Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
105 MHz |
1 |
CMOS |
11 |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e0 |
0.276 in (7 mm) |
||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
48 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
80 MHz |
1 |
CMOS |
14 |
0.0183 % |
5 V |
Offset Binary, 2's Complement Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
R-PDSO-G48 |
1 |
0.047 in (1.2 mm) |
0.24 in (6.1 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.492 in (12.5 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter |
Industrial |
No Lead |
48 |
QCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
4 |
CMOS |
14 |
1.8 V |
Offset Binary |
1.8 V |
Chip Carrier |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Quad |
S-PQCC-N48 |
3 |
No |
e3 |
30 s |
260 °C (500 °F) |
||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
48 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
1.6 V |
50 MHz |
1 |
CMOS |
14 |
0.0244 % |
5 V |
Offset Binary, 2's Complement Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.6 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
R-PDSO-G48 |
1 |
0.047 in (1.2 mm) |
0.24 in (6.1 mm) |
No |
e3 |
260 °C (500 °F) |
0.492 in (12.5 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
1.5 V |
250 MHz |
1 |
CMOS |
14 |
0.0336 % |
1.8 V |
Offset Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1.5 V |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N48 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
e3 |
0.276 in (7 mm) |
||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
4.116 V |
2.5 MHz |
1 |
CMOS |
16 |
0.0015 % |
5 V |
Binary, Offset Binary, 2's Complement Binary |
Flatpack, Low Profile, Fine Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-4.076 V |
Serial, Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
310 ns |
S-PQFP-G48 |
3 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
25 MHz |
1 |
CMOS |
16 |
0.0069 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 mV |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e0 |
0.276 in (7 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
No Lead |
48 |
VQCCN |
Square |
1 |
Yes |
3.25 V |
625 kHz |
1 |
CMOS |
24 |
2.5 V |
Binary |
2.5,3.3/5 V |
Chip Carrier, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-3.25 V |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-XQCC-N48 |
0.035 in (0.9 mm) |
0.276 in (7 mm) |
No |
e0 |
0.276 in (7 mm) |
||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2 V |
40 MHz |
1 |
CMOS |
16 |
0.0092 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Sample |
Quad |
S-PQCC-N48 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
0.276 in (7 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
48 |
LQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
2.2 V |
1 |
CMOS |
10 |
34 mA |
0.2441 % |
5 V |
Binary, 2's Complement Binary |
5 V |
Flatpack, Low Profile |
QFP48,.35SQ,20 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
70 °C (158 °F) |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Quad |
67 ns |
S-PQFP-G48 |
0.067 in (1.7 mm) |
0.276 in (7 mm) |
No |
e0 |
0.276 in (7 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
48 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
1.6 V |
25 MHz |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Offset Binary, 2's Complement Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
R-PDSO-G48 |
1 |
0.047 in (1.2 mm) |
0.24 in (6.1 mm) |
e3 |
260 °C (500 °F) |
0.492 in (12.5 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
2 |
Yes |
1.75 V |
170 MHz |
1 |
CMOS |
14 |
0.01282 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.75 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
25 ns |
S-XQCC-N48 |
3 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2.25 V |
65 MHz |
1 |
CMOS |
14 |
0.0092 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier |
0.02 in (0.5 mm) |
70 °C (158 °F) |
1.5 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
48 |
TFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
2.5 V |
1 MHz |
2 |
14 |
0.0122 % |
5 V |
2's Complement Binary |
3/5,5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP48,.35SQ |
Analog to Digital Converters |
0.02 in (0.5 mm) |
105 °C (221 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Track |
Quad |
530 ns |
S-PQFP-G48 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
No |
40 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
80 MHz |
1 |
CMOS |
10 |
0.2637 % |
3 V |
Offset Binary, 2's Complement Binary |
3 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
S-PQFP-G48 |
3 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e0 |
240 °C (464 °F) |
0.276 in (7 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
4 |
Yes |
2 V |
80 MHz |
1 |
CMOS |
14 |
