Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Pin/Peg |
22 |
Rectangular |
1 |
No |
15 V |
20 MHz |
1 |
Hybrid |
8 |
0.02 % |
5 V |
Binary |
Microelectronic Assembly |
70 °C (158 °F) |
-15 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Gold |
Sample |
Dual |
140 ns |
R-XDMA-P22 |
No |
e4 |
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Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Pin/Peg |
37 |
Rectangular |
1 |
No |
4 V |
10 MHz |
1 |
Hybrid |
14 |
0.009 % |
15 V |
Binary |
5,-5.2,±15 V |
-15 V |
Microelectronic Assembly |
DIE OR CHIP |
Analog to Digital Converters |
70 °C (158 °F) |
-4 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Track |
Quad |
R-XQMA-P37 |
No |
e0 |
||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Pin/Peg |
24 |
DIP |
Rectangular |
Metal |
1 |
No |
1 V |
100 MHz |
1 |
Bipolar |
8 |
303 mA |
0.4688 % |
5 V |
Binary |
5,-5.2 V |
-5.2 V |
In-Line |
DIP24,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-1 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Dual |
R-MDIP-P24 |
0.6 in (15.24 mm) |
No |
e0 |
1.272 in (32.3205 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Pin/Peg |
72 |
Rectangular |
1 |
No |
10 V |
1 |
10 |
0.0977 % |
15 V |
Binary, Offset Binary, 2's Complement Binary |
-15 V |
Microelectronic Assembly |
70 °C (158 °F) |
-10 V |
Parallel, Word |
0 °C (32 °F) |
Dual |
1.5 µs |
R-XDMA-P72 |
No |
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Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Pin/Peg |
40 |
Rectangular |
1 |
No |
2 V |
20 MHz |
1 |
12 |
3.006 A |
15 V |
Binary, 2's Complement Binary |
-15 V |
Microelectronic Assembly |
70 °C (158 °F) |
-2 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Track |
R-XXMA-P40 |
No |
e0 |
|||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Pin/Peg |
37 |
Rectangular |
1 |
No |
4 V |
10 MHz |
1 |
Hybrid |
14 |
0.006 % |
15 V |
Binary |
5,-5.2,±15 V |
-15 V |
Microelectronic Assembly |
DIE OR CHIP |
Analog to Digital Converters |
70 °C (158 °F) |
-4 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Track |
Quad |
R-XQMA-P37 |
No |
e0 |
||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Pin/Peg |
32 |
DIP |
Rectangular |
1 |
No |
10 V |
1 |
16 |
0.003 % |
15 V |
Binary, Offset Binary, 2's Complement Binary |
-15 V |
In-Line |
85 °C (185 °F) |
-10 V |
Serial, Parallel, Word |
-25 °C (-13 °F) |
Dual |
100 µs |
R-XDIP-P32 |
No |
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Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Pin/Peg |
32 |
DIP |
Rectangular |
Metal |
1 |
No |
5.12 V |
641 kHz |
1 |
Hybrid |
12 |
0.0122 % |
15 V |
Binary, Offset Binary |
5,±15 V |
-15 V |
In-Line |
DIP32,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-5.12 V |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Track |
Dual |
1.56 µs |
R-MDIP-P32 |
0.2 in (5.08 mm) |
0.9 in (22.86 mm) |
No |
e0 |
1.5 in (38.1 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Pin/Peg |
32 |
DIP |
Square |
1 |
No |
10 V |
1 |
Hybrid |
16 |
0.003 % |
15 V |
Binary, Offset Binary, 2's Complement Binary |
5,±15 V |
-15 V |
Microelectronic Assembly |
DIP34,1.8 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-10 V |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Dual |
35 µs |
S-XDMA-P32 |
No |
e0 |
|||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Pin/Peg |
32 |
DIP |
Rectangular |
Metal |
1 |
No |
5.12 V |
349 kHz |
1 |
Hybrid |
MIL-STD-883 Class B (Modified) |
12 |
0.0122 % |
15 V |
Binary, Offset Binary |
5,±15 V |
-15 V |
In-Line |
DIP32,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
