64 Analog-to-Digital Converters 1,266

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

MAX11048ECB+T

Analog Devices

Analog To Digital Converter

Industrial

Gull Wing

64

HTFQFP

Square

6

Yes

5.0166 V

250 kHz

1

BICMOS

16

0.0031 %

Offset Binary, 2's Complement Binary

3/5,5 V

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

TQFP64,.47SQ

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Track

Quad

3 µs

S-XQFP-G64

3

0.047 in (1.2 mm)

0.394 in (10 mm)

No

30 s

260 °C (500 °F)

0.394 in (10 mm)

MAX17823HGCB/V+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

12

Yes

1

AEC-Q100

12

48 V

Binary

Flatpack, Low Profile, Fine Pitch

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQFP-G64

3

0.063 in (1.6 mm)

0.394 in (10 mm)

e3

30 s

260 °C (500 °F)

0.394 in (10 mm)

MAX11047ECB+T

Analog Devices

Analog To Digital Converter

Industrial

Gull Wing

64

HTFQFP

Square

8

Yes

5.0166 V

250 kHz

1

BICMOS

16

0.0031 %

Offset Binary, 2's Complement Binary

3/5,5 V

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

TQFP64,.47SQ

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Track

Quad

3 µs

S-XQFP-G64

3

0.047 in (1.2 mm)

0.394 in (10 mm)

No

30 s

260 °C (500 °F)

0.394 in (10 mm)

MAX11049ECB+T

Analog Devices

Analog To Digital Converter

Industrial

Gull Wing

64

HTFQFP

Square

4

Yes

5.0166 V

250 kHz

1

BICMOS

16

0.0031 %

Offset Binary, 2's Complement Binary

3/5,5 V

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

TQFP64,.47SQ

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

3 µs

S-XQFP-G64

3

0.047 in (1.2 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

0.394 in (10 mm)

MAX17823BGCB+T

Analog Devices

Data Acquisition Device

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

12

Yes

2.3 V

1

AEC-Q100

12

48 V

Binary

Flatpack, Low Profile, Fine Pitch

QFP64,.47SQ,20

0.02 in (0.5 mm)

105 °C (221 °F)

-2.3 V

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQFP-G64

3

0.063 in (1.6 mm)

0.394 in (10 mm)

e3

30 s

260 °C (500 °F)

0.394 in (10 mm)

MAX11045BECB+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

64

HTFQFP

Square

Plastic/Epoxy

6

Yes

5.0166 V

250 kHz

1

BICMOS

16

0.0046 %

Offset Binary, 2's Complement Binary

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-5.0166 V

Parallel, Word

-40 °C (-40 °F)

Track

Quad

3 µs

S-PQFP-G64

0.047 in (1.2 mm)

0.394 in (10 mm)

0.394 in (10 mm)

MAX11059ECB+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

64

HTFQFP

Square

Plastic/Epoxy

8

Yes

5.02 V

250 kHz

1

BICMOS

14

0.0061 %

5 V

Offset Binary, 2's Complement Binary

3/5,5 V

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

TQFP64,.47SQ

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

3 µs

S-PQFP-G64

3

0.047 in (1.2 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

0.394 in (10 mm)

MAX11045BECB+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

64

HTFQFP

Square

Plastic/Epoxy

6

Yes

5.0166 V

250 kHz

1

BICMOS

16

0.0046 %

5 V

Offset Binary, 2's Complement Binary

3/5,5 V

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

TQFP64,.47SQ

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-5.0166 V

Parallel, Word

-40 °C (-40 °F)

Track

Quad

3 µs

S-PQFP-G64

3

0.047 in (1.2 mm)

0.394 in (10 mm)

No

0.394 in (10 mm)

MAX11057ECB+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

64

HTFQFP

Square

Plastic/Epoxy

4

Yes

5.02 V

250 kHz

1

BICMOS

14

0.0061 %

5 V

Offset Binary, 2's Complement Binary

3/5,5 V

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

TQFP64,.47SQ

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

3 µs

S-PQFP-G64

3

0.047 in (1.2 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

0.394 in (10 mm)

MAX11044ECB+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

64

HTFQFP

Square

Plastic/Epoxy

4

Yes

5 V

250 kHz

1

BICMOS

16

0.0031 %

5 V

Offset Binary, 2's Complement Binary

3/5,5 V

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

QFP64,.47SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

3 µs

S-PQFP-G64

3

0.047 in (1.2 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

0.394 in (10 mm)

MAX11057ECB+T

Analog Devices

Analog To Digital Converter

Industrial

Gull Wing

64

HTFQFP

Square

8

Yes

5.0166 V

250 kHz

1

BICMOS

14

0.0055 %

Offset Binary, 2's Complement Binary

3/5,5 V

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

TQFP64,.47SQ

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

3 µs

S-XQFP-G64

3

0.047 in (1.2 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

0.394 in (10 mm)

AD9269-80

Analog Devices

Analog To Digital Converter

Industrial

No Lead

64

HVQCCN

Square

1

Yes

80 MHz

2

16

119 mA

0.099 %

1.8 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

0.02 in (0.5 mm)

85 °C (185 °F)

2 V

Serial

-40 °C (-40 °F)

Sample

Quad

S-XQCC-N64

0.039 in (1 mm)

0.354 in (9 mm)

0.354 in (9 mm)

AD9680BCPZRL7-1000

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

2

Yes

1.7 V

1000 MHz

1

14

0.0421 %

1.25 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1.7 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-XQCC-N64

3

0.031 in (0.8 mm)

0.354 in (9 mm)

e3

260 °C (500 °F)

0.354 in (9 mm)

