Automotive Analog-to-Digital Converters 1,880

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

MAX11136ATI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

8

Yes

3.65 V

500 kHz

1

12

0.0244 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11115AUT+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

Gull Wing

6

LSSOP

Rectangular

Plastic/Epoxy

1

Yes

3.6 V

2 MHz

1

CMOS

8

0.0977 %

3 V

Binary

2.5/3.3 V

Small Outline, Low Profile, Shrink Pitch

TSOP6,.11,37

Analog to Digital Converters

0.037 in (0.95 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Dual

R-PDSO-G6

1

0.057 in (1.45 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0.114 in (2.9 mm)

MAX11131AUI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

Gull Wing

28

HTSSOP

Rectangular

Plastic/Epoxy

16

Yes

3.65 V

1

12

0.0244 %

3 V

2's Complement Binary

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

0.026 in (0.65 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Dual

R-PDSO-G28

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

e3

30 s

260 °C (500 °F)

0.382 in (9.7 mm)

MAX11108AVB+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

10

VQCCN

Rectangular

1

Yes

3.65 V

3 MHz

1

CMOS

12

0.0244 %

Binary

Chip Carrier, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Nickel Gold Palladium

Sample

Quad

R-XQCC-N10

1

0.02 in (0.5 mm)

0.063 in (1.6 mm)

30 s

260 °C (500 °F)

0.083 in (2.1 mm)

MAX11117AUT+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

Gull Wing

6

LSSOP

Rectangular

Plastic/Epoxy

1

Yes

3.6 V

3 MHz

1

CMOS

10

0.0977 %

3 V

Binary

2.5/3.3 V

Small Outline, Low Profile, Shrink Pitch

TSOP6,.11,37

Analog to Digital Converters

0.037 in (0.95 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Dual

R-PDSO-G6

1

0.057 in (1.45 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0.114 in (2.9 mm)

MAX11127ATI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

16

Yes

3.65 V

1 MHz

1

10

2.5 μA

0.0390625 %

3 V

2's Complement Binary

2.5/3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-300 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX186_EWP

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

20

SOP

Rectangular

Plastic/Epoxy

1

Yes

4.116 V

133 kHz

1

12

5 V

Binary, 2's Complement Binary

-5 V

Small Outline

85 °C (185 °F)

-4.116 V

Serial

-40 °C (-40 °F)

Track

Dual

10 µs

R-PDSO-G20

MAX11123ATI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

8

Yes

3.65 V

1 MHz

1

8

2.5 μA

0.05859375 %

3 V

2's Complement Binary

2.5/3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-300 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11128ATI/V+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

16

Yes

3.65 V

1 MHz

1

AEC-Q100

12

2.5 μA

0.029296875 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.2SQ,20

0.02 in (0.5 mm)

125 °C (257 °F)

-300 mV

Serial

-40 °C (-40 °F)

Nickel Gold Palladium

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11325ATJ+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

8

Yes

3.65 V

1 MHz

1

12

0.0244 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11127ATI+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

16

Yes

3.65 V

1 MHz

1

10

0.0391 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

0.197 in (5 mm)

MAX11102ATB+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

10

HVSON

Square

Plastic/Epoxy

2

Yes

3.65 V

2 MHz

1

CMOS

12

0.0244 %

Binary

Small Outline, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0.118 in (3 mm)

MAX11663AUT+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

Gull Wing

6

LSSOP

Rectangular

Plastic/Epoxy

1

Yes

3.6 V

500 kHz

1

CMOS

10

0.0488 %

Binary

2.5/3.3 V

Small Outline, Low Profile, Shrink Pitch

TSOP6,.11,37

Analog to Digital Converters

0.037 in (0.95 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Dual

2 µs

R-PDSO-G6

1

0.057 in (1.45 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0.114 in (2.9 mm)

MAX11666AUB/V+T

Analog Devices

Analog To Digital Converter

Automotive

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

2

Yes

3.65 V

500 kHz

1

CMOS

AEC-Q100

12

0.0244 %

Binary

2.5/3.3 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.118 in (3 mm)

MAX11328ATJ+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

16

Yes

3.65 V

1 MHz

1

12

0.0244 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11103ATB+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

