40 Analog-to-Digital Converters 701

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

LTC2153CUJ-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.32 V

310 MHz

1

CMOS

14

0.0458 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1.32 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

3 ns

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

HAS-1409AKM

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

125 kHz

1

Hybrid

14

0.009 %

15 V

Offset Binary, 2's Complement Binary

5,±15 V

-15 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

R-PDIP-T40

0.19 in (4.83 mm)

0.9 in (22.86 mm)

No

e0

CAV-1220

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

40

1

No

2 V

20 MHz

1

12

0.0125 %

15 V

Binary, 2's Complement Binary

-15 V

Microelectronic Assembly

70 °C (158 °F)

-2 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

X-XXMA-X40

No

e0

LTC2258CUJ-12#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

2 V

65 MHz

1

CMOS

12

0.0244 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

1 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

LTC2263IUJ-12#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

2

Yes

2 V

25 MHz

1

CMOS

12

0.0244 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

AD9034TD

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1.024 V

20.48 MHz

1

CMOS

12

5 V

2's Complement Binary

5,-5.2 V

-5.2 V

In-Line

DIP40,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-1.024 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

49 ns

R-CDIP-T40

0.225 in (5.715 mm)

0.6 in (15.24 mm)

No

e0

2.095 in (53.21 mm)

CAV-1220-200

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Pin/Peg

40

Rectangular

1

No

2 V

20 MHz

1

12

3.006 A

15 V

Binary, 2's Complement Binary

-15 V

Microelectronic Assembly

70 °C (158 °F)

-2 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

R-XXMA-P40

No

e0

LTC2150IUJ-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.5 V

170 MHz

1

CMOS

14

0.0311 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1.5 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Quad

5.8 ns

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

LTC2151CUJ-12#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.5 V

210 MHz

1

CMOS

12

0.0293 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1.5 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

LTC2258CUJ-12#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

2 V

65 MHz

1

CMOS

12

0.0244 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

1 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

AD9032BD

Analog Devices

Analog To Digital Converter, Flash Method

Other

Through-Hole

40

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1.024 V

25 MHz

1

Bipolar

12

0.0488 %

5 V

2's Complement Binary

5,-5.2 V

-5.2 V

In-Line

DIP40,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-1.024 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

93.1 ns

R-CDIP-T40

0.225 in (5.715 mm)

0.6 in (15.24 mm)

No

e0

2.095 in (53.21 mm)

LTC2260IUJ-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

105 MHz

1

CMOS

14

0.0229 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

LTC2259IUJ-14#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

80 MHz

1

CMOS

14

0.0214 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

HAS-1409LMB

Analog Devices

Analog To Digital Converter

Other

Through-Hole

40

DIP

Rectangular

Metal

1

No

10 V

1

Hybrid

MIL-STD-883 Class B (Modified)

14

0.009 %

Offset Binary, 2's Complement Binary

5,±15 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-MDIP-T40

No

e0

LTC2268CUJ-12#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

2

Yes

2 V

125 MHz

1

CMOS

12

0.0244 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-2 V

Serial

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

LTC2274IUJ#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.5 V

105 MHz

1

CMOS

16

0.0069 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

1 V

Serial

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e0

0.236 in (6 mm)

LTC2150CUJ-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.5 V

170 MHz

1

CMOS

14

0.0311 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1.5 V

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

5.8 ns

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

AD4116BCPZ-RL7

Analog Devices

Analog To Digital Converter, Delta-Sigma

No Lead

40

HVQCCN

Square

16

Yes

10 V

1

24

6.63 mA

0.02 %

5 V

Binary, Offset Binary

0 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC40,.24SQ,20

0.02 in (0.5 mm)

105 °C (221 °F)

-10 V

Serial

-40 °C (-40 °F)

Quad

S-XQCC-N40

3

0.039 in (1 mm)

0.236 in (6 mm)

30 s

260 °C (500 °F)

