VFBGA Analog-to-Digital Converters 49

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD7689BCBZ-RL7

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

20

VFBGA

Square

Plastic/Epoxy

8

Yes

2.9 V

250 kHz

1

CMOS

16

0.0023 %

2.5 V

2's Complement Binary

2.5/5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA20,5X9,17/10

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

250 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

2.2 µs

S-PBGA-B20

1

0.022 in (0.56 mm)

0.094 in (2.39 mm)

No

e1

0.094 in (2.39 mm)

AD7682BCBZ-RL7

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

20

VFBGA

Square

Plastic/Epoxy

8

Yes

2.5 V

250 kHz

1

16

0.0023 %

5 V

2's Complement Binary

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-2.5 V

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

2.2 ms

S-PBGA-B20

1

0.022 in (0.56 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0.094 in (2.39 mm)

TLV320ADC3001IYZHT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

16

VFBGA

Square

Plastic/Epoxy

2

Yes

3.6 V

96 kHz

1

16

3.3 V

2's Complement Binary

1.8,3.3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA16,4X4,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

No

e1

30 s

260 °C (500 °F)

AD7699BCBZ-RL7

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

20

VFBGA

Square

Plastic/Epoxy

8

Yes

2.9 V

500 kHz

1

Bipolar

16

0.0038 %

5 V

Binary, 2's Complement Binary

Grid Array, Very Thin Profile, Fine Pitch

85 °C (185 °F)

-250 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

1.675 µs

S-PBGA-B20

1

0.022 in (0.56 mm)

0.094 in (2.39 mm)

e1

0.094 in (2.39 mm)

MAX11261ENX+

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

Ball

36

VFBGA

Square

Plastic/Epoxy

6

Yes

3.6 V

16 kHz

1

24

5.65 mA

0.0015 %

3.465 V

Offset Binary, 2's Complement Binary

Grid Array, Very Thin Profile, Fine Pitch

BGA36,6X6,16

0.016 in (0.4 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin/Silver/Copper/Nickel

Bottom

S-PBGA-B36

1

0.02 in (0.5 mm)

0.112 in (2.838 mm)

e2

30 s

260 °C (500 °F)

0.112 in (2.838 mm)

MAX11607EWC+

Maxim Integrated

Analog To Digital Converter, Proprietary Method

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

4

Yes

2.128 V

94.4 kHz

1

BICMOS

10

0.0977 %

3 V

Binary, 2's Complement Binary

3/3.3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA12,3X4,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

6.8 µs

R-PBGA-B12

1

0.027 in (0.69 mm)

0.074 in (1.885 mm)

No

e1

30 s

260 °C (500 °F)

0.087 in (2.215 mm)

MAX11607EWC+T

Maxim Integrated

Digital To Analog Converter

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

4

Yes

1.8 V

94.4 kHz

1

BICMOS

10

0.0977 %

2's Complement Binary

3/3.3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA12,3X4,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-500 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

6.8 µs

R-PBGA-B12

1

0.027 in (0.69 mm)

0.074 in (1.885 mm)

No

e1

30 s

260 °C (500 °F)

0.087 in (2.215 mm)

MAX11613EWC+

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

4

Yes

1.064 V

51 kHz

1

BICMOS

12

0.0244 %

3 V

Binary, 2's Complement Binary

3/3.3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA12,3X4,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

7.5 µs

R-PBGA-B12

1

0.027 in (0.69 mm)

0.074 in (1.885 mm)

No

e1

30 s

260 °C (500 °F)

0.087 in (2.215 mm)

MAX11613EWC+T

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

4

Yes

1.8 V

1

BICMOS

12

0.0244 %

3 V

2's Complement Binary

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

7.5 µs

R-PBGA-B12

1

0.027 in (0.69 mm)

0.074 in (1.885 mm)

e1

30 s

260 °C (500 °F)

0.087 in (2.215 mm)

AD4698BCBZ-RL7

Analog Devices

Analog To Digital Converter, Successive Approximation

Ball

36

VFBGA

Square

Plastic/Epoxy

8

Yes

2.6 V

1 MHz

1

16

0.003815 %

5 V

Binary, 2’s Complement Binary

Grid Array, Very Thin Profile, Fine Pitch

BGA36,6X6,20

0.02 in (0.5 mm)

125 °C (257 °F)