100 °C (212 °F) |
-5.12 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
2.86 µs |
R-MDIP-P32 |
0.2 in (5.08 mm) |
0.9 in (22.86 mm) |
No |
e0 |
1.5 in (38.1 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Pin/Peg |
32 |
Rectangular |
1 |
No |
2.048 V |
5 MHz |
1 |
12 |
15 V |
Offset Binary, 2's Complement Binary |
-15 V |
Microelectronic Assembly |
70 °C (158 °F) |
-2.048 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Track |
Dual |
R-XDMA-P32 |
No |
e0 |
|||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Pin/Peg |
32 |
DIP |
Rectangular |
1 |
No |
10 V |
1 |
16 |
0.006 % |
15 V |
Binary, Offset Binary, 2's Complement Binary |
-15 V |
In-Line |
85 °C (185 °F) |
-10 V |
Serial, Parallel, Word |
-25 °C (-13 °F) |
Dual |
70 µs |
R-XDIP-P32 |
No |
||||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Pin/Peg |
22 |
Rectangular |
1 |
No |
15 V |
20 MHz |
1 |
Hybrid |
8 |
0.02 % |
5 V |
Binary |
Microelectronic Assembly |
70 °C (158 °F) |
-15 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Gold |
Sample |
Dual |
170 ns |
R-XDMA-P22 |
No |
e4 |
|||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Commercial |
Pin/Peg |
32 |
Rectangular |
1 |
No |
10 V |
20 kHz |
1 |
15 |
0.003 % |
15 V |
Binary, Offset Binary, 2's Complement Binary |
-15 V |
Microelectronic Assembly |
70 °C (158 °F) |
-10 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
35 µs |
R-XXMA-P32 |
No |
e0 |
||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Pin/Peg |
36 |
Rectangular |
1 |
No |
4 V |
40 MHz |
1 |
10 |
375 mA |
15 V |
Complementary Binary, Complementary 2's Complement |
-15 V |
Microelectronic Assembly |
70 °C (158 °F) |
-4 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Track |
R-XXMA-P36 |
No |
e0 |
|||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Other |
Pin/Peg |
32 |
Rectangular |
1 |
No |
10 V |
18 kHz |
1 |
CMOS |
14 |
0.005 % |
15 V |
Binary, Offset Binary, 2's Complement Binary |
-15 V |
Microelectronic Assembly |
85 °C (185 °F) |
-10 V |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Sample |
50 µs |
R-XXMA-P32 |
No |
e0 |
|||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Pin/Peg |
37 |
Rectangular |
1 |
No |
1 V |
10 MHz |
1 |
Hybrid |
14 |
0.006 % |
5 V |
Offset Binary |
5,-5.2,±15 V |
-5.2 V |
Microelectronic Assembly |
DIE OR CHIP |
Analog to Digital Converters |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Track |
Quad |
R-XQMA-P37 |
No |
e0 |
||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Dual-Slope |
Commercial |
Pin/Peg |
72 |
Rectangular |
1 |
No |
1 |
11 |
0.05 % |
5 V |
Binary Coded Decimal |
Microelectronic Assembly |
70 °C (158 °F) |
Parallel, Word |
0 °C (32 °F) |
Dual |
42 µs |
R-XDMA-P72 |
No |
||||||||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Pin/Peg |
26 |
Rectangular |
Metal |
1 |
No |
5 V |
1 |
22 |
0.00005 % |
15 V |
Offset Binary |
-15 V |
Microelectronic Assembly |
70 °C (158 °F) |
-5 V |
Parallel, Word |
0 °C (32 °F) |
Dual |
R-MDMA-P26 |
No |
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Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
Pin/Peg |
24 |
DIP |
Rectangular |
Metal |
1 |
No |
1 V |
100 MHz |
1 |
Bipolar |
MIL-STD-883 Class B (Modified) |
8 |
303 mA |
0.4688 % |
5 V |
Binary |
5,-5.2 V |
-5.2 V |
In-Line |
DIP24,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-1 V |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-MDIP-P24 |
0.6 in (15.24 mm) |
No |
e0 |
1.272 in (32.3205 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
Pin/Peg |
34 |
DMA |
Rectangular |
Plastic/Epoxy |
1 |
No |
15 V |