0.236 in (6 mm)

AD4116BCPZ

Analog Devices

Analog To Digital Converter, Delta-Sigma

No Lead

40

HVQCCN

Square

16

Yes

10 V

1

24

6.63 mA

0.02 %

5 V

Binary, Offset Binary

0 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC40,.24SQ,20

0.02 in (0.5 mm)

105 °C (221 °F)

-10 V

Serial

-40 °C (-40 °F)

Quad

S-XQCC-N40

3

0.039 in (1 mm)

0.236 in (6 mm)

30 s

260 °C (500 °F)

0.236 in (6 mm)

MAX131C/D

Analog Devices

Analog To Digital Converter, Dual-Slope

Commercial

No Lead

40

DIE

Rectangular

1

Yes

2 V

1

CMOS

16

120 μA

0.0015 %

9 V

Binary

9 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

200 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N40

No

e0

ICL7109EPL+

Analog Devices

Analog To Digital Converter, Dual-Slope

Industrial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

1

No

3.5 V

1

CMOS

12

0.0244 %

5 V

Binary

±5 V

-5 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-3.5 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDIP-T40

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

2.05 in (52.075 mm)

MAX12555ETL+T

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

40

HVQCCN

Square

1

Yes

1.024 V

95 MHz

1

CMOS

14

3.3 V

2's Complement Binary

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC40,.24SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-1.024 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

ICL7116CPL+

Analog Devices

Analog To Digital Converter, Dual-Slope

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

1

No

2 V

1

CMOS

16

0.0015 %

9 V

Binary

9 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T40

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

2.05 in (52.07 mm)

MAX134EPL+

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

1

No

3.3 V

1

Bipolar

4

1 %

5 V

9's Complement Binary Coded Decimal

9 V

-5 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

2.8 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDIP-T40

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

2.05 in (52.075 mm)

ICL7136C/D

Analog Devices

Analog To Digital Converter, Dual-Slope

Commercial

No Lead

40

DIE

1

Yes

2 V

1

CMOS

16

0.0015 %

9 V

Binary

9 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Tin Lead

Upper

X-XUUC-N40

2

No

e0

MAX131CPL+

Analog Devices

Analog To Digital Converter, Dual-Slope

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

1

No

2 V

1

CMOS

16

120 μA

0.0015 %

9 V

Binary

9 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

200 mV

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T40

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

2.05 in (52.075 mm)

MAX12555ETL+

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

40

HVQCCN

Square

1

Yes

1.024 V

95 MHz

1

CMOS

14

3.3 V

2's Complement Binary

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC40,.24SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-1.024 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

5962-8967602QA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

50 kHz

1

CMOS

MIL-STD-883

16

0.0015 %

5 V

Binary, Offset Binary

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

16.25 µs

R-GDIP-T40

0.23 in (5.84 mm)

0.6 in (15.24 mm)

No

e0

30 s

225 °C (437 °F)

2.06 in (52.32 mm)

ICL7109IPL+

Analog Devices

Analog To Digital Converter, Dual-Slope

Other

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

1

No

3.5 V

1

CMOS

12

0.0244 %

5 V

Binary

±5 V

-5 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-3.5 V

Parallel, Word

-20 °C (-4 °F)

Matte Tin - annealed

Dual

R-PDIP-T40

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

2.05 in (52.075 mm)

ICL7129ACPL+

Analog Devices

Analog To Digital Converter, Dual-Slope

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

1

No

2 V

1

CMOS

4

9 V

Binary

9 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-3 V

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T40

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

2.05 in (52.07 mm)

5962-8967402QC

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

4.52 V

55.6 kHz

1

CMOS

14

0.0031 %

5 V

Binary, Offset Binary

-5 V

In-Line

125 °C (257 °F)