0.0244 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
12.5 ns |
S-XQCC-N48 |
3 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
4 |
Yes |
5 V |
500 kHz |
1 |
16 |
0.0053 % |
5 V |
Binary |
3/5,5 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Quad |
875 ns |
S-PQFP-G48 |
3 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e0 |
240 °C (464 °F) |
0.276 in (7 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
48 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
1.6 V |
25 MHz |
1 |
CMOS |
14 |
0.0183 % |
5 V |
Offset Binary, 2's Complement Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.6 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
R-PDSO-G48 |
1 |
0.047 in (1.2 mm) |
0.24 in (6.1 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.492 in (12.5 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
20 MHz |
1 |
CMOS |
16 |
0.0076 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-2.5 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
4 |
Yes |
192 kHz |
1 |
AEC-Q100 |
24 |
3.3 V |
Binary |
Flatpack, Low Profile, Fine Pitch |
0.02 in (0.5 mm) |
105 °C (221 °F) |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G48 |
3 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
4.75 V |
500 kHz |
1 |
CMOS |
16 |
0.0031 % |
5 V |
Offset Binary, 2's Complement Binary |
Flatpack, Low Profile, Fine Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-2.5 V |
Serial, Parallel, Word |
0 °C (32 °F) |
Matte Tin - annealed |
Sample |
Quad |
1.3 µs |
S-PQFP-G48 |
3 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1.5 V |
65 MHz |
1 |
CMOS |
16 |
0.0069 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
1 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
Through-Hole |
48 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
2 |
No |
2 V |
50 MHz |
1 |
MIL-STD-883 |
8 |
0.49 % |
5 V |
Binary |
±5 V |
-5 V |
In-Line |
DIP48,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
0 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Dual |
R-CDIP-T48 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
2.4 in (60.96 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
2 |
Yes |
1.75 V |
250 MHz |
1 |
CMOS |
14 |
0.0214 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.75 V |
Serial |
-40 °C (-40 °F) |
Sample |
Quad |
25 ns |
S-XQCC-N48 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
0.276 in (7 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2.25 V |
65 MHz |
1 |
CMOS |
14 |
0.0092 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier |
0.02 in (0.5 mm) |
85 °C (185 °F) |
1.5 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
512 mV |
100 MHz |
2 |
CMOS |
8 |
0.4883 % |
3 V |
Offset Binary, 2's Complement Binary |
3 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-512 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
S-PQFP-G48 |
3 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e0 |
240 °C (464 °F) |
0.276 in (7 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
No Lead |
48 |
VQCCN |
Square |
4 |
Yes |
10 V |
570 kHz |
1 |
CMOS |
16 |
0.0038 % |
5 V |
Binary, 2's Complement Binary |
3/5,5 V |
Chip Carrier, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-10 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Quad |
2.25 µs |
S-XQCC-N48 |
0.039 in (1 mm) |
0.276 in (7 mm) |
No |
e0 |
0.276 in (7 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
3.125 V |
500 kHz |
2 |
12 |
0.0244 % |
5 V |
2's Complement Binary |
3/5,5 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
105 °C (221 °F) |
1.875 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Track |
Quad |
950 ns |
S-PQFP-G48 |
3 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
48 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
500 kHz |
1 |
Hybrid |
16 |
0.0015 % |
15 V |
Complementary 2's Complement, Complementary Offset Binary |
±5,±15 V |
-15 V |
In-Line |
DIP48,1.0 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-10 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Track |
Dual |
R-CDIP-T48 |
0.233 in (5.92 mm) |
1 in (25.4 mm) |
No |
e0 |
2.475 in (62.865 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
105 MHz |
1 |
CMOS |
12 |
0.0317 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e0 |
0.276 in (7 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
48 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
1.6 V |
80 MHz |
1 |
CMOS |
14 |
0.0183 % |
5 V |
Offset Binary, 2's Complement Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.6 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
R-PDSO-G48 |
1 |
0.047 in (1.2 mm) |
0.24 in (6.1 mm) |
No |
e3 |
260 °C (500 °F) |
0.492 in (12.5 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2.25 V |
80 MHz |
1 |
CMOS |
16 |