-2.4 V

Serial, Parallel, Word

-40 °C (-40 °F)

Bottom

415 ns

S-PBGA-B36

1

0.022 in (0.56 mm)

0.117 in (2.96 mm)

30 s

260 °C (500 °F)

0.117 in (2.96 mm)

ADS7066IYBHT

Texas Instruments

Analog To Digital Converter, Successive Approximation

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

8

Yes

5.5 V

250 kHz

1

16

1.56 mA

0.006103515625 %

3.3 V

Binary

Grid Array, Very Thin Profile, Fine Pitch

BGA16,4X4,16

1.65 V

0.016 in (0.4 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Sample

Bottom

3.2 µs

S-PBGA-B16

1

0.016 in (0.4 mm)

0.064 in (1.6205 mm)

e1

30 s

260 °C (500 °F)

0.064 in (1.6205 mm)

TLV320ADC3001IYZHR

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

16

VFBGA

Square

Plastic/Epoxy

2

Yes

3.6 V

96 kHz

1

16

3.3 V

2's Complement Binary

1.8,3.3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA16,4X4,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

No

e1

30 s

260 °C (500 °F)

TSC2003IZQCT

Texas Instruments

Analog To Digital Converter, Successive Approximation

Industrial

Ball

48

VFBGA

Square

Plastic/Epoxy

2

Yes

5.25 V

50 kHz

1

CMOS

12

0.0977 %

2.7 V

Binary

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Sample

Bottom

S-PBGA-B48

0.039 in (1 mm)

0.157 in (4 mm)

No

0.157 in (4 mm)

TSC2003IZQCR

Texas Instruments

Analog To Digital Converter, Successive Approximation

Industrial

Ball

48

VFBGA

Square

Plastic/Epoxy

2

Yes

5.25 V

50 kHz

1

CMOS

12

0.0977 %

2.7 V

Binary

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Sample

Bottom

S-PBGA-B48

2

0.039 in (1 mm)

0.157 in (4 mm)

No

e1

30 s

260 °C (500 °F)

0.157 in (4 mm)

PCM1870AYZFT

Texas Instruments

Analog To Digital Converter, Delta-Sigma

Industrial

Ball

24

VFBGA

Rectangular

2

Yes

2.828 V

50 kHz

1

16

3.3 V

2's Complement Binary

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

R-XBGA-B24

1

0.025 in (0.625 mm)

No

e1

260 °C (500 °F)

ADS7067IYBHR

Texas Instruments

Analog To Digital Converter, Successive Approximation

Ball

16

VFBGA

Rectangular

Plastic/Epoxy

8

Yes

5.5 V

800 kHz

1

16

2.8 mA

0.0061035 %

3.3 V

Binary

Grid Array, Very Thin Profile, Fine Pitch

BGA16,4X4,16

1.65 V

0.016 in (0.4 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Sample

Bottom

950 ns

S-PBGA-B16

1

0.016 in (0.4 mm)

0.064 in (1.6205 mm)

e1

260 °C (500 °F)

0.064 in (1.6205 mm)

XADS7067IYBHR

Texas Instruments

Analog To Digital Converter, Successive Approximation

Automotive

Ball

16

VFBGA

Rectangular

Plastic/Epoxy

8

Yes

5.5 V

800 kHz

1

16

2.8 mA

0.006103 %

3.3 V

Binary

Grid Array, Very Thin Profile, Fine Pitch

BGA16,4X4,16

1.65 V

0.016 in (0.4 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Sample

Bottom

950 ns

R-PBGA-B16

0.016 in (0.4 mm)

0.063 in (1.598 mm)

0.065 in (1.653 mm)

PCM1870AYZFR

Texas Instruments

Analog To Digital Converter, Delta-Sigma

Industrial

Ball

24

VFBGA

Rectangular

2

Yes

2.828 V

50 kHz

1

16

3.3 V

2's Complement Binary

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

R-XBGA-B24

1

0.025 in (0.625 mm)

No

e1

260 °C (500 °F)

ADS7067IYBHT

Texas Instruments

Analog To Digital Converter, Successive Approximation

Ball

16

VFBGA

Rectangular

Plastic/Epoxy

8

Yes

5.5 V

800 kHz

1

16

2.8 mA

0.0061035 %

3.3 V

Binary

Grid Array, Very Thin Profile, Fine Pitch

BGA16,4X4,16

1.65 V

0.016 in (0.4 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Sample

Bottom

950 ns

S-PBGA-B16

1

0.016 in (0.4 mm)

