Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Ball |
20 |
VFBGA |
Square |
Plastic/Epoxy |
8 |
Yes |
2.9 V |
250 kHz |
1 |
CMOS |
16 |
0.0023 % |
2.5 V |
2's Complement Binary |
2.5/5 V |
Grid Array, Very Thin Profile, Fine Pitch |
BGA20,5X9,17/10 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
250 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
2.2 µs |
S-PBGA-B20 |
1 |
0.022 in (0.56 mm) |
0.094 in (2.39 mm) |
No |
e1 |
0.094 in (2.39 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Ball |
20 |
VFBGA |
Square |
Plastic/Epoxy |
8 |
Yes |
2.5 V |
250 kHz |
1 |
16 |
0.0023 % |
5 V |
2's Complement Binary |
Grid Array, Very Thin Profile, Fine Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.5 V |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
2.2 ms |
S-PBGA-B20 |
1 |
0.022 in (0.56 mm) |
0.094 in (2.39 mm) |
e1 |
30 s |
260 °C (500 °F) |
0.094 in (2.39 mm) |
|||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
16 |
VFBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
3.6 V |
96 kHz |
1 |
16 |
3.3 V |
2's Complement Binary |
1.8,3.3 V |
Grid Array, Very Thin Profile, Fine Pitch |
BGA16,4X4,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B16 |
1 |
0.025 in (0.625 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Ball |
20 |
VFBGA |
Square |
Plastic/Epoxy |
8 |
Yes |
2.9 V |
500 kHz |
1 |
Bipolar |
16 |
0.0038 % |
5 V |
Binary, 2's Complement Binary |
Grid Array, Very Thin Profile, Fine Pitch |
85 °C (185 °F) |
-250 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
1.675 µs |
S-PBGA-B20 |
1 |
0.022 in (0.56 mm) |
0.094 in (2.39 mm) |
e1 |
0.094 in (2.39 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Ball |
36 |
VFBGA |
Square |
Plastic/Epoxy |
6 |
Yes |
3.6 V |
16 kHz |
1 |
24 |
5.65 mA |
0.0015 % |
3.465 V |
Offset Binary, 2's Complement Binary |
Grid Array, Very Thin Profile, Fine Pitch |
BGA36,6X6,16 |
0.016 in (0.4 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin/Silver/Copper/Nickel |
Bottom |
S-PBGA-B36 |
1 |
0.02 in (0.5 mm) |
0.112 in (2.838 mm) |
e2 |
30 s |
260 °C (500 °F) |
0.112 in (2.838 mm) |
|||||||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
12 |
VFBGA |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
2.128 V |
94.4 kHz |
1 |
BICMOS |
10 |
0.0977 % |
3 V |
Binary, 2's Complement Binary |
3/3.3 V |
Grid Array, Very Thin Profile, Fine Pitch |
BGA12,3X4,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
6.8 µs |
R-PBGA-B12 |
1 |
0.027 in (0.69 mm) |
0.074 in (1.885 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
0.087 in (2.215 mm) |
||||||||||
|
Maxim Integrated |
Digital To Analog Converter |
Industrial |
Ball |
12 |
VFBGA |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
1.8 V |
94.4 kHz |
1 |
BICMOS |
10 |
0.0977 % |
2's Complement Binary |
3/3.3 V |
Grid Array, Very Thin Profile, Fine Pitch |
BGA12,3X4,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-500 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
6.8 µs |
R-PBGA-B12 |
1 |
0.027 in (0.69 mm) |
0.074 in (1.885 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
0.087 in (2.215 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
12 |
VFBGA |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
1.064 V |
51 kHz |
1 |
BICMOS |
12 |
0.0244 % |
3 V |
Binary, 2's Complement Binary |
3/3.3 V |
Grid Array, Very Thin Profile, Fine Pitch |
BGA12,3X4,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
7.5 µs |
R-PBGA-B12 |
1 |
