FBGA Analog-to-Digital Converters 84

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

ADC09SJ800AAVTQ1

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

1

Yes

800 mV

800 MHz

1

AEC-Q100

9

0.09765 %

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

260 °C (500 °F)

0.394 in (10 mm)

ADC09SJ1300AAVTQ1

Texas Instruments

Analog To Digital Converter, Proprietary Method

Automotive

Ball

144

FBGA

Square

Plastic/Epoxy

1

Yes

800 mV

1300 MHz

1

AEC-Q100

9

0.06445 %

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC12QJ1600AAVQ1

Texas Instruments

Analog To Digital Converter, Proprietary Method

Automotive

Ball

144

FBGA

Square

Plastic/Epoxy

4

Yes

800 mV

1600 MHz

1

AEC-Q100

12

100 mA

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC12SJ1600AAV

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

1

Yes

800 mV

1600 MHz

1

12

0.046386 %

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC12QJ800AAVQ1

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

4

Yes

800 mV

800 MHz

1

AEC-Q100

12

0.046386 %

1.1 V

2’s Complement, Offset Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC12SJ1600AAVT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

1

Yes

800 mV

1600 MHz

1

12

0.046386 %

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC09QJ800AAV

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

4

Yes

800 mV

800 MHz

1

9

0.09765 %

1.1 V

2’s Complement, Offset Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC08DJ3200AAVT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2

Yes

800 mV

3200 MHz

1

8

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial, Parallel, 8 Bits

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC09QJ800AAVQ1

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

4

Yes

800 mV

800 MHz

1

AEC-Q100

9

0.09765 %

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC09DJ800AAV

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

2

Yes

800 mV

800 MHz

1

9

0.09765 %

1.1 V

2’s Complement, Offset Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC09QJ1300AAVQ1

Texas Instruments

Analog To Digital Converter, Proprietary Method

Automotive

Ball

144

FBGA

Square

Plastic/Epoxy

4

Yes

800 mV

1300 MHz

1

AEC-Q100

9

0.09765 %

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC09SJ800AAV

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

1

Yes

800 mV

800 MHz

1

9

0.09765 %

1.1 V

2’s Complement, Offset Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC09SJ1300AAVQ1

Texas Instruments

Analog To Digital Converter, Proprietary Method

Automotive

Ball

144

FBGA

Square

Plastic/Epoxy

1

Yes

800 mV

1300 MHz

1

AEC-Q100

9

0.06445 %

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC12DJ2700ZEG

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2

Yes

800 mV

2700 MHz

1

12

950 mA

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial, Parallel, Word

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e0

20 s

235 °C (455 °F)

0.394 in (10 mm)

ADC09QJ800AAVTQ1

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

4

Yes

800 mV

800 MHz

1

AEC-Q100

9

0.09765 %

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

260 °C (500 °F)

0.394 in (10 mm)

ADC12QJ800AAVTQ1

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

4

Yes

800 mV

800 MHz

1

AEC-Q100

12

0.046386 %

1.1 V

2’s Complement, Offset Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

260 °C (500 °F)

0.394 in (10 mm)

5962F1820901VXC

Texas Instruments

Analog To Digital Converter, Proprietary Method

Military

Ball

196

FBGA

Rectangular

300k Rad(Si)

Ceramic, Metal-Sealed Cofired

1

Yes

800 mV

6400 MHz

1

MIL-PRF-38535 Class V

12

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial, Parallel, Word

-55 °C (-67 °F)

Bottom

R-CBGA-B196

0.076 in (1.94 mm)

0.394 in (10 mm)

Yes

Peak-to-peak input voltage range: 0.8 V

0.394 in (10 mm)

ADC12DJ800AAVQ1

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

2

Yes

800 mV

800 MHz

1

AEC-Q100

12

0.046386 %

1.1 V

2’s Complement, Offset Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC12QJ1600AAV