0.0069 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 mV |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
5 V |
570 kHz |
1 |
CMOS |
16 |
0.0038 % |
5 V |
Binary, 2's Complement Binary |
3/5,5 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Quad |
2 µs |
S-PQFP-G48 |
3 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e0 |
240 °C (464 °F) |
0.276 in (7 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Pipelined |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
2 |
Yes |
2.087 V |
80 MHz |
1 |
14 |
0.0067 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
12.5 ns |
S-XQCC-N48 |
3 |
0.039 in (1 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Automotive |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
8 |
Yes |
4.101 V |
200 kHz |
1 |
CMOS |
18 |
0.0023 % |
5 V |
2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-4.091 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
4.405 µs |
S-PQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2.25 V |
65 MHz |
1 |
CMOS |
14 |
0.0092 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier |
0.02 in (0.5 mm) |
70 °C (158 °F) |
1.5 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e0 |
0.276 in (7 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
No Lead |
48 |
VQCCN |
Square |
1 |
Yes |
5.35 V |
570 kHz |
1 |
CMOS |
18 |
0.001 % |
5 V |
Binary, 2's Complement Binary |
3/5,5 V |
Chip Carrier, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-3 V |
Serial, Parallel, 8 Bits, Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Quad |
1.5 µs |
S-XQCC-N48 |
0.039 in (1 mm) |
0.276 in (7 mm) |
No |
e0 |
0.276 in (7 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
48 |
TSSOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
2.048 V |
1.25 MHz |
1 |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 mV |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
650 ns |
R-PDSO-G48 |
1 |
0.047 in (1.2 mm) |
0.24 in (6.1 mm) |
No |
e0 |
0.492 in (12.5 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
No Lead |
48 |
VQCCN |
Square |
1 |
Yes |
2.5 V |
1 MHz |
1 |
16 |
0.0015 % |
5 V |
Binary, 2's Complement Binary |
Chip Carrier, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.5 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Track |
Quad |
1.25 µs |
S-XQCC-N48 |
1 |
0.039 in (1 mm) |
0.276 in (7 mm) |
No |
e3 |
40 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
4.116 V |
250 kHz |
1 |
CMOS |
16 |
0.0031 % |
5 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-4.076 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Sample |
Quad |
2.5 µs |
S-PQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
2 |
Yes |
1.2 V |
500 MHz |
1 |
CMOS |
8 |
130 mA |
0.1172 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.2 V |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
0.276 in (7 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter |
Commercial |
Through-Hole |
48 |
DIP |
Rectangular |
Ceramic |
No |
2 V |
2 |
CMOS |
8 |
0.49 % |
5 V |
Offset Binary |
±5 V |
-5 V |
In-Line |
DIP48,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Dual |
R-XDIP-T48 |
1 |
No |
|||||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
4 |
Yes |
50 MHz |
1 |
CMOS |
12 |
0.024 % |
3 V |
Offset Binary |
3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Track |
Quad |
S-XQCC-N48 |
3 |
0.039 in (1 mm) |
0.276 in (7 mm) |
No |
e3 |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
4 V |
65 MHz |
1 |
CMOS |
14 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
3,5 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
500 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Quad |
S-PQFP-G48 |
3 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e0 |
240 °C (464 °F) |
0.276 in (7 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
40 MHz |
1 |
CMOS |
10 |
0.1562 % |
3 V |
Offset Binary, 2's Complement Binary |
3 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
S-PQFP-G48 |
3 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e0 |
240 °C (464 °F) |
0.276 in (7 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Pipelined |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
4 |
Yes |
2 V |
50 MHz |
1 |
CMOS |
14 |
0.0214 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N48 |
3 |
0.039 in (1 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
1 |
Yes |
5 V |
570 kHz |
1 |
CMOS |
16 |
0.0038 % |
5 V |
Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
2 µs |
S-XQCC-N48 |
3 |
0.039 in (1 mm) |
0.276 in (7 mm) |
No |
e3 |
0.276 in (7 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2.25 V |
105 MHz |
1 |
CMOS |
14 |
0.0092 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 mV |
Parallel, Word |
0 °C (32 °F) |
Matte Tin - annealed |
Sample |
Quad |
S-PQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.