Pin/Peg Analog-to-Digital Converters 48

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

MATV-0816

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Pin/Peg

22

Rectangular

1

No

15 V

20 MHz

1

Hybrid

8

0.02 %

5 V

Binary

Microelectronic Assembly

70 °C (158 °F)

-15 V

Parallel, 8 Bits

0 °C (32 °F)

Gold

Sample

Dual

140 ns

R-XDMA-P22

No

e4

AD9014J

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Pin/Peg

37

Rectangular

1

No

4 V

10 MHz

1

Hybrid

14

0.009 %

15 V

Binary

5,-5.2,±15 V

-15 V

Microelectronic Assembly

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

-4 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Quad

R-XQMA-P37

No

e0

AD9011JM

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Pin/Peg

24

DIP

Rectangular

Metal

1

No

1 V

100 MHz

1

Bipolar

8

303 mA

0.4688 %

5 V

Binary

5,-5.2 V

-5.2 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-1 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Dual

R-MDIP-P24

0.6 in (15.24 mm)

No

e0

1.272 in (32.3205 mm)

ADC1103-002

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Pin/Peg

72

Rectangular

1

No

10 V

1

10

0.0977 %

15 V

Binary, Offset Binary, 2's Complement Binary

-15 V

Microelectronic Assembly

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Dual

1.5 µs

R-XDMA-P72

No

CAV-1220-200

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Pin/Peg

40

Rectangular

1

No

2 V

20 MHz

1

12

3.006 A

15 V

Binary, 2's Complement Binary

-15 V

Microelectronic Assembly

70 °C (158 °F)

-2 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

R-XXMA-P40

No

e0

AD9014K

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Pin/Peg

37

Rectangular

1

No

4 V

10 MHz

1

Hybrid

14

0.006 %

15 V

Binary

5,-5.2,±15 V

-15 V

Microelectronic Assembly

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

-4 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Quad

R-XQMA-P37

No

e0

ADC1143K

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Pin/Peg

32

DIP

Rectangular

1

No

10 V

1

16

0.003 %

15 V

Binary, Offset Binary, 2's Complement Binary

-15 V

In-Line

85 °C (185 °F)

-10 V

Serial, Parallel, Word

-25 °C (-13 °F)

Dual

100 µs

R-XDIP-P32

No

HAS-1202AM

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Pin/Peg

32

DIP

Rectangular

Metal

1

No

5.12 V

641 kHz

1

Hybrid

12

0.0122 %

15 V

Binary, Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5.12 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

1.56 µs

R-MDIP-P32

0.2 in (5.08 mm)

0.9 in (22.86 mm)

No

e0

1.5 in (38.1 mm)

ADC1140

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Pin/Peg

32

DIP

Square

1

No

10 V

1

Hybrid

16

0.003 %

15 V

Binary, Offset Binary, 2's Complement Binary

5,±15 V

-15 V

Microelectronic Assembly

DIP34,1.8

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Dual

35 µs

S-XDMA-P32

No

e0

HAS-1202MB

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Pin/Peg

32

DIP

Rectangular

Metal

1

No

5.12 V

349 kHz

1

Hybrid

MIL-STD-883 Class B (Modified)

12

0.0122 %

15 V

Binary, Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

100 °C (212 °F)

-5.12 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

2.86 µs

R-MDIP-P32

0.2 in (5.08 mm)

0.9 in (22.86 mm)

No

e0

1.5 in (38.1 mm)

MOD-1205

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Pin/Peg

32

Rectangular

1

No

2.048 V

5 MHz

1

12

15 V

Offset Binary, 2's Complement Binary

-15 V

Microelectronic Assembly

70 °C (158 °F)

-2.048 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

R-XDMA-P32

No

e0

ADC1143J

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Pin/Peg

32

DIP

Rectangular

1

No

10 V

1

16

0.006 %

15 V

Binary, Offset Binary, 2's Complement Binary

-15 V

In-Line

85 °C (185 °F)

-10 V

Serial, Parallel, Word

-25 °C (-13 °F)