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

4

Yes

800 mV

1600 MHz

1

12

0.046386 %

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC12DJ1600AAVT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

2

Yes

800 mV

1600 MHz

1

12

0.046386 %

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADAQ23876BBCZ

Analog Devices

Data Acquisition Device, Wireless

Ball

100

FBGA

Square

Plastic/Epoxy

1

Yes

11 V

15 MHz

1

16

52 mA

0.00125 %

5 V

2's Complement Binary

Grid Array, Fine Pitch

BGA100,10X10,32

0.031 in (0.8 mm)

85 °C (185 °F)

-11 V

Serial

-40 °C (-40 °F)

Sample

Bottom

63 ns

S-PBGA-B100

0.093 in (2.368 mm)

0.354 in (9 mm)

0.354 in (9 mm)

LTM9011IY-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

140

FBGA

Rectangular

Plastic/Epoxy

8

Yes

2 V

125 MHz

1

14

0.025 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Serial, Parallel, Word

-40 °C (-40 °F)

Tin Silver Copper

Sample

Bottom

R-PBGA-B140

3

0.113 in (2.87 mm)

0.354 in (9 mm)

No

e1

30 s

260 °C (500 °F)

0.443 in (11.25 mm)

LTM9008IY-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

140

FBGA

Rectangular

Plastic/Epoxy

8

Yes

2 V

65 MHz

1

14

0.025 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Serial, Parallel, Word

-40 °C (-40 °F)

Tin Silver Copper

Sample

Bottom

R-PBGA-B140

0.113 in (2.87 mm)

0.354 in (9 mm)

e1

0.443 in (11.25 mm)

LTM9010IY-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

140

FBGA

Rectangular

Plastic/Epoxy

8

Yes

2 V

105 MHz

1

14

0.0198 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Serial, Parallel, Word

-40 °C (-40 °F)

Tin Silver Copper

Sample

Bottom

R-PBGA-B140

3

0.113 in (2.87 mm)

0.354 in (9 mm)

No

e1

30 s

260 °C (500 °F)

0.443 in (11.25 mm)

LTM9006IY-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

140

FBGA

Rectangular

Plastic/Epoxy

8

Yes

2 V

25 MHz

1

14

0.0168 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Serial, Parallel, Word

-40 °C (-40 °F)

Tin Silver Copper

Sample

Bottom

R-PBGA-B140

0.113 in (2.87 mm)

0.354 in (9 mm)

e1

0.443 in (11.25 mm)

LTM9009CY-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Ball

140

FBGA

Rectangular

Plastic/Epoxy

8

Yes

2 V

80 MHz

1

14

0.0168 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

70 °C (158 °F)

-2 V

Serial, Parallel, Word

0 °C (32 °F)

Tin Silver Copper

Sample

Bottom

R-PBGA-B140

3

0.113 in (2.87 mm)

0.354 in (9 mm)

No

e1

30 s

260 °C (500 °F)

0.443 in (11.25 mm)

LTM9010CY-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Ball

140

FBGA

Rectangular

Plastic/Epoxy

8

Yes

2 V

105 MHz

1

14

0.0198 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

70 °C (158 °F)

-2 V

Serial, Parallel, Word

0 °C (32 °F)

Tin Silver Copper

Sample

Bottom

R-PBGA-B140

0.113 in (2.87 mm)

0.354 in (9 mm)

No

e1

0.443 in (11.25 mm)

LTM9009IY-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

140

FBGA

Rectangular

Plastic/Epoxy

8

Yes

2 V

80 MHz

1

14

0.0168 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Serial, Parallel, Word

-40 °C (-40 °F)

Tin Silver Copper

Sample

Bottom

R-PBGA-B140

0.113 in (2.87 mm)

0.354 in (9 mm)

No

e1

0.443 in (11.25 mm)

