Automotive Analog-to-Digital Converters 1,880

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

MAX11136ATI+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

8

Yes

3.65 V

500 kHz

1

12

0.0244 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1383ATP+T

Analog Devices

Digital To Analog Converter

Automotive

No Lead

20

HVQCCN

Square

2

Yes

10 V

1.25 MHz

1

BICMOS

12

0.0366 %

5 V

Binary

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC20,.20SQ,25

Analog to Digital Converters

0.026 in (0.65 mm)

125 °C (257 °F)

-10 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N20

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11335ATJ+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

4

Yes

3.65 V

500 kHz

1

BICMOS

12

0.0244 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1379ATP+T

Analog Devices

Digital To Analog Converter

Automotive

No Lead

20

HVQCCN

Square

2

Yes

2.65 V

1.25 MHz

1

BICMOS

12

0.0305 %

5 V

Binary, 2's Complement Binary

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC20,.20SQ,25

Analog to Digital Converters

0.026 in (0.65 mm)

125 °C (257 °F)

-500 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N20

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1377ATP+T

Analog Devices

Digital To Analog Converter

Automotive

No Lead

20

HVQCCN

Square

2

Yes

1.825 V

1.25 MHz

1

BICMOS

12

0.0305 %

3 V

Binary, 2's Complement Binary

3/3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC20,.20SQ,25

Analog to Digital Converters

0.026 in (0.65 mm)

125 °C (257 °F)

-500 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

S-XQCC-N20

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1379ATP+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

20

HVQCCN

Square

2

Yes

2.048 V

1.25 MHz

1

BICMOS

12

0.0305 %

5 V

Binary, 2's Complement Binary

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC20,.20SQ,25

Analog to Digital Converters

0.026 in (0.65 mm)

125 °C (257 °F)

-2.048 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

800 ns

S-XQCC-N20

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MC145053P

NXP Semiconductors

Analog To Digital Converter, Successive Approximation

Automotive

Through-Hole

14

DIP

Rectangular

Plastic/Epoxy

5

No

5.6 V

20.4 kHz

1

CMOS

10

0.0977 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-100 mV

Serial

-40 °C (-40 °F)

Sample

Dual

44 µs

R-PDIP-T14

0.185 in (4.69 mm)

0.3 in (7.62 mm)

0.743 in (18.86 mm)

MC145053D

NXP Semiconductors

Analog To Digital Converter, Successive Approximation

Automotive

Gull Wing

14

SOP

Rectangular

Plastic/Epoxy

5

Yes

5.6 V

20.4 kHz

1

CMOS

10

2.5 mA

0.09765 %

5 V

Binary

Small Outline

SOP14,.25

0.05 in (1.27 mm)

125 °C (257 °F)

-100 mV

Serial

-40 °C (-40 °F)

Sample

Dual

44 µs

R-PDSO-G14

0.069 in (1.75 mm)

0.154 in (3.9 mm)

0.341 in (8.65 mm)

MC145050P

NXP Semiconductors

Analog To Digital Converter, Successive Approximation

Automotive

Through-Hole

14

DIP

Rectangular

Plastic/Epoxy

11

No

5.6 V

26.316 kHz

1

CMOS

10

0.0977 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-100 mV

Serial

-40 °C (-40 °F)

Sample

Dual

88 µs

R-PDIP-T14

0.18 in (4.57 mm)

0.3 in (7.62 mm)

1.04 in (26.415 mm)

MC145051DW

NXP Semiconductors

Analog To Digital Converter, Successive Approximation

Automotive

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

11

Yes

5.6 V

20.4 kHz

1

CMOS

10

50 mA

0.09765625 %

5 V

Binary

Small Outline

SOP20,.4

0.05 in (1.27 mm)

125 °C (257 °F)

-100 mV

Serial

-40 °C (-40 °F)

Sample

Dual

44 µs

R-PDSO-G20

0.104 in (2.65 mm)

0.295 in (7.5 mm)

0.504 in (12.8 mm)

MC145051P

NXP Semiconductors

Analog To Digital Converter, Successive Approximation

Automotive

Through-Hole

14

DIP

Rectangular

Plastic/Epoxy

11

No

5.6 V

20.4 kHz

1

CMOS

10

2.5 mA

0.09765 %

5 V

Binary

In-Line

DIP14,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-100 mV

Serial

-40 °C (-40 °F)

Sample

Dual

44 µs

R-PDIP-T14

0.18 in (4.57 mm)