0.027 in (0.69 mm) |
0.074 in (1.885 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
0.087 in (2.215 mm) |
||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
12 |
VFBGA |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
1.8 V |
1 |
BICMOS |
12 |
0.0244 % |
3 V |
2's Complement Binary |
Grid Array, Very Thin Profile, Fine Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
7.5 µs |
R-PBGA-B12 |
1 |
0.027 in (0.69 mm) |
0.074 in (1.885 mm) |
e1 |
30 s |
260 °C (500 °F) |
0.087 in (2.215 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Ball |
36 |
VFBGA |
Square |
Plastic/Epoxy |
8 |
Yes |
2.6 V |
1 MHz |
1 |
16 |
0.003815 % |
5 V |
Binary, 2’s Complement Binary |
Grid Array, Very Thin Profile, Fine Pitch |
BGA36,6X6,20 |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-2.4 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Bottom |
415 ns |
S-PBGA-B36 |
1 |
0.022 in (0.56 mm) |
0.117 in (2.96 mm) |
30 s |
260 °C (500 °F) |
0.117 in (2.96 mm) |
||||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Automotive |
Ball |
16 |
VFBGA |
Square |
Plastic/Epoxy |
8 |
Yes |
5.5 V |
250 kHz |
1 |
16 |
1.56 mA |
0.006103515625 % |
3.3 V |
Binary |
Grid Array, Very Thin Profile, Fine Pitch |
BGA16,4X4,16 |
1.65 V |
0.016 in (0.4 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Sample |
Bottom |
3.2 µs |
S-PBGA-B16 |
1 |
0.016 in (0.4 mm) |
0.064 in (1.6205 mm) |
e1 |
30 s |
260 °C (500 °F) |
0.064 in (1.6205 mm) |
||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
16 |
VFBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
3.6 V |
96 kHz |
1 |
16 |
3.3 V |
2's Complement Binary |
1.8,3.3 V |
Grid Array, Very Thin Profile, Fine Pitch |
BGA16,4X4,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B16 |
1 |
0.025 in (0.625 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
|||||||||||||||||
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Industrial |
Ball |
48 |
VFBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
5.25 V |
50 kHz |
1 |
CMOS |
12 |
0.0977 % |
2.7 V |
Binary |
Grid Array, Very Thin Profile, Fine Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Sample |
Bottom |
S-PBGA-B48 |
0.039 in (1 mm) |
0.157 in (4 mm) |
No |
0.157 in (4 mm) |
||||||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Industrial |
Ball |
48 |
VFBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
5.25 V |
50 kHz |
1 |
CMOS |
12 |
0.0977 % |
2.7 V |
Binary |
Grid Array, Very Thin Profile, Fine Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Sample |
Bottom |
S-PBGA-B48 |
2 |
0.039 in (1 mm) |
0.157 in (4 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
0.157 in (4 mm) |
||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Ball |
24 |
VFBGA |
Rectangular |
2 |
Yes |
2.828 V |
50 kHz |
1 |
16 |
3.3 V |
2's Complement Binary |
Grid Array, Very Thin Profile, Fine Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin/Silver/Copper |
Bottom |
R-XBGA-B24 |
1 |
0.025 in (0.625 mm) |
No |
e1 |
260 °C (500 °F) |
|||||||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Ball |
16 |
VFBGA |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
5.5 V |
800 kHz |
1 |
16 |
2.8 mA |
0.0061035 % |
3.3 V |
Binary |
Grid Array, Very Thin Profile, Fine Pitch |
BGA16,4X4,16 |
1.65 V |
0.016 in (0.4 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Sample |
Bottom |
950 ns |
S-PBGA-B16 |
1 |
0.016 in (0.4 mm) |
0.064 in (1.6205 mm) |
e1 |
260 °C (500 °F) |
0.064 in (1.6205 mm) |
