No Lead Analog-to-Digital Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

LTC2295IUP#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

2

Yes

1 V

10 MHz

1

CMOS

14

0.0305 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-500 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC2216IUP#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

2.75 V

80 MHz

1

CMOS

16

0.0053 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

AD7690BCPZRL

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

1

Yes

5.55 V

400 kHz

1

CMOS

18

0.0006 %

5 V

2's Complement Binary

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.11,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-500 mV

Serial

-40 °C (-40 °F)

Matte Tin

Track

Dual

2.5 µs

S-PDSO-N10

3

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

260 °C (500 °F)

0.118 in (3 mm)

LTC2450CDC#PBF

Analog Devices

Analog To Digital Converter, Delta-Sigma

Commercial

No Lead

6

HVSON

Square

Plastic/Epoxy

1

Yes

5.5 V

1

CMOS

16

0.0153 %

3 V

Binary

Small Outline, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Matte Tin - annealed

Dual

42 ms

S-PDSO-N6

1

0.031 in (0.8 mm)

0.079 in (2 mm)

No

e3

30 s

260 °C (500 °F)

0.079 in (2 mm)

AD9058CHIPS

Analog Devices

Analog To Digital Converter, Proprietary Method

No Lead

42

DIE

Rectangular

1

Yes

1 V

50 MHz

2

8

5 V

Binary

-5 V

Uncased Chip

-1 V

Parallel, 8 Bits

Tin Lead

Upper

R-XUUC-N42

No

e0

LTC2389CUK-18#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

4.116 V

2.5 MHz

1

CMOS

18

0.0011 %

5 V

Binary, Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-4.076 V

Serial, Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

310 ns

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

AD9648BCPZRL7-105

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

64

HVQCCN

Square

2

Yes

2 V

105 MHz

1

CMOS

14

0.014 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Matte Tin

Quad

9.52 ns

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

0.354 in (9 mm)

LTC2376CDE-18#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

16

HVSON

Rectangular

Plastic/Epoxy

1

Yes

5.1 V

250 kHz

1

CMOS

18

0.0007 %

2.5 V

2's Complement Binary

Small Outline, Heat Sink/Slug, Very Thin Profile

0.018 in (0.45 mm)

70 °C (158 °F)

-2.5 V

Serial

0 °C (32 °F)

Matte Tin

Dual

3 µs

R-PDSO-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.157 in (4 mm)

AD7938

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

32

VQCCN

Square

8

Yes

2.5 V

1.5 MHz

1

12

0.0244 %

3 V

Binary, 2's Complement Binary

3/5 V

Chip Carrier, Very Thin Profile

LCC32,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Quad

S-XQCC-N32

0.035 in (0.9 mm)

0.197 in (5 mm)

No

e0

0.197 in (5 mm)

5962-87762022A

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

2.46 V

1

BICMOS

8

7 mA

5 V

Binary

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Quad

15 µs

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

LTC2367IDE-18#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

16

HVSON

Rectangular

Plastic/Epoxy

1

Yes

5.1 V

500 kHz

1

CMOS

18

0.001 %

2.5 V

Binary

Small Outline, Heat Sink/Slug, Very Thin Profile

0.018 in (0.45 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Dual

1.5 µs

R-PDSO-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0.157 in (4 mm)

LTC2236CUH

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

25 MHz

1

CMOS

10

0.0488 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

0.197 in (5 mm)

LTC2323IUFD-12#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

28

HVQCCN

Rectangular

Plastic/Epoxy

2

Yes

2.053 V

5 MHz

1

CMOS

12

0.0244 %

3.3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2.044 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

R-PQCC-N28

0.031 in (0.8 mm)

0.157 in (4 mm)

e3

0.197 in (5 mm)

5962-01-303-0789

Analog Devices

Analog To Digital Converter

Military

No Lead

28

QCCN

Square

Ceramic

Yes

20 V

1

38535Q/M;38534H;883B

12

0.024 %

Offset Binary

5,±12/±15 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N28

No

LTC2446IUHF

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

No Lead

38

HVQCCN

Rectangular

Plastic/Epoxy

8

Yes

2.75 V

1

24

5 V

Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-50 mV

Serial

-40 °C (-40 °F)

Tin Lead

Quad

170 ns

R-PQCC-N38

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

0.276 in (7 mm)