0.064 in (1.6205 mm)

e1

260 °C (500 °F)

0.064 in (1.6205 mm)

AD7699BCBZ-WP

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

20

VFBGA

Square

Plastic/Epoxy

8

Yes

2.9 V

500 kHz

1

Bipolar

16

0.0038 %

5 V

Binary, 2's Complement Binary

Grid Array, Very Thin Profile, Fine Pitch

85 °C (185 °F)

-250 mV

Serial

-40 °C (-40 °F)

Track

Bottom

1.675 µs

S-PBGA-B20

0.022 in (0.56 mm)

0.094 in (2.39 mm)

0.094 in (2.39 mm)

AD7889-1ACBZ-RL7

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

2

Yes

3.6 V

105 kHz

1

12

0.0732 %

2.6 V

Binary

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

R-PBGA-B12

1

0.026 in (0.65 mm)

0.059 in (1.505 mm)

No

30 s

260 °C (500 °F)

0.079 in (2.005 mm)

AD7889-1ACBZ-500R7

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

2

Yes

3.6 V

105 kHz

1

12

0.0732 %

2.6 V

Binary

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

R-PBGA-B12

1

0.026 in (0.65 mm)

0.059 in (1.505 mm)

No

30 s

260 °C (500 °F)

0.079 in (2.005 mm)

AD7889-1ACBZ-RL

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

2

Yes

3.6 V

105 kHz

1

12

0.0732 %

2.6 V

Binary

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

R-PBGA-B12

1

0.026 in (0.65 mm)

0.059 in (1.505 mm)

No

30 s

260 °C (500 °F)

0.079 in (2.005 mm)

AD7879ACBZ-RL

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

2

Yes

3.6 V

105 kHz

1

12

0.0732 %

2.6 V

Binary

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Track

Bottom

R-PBGA-B12

1

0.026 in (0.65 mm)

0.063 in (1.61 mm)

No

e3

0.079 in (2.01 mm)

AD7889ACBZ-RL

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

2

Yes

3.6 V

105 kHz

1

12

0.0732 %

2.6 V

Binary

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

R-PBGA-B12

1

0.026 in (0.65 mm)

0.059 in (1.505 mm)

No

30 s

260 °C (500 °F)

0.079 in (2.005 mm)

AD7889-1ACBZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

2

Yes

3.6 V

105 kHz

1

12

0.0732 %

2.6 V

Binary

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Track

Bottom

R-PBGA-B12

0.026 in (0.65 mm)

0.059 in (1.505 mm)

0.079 in (2.005 mm)

AD7879ACBZ-500R7

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

2

Yes

3.6 V

105 kHz

1

12

0.0732 %

2.6 V

Binary

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Track

Bottom

R-PBGA-B12

1

0.026 in (0.65 mm)

0.063 in (1.61 mm)

No

e3

0.079 in (2.01 mm)

AD7879-1ACBZ-500R7

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

2

Yes

3.6 V

105 kHz

1

12

0.0732 %

2.6 V

Binary

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Bottom

R-PBGA-B12

1

0.026 in (0.65 mm)

0.063 in (1.61 mm)

No

e3

0.079 in (2.01 mm)

AD7879-1ACBZ-RL

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

2

Yes

3.6 V

105 kHz

1

12

0.0732 %

2.6 V

Binary

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Track

Bottom

R-PBGA-B12

1

0.026 in (0.65 mm)

0.063 in (1.61 mm)

No

e3

0.079 in (2.01 mm)

AD7889ACBZ-500R7

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

2

Yes

3.6 V

105 kHz

1

12

0.0732 %

2.6 V

Binary

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

R-PBGA-B12

1

0.026 in (0.65 mm)

0.059 in (1.505 mm)

No

30 s

260 °C (500 °F)

0.079 in (2.005 mm)

AD4696BCBZ-RL7

Analog Devices

Analog To Digital Converter, Successive Approximation

Ball

32

VFBGA

Square

Plastic/Epoxy

16

Yes

5.75 V

1 MHz

1

16

0.003814697 %

5 V

Binary, 2's Complement Binary

Grid Array, Very Thin Profile, Fine Pitch

BGA36,6X6,20

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Bottom

415 ns

S-PBGA-B36

0.022 in (0.56 mm)