Dual

70 µs

R-XDIP-P32

No

MATV-0811

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Pin/Peg

22

Rectangular

1

No

15 V

20 MHz

1

Hybrid

8

0.02 %

5 V

Binary

Microelectronic Assembly

70 °C (158 °F)

-15 V

Parallel, 8 Bits

0 °C (32 °F)

Gold

Sample

Dual

170 ns

R-XDMA-P22

No

e4

DAS1153

Analog Devices

Analog To Digital Converter Subsystem

Commercial

Pin/Peg

32

Rectangular

1

No

10 V

20 kHz

1

15

0.003 %

15 V

Binary, Offset Binary, 2's Complement Binary

-15 V

Microelectronic Assembly

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

35 µs

R-XXMA-P32

No

e0

CAV-1040A-400

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Pin/Peg

36

Rectangular

1

No

4 V

40 MHz

1

10

375 mA

15 V

Complementary Binary, Complementary 2's Complement

-15 V

Microelectronic Assembly

70 °C (158 °F)

-4 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

R-XXMA-P36

No

e0

DAS1157

Analog Devices

Analog To Digital Converter Subsystem

Other

Pin/Peg

32

Rectangular

1

No

10 V

18 kHz

1

CMOS

14

0.005 %

15 V

Binary, Offset Binary, 2's Complement Binary

-15 V

Microelectronic Assembly

85 °C (185 °F)

-10 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Sample

50 µs

R-XXMA-P32

No

e0

AD9014K-50

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Pin/Peg

37

Rectangular

1

No

1 V

10 MHz

1

Hybrid

14

0.006 %

5 V

Offset Binary

5,-5.2,±15 V

-5.2 V

Microelectronic Assembly

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Quad

R-XQMA-P37

No

e0

ADC1100/BCD

Analog Devices

Analog To Digital Converter, Dual-Slope

Commercial

Pin/Peg

72

Rectangular

1

No

1

11

0.05 %

5 V

Binary Coded Decimal

Microelectronic Assembly

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Dual

42 µs

R-XDMA-P72

No

AD1175K

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Pin/Peg

26

Rectangular

Metal

1

No

5 V

1

22

0.00005 %

15 V

Offset Binary

-15 V

Microelectronic Assembly

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Dual

R-MDMA-P26

No

AD9011TMB

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Pin/Peg

24

DIP

Rectangular

Metal

1

No

1 V

100 MHz

1

Bipolar

MIL-STD-883 Class B (Modified)

8

303 mA

0.4688 %

5 V

Binary

5,-5.2 V

-5.2 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-1 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

R-MDIP-P24

0.6 in (15.24 mm)

No

e0

1.272 in (32.3205 mm)

ADC1111

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Pin/Peg

34

DMA

Rectangular

Plastic/Epoxy

1

No

15 V

1

12

275 mA

0.0122 %

15 V

Offset Binary, 2's Complement Binary, Complementary 2's Complement, Complementary Offset Binary

-15 V

Microelectronic Assembly

125 °C (257 °F)

-15 V

Parallel, Word

-55 °C (-67 °F)

Gold

Dual

25 µs

R-PDMA-P34

0.421 in (10.7 mm)

2 in (50.8 mm)

No

e4

4 in (101.6 mm)

HAS-1202AMB

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Pin/Peg

32

DIP

Rectangular

Metal

1

No

5.12 V

641 kHz

1

Hybrid

MIL-STD-883 Class B (Modified)

12

0.0122 %

15 V

Binary, Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

100 °C (212 °F)

-5.12 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

1.56 µs

R-MDIP-P32

0.2 in (5.08 mm)

0.9 in (22.86 mm)

No

e0

1.5 in (38.1 mm)

HAS-1202M

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Pin/Peg

32

DIP

Rectangular

Metal

1

No

5.12 V

349 kHz

1

Hybrid

12

0.0122 %

15 V

Binary, Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5.12 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

2.86 µs

R-MDIP-P32

0.2 in (5.08 mm)

0.9 in (22.86 mm)

No

e0

1.5 in (38.1 mm)