LTC2259CUJ-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

80 MHz

1

CMOS

14

0.0214 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

LTC2480IDD#TRPBF

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

1

Yes

5.5 V

1

CMOS

16

0.001 %

5 V

Binary

Small Outline, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Dual

163.5 ms

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.118 in (3 mm)

LTC2232IUK#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

105 MHz

1

CMOS

10

0.0781 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

AD4020BCPZ-R2

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

10

HVSON

Square

Plastic/Epoxy

1

Yes

5.1 V

1.8 MHz

1

20

0.00031 %

1.8 V

2's Complement Binary

Small Outline, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-2.4 V

Serial

-40 °C (-40 °F)

Track

Dual

350 ns

S-PDSO-N10

3

0.033 in (0.85 mm)

0.118 in (3 mm)

260 °C (500 °F)

0.118 in (3 mm)

HMCAD1063LP9DE

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

2

Yes

500 MHz

1

14

0.0146 %

1.9 V

Offset Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

0.02 in (0.5 mm)

85 °C (185 °F)

Parallel, Word

-40 °C (-40 °F)

Sample

Quad

2 ns

S-PQCC-N64

0.037 in (0.95 mm)

0.354 in (9 mm)

0.354 in (9 mm)

AD7654ACPZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

48

HVQCCN

Square

4

Yes

5 V

500 kHz

1

16

0.0053 %

5 V

Binary

3/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC48,.27SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial, Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

875 ns

S-XQCC-N48

3

0.039 in (1 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

LTC2266CUJ-14#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

2

Yes

2 V

80 MHz

1

CMOS

14

0.0168 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-2 V

Serial

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

AD9253BCPZRL7-80

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

48

HVQCCN

Square

4

Yes

2 V

80 MHz

1

CMOS

14

0.0244 %

1.8 V

Offset Binary, 2's Complement Binary

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC48,.27SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

12.5 ns

S-XQCC-N48

3

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

PM7572ATC12

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

15 V

1

CMOS

12

12 mA

0.012 %

5 V

Binary

-15 V

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

-15 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Quad

13 µs

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

AD9228BCPZRL7-40

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

48

HVQCCN

Square

4

Yes

2 V

40 MHz

1

CMOS

12

0.0244 %

1.8 V

Offset Binary, 2's Complement Binary

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC48,.27SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-XQCC-N48

3

0.039 in (1 mm)

0.276 in (7 mm)

No

e3

260 °C (500 °F)

0.276 in (7 mm)

LTC2494CUHF

Analog Devices

Analog To Digital Converter, Delta-Sigma

Commercial

No Lead

38

HVQCCN

Rectangular

Plastic/Epoxy

16

Yes

1

16

5 V

Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

Serial

0 °C (32 °F)

Tin Lead

Sample

Quad

81.9 ms

R-PQCC-N38

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

0.276 in (7 mm)

AD9287BCPZRL-100

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

48

HVQCCN

Square

4

Yes

2 V

100 MHz

1

8

0.2539 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-XQCC-N48

0.039 in (1 mm)

0.276 in (7 mm)

No

e3

0.276 in (7 mm)

LTC2239IUH#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

80 MHz

1

CMOS

10

0.0488 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

LTC2208CUP#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

2.25 V

130 MHz

1

CMOS

16

0.0069 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC2242IUP-12#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

250 MHz

1

12

0.0659 %

2.5 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

AD9212BCPZRL7-65

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

64

HVQCCN

Square

8

Yes

2 V

65 MHz

1

CMOS

10

0.0977 %

1.8 V

Offset Binary, 2's Complement Binary

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

260 °C (500 °F)

0.354 in (9 mm)

LTC2153CUJ-12#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.32 V

310 MHz

1

CMOS

12

1.8 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1.32 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

AD7820BCHIPS

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

20

DIE

1

Yes

5 V

1

CMOS

8

0.3906 %

5 V

Binary

5 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Track

Upper

1.36 µs

X-XUUC-N20

No

LTC2320CUKG-12#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

8

Yes

2.064 V

1.5 MHz

1

CMOS

12

0.0244 %

3.3 V

Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-2.034 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Quad

450 ns

R-PQCC-N52

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

0.315 in (8 mm)

LTC2323HUFD-12#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Rectangular

Plastic/Epoxy

2

Yes

2.053 V

5 MHz

1

CMOS

12

0.0244 %

3.3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-2.044 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

