HVQCCN Analog-to-Digital Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

MAX1278ETC+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

12

HVQCCN

Square

1

Yes

2.053 V

1.8 MHz

1

BICMOS

12

0.0305 %

5 V

2's Complement Binary

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC12,.16SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-2.043 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

556 ns

S-XQCC-N12

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0.157 in (4 mm)

MAX11338ATJ+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

4

Yes

3.65 V

500 kHz

1

BICMOS

10

0.039 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11126ATI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

16

Yes

3.65 V

1 MHz

1

8

2.5 μA

0.05859375 %

3 V

2's Complement Binary

2.5/3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-300 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11044ETN+T

Analog Devices

Analog To Digital Converter

Industrial

No Lead

56

HVQCCN

Square

4

Yes

5.0166 V

250 kHz

1

BICMOS

16

0.0031 %

5 V

Offset Binary, 2's Complement Binary

3/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-5.0166 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

3 µs

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

MAX11340ATJ+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

16

Yes

3.65 V

500 kHz

1

BICMOS

10

0.039 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11043ATL+T

Analog Devices

Analog To Digital Converter, Delta-Sigma

Automotive

No Lead

40

HVQCCN

Square

4

Yes

3.6 V

400 kHz

1

BICMOS

16

3.3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Quad

2.5 µs

S-XQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

MAX11043ATL/V+

Analog Devices

Analog To Digital Converter, Delta-Sigma

Automotive

No Lead

40

HVQCCN

Square

4

Yes

3.6 V

9.6 MHz

1

BICMOS

AEC-Q100

16

0.0008 %

3.3 V

2's Complement Binary

3,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC40,.24SQ,20

Other Converters

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Quad

2.5 ms

S-XQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

MAX19506ETM+T

Analog Devices

Analog To Digital Converter

Industrial

No Lead

48

HVQCCN

Square

2

Yes

1.5 V

100 MHz

1

CMOS

8

0.1172 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

1.8/3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC48,.27SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-1.5 V

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

MAX11128ATI/V+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

16

Yes

3.65 V

1 MHz

1

AEC-Q100

12

2.5 μA

0.029296875 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.2SQ,20

0.02 in (0.5 mm)

125 °C (257 °F)

-300 mV

Serial

-40 °C (-40 °F)

Nickel Gold Palladium

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11045BETN+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

56

HVQCCN

Square

6

Yes

5.0166 V

250 kHz

1

BICMOS

16

0.0046 %

5 V

Offset Binary, 2's Complement Binary

3/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-5.0166 V

Parallel, Word

-40 °C (-40 °F)

Track

Quad

3 µs

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

0.315 in (8 mm)

MAX11138ATI+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

4

Yes

3.65 V

500 kHz

1

10

0.0391 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1377ATP+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

20

HVQCCN

Square

2

Yes

1.024 V

1.25 MHz

1

BICMOS

12

0.0305 %

3 V

Binary, 2's Complement Binary

3/3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC20,.20SQ,25

Analog to Digital Converters

0.026 in (0.65 mm)

125 °C (257 °F)

-1.024 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

800 ns

S-XQCC-N20

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11139ATI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

8

Yes

3.65 V

500 kHz

1

10

0.0391 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1437BETK+T

Analog Devices

Analog To Digital Converter

Industrial

No Lead

68

HVQCCN

Square

8

Yes

1.4 V

50 MHz

1

BICMOS

12

0.061 %

1.8 V

2's Complement Binary

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-1.4 V

Serial, Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

20 ns

S-XQCC-N68

3

0.031 in (0.8 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

0.394 in (10 mm)

MAX11140ATI+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

16

Yes

3.65 V

500 kHz

1

10

0.0391 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX12557ETK+D

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

68

HVQCCN

Square

1

Yes

65 MHz

2

CMOS

14

3.3 V

2's Complement Binary

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N68

3

0.031 in (0.8 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

0.394 in (10 mm)

MAX19516ETM+T

Analog Devices

Analog To Digital Converter

Industrial

No Lead

48

HVQCCN

Square

2

Yes

1.5 V

100 MHz

1

CMOS

10

0.078125 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC48,.27SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-1.5 V

Serial, Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

MAX1230BETI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

28

HVQCCN

Square

16

Yes

2.048 V

300 kHz

1

BICMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-2.048 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1275AETC+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

12

HVQCCN

Square

1

Yes

4.096 V

1.8 MHz

1

BICMOS

12

0.0244 %

5 V

2's Complement Binary

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC12,.16SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

556 ns

S-XQCC-N12

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0.157 in (4 mm)

MAX19191ETI/V+

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

28

HVQCCN

Square

1

Yes

512 mV

10 MHz

1

CMOS

AEC-Q100

8

0.3906 %

3 V

Offset Binary

1.8,3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-512 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11121ATI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

4

Yes

3.65 V

1 MHz

1

10

2.5 μA

0.0390625 %

3 V

2's Complement Binary

2.5/3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-300 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11143ATI+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

16

Yes

3.65 V

500 kHz

1

8

0.0586 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11122ATI+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

4

Yes

3.65 V

1 MHz

1

12

0.0244 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX19191ETI+

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

28

HVQCCN

Square

1

Yes

512 mV

10 MHz

1

CMOS

8

0.3906 %

3 V

Offset Binary

1.8,3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-512 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11047ETN+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