1 |
12 |
275 mA |
0.0122 % |
15 V |
Offset Binary, 2's Complement Binary, Complementary 2's Complement, Complementary Offset Binary |
-15 V |
Microelectronic Assembly |
125 °C (257 °F) |
-15 V |
Parallel, Word |
-55 °C (-67 °F) |
Gold |
Dual |
25 µs |
R-PDMA-P34 |
0.421 in (10.7 mm) |
2 in (50.8 mm) |
No |
e4 |
4 in (101.6 mm) |
|||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Pin/Peg |
32 |
DIP |
Rectangular |
Metal |
1 |
No |
5.12 V |
641 kHz |
1 |
Hybrid |
MIL-STD-883 Class B (Modified) |
12 |
0.0122 % |
15 V |
Binary, Offset Binary |
5,±15 V |
-15 V |
In-Line |
DIP32,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
100 °C (212 °F) |
-5.12 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
1.56 µs |
R-MDIP-P32 |
0.2 in (5.08 mm) |
0.9 in (22.86 mm) |
No |
e0 |
1.5 in (38.1 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Pin/Peg |
32 |
DIP |
Rectangular |
Metal |
1 |
No |
5.12 V |
349 kHz |
1 |
Hybrid |
12 |
0.0122 % |
15 V |
Binary, Offset Binary |
5,±15 V |
-15 V |
In-Line |
DIP32,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-5.12 V |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Track |
Dual |
2.86 µs |
R-MDIP-P32 |
0.2 in (5.08 mm) |
0.9 in (22.86 mm) |
No |
e0 |
1.5 in (38.1 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Pin/Peg |
24 |
DIP |
Rectangular |
Metal |
1 |
No |
1 V |
100 MHz |
1 |
Bipolar |
8 |
303 mA |
0.4688 % |
5 V |
Binary |
5,-5.2 V |
-5.2 V |
In-Line |
DIP24,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-1 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Dual |
R-MDIP-P24 |
0.6 in (15.24 mm) |
No |
e0 |
1.272 in (32.3205 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
Pin/Peg |
24 |
DIP |
Rectangular |
Metal |
1 |
No |
1 V |
100 MHz |
1 |
Bipolar |
MIL-STD-883 Class B (Modified) |
8 |
303 mA |
0.4688 % |
5 V |
Binary |
5,-5.2 V |
-5.2 V |
In-Line |
DIP24,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-1 V |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-MDIP-P24 |
0.6 in (15.24 mm) |
No |
e0 |
1.272 in (32.3205 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Pin/Peg |
72 |
Rectangular |
1 |
No |
10 V |
1 |
8 |
0.3906 % |
15 V |
Binary, Offset Binary, 2's Complement Binary |
-15 V |
Microelectronic Assembly |
70 °C (158 °F) |
-10 V |
Parallel, Word |
0 °C (32 °F) |
Dual |
1 µs |
R-XDMA-P72 |
No |
|||||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Pin/Peg |
22 |
Rectangular |
1 |
No |
15 V |
20 MHz |
1 |
Hybrid |
8 |
0.01 % |
5 V |
Binary |
Microelectronic Assembly |
70 °C (158 °F) |
-15 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Gold |
Sample |
Dual |
45.05 ns |
R-XDMA-P22 |
No |
e4 |
|||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Commercial |
Pin/Peg |
32 |
Rectangular |
1 |
No |
10 V |
25 kHz |
1 |
14 |
0.005 % |
15 V |
Binary, Offset Binary, 2's Complement Binary |
-15 V |
Microelectronic Assembly |
70 °C (158 °F) |
-10 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
35 µs |
R-XXMA-P32 |
No |
e0 |
||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Other |
Pin/Peg |
46 |
QIP |
Rectangular |
Metal |
1 |
No |
1.25 V |
10.24 MHz |
1 |
Hybrid |
12 |
5 V |
2's Complement Binary |
5,-5.2 V |
-5.2 V |
In-Line |
DIP46,1.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-1.25 V |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Track |
Dual |
97 ns |
R-MDIP-P46 |
0.305 in (7.743 mm) |
1.3 in (33.02 mm) |
No |
e0 |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Pin/Peg |
28 |
Rectangular |
2 |
No |
1 |
Bipolar |
12 |
0.0122 % |
5 V |
Binary, Offset Binary, 2's Complement Binary |