0.117 in (2.96 mm)

0.117 in (2.96 mm)

AD4695BCBZ-RL7

Analog Devices

Analog To Digital Converter, Successive Approximation

Ball

32

VFBGA

Square

Plastic/Epoxy

16

Yes

5.75 V

500 kHz

1

16

0.003814697 %

5 V

Binary, 2's Complement Binary

Grid Array, Very Thin Profile, Fine Pitch

BGA36,6X6,20

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Bottom

415 ns

S-PBGA-B36

0.022 in (0.56 mm)

0.117 in (2.96 mm)

0.117 in (2.96 mm)

MAX19777AZA+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

Ball

8

VFBGA

Rectangular

Plastic/Epoxy

2

Yes

3.3 V

3 MHz

1

CMOS

12

0.0488 %

Binary

Grid Array, Very Thin Profile, Fine Pitch

0.014 in (0.35 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper Nickel

Sample

Bottom

R-PBGA-B8

1

0.015 in (0.37 mm)

0.034 in (0.857 mm)

e2

30 s

260 °C (500 °F)

0.056 in (1.432 mm)

MAX11615EWE+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

16

VFBGA

Rectangular

Plastic/Epoxy

8

Yes

1.8 V

1

BICMOS

12

0.0244 %

3 V

2's Complement Binary

3/3.3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA16,4X4,16

Analog to Digital Converters

0.016 in (0.4 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper Nickel

Track

Bottom

7.5 µs

R-PBGA-B16

1

0.027 in (0.69 mm)

0.079 in (1.995 mm)

No

e2

30 s

260 °C (500 °F)

0.084 in (2.145 mm)

MAX11259AWX+

Analog Devices

Analog To Digital Converter, Delta-Sigma

Automotive

Ball

36

VFBGA

Square

Plastic/Epoxy

6

Yes

3.6 V

16 kHz

1

CMOS

24

6.2 mA

0.0015 %

3.6 V

Offset Binary, 2's Complement Binary

Grid Array, Very Thin Profile, Fine Pitch

BGA36,6X6,20

0.02 in (0.5 mm)

125 °C (257 °F)

-1.5 V

Serial

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

S-PBGA-B36

1

0.027 in (0.69 mm)

0.116 in (2.957 mm)

e2

30 s

260 °C (500 °F)

0.116 in (2.957 mm)

MAX11615EWE+T

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

16

VFBGA

Rectangular

Plastic/Epoxy

8

Yes

1.8 V

1

BICMOS

12

0.0244 %

3 V

2's Complement Binary

Grid Array, Very Thin Profile, Fine Pitch

0.016 in (0.4 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper Nickel

Track

Bottom

7.5 µs

R-PBGA-B16

1

0.027 in (0.69 mm)

0.079 in (1.995 mm)

e2

30 s

260 °C (500 °F)

0.084 in (2.145 mm)

MAX11647EWC+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

2

Yes

2.128 V

1 MHz

1

BICMOS

10

0.0977 %

3 V

Binary, 2's Complement Binary

3/3.3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA12,3X4,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

6.8 µs

R-PBGA-B12

1

0.027 in (0.69 mm)

0.074 in (1.885 mm)

No

e1

30 s

260 °C (500 °F)

0.087 in (2.215 mm)

MAX11645EWC+T

Analog Devices

Digital To Analog Converter

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

1

Yes

1.064 V

94.4 kHz

1

BICMOS

12

0.0244 %

3 V

2's Complement Binary

3/3.3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA12,3X4,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-1.064 V

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

7.5 µs

R-PBGA-B12

1

0.027 in (0.69 mm)

0.074 in (1.885 mm)

No

e1

30 s

260 °C (500 °F)

0.087 in (2.215 mm)

MAX11647EWC+T

Analog Devices

Digital To Analog Converter

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

1

Yes

1.064 V

94.4 kHz

1

BICMOS

12

0.0244 %

3 V

2's Complement Binary

3/3.3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA12,3X4,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-1.064 V

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

6.8 µs

R-PBGA-B12

1

0.027 in (0.69 mm)

0.074 in (1.885 mm)

No

e1

30 s

260 °C (500 °F)

0.087 in (2.215 mm)

