52 Analog-to-Digital Converters 209

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

LTC2174IUKG-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

2 V

105 MHz

1

CMOS

14

0.0198 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial, Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Quad

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2174IUKG-14#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

2 V

105 MHz

1

CMOS

14

0.0198 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial, Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Quad

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2271IUKG#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

2

Yes

2.1 V

20 MHz

1

CMOS

16

0.004 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2.1 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2325IUKG-16#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

2.064 V

5 MHz

1

CMOS

16

0.0137 %

3.3 V

Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2.034 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

170 ns

R-PQCC-N52

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

0.315 in (8 mm)

LTC2320HUKG-16#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

8

Yes

2.064 V

1.5 MHz

1

CMOS

16

0.0183 %

3.3 V

Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-2.034 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

R-PQCC-N52

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

0.315 in (8 mm)

LTC2325CUKG-12#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

2.064 V

5 MHz

1

CMOS

12

0.0244 %

3.3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-2.034 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Quad

170 ns

R-PQCC-N52

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2325HUKG-12#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

2.064 V

5 MHz

1

CMOS

12

0.0244 %

3.3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-2.034 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

170 ns

R-PQCC-N52

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2325CUKG-16#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

2.064 V

5 MHz

1

CMOS

16

0.0137 %

3.3 V

Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-2.034 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Quad

170 ns

R-PQCC-N52

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

0.315 in (8 mm)

LTC2320IUKG-16#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

8

Yes

2.064 V

1.5 MHz

1

CMOS

16

0.0183 %

3.3 V

Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2.034 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

R-PQCC-N52

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

0.315 in (8 mm)

LTC2324IUKG-16#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

2.064 V

2 MHz

1

CMOS

16

0.0183 %

3.3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2.034 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

R-PQCC-N52

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2325HUKG-16#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

2.064 V

5 MHz

1

CMOS

16

0.0137 %

3.3 V

Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-2.034 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

170 ns

R-PQCC-N52

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

0.315 in (8 mm)

LTC2175IUKG-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

2 V

125 MHz

1

CMOS

14

0.025 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial, Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Quad

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2325HUKG-14#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

2.064 V

5 MHz

1

CMOS

14

44.5 mA

0.0183 %

3.3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC52,.27X.31,20

0.02 in (0.5 mm)

125 °C (257 °F)

-2.034 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

200 ns

R-PQCC-N52

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2320IUKG-12#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

8

Yes

2.064 V

1.5 MHz

1

CMOS

12

0.0244 %

3.3 V

Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2.034 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

450 ns

R-PQCC-N52

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

0.315 in (8 mm)

LTC2271IUKG#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

2

Yes

2.1 V

20 MHz

1

CMOS

16

0.004 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2.1 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2170IUKG-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

2 V

25 MHz

1

CMOS

14

0.0168 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Quad

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2320HUKG-12#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

8

Yes

2.064 V

1.5 MHz

1

CMOS

12

0.0244 %

3.3 V

Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-2.034 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

450 ns

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

260 °C (500 °F)

0.315 in (8 mm)

LTC2271CUKG#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

2

Yes

2.1 V

20 MHz

1

CMOS

16

0.004 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-2.1 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Quad

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2320IUKG-14#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

8

Yes

2.064 V

1.5 MHz

1

CMOS

14

0.0183 %

3.3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2.034 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

450 ns

R-PQCC-N52

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

0.315 in (8 mm)

LTC2325IUKG-12#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

2.064 V

5 MHz

1

CMOS

12

0.0244 %

3.3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2.034 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

170 ns

R-PQCC-N52

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2171IUKG-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

2 V

40 MHz

1

CMOS

14

0.0168 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Quad

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2195IUKG#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

2

Yes

1.25 V

125 MHz

1

CMOS

16

0.0107 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

700 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Quad

1 µs

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

AD6644ASTZ-65

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

52

LQFP

Square

Plastic/Epoxy

1

Yes

2.2 V

65 MHz

1

Bipolar

14

0.0031 %

5 V

2's Complement Binary

3.3,5 V

Flatpack, Low Profile

QFP52,.47SQ

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-25 °C (-13 °F)

Matte Tin

Track

Quad

S-PQFP-G52

3

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

0.394 in (10 mm)

LTC2324CUKG-16#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

2.064 V

2 MHz

1

CMOS

16

0.0183 %

3.3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-2.034 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Quad

R-PQCC-N52

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2175IUKG-14#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

2 V

125 MHz

1

CMOS

14

0.025 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial, Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Quad

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2320IUKG-12#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

8

Yes

2.064 V

1.5 MHz

1

CMOS

12

0.0244 %

3.3 V

Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2.034 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

450 ns

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

260 °C (500 °F)

0.315 in (8 mm)

LTC2325IUKG-14#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

2.064 V

5 MHz

1

CMOS

14

44.5 mA

0.0183 %

3.3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC52,.27X.31,20

0.02 in (0.5 mm)