||||||||||||||
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Automotive |
Ball |
16 |
VFBGA |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
5.5 V |
800 kHz |
1 |
16 |
2.8 mA |
0.006103 % |
3.3 V |
Binary |
Grid Array, Very Thin Profile, Fine Pitch |
BGA16,4X4,16 |
1.65 V |
0.016 in (0.4 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Sample |
Bottom |
950 ns |
R-PBGA-B16 |
0.016 in (0.4 mm) |
0.063 in (1.598 mm) |
0.065 in (1.653 mm) |
||||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Ball |
24 |
VFBGA |
Rectangular |
2 |
Yes |
2.828 V |
50 kHz |
1 |
16 |
3.3 V |
2's Complement Binary |
Grid Array, Very Thin Profile, Fine Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin/Silver/Copper |
Bottom |
R-XBGA-B24 |
1 |
0.025 in (0.625 mm) |
No |
e1 |
260 °C (500 °F) |
|||||||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Ball |
16 |
VFBGA |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
5.5 V |
800 kHz |
1 |
16 |
2.8 mA |
0.0061035 % |
3.3 V |
Binary |
Grid Array, Very Thin Profile, Fine Pitch |
BGA16,4X4,16 |
1.65 V |
0.016 in (0.4 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Sample |
Bottom |
950 ns |
S-PBGA-B16 |
1 |
0.016 in (0.4 mm) |
0.064 in (1.6205 mm) |
e1 |
260 °C (500 °F) |
0.064 in (1.6205 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Ball |
20 |
VFBGA |
Square |
Plastic/Epoxy |
8 |
Yes |
2.9 V |
500 kHz |
1 |
Bipolar |
16 |
0.0038 % |
5 V |
Binary, 2's Complement Binary |
Grid Array, Very Thin Profile, Fine Pitch |
85 °C (185 °F) |
-250 mV |
Serial |
-40 °C (-40 °F) |
Track |
Bottom |
1.675 µs |
S-PBGA-B20 |
0.022 in (0.56 mm) |
0.094 in (2.39 mm) |
0.094 in (2.39 mm) |
||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Ball |
12 |
VFBGA |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
3.6 V |
105 kHz |
1 |
12 |
0.0732 % |
2.6 V |
Binary |
Grid Array, Very Thin Profile, Fine Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
R-PBGA-B12 |
1 |
0.026 in (0.65 mm) |
0.059 in (1.505 mm) |
No |
30 s |
260 °C (500 °F) |
0.079 in (2.005 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Ball |
12 |
VFBGA |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
3.6 V |
105 kHz |
1 |
12 |
0.0732 % |
2.6 V |
Binary |
Grid Array, Very Thin Profile, Fine Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
R-PBGA-B12 |
1 |
0.026 in (0.65 mm) |
0.059 in (1.505 mm) |
No |
30 s |
260 °C (500 °F) |
0.079 in (2.005 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Ball |
12 |
VFBGA |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
3.6 V |
105 kHz |
1 |
12 |
0.0732 % |
2.6 V |
Binary |
Grid Array, Very Thin Profile, Fine Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
R-PBGA-B12 |
1 |
0.026 in (0.65 mm) |
0.059 in (1.505 mm) |
No |
30 s |
260 °C (500 °F) |
0.079 in (2.005 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Ball |
12 |
VFBGA |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
3.6 V |
105 kHz |
1 |
12 |
0.0732 % |
2.6 V |
Binary |
Grid Array, Very Thin Profile, Fine Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Track |
Bottom |
R-PBGA-B12 |
1 |
0.026 in (0.65 mm) |
0.063 in (1.61 mm) |
No |
e3 |
0.079 in (2.01 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Ball |
12 |
VFBGA |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
3.6 V |
105 kHz |
1 |
12 |
0.0732 % |
2.6 V |
Binary |
Grid Array, Very Thin Profile, Fine Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
R-PBGA-B12 |
1 |
0.026 in (0.65 mm) |