-4.5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Gold

Dual

14.25 µs

R-GDIP-T40

No

e4

5962-01-307-8470

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

No

2 V

1

CMOS

0.05 %

5 V

Offset Binary

±5 V

-5 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T40

1

No

MAX140CPL+

Analog Devices

Analog To Digital Converter, Dual-Slope

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

1

No

200 mV

1

CMOS

24

0.0015 %

5 V

Binary

5 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T40

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

2.05 in (52.075 mm)

MAX7129ACJL

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

40

DIP

Rectangular

Ceramic

1

No

2 V

1

CMOS

9 V

7-Segment

9 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-XDIP-T40

e0

ICL7109CPL+2

Analog Devices

Analog To Digital Converter, Dual-Slope

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

1

No

3.5 V

1

CMOS

12

0.0244 %

5 V

Binary

±5 V

-5 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-3.5 V

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T40

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

2.05 in (52.075 mm)

ICL7109CPL+

Analog Devices

Analog To Digital Converter, Dual-Slope

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

1

No

3.5 V

1

CMOS

12

0.0244 %

5 V

Binary

±5 V

-5 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-3.5 V

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T40

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

2.05 in (52.075 mm)

ICL7129ACPA

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

1

No

2 V

1

CMOS

9 V

7-Segment

9 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T40

e0

MAX134CPL+

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

1

No

3.3 V

1

Bipolar

4

1 %

5 V

9's Complement Binary Coded Decimal

9 V

-5 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

2.8 V

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T40

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

2.05 in (52.075 mm)

5962-8967901QC

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

62.5 kHz

1

CMOS

12

0.0122 %

5 V

Binary, Offset Binary

-5 V

In-Line

125 °C (257 °F)

-2.5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Gold

Dual

12.25 µs

R-GDIP-T40

No

e4

ICL7106RCPL

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

1

No

2 V

1

CMOS

9 V

Offset Binary

9 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T40

1

e0

5962-8967401QX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

56 kHz

1

CMOS

MIL-STD-883

14

0.0031 %

5 V

Binary, Offset Binary

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

14.25 µs

R-GDIP-T40

0.23 in (5.84 mm)

0.6 in (15.24 mm)

No

e0

2.06 in (52.32 mm)

5962-8967601QA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

50 kHz

1

CMOS

MIL-STD-883

16

0.0015 %

5 V

Binary, Offset Binary

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

16.25 µs

R-GDIP-T40

0.23 in (5.84 mm)

0.6 in (15.24 mm)

No

e0

2.06 in (52.32 mm)

MAX133CPL+

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

1

No

3.3 V

1

Bipolar

4

1 %

5 V

9's Complement Binary Coded Decimal

9 V

-5 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

2.8 V

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T40

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

2.05 in (52.075 mm)

MAX180CCPL+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

8

No

2.5 V

100 kHz

1

12

0.0244 %

5 V

Binary

5,-12/-15 V

-12 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-2.5 V

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

10 µs

R-PDIP-T40

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

2.05 in (52.07 mm)

MAX133EPL+

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

1

No

3.3 V

1

Bipolar

4

1 %

5 V

9's Complement Binary Coded Decimal

9 V

-5 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

2.8 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDIP-T40

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

2.05 in (52.075 mm)

ICL7129CJL

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

40

DIP

Rectangular

Ceramic

1

No

2 V

1

CMOS

9 V

7-Segment

9 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-XDIP-T40

e0

5962-8967402QX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

56 kHz

1

CMOS

MIL-STD-883

14

0.0031 %

5 V

Binary, Offset Binary

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

14.25 µs

R-GDIP-T40

0.23 in (5.84 mm)

0.6 in (15.24 mm)

No

e0

2.06 in (52.32 mm)

ICL7137CPL+

Analog Devices

Analog To Digital Converter, Dual-Slope

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

1

No

3.2 V

1

CMOS

23

0 %

9 V

Binary

±5 V

-5 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

2.6 V

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T40

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

2.05 in (52.07 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.