Microelectronic Assembly |
70 °C (158 °F) |
Parallel, Word |
0 °C (32 °F) |
Gold |
Dual |
25 µs |
R-XDMA-P28 |
No |
e4 |
|||||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Pin/Peg |
40 |
DIP |
Rectangular |
Metal |
1 |
No |
5 V |
500 kHz |
1 |
Hybrid |
12 |
177 mA |
15 V |
Complementary Binary, Complementary Offset Binary |
5,±15 V |
-15 V |
In-Line |
DIP40,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-5 V |
Serial, Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Track |
Dual |
2 µs |
R-MDIP-P40 |
0.19 in (4.83 mm) |
0.9 in (22.86 mm) |
No |
e0 |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Pin/Peg |
72 |
Rectangular |
1 |
No |
10 V |
1 |
12 |
0.0244 % |
15 V |
Binary, Offset Binary, 2's Complement Binary |
-15 V |
Microelectronic Assembly |
70 °C (158 °F) |
-10 V |
Parallel, Word |
0 °C (32 °F) |
Dual |
3.5 µs |
R-XDMA-P72 |
No |
|||||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Dual-Slope |
Commercial |
Pin/Peg |
72 |
Rectangular |
1 |
No |
10 V |
1 |
10 |
15 V |
Binary |
-15 V |
Microelectronic Assembly |
50 °C (122 °F) |
-10 V |
Parallel, Word |
0 °C (32 °F) |
Dual |
15.36 ms |
R-XDMA-P72 |
0.61 in (15.5 mm) |
2.012 in (51.1 mm) |
4.031 in (102.4 mm) |
||||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Dual-Slope |
Commercial |
Pin/Peg |
72 |
Rectangular |
1 |
No |
1 |
11 |
0.05 % |
5 V |
Binary |
Microelectronic Assembly |
70 °C (158 °F) |
Parallel, Word |
0 °C (32 °F) |
Dual |
42 µs |
R-XDMA-P72 |
No |
||||||||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Pin/Peg |
36 |
Rectangular |
1 |
No |
4 V |
40 MHz |
1 |
10 |
375 mA |
15 V |
Binary, 2's Complement Binary |
-15 V |
Microelectronic Assembly |
70 °C (158 °F) |
-4 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Track |
R-XXMA-P36 |
No |
e0 |
|||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Pin/Peg |
37 |
Rectangular |
1 |
No |
1 V |
10 MHz |
1 |
Hybrid |
14 |
0.009 % |
5 V |
Offset Binary |
5,-5.2,±15 V |
-5.2 V |
Microelectronic Assembly |
DIE OR CHIP |
Analog to Digital Converters |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Track |
Quad |
R-XQMA-P37 |
No |
e0 |
||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Pin/Peg |
32 |
DIP |
Rectangular |
Metal |
1 |
No |
5.12 V |
641 kHz |
1 |
Hybrid |
12 |
232 mA |
15 V |
Binary, Offset Binary |
5,±15 V |
-15 V |
In-Line |
DIP32,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-5.12 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Dual |
1.56 µs |
R-MDIP-P32 |
0.2 in (5.08 mm) |
0.9 in (22.86 mm) |
No |
e0 |
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Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Pin/Peg |
25 |
Rectangular |
1 |
No |
1 |
Bipolar |
10 |
0.0488 % |
5 V |
Binary, Offset Binary, 2's Complement Binary |
Microelectronic Assembly |
70 °C (158 °F) |
Parallel, Word |
0 °C (32 °F) |
Gold |
Single |
4 µs |
R-XSMA-P25 |
No |
e4 |
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Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Pin/Peg |
32 |
DIP |
Rectangular |
Metal |
1 |
No |
5.12 V |
641 kHz |
1 |
Hybrid |
12 |
232 mA |
15 V |
Binary, Offset Binary |
5,±15 V |
-15 V |
In-Line |
DIP32,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-5.12 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Dual |
2.86 µs |
R-MDIP-P32 |
0.2 in (5.08 mm) |
0.9 in (22.86 mm) |
No |
e0 |
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Analog Devices |
Analog To Digital Converter, Dual-Slope |
Commercial |
Pin/Peg |
72 |
Rectangular |
1 |
No |
10 V |
1 |
14 |
15 V |
Binary |
-15 V |
Microelectronic Assembly |
50 °C (122 °F) |