85 °C (185 °F)

-2.034 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

200 ns

R-PQCC-N52

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2320IUKG-16#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

8

Yes

2.064 V

1.5 MHz

1

CMOS

16

0.0183 %

3.3 V

Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2.034 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

260 °C (500 °F)

0.315 in (8 mm)

ADS5423IPJYR

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

52

HLQFP

Square

Plastic/Epoxy

1

Yes

2.2 V

80 MHz

1

Bipolar

14

5 V

2's Complement Binary

3.3,5 V

Flatpack, Heat Sink/Slug, Low Profile

HQFP52,.47SQ

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Tin

Track

Quad

S-PQFP-G52

3

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e3

0.394 in (10 mm)

ADS5423IPJYRG3

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

52

HLQFP

Square

Plastic/Epoxy

1

Yes

2.2 V

80 MHz

1

Bipolar

14

5 V

2's Complement Binary

3.3,5 V

Flatpack, Heat Sink/Slug, Low Profile

HQFP52,.47SQ

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Tin

Track

Quad

S-PQFP-G52

3

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e3

0.394 in (10 mm)

ADS5423IPJYRG4

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

52

HLQFP

Square

Plastic/Epoxy

1

Yes

2.2 V

80 MHz

1

Bipolar

14

5 V

2's Complement Binary

3.3,5 V

Flatpack, Heat Sink/Slug, Low Profile

HQFP52,.47SQ

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Track

Quad

S-PQFP-G52

0.063 in (1.6 mm)

0.394 in (10 mm)

No

0.394 in (10 mm)

LTC2320CUKG-16#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

8

Yes

2.064 V

1.5 MHz

1

CMOS

16

0.0183 %

3.3 V

Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-2.034 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Quad

R-PQCC-N52

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

0.315 in (8 mm)

LTC2325CUKG-14#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

2.064 V

5 MHz

1

CMOS

14

44.5 mA

0.0183 %

3.3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC52,.27X.31,20

0.02 in (0.5 mm)

70 °C (158 °F)

-2.034 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Quad

200 ns

R-PQCC-N52

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2325HUKG-16#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

2.064 V

5 MHz

1

CMOS

16

0.0137 %

3.3 V

Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-2.034 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

170 ns

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

260 °C (500 °F)

0.315 in (8 mm)

LTC2170IUKG-14#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

2 V

25 MHz

1

CMOS

14

0.0168 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Quad

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2325CUKG-16#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

2.064 V

5 MHz

1

CMOS

16

0.0137 %

3.3 V

Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-2.034 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Quad

170 ns

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

260 °C (500 °F)

0.315 in (8 mm)

LTC2325HUKG-12#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

2.064 V

5 MHz

1

CMOS

12

0.0244 %

3.3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-2.034 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

170 ns

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2320IUKG-14#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

8

Yes

2.064 V

1.5 MHz

1

CMOS

14

0.0183 %

3.3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2.034 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

450 ns

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

260 °C (500 °F)

0.315 in (8 mm)

LTC2325CUKG-12#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

2.064 V

5 MHz

1

CMOS

12

0.0244 %

3.3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-2.034 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Quad

170 ns

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2325IUKG-12#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

2.064 V

5 MHz

1

CMOS

12

0.0244 %

3.3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2.034 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

170 ns

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2325IUKG-16#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

2.064 V

5 MHz

1

CMOS

16

0.0137 %

3.3 V

Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2.034 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

170 ns

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

260 °C (500 °F)

0.315 in (8 mm)

LTC2175CUKG-12#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

125 MHz

1

CMOS

12

0.0244 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

Serial

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2320HUKG-14#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

8

Yes

2.064 V

1.5 MHz

1

CMOS

14

0.0183 %

3.3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-2.034 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

450 ns

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

260 °C (500 °F)

0.315 in (8 mm)

AD6645ASVZ-105

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

52

HTQFP

Square

Plastic/Epoxy

1

Yes

2.2 V

105 MHz

1

Bipolar

14

5 V

2's Complement Binary

3.3,5 V

Flatpack, Heat Sink/Slug, Thin Profile

TQFP52,.47SQ,25

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-10 °C (14 °F)

Matte Tin

Track

Quad

S-PQFP-G52

3

0.047 in (1.2 mm)

0.472 in (12 mm)

No

e3

30 s

260 °C (500 °F)

0.472 in (12 mm)

LTC2171IUKG-12#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

2 V

40 MHz

1

CMOS

12

0.0244 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Quad

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2171IUKG-14#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

2 V

40 MHz

1

CMOS

14

0.0168 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Quad

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2194CUKG#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

2

Yes

1.25 V

105 MHz

1

CMOS

16

0.0114 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

700 mV

Serial

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

1 µs

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2271CUKG#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

2

Yes

2.1 V

20 MHz

1

CMOS

16

0.004 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-2.1 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Quad

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.