R-PQCC-N28

1

0.031 in (0.8 mm)

0.157 in (4 mm)

e3

260 °C (500 °F)

0.197 in (5 mm)

AD9629BCPZRL7-20

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

32

HVQCCN

Square

1

Yes

2 V

20 MHz

1

CMOS

12

0.0098 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

50 ns

S-XQCC-N32

3

0.039 in (1 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

AD9234BCPZRL7-1000

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

2

Yes

1.34 V

1024 MHz

1

12

0.0342 %

1.25 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1.34 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-XQCC-N64

3

0.031 in (0.8 mm)

0.354 in (9 mm)

e3

260 °C (500 °F)

0.354 in (9 mm)

AD7688BCP

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

10

VSON

Square

1

Yes

5.8 V

500 kHz

1

16

0.0023 %

2.5 V

2's Complement Binary

2.5/5 V

Small Outline, Very Thin Profile

SOLCC10,.11,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-500 mV

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

2.2 µs

S-XDSO-N10

0.039 in (1 mm)

0.118 in (3 mm)

No

e0

0.118 in (3 mm)

AD9237BCPZRL7-65

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

1

Yes

4 V

65 MHz

1

CMOS

12

0.0488 %

3 V

Offset Binary, 2's Complement Binary

2.5,3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-XQCC-N32

3

0.035 in (0.9 mm)

0.197 in (5 mm)

No

e3

260 °C (500 °F)

0.197 in (5 mm)

LTC2150IUJ-12#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.5 V

170 MHz

1

CMOS

12

0.0293 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1.5 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

LTC2472CDD#PBF

Analog Devices

Analog To Digital Converter, Delta-Sigma

Commercial

No Lead

12

HVSON

Square

Plastic/Epoxy

2

Yes

1.25 V

1 kHz

1

CMOS

16

0.0183 %

Binary

Small Outline, Heat Sink/Slug, Very Thin Profile

0.018 in (0.45 mm)

70 °C (158 °F)

-1.25 V

Serial

0 °C (32 °F)

Matte Tin - annealed

Dual

4.8 ms

S-PDSO-N12

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.118 in (3 mm)

LTC2282IUP#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

105 MHz

2

CMOS

12

0.0366 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

5962-87591053B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

2.5 V

1

BICMOS

12

12 mA

0.0244 %

5 V

Offset Binary, Complementary Offset Binary

-15 V

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

-2.5 V

Parallel, Word

-55 °C (-67 °F)

Quad

13 µs

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

0.45 in (11.43 mm)

AD7676ACPZRL

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

48

HVQCCN

Square

1

Yes

3.4 V

500 kHz

1

CMOS

16

0.0015 %

5 V

Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2.3 V

Serial, Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

1.25 µs

S-XQCC-N48

3

0.039 in (1 mm)

0.276 in (7 mm)

No

e3

260 °C (500 °F)

0.276 in (7 mm)

AD9245BCP-80

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

32

HVQCCN

Square

1

Yes

2 V

80 MHz

1

CMOS

14

0.0314 %

3 V

Offset Binary, 2's Complement Binary

2.5,3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

1 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-XQCC-N32

0.039 in (1 mm)

0.197 in (5 mm)

No

e0

0.197 in (5 mm)

5962-88764043X

Analog Devices

Analog To Digital Converter, Flash Method

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

8

Yes

5 V

50 kHz

1

CMOS

MIL-STD-883

8

5 V

Binary, Complementary Offset Binary

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Track

Quad

2 µs

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

Yes

0.45 in (11.43 mm)

LTC2323CUFD-16#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

28

HVQCCN

Rectangular

Plastic/Epoxy

2

Yes

2.053 V

5 MHz

1

CMOS

16

0.0183 %

3.3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-2.044 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Quad

R-PQCC-N28

0.031 in (0.8 mm)

0.157 in (4 mm)

e3

0.197 in (5 mm)

AD9215BCP-105

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

32

VQCCN

Square

1

Yes

2 V

105 MHz

1

CMOS

10

0.1172 %

3 V

Offset Binary, 2's Complement Binary

2.5,3 V

Chip Carrier

LCC32,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-XQCC-N32

3

0.039 in (1 mm)

0.197 in (5 mm)

No

e0

240 °C (464 °F)

0.197 in (5 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.