ADAQ4001BBCZ

Analog Devices

Data Acquisition Device

Ball

49

FBGA

Square

Plastic/Epoxy

1

Yes

12.705 V

2 MHz

1

16

0.00119 %

1.8 V

2’s Complement Hexadecimal

Grid Array, Fine Pitch

BGA49,7X7,20

0.02 in (0.5 mm)

125 °C (257 °F)

-5.28 V

Serial

-40 °C (-40 °F)

Bottom

320 ns

S-PBGA-B49

3

0.096 in (2.432 mm)

0.276 in (7 mm)

30 s

260 °C (500 °F)

0.276 in (7 mm)

ADAS1124JBCZ

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Ball

324

FBGA

Square

Plastic/Epoxy

256

Yes

226 kHz

1

24

1.8 V

Binary, Offset Binary

Grid Array, Fine Pitch

BGA324,.9X9,20

0.031 in (0.8 mm)

70 °C (158 °F)

Serial

0 °C (32 °F)

Sample

Bottom

2.857 µs

S-PBGA-B324

0.074 in (1.89 mm)

0.591 in (15 mm)

0.591 in (15 mm)

LTM9012IY-AB#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

221

FBGA

Rectangular

Plastic/Epoxy

4

Yes

200 mV

125 MHz

1

14

0.0305 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-200 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Sample

Bottom

R-PBGA-B221

0.117 in (2.97 mm)

0.443 in (11.25 mm)

e1

0.591 in (15 mm)

LTM9007IY-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

140

FBGA

Rectangular

Plastic/Epoxy

8

Yes

2 V

40 MHz

1

14

0.0168 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Serial, Parallel, Word

-40 °C (-40 °F)

Tin Silver Copper

Sample

Bottom

R-PBGA-B140

0.113 in (2.87 mm)

0.354 in (9 mm)

e1

0.443 in (11.25 mm)

ADAQ23875BBC

Analog Devices

Analog To Digital Converter, Successive Approximation

Ball

100

FBGA

Square

Plastic/Epoxy

1

Yes

2.048 V

15 MHz

1

16

52 mA

0.000915 %

5 V

Offset Binary

Grid Array, Fine Pitch

BGA100,10X10,32

0.031 in (0.8 mm)

85 °C (185 °F)

-2.048 V

Serial

-40 °C (-40 °F)

Sample

Bottom

63 ns

S-PBGA-B100

0.093 in (2.368 mm)

0.354 in (9 mm)

0.354 in (9 mm)

LTM9007CY-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Ball

140

FBGA

Rectangular

Plastic/Epoxy

8

Yes

2 V

40 MHz

1

14

0.0168 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

70 °C (158 °F)

-2 V

Serial, Parallel, Word

0 °C (32 °F)

Tin Silver Copper

Sample

Bottom

R-PBGA-B140

0.113 in (2.87 mm)

0.354 in (9 mm)

e1

0.443 in (11.25 mm)

ADAQ4001BBCZ-RL13

Analog Devices

Data Acquisition Device

Ball

49

FBGA

Square

Plastic/Epoxy

1

Yes

12.705 V

2 MHz

1

16

0.00119 %

1.8 V

2’s Complement Hexadecimal

Grid Array, Fine Pitch

BGA49,7X7,20

0.02 in (0.5 mm)

125 °C (257 °F)

-5.28 V

Serial

-40 °C (-40 °F)

Bottom

320 ns

S-PBGA-B49

3

0.096 in (2.432 mm)

0.276 in (7 mm)

30 s

260 °C (500 °F)

0.276 in (7 mm)

LTM9012CY-AB#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Ball

221

FBGA

Rectangular

Plastic/Epoxy

4

Yes

200 mV

125 MHz

1

14

0.0305 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

70 °C (158 °F)

-200 mV

Serial

0 °C (32 °F)

Tin Silver Copper

Sample

Bottom

R-PBGA-B221

0.117 in (2.97 mm)

0.443 in (11.25 mm)

e1

0.591 in (15 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.