0.059 in (1.505 mm) |
No |
30 s |
260 °C (500 °F) |
0.079 in (2.005 mm) |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Ball |
12 |
VFBGA |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
3.6 V |
105 kHz |
1 |
12 |
0.0732 % |
2.6 V |
Binary |
Grid Array, Very Thin Profile, Fine Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Track |
Bottom |
R-PBGA-B12 |
0.026 in (0.65 mm) |
0.059 in (1.505 mm) |
0.079 in (2.005 mm) |
||||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Ball |
12 |
VFBGA |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
3.6 V |
105 kHz |
1 |
12 |
0.0732 % |
2.6 V |
Binary |
Grid Array, Very Thin Profile, Fine Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Track |
Bottom |
R-PBGA-B12 |
1 |
0.026 in (0.65 mm) |
0.063 in (1.61 mm) |
No |
e3 |
0.079 in (2.01 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Ball |
12 |
VFBGA |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
3.6 V |
105 kHz |
1 |
12 |
0.0732 % |
2.6 V |
Binary |
Grid Array, Very Thin Profile, Fine Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Bottom |
R-PBGA-B12 |
1 |
0.026 in (0.65 mm) |
0.063 in (1.61 mm) |
No |
e3 |
0.079 in (2.01 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Ball |
12 |
VFBGA |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
3.6 V |
105 kHz |
1 |
12 |
0.0732 % |
2.6 V |
Binary |
Grid Array, Very Thin Profile, Fine Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Track |
Bottom |
R-PBGA-B12 |
1 |
0.026 in (0.65 mm) |
0.063 in (1.61 mm) |
No |
e3 |
0.079 in (2.01 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Ball |
12 |
VFBGA |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
3.6 V |
105 kHz |
1 |
12 |
0.0732 % |
2.6 V |
Binary |
Grid Array, Very Thin Profile, Fine Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
R-PBGA-B12 |
1 |
0.026 in (0.65 mm) |
0.059 in (1.505 mm) |
No |
30 s |
260 °C (500 °F) |
0.079 in (2.005 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Ball |
32 |
VFBGA |
Square |
Plastic/Epoxy |
16 |
Yes |
5.75 V |
1 MHz |
1 |
16 |
0.003814697 % |
5 V |
Binary, 2's Complement Binary |
Grid Array, Very Thin Profile, Fine Pitch |
BGA36,6X6,20 |
0.02 in (0.5 mm) |
125 °C (257 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Bottom |
415 ns |
S-PBGA-B36 |
0.022 in (0.56 mm) |
0.117 in (2.96 mm) |
0.117 in (2.96 mm) |
|||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Ball |
32 |
VFBGA |
Square |
Plastic/Epoxy |
16 |
Yes |
5.75 V |
500 kHz |
1 |
16 |
0.003814697 % |
5 V |
Binary, 2's Complement Binary |
Grid Array, Very Thin Profile, Fine Pitch |
BGA36,6X6,20 |
0.02 in (0.5 mm) |
125 °C (257 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Bottom |
415 ns |
S-PBGA-B36 |
0.022 in (0.56 mm) |
0.117 in (2.96 mm) |
0.117 in (2.96 mm) |
|||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Automotive |
Ball |
8 |
VFBGA |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
3.3 V |
3 MHz |
1 |
CMOS |
12 |
0.0488 % |
Binary |
Grid Array, Very Thin Profile, Fine Pitch |
0.014 in (0.35 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper Nickel |
Sample |
Bottom |
R-PBGA-B8 |
1 |
0.015 in (0.37 mm) |
0.034 in (0.857 mm) |
e2 |
30 s |
260 °C (500 °F) |
0.056 in (1.432 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Ball |
16 |
VFBGA |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
1.8 V |
1 |
BICMOS |
12 |
0.0244 % |
3 V |
2's Complement Binary |
3/3.3 V |
Grid Array, Very Thin Profile, Fine Pitch |