-10 V |
Parallel, Word |
0 °C (32 °F) |
Gold |
Dual |
R-XDMA-P72 |
No |
e4 |
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Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Pin/Peg |
34 |
DIP |
Rectangular |
1 |
No |
10 V |
1 |
14 |
0.0061 % |
15 V |
Binary, Offset Binary, 2's Complement Binary |
-15 V |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-10 V |
Serial, Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Dual |
12 µs |
R-XDIP-P34 |
0.409 in (10.4 mm) |
1.8 in (45.72 mm) |
No |
e0 |
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Analog Devices |
Analog To Digital Converter Subsystem |
Other |
Pin/Peg |
32 |
Rectangular |
1 |
No |
10 V |
1 |
CMOS |
15 |
0.003 % |
15 V |
Binary, Offset Binary, 2's Complement Binary |
-15 V |
Microelectronic Assembly |
85 °C (185 °F) |
-10 V |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Sample |
50 µs |
R-XXMA-P32 |
No |
e0 |
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Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Pin/Peg |
34 |
DIP |
Rectangular |
1 |
No |
10 V |
1 |
14 |
0.0061 % |
15 V |
Binary, Offset Binary, 2's Complement Binary |
-15 V |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-10 V |
Serial, Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Dual |
12 µs |
R-XDIP-P34 |
0.409 in (10.4 mm) |
1.8 in (45.72 mm) |
No |
e0 |
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Analog Devices |
Analog To Digital Converter Subsystem |
Other |
Pin/Peg |
32 |
DIP |
Rectangular |
1 |
No |
10 V |
1 |
CMOS |
16 |
0.003 % |
15 V |
Binary, Offset Binary, 2's Complement Binary |
5,±15 V |
-15 V |
Microelectronic Assembly |
DIP34,1.8 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-10 V |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Sample |
50 µs |
R-XXMA-P32 |
No |
e0 |
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Analog Devices |
Analog To Digital Converter, Flash Method |
Other |
Pin/Peg |
46 |
QIP |
Rectangular |
Metal |
1 |
No |
1.25 V |
10.24 MHz |
1 |
Hybrid |
12 |
5 V |
2's Complement Binary |
5,-5.2 V |
-5.2 V |
In-Line |
DIP46,1.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-1.25 V |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Track |
Dual |
97 ns |
R-MDIP-P46 |
0.305 in (7.743 mm) |
1.3 in (33.02 mm) |
No |
e0 |
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Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Pin/Peg |
34 |
DIP |
Rectangular |
1 |
No |
10 V |
1 |
14 |
0.0061 % |
15 V |
Binary, Offset Binary, 2's Complement Binary |
-15 V |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-10 V |
Serial, Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Dual |
25 µs |
R-XDIP-P34 |
0.409 in (10.4 mm) |
1.8 in (45.72 mm) |
No |
e0 |
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Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Pin/Peg |
40 |
DIP |
Rectangular |
Metal |
1 |
No |
5 V |
500 kHz |
1 |
Hybrid |
12 |
177 mA |
15 V |
Complementary Binary, Complementary Offset Binary |
5,±15 V |
-15 V |
In-Line |
DIP40,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
100 °C (212 °F) |
-5 V |
Serial, Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
2 µs |
R-MDIP-P40 |
0.19 in (4.83 mm) |
0.9 in (22.86 mm) |
No |
e0 |
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Maxim Integrated |
Analog To Digital Converter, Flash Method |
Pin/Peg |
192 |
PGA |
Square |
1 |
No |
1000 MHz |
1 |
Bipolar |
8 |
5 V |
Binary |
-5 V |
Grid Array |
Parallel, 8 Bits |
Tin Lead |
Track |
Perpendicular |
S-XPGA-P192 |
No |
e0 |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.