10

HVSON

Square

Plastic/Epoxy

2

Yes

3.65 V

3 MHz

1

CMOS

12

0.0244 %

Binary

Small Outline, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0.118 in (3 mm)

MAX11137ATI+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

16

Yes

3.65 V

500 kHz

1

12

0.0244 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11123ATI+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

8

Yes

3.65 V

1 MHz

1

8

0.0586 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11105AUT+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

Gull Wing

6

LSSOP

Rectangular

Plastic/Epoxy

1

Yes

3.6 V

2 MHz

1

CMOS

12

0.0244 %

3 V

Binary

2.5/3.3 V

Small Outline, Low Profile, Shrink Pitch

TSOP6,.11,37

Analog to Digital Converters

0.037 in (0.95 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Dual

R-PDSO-G6

1

0.057 in (1.45 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0.114 in (2.9 mm)

MAX11103AUB+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

2

Yes

3.65 V

3 MHz

1

CMOS

12

0.0244 %

3 V

Binary

2.5/3.3 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.118 in (3 mm)

MAX11135ATI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

4

Yes

3.65 V

500 kHz

1

12

0.0244 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11122ATI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

4

Yes

3.65 V

1 MHz

1

12

2.5 μA

0.024414063 %

3 V

2's Complement Binary

2.5/3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-300 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11137ATI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

16

Yes

3.65 V

500 kHz

1

12

0.0244 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11138ATI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

4

Yes

3.65 V

500 kHz

1

10

0.0391 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11663AUT+T

Analog Devices

Analog To Digital Converter

Automotive

Gull Wing

6

LSSOP

Rectangular

Plastic/Epoxy

1

Yes

3.6 V

500 kHz

1

CMOS

10

0.0488 %

Binary

2.5/3.3 V

Small Outline, Low Profile, Shrink Pitch

TSOP6,.11,37

Analog to Digital Converters

0.037 in (0.95 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Dual

R-PDSO-G6

1

0.057 in (1.45 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0.114 in (2.9 mm)

MAX11259AWX+

Analog Devices

Analog To Digital Converter, Delta-Sigma

Automotive

Ball

36

VFBGA

Square

Plastic/Epoxy

6

Yes

3.6 V

16 kHz

1

CMOS

24

6.2 mA

0.0015 %

3.6 V

Offset Binary, 2's Complement Binary

Grid Array, Very Thin Profile, Fine Pitch

BGA36,6X6,20

0.02 in (0.5 mm)

125 °C (257 °F)

-1.5 V

Serial

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

S-PBGA-B36

1

0.027 in (0.69 mm)

0.116 in (2.957 mm)

e2

30 s

260 °C (500 °F)

0.116 in (2.957 mm)

MAX11664AUB+T

Analog Devices

Analog To Digital Converter

Automotive

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

2

Yes

3.65 V

500 kHz

1

CMOS

10

0.0488 %

Binary

2.5/3.3 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.118 in (3 mm)

MAX11108AVB+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

10

VQCCN

Rectangular

1

Yes

3.65 V

3 MHz

1

CMOS

12

0.0244 %

Binary

2.5/3.3 V

Chip Carrier, Very Thin Profile

LCC10,.06X.08,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Nickel Gold Palladium

Sample

Quad

333.3 ns

R-XQCC-N10

1

0.02 in (0.5 mm)

0.063 in (1.6 mm)

No

30 s

260 °C (500 °F)

0.083 in (2.1 mm)

MAX11331ATJ+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

8

Yes

3.65 V

3 MHz

1

BICMOS

12

6.5 mA

0.0244140625 %

3 V

Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11121ATI+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

4

Yes

3.65 V

1 MHz

1

10

0.0391 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Track

Quad

S-XQCC-N28

0.031 in (0.8 mm)

0.197 in (5 mm)

0.197 in (5 mm)

MAX11661AUT+T

Analog Devices

Analog To Digital Converter

Automotive

Gull Wing

6

LSSOP

Rectangular

Plastic/Epoxy

1

Yes

3.6 V

500 kHz

1

CMOS

8

0.0977 %

Binary

2.5/3.3 V

Small Outline, Low Profile, Shrink Pitch

TSOP6,.11,37

Analog to Digital Converters

0.037 in (0.95 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Dual

R-PDSO-G6

1

0.057 in (1.45 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0.114 in (2.9 mm)