MAX19777AZA+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

Ball

8

VFBGA

Rectangular

Plastic/Epoxy

2

Yes

3.3 V

3 MHz

1

CMOS

12

0.0488 %

Binary

Grid Array, Very Thin Profile, Fine Pitch

0.014 in (0.35 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper Nickel

Sample

Bottom

R-PBGA-B8

1

0.015 in (0.37 mm)

0.034 in (0.857 mm)

e2

30 s

260 °C (500 °F)

0.056 in (1.432 mm)

MAX11617EWE+T

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

16

VFBGA

Rectangular

Plastic/Epoxy

12

Yes

1.8 V

1

BICMOS

12

0.0244 %

3 V

2's Complement Binary

Grid Array, Very Thin Profile, Fine Pitch

0.016 in (0.4 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper Nickel

Track

Bottom

7.5 µs

R-PBGA-B16

1

0.027 in (0.69 mm)

0.079 in (1.995 mm)

e2

30 s

260 °C (500 °F)

0.084 in (2.145 mm)

MAX11259AWX+T

Analog Devices

Analog To Digital Converter, Delta-Sigma

Automotive

Ball

36

VFBGA

Square

Plastic/Epoxy

6

Yes

3.6 V

16 kHz

1

CMOS

24

6.2 mA

0 %

3.6 V

2's Complement Binary

0 V

Grid Array, Very Thin Profile, Fine Pitch

BGA36,6X6,20

0.02 in (0.5 mm)

125 °C (257 °F)

-1.5 V

Serial

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

S-PBGA-B36

1

0.027 in (0.69 mm)

0.116 in (2.957 mm)

e2

30 s

260 °C (500 °F)

0.116 in (2.957 mm)

MAX11645EWC+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

2

Yes

1.064 V

94.4 kHz

1

BICMOS

12

0.0244 %

3 V

Binary, 2's Complement Binary

3/3.3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA12,3X4,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

7.5 µs

R-PBGA-B12

1

0.027 in (0.69 mm)

0.074 in (1.885 mm)

No

e1

30 s

260 °C (500 °F)

0.087 in (2.215 mm)

MAX11617EWE+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

16

VFBGA

Rectangular

Plastic/Epoxy

12

Yes

1.8 V

1

BICMOS

12

0.0244 %

3 V

2's Complement Binary

3/3.3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA16,4X4,16

Analog to Digital Converters

0.016 in (0.4 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper Nickel

Track

Bottom

7.5 µs

R-PBGA-B16

1

0.027 in (0.69 mm)

0.079 in (1.995 mm)

No

e2

30 s

260 °C (500 °F)

0.084 in (2.145 mm)

AD4697BCBZ-RL7

Analog Devices

Analog To Digital Converter, Successive Approximation

Ball

36

VFBGA

Square

Plastic/Epoxy

8

Yes

2.6 V

500 kHz

1

16

0.003815 %

5 V

Binary, 2’s Complement Binary

Grid Array, Very Thin Profile, Fine Pitch

BGA36,6X6,20

0.02 in (0.5 mm)

125 °C (257 °F)

-2.4 V

Serial, Parallel, Word

-40 °C (-40 °F)

Bottom

415 ns

S-PBGA-B36

0.022 in (0.56 mm)

0.117 in (2.96 mm)

0.117 in (2.96 mm)

MAX11100EWC+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

1

Yes

5.25 V

200 kHz

1

BICMOS

16

0.0031 %

5 V

Binary

5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA12,3X4,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

240 µs

R-PBGA-B12

1

0.027 in (0.69 mm)

0.061 in (1.55 mm)

No

e1

30 s

260 °C (500 °F)

0.084 in (2.135 mm)

MAX11101EWC+T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Industrial

Ball

12

VFBGA

Rectangular

1

Yes

5.25 V

200 kHz

1

BICMOS

14

0.0061 %

5 V

Binary

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

240 µs

R-XBGA-B12

1

0.027 in (0.69 mm)

0.061 in (1.55 mm)

e1

30 s

260 °C (500 °F)

0.084 in (2.135 mm)

MAX11101EWC+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Industrial

Ball

12

VFBGA

Rectangular

1

Yes

5.25 V

200 kHz

1

BICMOS

14

0.0061 %

5 V

Binary

5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA12,3X4,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

240 µs

R-XBGA-B12

1

0.027 in (0.69 mm)

0.061 in (1.55 mm)

No

e1

30 s

260 °C (500 °F)

0.084 in (2.135 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.