BGA16,4X4,16 |
Analog to Digital Converters |
0.016 in (0.4 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper Nickel |
Track |
Bottom |
7.5 µs |
R-PBGA-B16 |
1 |
0.027 in (0.69 mm) |
0.079 in (1.995 mm) |
No |
e2 |
30 s |
260 °C (500 °F) |
0.084 in (2.145 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Automotive |
Ball |
36 |
VFBGA |
Square |
Plastic/Epoxy |
6 |
Yes |
3.6 V |
16 kHz |
1 |
CMOS |
24 |
6.2 mA |
0.0015 % |
3.6 V |
Offset Binary, 2's Complement Binary |
Grid Array, Very Thin Profile, Fine Pitch |
BGA36,6X6,20 |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-1.5 V |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper Nickel |
Bottom |
S-PBGA-B36 |
1 |
0.027 in (0.69 mm) |
0.116 in (2.957 mm) |
e2 |
30 s |
260 °C (500 °F) |
0.116 in (2.957 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
16 |
VFBGA |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
1.8 V |
1 |
BICMOS |
12 |
0.0244 % |
3 V |
2's Complement Binary |
Grid Array, Very Thin Profile, Fine Pitch |
0.016 in (0.4 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper Nickel |
Track |
Bottom |
7.5 µs |
R-PBGA-B16 |
1 |
0.027 in (0.69 mm) |
0.079 in (1.995 mm) |
e2 |
30 s |
260 °C (500 °F) |
0.084 in (2.145 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Ball |
12 |
VFBGA |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
2.128 V |
1 MHz |
1 |
BICMOS |
10 |
0.0977 % |
3 V |
Binary, 2's Complement Binary |
3/3.3 V |
Grid Array, Very Thin Profile, Fine Pitch |
BGA12,3X4,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
6.8 µs |
R-PBGA-B12 |
1 |
0.027 in (0.69 mm) |
0.074 in (1.885 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
0.087 in (2.215 mm) |
||||||||||
|
Analog Devices |
Digital To Analog Converter |
Industrial |
Ball |
12 |
VFBGA |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
1.064 V |
94.4 kHz |
1 |
BICMOS |
12 |
0.0244 % |
3 V |
2's Complement Binary |
3/3.3 V |
Grid Array, Very Thin Profile, Fine Pitch |
BGA12,3X4,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.064 V |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
7.5 µs |
R-PBGA-B12 |
1 |
0.027 in (0.69 mm) |
0.074 in (1.885 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
0.087 in (2.215 mm) |
||||||||||
|
Analog Devices |
Digital To Analog Converter |
Industrial |
Ball |
12 |
VFBGA |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
1.064 V |
94.4 kHz |
1 |
BICMOS |
12 |
0.0244 % |
3 V |
2's Complement Binary |
3/3.3 V |
Grid Array, Very Thin Profile, Fine Pitch |
BGA12,3X4,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.064 V |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
6.8 µs |
R-PBGA-B12 |
1 |
0.027 in (0.69 mm) |
0.074 in (1.885 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
0.087 in (2.215 mm) |
||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Automotive |
Ball |
8 |
VFBGA |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
3.3 V |
3 MHz |
1 |
CMOS |
12 |
0.0488 % |
Binary |
Grid Array, Very Thin Profile, Fine Pitch |
0.014 in (0.35 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper Nickel |
Sample |
Bottom |
R-PBGA-B8 |
1 |
0.015 in (0.37 mm) |
0.034 in (0.857 mm) |
e2 |
30 s |
260 °C (500 °F) |
0.056 in (1.432 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
16 |
VFBGA |
Rectangular |
Plastic/Epoxy |
12 |
Yes |
1.8 V |
1 |
BICMOS |
12 |
0.0244 % |
3 V |
2's Complement Binary |
Grid Array, Very Thin Profile, Fine Pitch |