LTC2281CUP#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

125 MHz

2

CMOS

10

0.0684 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

LTC2289IUP

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

2

Yes

1 V

80 MHz

1

CMOS

10

0.0586 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-500 mV

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

AD9216BCPZRL7-80

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

2

Yes

80 MHz

1

CMOS

10

0.1562 %

3 V

Offset Binary, 2's Complement Binary

2.5,3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC2221IUP#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

135 MHz

1

CMOS

12

0.0244 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC2217IUP#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

2.75 V

105 MHz

1

16

0.0053 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

AD9643BCPZRL7-170

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

64

HVQCCN

Square

2

Yes

1.75 V

170 MHz

1

14

0.011 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

5.8 ns

S-XQCC-N64

1

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

0.354 in (9 mm)

LTC2294CUP

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

2

Yes

1 V

80 MHz

1

CMOS

12

0.0342 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-500 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

AD9289BBC-65

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

64

LFBGA

Rectangular

Plastic/Epoxy

4

Yes

2 V

65 MHz

1

CMOS

8

3 V

Binary, 2's Complement Binary

3 V

Grid Array, Low Profile, Fine Pitch

BGA64,8X8,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

1 V

Serial

-40 °C (-40 °F)

Tin Lead Silver

Sample

Bottom

R-PBGA-B64

0.067 in (1.7 mm)

0.315 in (8 mm)

No

e0

0.315 in (8 mm)

AD9600BCPZ-105

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

1

Yes

2 V

105 MHz

2

CMOS

10

0.0293 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

9 ns

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

260 °C (500 °F)

0.354 in (9 mm)

LTC2145IUP-12#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

2

Yes

1.25 V

125 MHz

1

CMOS

12

0.022 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

700 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

AD9627ABCPZ11-150

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

64

HVQCCN

Square

2

Yes

150 MHz

1

CMOS

11

0.0342 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

6.6 µs

S-XQCC-N64

1

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

0.354 in (9 mm)

LTC2157IUP-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

2

Yes

1.5 V

250 MHz

1

CMOS

14

0.0336 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1.5 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC2242IUP-10#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

250 MHz

1

CMOS

10

0.0977 %

2.5 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

AD9627BCPZ-125

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

1

Yes

2 V

125 MHz

2

CMOS

12

0.022 %

1.8 V

Offset Binary, 2's Complement Binary

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

8 ns

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

260 °C (500 °F)

0.354 in (9 mm)

LTC2215IUP

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

2.75 V

65 MHz

1

CMOS

16

0.0053 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

LTC2157CUP-14#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

2

Yes

1.5 V

250 MHz

1

CMOS

14

0.0336 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1.5 V

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

AD9680BCPZRL7-500

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

2

Yes

2.06 V

500 MHz

1

14

0.0305 %

1.25 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2.06 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-XQCC-N64

3

0.031 in (0.8 mm)

0.354 in (9 mm)

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC2180IUP#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

2

Yes

1.25 V

25 MHz

1

CMOS

16

0.0092 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

700 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Quad

S-PQCC-N64

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

0.354 in (9 mm)

LTC2158IUP-12#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

2

Yes

1.32 V

310 MHz

1

CMOS

12

2.2 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1.32 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC2241IUP-12

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

210 MHz

1

12

0.0562 %

2.5 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

AD7656-1YSTZ-500RL7

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

6

Yes

10 V

250 kHz

1

CMOS

16

0.0069 %

5 V

2's Complement Binary

5,±5/±15 V

-5 V

Flatpack, Low Profile, Fine Pitch

QFP64,.47SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-10 V

Serial

-40 °C (-40 °F)

Matte Tin

Track

Quad

3.1 µs

S-PQFP-G64

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e3

0.394 in (10 mm)

LTC2293CUP#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

65 MHz

2

CMOS

12

0.0342 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-500 mV

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC2216CUP

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

2.75 V

80 MHz

1

CMOS

16

0.0053 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

LTC2157IUP-14#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

2

Yes

1.5 V

250 MHz

1

CMOS

14

0.0336 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1.5 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC2288IUP

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

65 MHz

2

CMOS

10

0.0586 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

LTC2145IUP-14#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

2

Yes

2 V

125 MHz

1

CMOS

14

0.0159 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC2296CUP#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

25 MHz

2

CMOS

14

0.0305 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

AD7658-1YSTZ-REEL

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

6

Yes

10 V

250 kHz

1

CMOS

12

0.0244 %

5 V

2's Complement Binary

5,±5/±15 V

-5 V

Flatpack, Low Profile, Fine Pitch

QFP64,.47SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-10 V

Serial

-40 °C (-40 °F)

Matte Tin

Track

Quad

3.1 µs

S-PQFP-G64

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e3

0.394 in (10 mm)

AD9216BCPZRL7-65

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

2

Yes

65 MHz

1

CMOS

10

0.1367 %

3 V

Offset Binary, 2's Complement Binary

2.5,3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC2141IUP-14#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

2

Yes

2 V

40 MHz

1

CMOS

14

0.0146 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

AD9267BCPZRL7

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

No Lead

64

HVQCCN

Square

2

Yes

2 V

640 MHz

1

16

1.8 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Matte Tin

Quad

1.645 ns

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

e3

0.354 in (9 mm)

LTC2215CUP#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

2.75 V

65 MHz

1

CMOS

16

0.0053 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC2270IUP#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

2

Yes

2.1 V

20 MHz

1

CMOS

16

0.0035 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2.1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC2141IUP-12#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

2

Yes

1.25 V

40 MHz

1

CMOS

12

0.022 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

700 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

AD9222ABCPZRL7-40

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

8

Yes

2 V

40 MHz

1

CMOS

12

0.0244 %

1.8 V

Offset Binary, 2's Complement Binary

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.