0.3 in (7.62 mm)

1.04 in (26.415 mm)

MC145050DW

NXP Semiconductors

Analog To Digital Converter, Successive Approximation

Automotive

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

11

Yes

5.6 V

38 kHz

1

CMOS

10

50 mA

0.09765625 %

5 V

Binary

Small Outline

SOP20,.4

0.05 in (1.27 mm)

125 °C (257 °F)

-100 mV

Serial

-40 °C (-40 °F)

Sample

Dual

21 µs

R-PDSO-G20

0.104 in (2.65 mm)

0.295 in (7.5 mm)

0.504 in (12.8 mm)

SDA0810B

Infineon Technologies

Automotive

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

8

No

5 V

CMOS

10

0.05 %

5 V

Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDIP-T28

No

e0

SDA0808B

Infineon Technologies

Automotive

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

8

No

5 V

CMOS

8

0.2 %

5 V

Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDIP-T28

No

e0

MAX11124ATI+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

8

Yes

3.65 V

1 MHz

1

10

2.5 μA

0.0390625 %

3 V

2's Complement Binary

2.5/3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-300 mV

Serial

-40 °C (-40 °F)

Matte Tin

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11110AUT+T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Automotive

Gull Wing

6

LSSOP

Rectangular

Plastic/Epoxy

1

Yes

3.6 V

2 MHz

1

CMOS

10

0.0977 %

Binary

Small Outline, Low Profile, Shrink Pitch

0.037 in (0.95 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

R-PDSO-G6

1

0.057 in (1.45 mm)

0.064 in (1.625 mm)

e3

30 s

260 °C (500 °F)

0.114 in (2.9 mm)

MAX11141ATI+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

4

Yes

3.65 V

500 kHz

1

8

0.0586 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11124ATI+T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

8

Yes

3.65 V

1 MHz

1

10

0.0391 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11339ATJ+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

8

Yes

3.65 V

500 kHz

1

BICMOS

10

0.039 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11106ATB+T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

10

HVSON

Square

Plastic/Epoxy

2

Yes

3.65 V

3 MHz

1

CMOS

10

0.039 %

Binary

Small Outline, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0.118 in (3 mm)

MAX11120ATI+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

4

Yes

3.65 V

1 MHz

1

8

2.5 μA

0.05859375 %

3 V

2's Complement Binary

2.5/3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-300 mV

Serial

-40 °C (-40 °F)

Matte Tin

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11324ATJ+T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

8

Yes

3.65 V

1 MHz

1

10

0.0391 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11106ATB+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

10

HVSON

Square

Plastic/Epoxy

2

Yes

3.65 V

3 MHz

1

CMOS

10

0.0391 %

3 V

Binary

2.5/3.3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.11,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.118 in (3 mm)

MAX11130ATI+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

8

Yes

3.6 V

3 MHz

1

10

0.0391 %

3 V

Binary, 2's Complement Binary

1.8/3.3,2.5/3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Track

Quad

333 ns

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11130ATI+T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

8

Yes

3.65 V

3 MHz

1

10

0.0391 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11324ATJ+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

8

Yes

3.65 V

1 MHz

1

10

0.039 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11336ATJ+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

8

Yes

3.65 V

500 kHz

1

BICMOS

12

0.0244 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11129ATI+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

16

Yes

3.6 V

3 MHz

1

10

0.0391 %

3 V

Binary, 2's Complement Binary

1.8/3.3,2.5/3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Track

Quad

333 ns

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11327ATJ+T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

16

Yes

3.65 V

1 MHz

1

10

0.0391 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11321ATJ+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

4

Yes

3.65 V

1 MHz

1

10

0.039 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11321ATJ+T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

4

Yes

3.65 V

1 MHz

1

10

0.0391 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11327ATJ+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

16

Yes

3.65 V

1 MHz

1

10

0.039 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11120ATI+T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

4

Yes

3.65 V

1 MHz

1

8

0.0586 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11339ATJ+T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

8

Yes

3.65 V

500 kHz

1

BICMOS

10

0.039 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11336ATJ+T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

32

HVQCCN

Square

8

Yes

3.65 V

500 kHz

1

BICMOS

12

0.0244 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin

Track

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11110AUT+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Automotive