0.016 in (0.4 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper Nickel |
Track |
Bottom |
7.5 µs |
R-PBGA-B16 |
1 |
0.027 in (0.69 mm) |
0.079 in (1.995 mm) |
e2 |
30 s |
260 °C (500 °F) |
0.084 in (2.145 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Automotive |
Ball |
36 |
VFBGA |
Square |
Plastic/Epoxy |
6 |
Yes |
3.6 V |
16 kHz |
1 |
CMOS |
24 |
6.2 mA |
0 % |
3.6 V |
2's Complement Binary |
0 V |
Grid Array, Very Thin Profile, Fine Pitch |
BGA36,6X6,20 |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-1.5 V |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper Nickel |
Bottom |
S-PBGA-B36 |
1 |
0.027 in (0.69 mm) |
0.116 in (2.957 mm) |
e2 |
30 s |
260 °C (500 °F) |
0.116 in (2.957 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Ball |
12 |
VFBGA |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
1.064 V |
94.4 kHz |
1 |
BICMOS |
12 |
0.0244 % |
3 V |
Binary, 2's Complement Binary |
3/3.3 V |
Grid Array, Very Thin Profile, Fine Pitch |
BGA12,3X4,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
7.5 µs |
R-PBGA-B12 |
1 |
0.027 in (0.69 mm) |
0.074 in (1.885 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
0.087 in (2.215 mm) |
||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Ball |
16 |
VFBGA |
Rectangular |
Plastic/Epoxy |
12 |
Yes |
1.8 V |
1 |
BICMOS |
12 |
0.0244 % |
3 V |
2's Complement Binary |
3/3.3 V |
Grid Array, Very Thin Profile, Fine Pitch |
BGA16,4X4,16 |
Analog to Digital Converters |
0.016 in (0.4 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper Nickel |
Track |
Bottom |
7.5 µs |
R-PBGA-B16 |
1 |
0.027 in (0.69 mm) |
0.079 in (1.995 mm) |
No |
e2 |
30 s |
260 °C (500 °F) |
0.084 in (2.145 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Ball |
36 |
VFBGA |
Square |
Plastic/Epoxy |
8 |
Yes |
2.6 V |
500 kHz |
1 |
16 |
0.003815 % |
5 V |
Binary, 2’s Complement Binary |
Grid Array, Very Thin Profile, Fine Pitch |
BGA36,6X6,20 |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-2.4 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Bottom |
415 ns |
S-PBGA-B36 |
0.022 in (0.56 mm) |
0.117 in (2.96 mm) |
0.117 in (2.96 mm) |
|||||||||||||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Industrial |
Ball |
12 |
VFBGA |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5.25 V |
200 kHz |
1 |
BICMOS |
16 |
0.0031 % |
5 V |
Binary |
5 V |
Grid Array, Very Thin Profile, Fine Pitch |
BGA12,3X4,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
240 µs |
R-PBGA-B12 |
1 |
0.027 in (0.69 mm) |
0.061 in (1.55 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
0.084 in (2.135 mm) |
||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Industrial |
Ball |
12 |
VFBGA |
Rectangular |
1 |
Yes |
5.25 V |
200 kHz |
1 |
BICMOS |
14 |
0.0061 % |
5 V |
Binary |
Grid Array, Very Thin Profile, Fine Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
240 µs |
R-XBGA-B12 |
1 |
0.027 in (0.69 mm) |
0.061 in (1.55 mm) |
e1 |
30 s |
260 °C (500 °F) |
0.084 in (2.135 mm) |
|||||||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Industrial |
Ball |
12 |
VFBGA |
Rectangular |
1 |
Yes |
5.25 V |
200 kHz |
1 |
BICMOS |
14 |
0.0061 % |
5 V |
Binary |
5 V |
Grid Array, Very Thin Profile, Fine Pitch |
BGA12,3X4,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
240 µs |
R-XBGA-B12 |
1 |
0.027 in (0.69 mm) |
0.061 in (1.55 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
0.084 in (2.135 mm) |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.