56

HVQCCN

Square

4

Yes

5.02 V

250 kHz

1

BICMOS

16

0.0031 %

5 V

Offset Binary, 2's Complement Binary

3/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

3 µs

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

MAX1122EGK

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

68

HVQCCN

Square

1

Yes

1.375 V

170 MHz

1

10

0.1465 %

1.8 V

Binary, Offset Binary, 2's Complement Binary

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

1.1 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Quad

S-XQCC-N68

3

0.035 in (0.9 mm)

0.394 in (10 mm)

No

e0

0.394 in (10 mm)

MAX11043ATL/V+T

Analog Devices

Analog To Digital Converter, Delta-Sigma

Automotive

No Lead

40

HVQCCN

Square

4

Yes

3.6 V

9.6 MHz

1

BICMOS

AEC-Q100

16

140 mA

0.0030517 %

3.3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC40,.24SQ,20

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

-40 °C (-40 °F)

Matte Tin - annealed

Quad

2.5 µs

S-XQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

MAX1224ETC+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

12

HVQCCN

Square

1

Yes

3.65 V

1.5 MHz

1

BICMOS

12

0.0366 %

3 V

Binary

3/3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC12,.16SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

667 ns

S-XQCC-N12

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

0.157 in (4 mm)

MAX19191ETI/V+T

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

28

HVQCCN

Square

1

Yes

512 mV

10 MHz

1

CMOS

AEC-Q100

8

0.3906 %

3 V

Offset Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-512 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

100 ns

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1123EGK+D

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

68

HVQCCN

Square

1

Yes

1.375 V

210 MHz

1

CMOS

10

0.1953 %

1.8 V

Binary, Offset Binary, 2's Complement Binary

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

1.1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N68

3

0.035 in (0.9 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

0.394 in (10 mm)

MAX1438BETK+

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

68

HVQCCN

Square

8

Yes

1.4 V

64 MHz

1

12

0.061 %

1.8 V

2's Complement Binary

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial, Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

15 ns

S-XQCC-N68

3

0.031 in (0.8 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

0.394 in (10 mm)

MAX11338ATJ+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

4

Yes

3.65 V

500 kHz

1

BICMOS

10

0.039 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11325ATJ+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

8

Yes

3.65 V

1 MHz

1

12

0.0244 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX19588ETN+TD

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

56

HVQCCN

Square

1

Yes

2.56 V

100 MHz

1

CMOS

16

3.3 V

2's Complement Binary

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

0.315 in (8 mm)

MAX11142ATI+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

8

Yes

3.65 V

500 kHz

1

8

0.0586 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1224ETC+

Analog Devices

Analog To Digital Converter

Industrial

No Lead

12

HVQCCN

Square

1

Yes

3.05 V

1.5 MHz

1

BICMOS

12

0.037 %

3 V

Binary

3/3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC12,.16SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

667 ns

S-XQCC-N12

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0.157 in (4 mm)

MAX11142ATI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

8

Yes

3.65 V

500 kHz

1

8

0.0586 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11337ATJ+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

16

Yes

3.65 V

500 kHz

1

BICMOS

12

0.0244 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Track

Quad

S-XQCC-N32

0.031 in (0.8 mm)

0.197 in (5 mm)

0.197 in (5 mm)

MAX11125ATI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

8

Yes

3.65 V

1 MHz

1

12

2.5 μA

0.024414063 %

3 V

2's Complement Binary

2.5/3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-300 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11139ATI+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

8

Yes

3.65 V

500 kHz

1

10

0.0391 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX12527ETK+D

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

68

HVQCCN

Square

1

Yes

65 MHz

2

CMOS

12

0.0269 %

3.3 V

2's Complement Binary

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N68

3

0.031 in (0.8 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

0.394 in (10 mm)

MAX11128ATI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

16

Yes

3.65 V

1 MHz

1

12

2.5 μA

0.024414063 %

3 V

2's Complement Binary

2.5/3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-300 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11253ATJ+T

Analog Devices

Analog To Digital Converter, Delta-Sigma

Automotive

No Lead

32

HVQCCN

Square

6

Yes

3.6 V

64 kHz

1

CMOS

16

0 %

3.6 V

2's Complement Binary

0 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1.5 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1087ETA

Analog Devices

Analog To Digital Converter

Industrial

No Lead

8

HVQCCN

Square

2

Yes

1.825 V

150 kHz

1

BICMOS

10

0.0977 %

3 V

2's Complement Binary

3/3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

SOLCC8,.12,25

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

-500 mV

Serial

-40 °C (-40 °F)

Tin Lead

Track

Quad

3.7 µs

S-XQCC-N8

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e0

0.118 in (3 mm)

MAX11045ETN+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

56

HVQCCN

Square

6

Yes

5 V

250 kHz

1

BICMOS

16

0.0031 %

5 V

Offset Binary, 2's Complement Binary

3/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

3 µs

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

MAX11284ETL+

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

No Lead

40

HVQCCN

Square

2

Yes

3.6 V

4 kHz

1

CMOS

24

0.0006 %

1.8 V

2's Complement Binary

-1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Quad

S-XQCC-N40

0.031 in (0.8 mm)

0.236 in (6 mm)

0.236 in (6 mm)

MAX1231BETI+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

28

HVQCCN

Square

16

Yes

1.26 V

300 kHz

1

BICMOS

12

0.0244 %

2.7 V

Binary, 2's Complement Binary

3/3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-1.24 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1383ATP+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

20

HVQCCN

Square

2

Yes

10 V

1.25 MHz

1

BICMOS

12

0.0366 %

5 V

Binary, 2's Complement Binary

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC20,.20SQ,25

Analog to Digital Converters

0.026 in (0.65 mm)

125 °C (257 °F)

-10 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

800 ns

S-XQCC-N20

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.