Gull Wing

6

LSSOP

Rectangular

Plastic/Epoxy

1

Yes

3.6 V

2 MHz

1

CMOS

10

0.0977 %

3 V

Binary

2.5/3.3 V

Small Outline, Low Profile, Shrink Pitch

TSOP6,.11,37

Analog to Digital Converters

0.037 in (0.95 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

R-PDSO-G6

1

0.057 in (1.45 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0.114 in (2.9 mm)

MAX11129ATI+T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

16

Yes

3.65 V

3 MHz

1

10

0.0391 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX11141ATI+T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

4

Yes

3.65 V

500 kHz

1

8

0.0586 %

3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-40 °C (-40 °F)

Matte Tin

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

R06PM0013EJ0111

Renesas Electronics

Analog To Digital Converter, Successive Approximation

Automotive

14

1.95 V

2 MHz

1

12

0.097656 %

1.8 V

Binary

125 °C (257 °F)

0 mV

-40 °C (-40 °F)

ISL26312FVZ-T7A

Renesas Electronics

Analog To Digital Converter, Successive Approximation

Automotive

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

2

Yes

5.25 V

125 kHz

1

12

3 mA

0.017089 %

5 V

2's Complement Binary

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

0.026 in (0.65 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

2

0.047 in (1.2 mm)

0.173 in (4.4 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

ISL26315FVZ

Renesas Electronics

Analog To Digital Converter, Successive Approximation

Automotive

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

4

Yes

5.25 V

125 kHz

1

12

3 mA

0.017089 %

Offset Binary

Small Outline, Thin Profile, Shrink Pitch

TSOP16,.25

0.026 in (0.65 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

2

0.047 in (1.2 mm)

0.173 in (4.4 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

ISL26313FBZ-T7

Renesas Electronics

Analog To Digital Converter, Successive Approximation

Automotive

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

2

Yes

125 mV

125 kHz

1

12

0.017089 %

5 V

Binary, 2's Complement Binary

Small Outline

SOP8,.25

0.05 in (1.27 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

2

0.069 in (1.75 mm)

0.154 in (3.9 mm)

e3

30 s

260 °C (500 °F)

0.193 in (4.9 mm)

ISL26320FBZ-T7

Renesas Electronics

Analog To Digital Converter, Successive Approximation

Automotive

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

1

Yes

5 V

250 kHz

1

12

0.017089 %

5 V

2's Complement Binary

Small Outline

SOP8,.25

0.05 in (1.27 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

R-PDSO-G8

2

0.069 in (1.75 mm)

0.154 in (3.9 mm)

e3

30 s

260 °C (500 °F)

0.193 in (4.9 mm)

ISL26320FBZ

Renesas Electronics

Analog To Digital Converter, Successive Approximation

Automotive

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

1

Yes

5 V

250 kHz

1

12

0.017089 %

5 V

2's Complement Binary

Small Outline

SOP8,.25

0.05 in (1.27 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

R-PDSO-G8

3

0.069 in (1.75 mm)

0.154 in (3.9 mm)

e3

30 s

260 °C (500 °F)

0.193 in (4.9 mm)

ISL26312FVZ-T

Renesas Electronics

Analog To Digital Converter, Successive Approximation

Automotive

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

2

Yes

125 mV

125 kHz

1

12

0.017089 %

5 V

Binary, 2's Complement Binary

Small Outline, Thin Profile, Shrink Pitch

TSOP16,.25

0.026 in (0.65 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

2

0.047 in (1.2 mm)

0.173 in (4.4 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

R06PM0015EJ0110

Renesas Electronics

Analog To Digital Converter, Successive Approximation

Automotive

1

3.6 V

2.5 MHz

1

12

0.0488 %

3.3 V

Binary

125 °C (257 °F)

0 mV

-40 °C (-40 °F)

ISL26319FVZ

Renesas Electronics

Analog To Digital Converter, Successive Approximation

Automotive

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

8

Yes

5.25 V

125 kHz

1

12

3 mA

0.017089 %

Offset Binary

Small Outline, Thin Profile, Shrink Pitch

TSOP16,.25

0.026 in (0.65 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

2

0.047 in (1.2 mm)

0.173 in (4.4 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

ISL26321FBZ-T7

Renesas Electronics

Analog To Digital Converter, Successive Approximation

Automotive

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

1

Yes

5 V

250 kHz

1

12

0.017089 %

5 V

Binary

Small Outline

SOP8,.25

0.05 in (1.27 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

R-PDSO-G8

2

0.069 in (1.75 mm)

0.154 in (3.9 mm)

e3

30 s

260 °C (500 °F)

0.193 in (4.9 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.