MAX11131AUI+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

Gull Wing

28

HTSSOP

Rectangular

Plastic/Epoxy

16

Yes

3.65 V

3 MHz

1

12

0.0244 %

3 V

2's Complement Binary

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

0.026 in (0.65 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Dual

R-PDSO-G28

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

e3

30 s

260 °C (500 °F)

0.382 in (9.7 mm)

MAX11322ATJ+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

4

Yes

3.65 V

1 MHz

1

12

0.0244 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11195ATE+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

16

HVQCCN

Rectangular

2

Yes

5.15 V

2 MHz

1

14

0.0061 %

5 V

Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-2.5 V

Serial

-40 °C (-40 °F)

Nickel Gold Palladium

Quad

R-XQCC-N16

1

0.031 in (0.8 mm)

0.079 in (2 mm)

30 s

260 °C (500 °F)

0.118 in (3 mm)

MAX11102AUB+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

2

Yes

3.65 V

2 MHz

1

CMOS

12

0.0244 %

3 V

Binary

2.5/3.3 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.118 in (3 mm)

MAX11335ATJ+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

4

Yes

3.65 V

500 kHz

1

BICMOS

12

0.0244 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11192ATE+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

16

HVQCCN

Rectangular

2

Yes

5.15 V

2 MHz

1

12

0.0122 %

5 V

Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-2.5 V

Serial

-40 °C (-40 °F)

Nickel Gold Palladium

Quad

R-XQCC-N16

1

0.031 in (0.8 mm)

0.079 in (2 mm)

30 s

260 °C (500 °F)

0.118 in (3 mm)

MAX11102AUB+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

2

Yes

3.65 V

2 MHz

1

CMOS

12

0.0244 %

Binary

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0.118 in (3 mm)

MAX188_EAP

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

20

SSOP

Rectangular

Plastic/Epoxy

1

Yes

4.116 V

133 kHz

1

12

5 V

Binary, 2's Complement Binary

-5 V

Small Outline, Shrink Pitch

85 °C (185 °F)

-4.116 V

Serial

-40 °C (-40 °F)

Track

Dual

10 µs

R-PDSO-G20

MAX11135ATI+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

4

Yes

3.65 V

500 kHz

1

12

0.0244 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11128ATI+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

16

Yes

3.65 V

1 MHz

1

12

0.0244 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11195ATE+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

16

HVQCCN

Rectangular

2

Yes

5.15 V

2 MHz

1

14

0.0061 %

5 V

Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-2.5 V

Serial

-40 °C (-40 °F)

Nickel Gold Palladium

Quad

R-XQCC-N16

1

0.031 in (0.8 mm)

0.079 in (2 mm)

30 s

260 °C (500 °F)

0.118 in (3 mm)

MAX11190ATE+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

16

HVQCCN

Square

4

Yes

3.65 V

3 MHz

1

CMOS

12

6.8 mA

0.0244 %

3 V

Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Quad

S-XQCC-N16

3

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0.118 in (3 mm)

MAX11664AUB+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

2

Yes

3.65 V

500 kHz

1

CMOS

10

0.0488 %

Binary

2.5/3.3 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Dual

2 µs

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.118 in (3 mm)

MAX11338ATJ+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

4

Yes

3.65 V

500 kHz

1

BICMOS

10

0.039 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11126ATI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

16

Yes

3.65 V

1 MHz

1

8

2.5 μA

0.05859375 %

3 V

2's Complement Binary

2.5/3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-300 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11340ATJ+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

16

Yes

3.65 V

500 kHz

1

BICMOS

10

0.039 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11661AUT+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

Gull Wing

6

LSSOP

Rectangular

Plastic/Epoxy

1

Yes

3.6 V

500 kHz

1

CMOS

8

0.0977 %

Binary

2.5/3.3 V

Small Outline, Low Profile, Shrink Pitch

TSOP6,.11,37

Analog to Digital Converters

0.037 in (0.95 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Dual

2 µs

R-PDSO-G6

1

0.057 in (1.45 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0.114 in (2.9 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.