 mm)

85 °C (185 °F)

-2.2 V

Serial

-40 °C (-40 °F)

Quad

S-PQFP-G32

0.063 in (1.6 mm)

0.276 in (7 mm)

0.276 in (7 mm)

MAX1444EHJ

Maxim Integrated

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

32

TFQFP

Square

Plastic/Epoxy

10

Yes

3.6 V

40 MHz

1

CMOS

10

0.1855 %

3 V

Offset Binary

3 V

Flatpack, Thin Profile, Fine Pitch

TQFP32,.28SQ

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

2.7 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Quad

S-PQFP-G32

1

0.047 in (1.2 mm)

0.197 in (5 mm)

No

e0

245 °C (473 °F)

0.197 in (5 mm)

MAX11332ATJ+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

No Lead

32

HVQCCN

Square

8

Yes

3.65 V

3 MHz

1

BICMOS

12

6.5 mA

0.024414063 %

3 V

Binary, 2’s Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MX578LN

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

BICMOS

12

80 mA

0.0122 %

15 V

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Serial, Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

R-CDIP-T32

No

e0

MAX11329ATJ+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

No Lead

32

HVQCCN

Square

16

Yes

3.65 V

3 MHz

1

BICMOS

10

6.5 mA

0.0390625 %

3 V

Binary, 2’s Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1444EHJ-T

Maxim Integrated

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

32

TFQFP

Square

Plastic/Epoxy

10

Yes

3.6 V

40 MHz

1

CMOS

10

0.1855 %

3 V

Offset Binary

3 V

Flatpack, Thin Profile, Fine Pitch

TQFP32,.28SQ

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

2.7 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Quad

S-PQFP-G32

1

0.047 in (1.2 mm)

0.197 in (5 mm)

No

e0

0.197 in (5 mm)

MAX11339ATJ+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

8

Yes

3.65 V

500 kHz

1

BICMOS

10

0.039 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1498ECJ

Maxim Integrated

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

32

LQFP

Square

Plastic/Epoxy

1

Yes

2 V

1

BICMOS

3.3 V

Binary

3/5 V

Flatpack, Low Profile

QFP32,.35SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G32

1

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e0

245 °C (473 °F)

0.276 in (7 mm)

MAX11324ATJ+T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

8

Yes

3.65 V

1 MHz

1

10

0.0391 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

AD578SN

Maxim Integrated

Analog To Digital Converter

Military

Through-Hole

32

DIP

Rectangular

Ceramic

1

No

20 V

1

Hybrid

12

0.012 %

Offset Binary

5,±15 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T32

e0

MAX1494CCJ-T

Maxim Integrated

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

32

LQFP

Square

Plastic/Epoxy

1

Yes

2.2 V

1

BICMOS

3.3 V

2's Complement Binary

3/5 V

Flatpack, Low Profile

QFP32,.35SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

70 °C (158 °F)

-2.2 V

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G32

1

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e0

0.276 in (7 mm)

MAX1447ECJ

Maxim Integrated

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

32

LQFP

Square

Plastic/Epoxy

1

Yes

2 V

1

BICMOS

3.3 V

Binary

3/5 V

Flatpack, Low Profile

QFP32,.35SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G32

1

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e0

245 °C (473 °F)

0.276 in (7 mm)

MX578SN

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

BICMOS

12

80 mA

0.0183 %

15 V

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

R-CDIP-T32

No

e0

MAX11324ATJ+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

8

Yes

3.65 V

1 MHz

1

10

0.039 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1446EHJ-T

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

32

TFQFP

Square

Plastic/Epoxy

1

Yes

1 V

60 MHz

1

CMOS

10

0.1855 %

3 V

Offset Binary

2.7,3 V

Flatpack, Thin Profile, Fine Pitch

TQFP32,.28SQ

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Quad

S-PQFP-G32

1

0.047 in (1.2 mm)

0.197 in (5 mm)

No

e0

245 °C (473 °F)

0.197 in (5 mm)

MAX1494CCJ

Maxim Integrated

Analog To Digital Converter, Delta-Sigma

Commercial

Gull Wing

32

LQFP

Square

Plastic/Epoxy

1

Yes

2.2 V

1

BICMOS

3.3 V

2's Complement Binary

3/5 V

Flatpack, Low Profile

QFP32,.35SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

70 °C (158 °F)

-2.2 V

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G32

1

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e0

245 °C (473 °F)

0.276 in (7 mm)

MAX11960ETJ+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

32

HVQCCN

Square

2

Yes

3.6 V

1 MHz

1

CMOS

20

4.8 mA

0.000476 %

1.8 V

Offset Binary, 2's Complement Binary, Complementary Offset Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

0.02 in (0.5 mm)

85 °C (185 °F)

-2.5 V

Serial

-40 °C (-40 °F)

Track

Quad

S-XQCC-N32

0.031 in (0.8 mm)

0.197 in (5 mm)

30 s

260 °C (500 °F)

0.197 in (5 mm)

MX578ZSN

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

BICMOS

12

80 mA

0.0183 %

12 V

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±12/±15 V

-12 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

R-CDIP-T32

No

e0

MAX11336ATJ+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

8

Yes

3.65 V

500 kHz

1

BICMOS

12

0.0244 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1495CCJ

Maxim Integrated

Analog To Digital Converter, Delta-Sigma

Commercial

Gull Wing

32

LQFP

Square

Plastic/Epoxy

1

Yes

2.2 V

1

BICMOS

3.3 V

Binary

3/5 V

Flatpack, Low Profile

QFP32,.35SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

70 °C (158 °F)

-2.2 V

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G32

1

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e0

245 °C (473 °F)

0.276 in (7 mm)

MAX1495CCJ+T

Maxim Integrated

Analog To Digital Converter, Delta-Sigma

Commercial

Gull Wing

32

LQFP

Square

Plastic/Epoxy

1

Yes

2.2 V

1

BICMOS

3.3 V

Binary

3/5 V

Flatpack, Low Profile

QFP32,.35SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

70 °C (158 °F)

-2.2 V

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G32

1

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e3

0.276 in (7 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.