AD9011KM

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Pin/Peg

24

DIP

Rectangular

Metal

1

No

1 V

100 MHz

1

Bipolar

8

303 mA

0.4688 %

5 V

Binary

5,-5.2 V

-5.2 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-1 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Dual

R-MDIP-P24

0.6 in (15.24 mm)

No

e0

1.272 in (32.3205 mm)

AD9011SMB

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Pin/Peg

24

DIP

Rectangular

Metal

1

No

1 V

100 MHz

1

Bipolar

MIL-STD-883 Class B (Modified)

8

303 mA

0.4688 %

5 V

Binary

5,-5.2 V

-5.2 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-1 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

R-MDIP-P24

0.6 in (15.24 mm)

No

e0

1.272 in (32.3205 mm)

ADC1103-001

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Pin/Peg

72

Rectangular

1

No

10 V

1

8

0.3906 %

15 V

Binary, Offset Binary, 2's Complement Binary

-15 V

Microelectronic Assembly

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Dual

1 µs

R-XDMA-P72

No

MATV-0820

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Pin/Peg

22

Rectangular

1

No

15 V

20 MHz

1

Hybrid

8

0.01 %

5 V

Binary

Microelectronic Assembly

70 °C (158 °F)

-15 V

Parallel, 8 Bits

0 °C (32 °F)

Gold

Sample

Dual

45.05 ns

R-XDMA-P22

No

e4

DAS1152

Analog Devices

Analog To Digital Converter Subsystem

Commercial

Pin/Peg

32

Rectangular

1

No

10 V

25 kHz

1

14

0.005 %

15 V

Binary, Offset Binary, 2's Complement Binary

-15 V

Microelectronic Assembly

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

35 µs

R-XXMA-P32

No

e0

AD9007BM

Analog Devices

Analog To Digital Converter, Flash Method

Other

Pin/Peg

46

QIP

Rectangular

Metal

1

No

1.25 V

10.24 MHz

1

Hybrid

12

5 V

2's Complement Binary

5,-5.2 V

-5.2 V

In-Line

DIP46,1.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-1.25 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

97 ns

R-MDIP-P46

0.305 in (7.743 mm)

1.3 in (33.02 mm)

No

e0

ADC1113

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Pin/Peg

28

Rectangular

2

No

1

Bipolar

12

0.0122 %

5 V

Binary, Offset Binary, 2's Complement Binary

Microelectronic Assembly

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Gold

Dual

25 µs

R-XDMA-P28

No

e4

HAS-1204BM

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Pin/Peg

40

DIP

Rectangular

Metal

1

No

5 V

500 kHz

1

Hybrid

12

177 mA

15 V

Complementary Binary, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP40,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Serial, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

2 µs

R-MDIP-P40

0.19 in (4.83 mm)

0.9 in (22.86 mm)

No

e0

ADC1103-003

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Pin/Peg

72

Rectangular

1

No

10 V

1

12

0.0244 %

15 V

Binary, Offset Binary, 2's Complement Binary

-15 V

Microelectronic Assembly

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Dual

3.5 µs

R-XDMA-P72

No

ADC1105J

Analog Devices

Analog To Digital Converter, Dual-Slope

Commercial

Pin/Peg

72

Rectangular

1

No

10 V

1

10

15 V

Binary

-15 V

Microelectronic Assembly

50 °C (122 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Dual

15.36 ms

R-XDMA-P72

0.61 in (15.5 mm)

2.012 in (51.1 mm)

4.031 in (102.4 mm)

ADC1100/BIN

Analog Devices

Analog To Digital Converter, Dual-Slope

Commercial

Pin/Peg

72

Rectangular

1

No

1

11

0.05 %

5 V

Binary

Microelectronic Assembly

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Dual

42 µs

R-XDMA-P72

No

CAV-1040-400

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Pin/Peg

36

Rectangular

1

No

4 V

40 MHz

1

10

375 mA

15 V

Binary, 2's Complement Binary

-15 V

Microelectronic Assembly

70 °C (158 °F)

-4 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

R-XXMA-P36

No

e0

AD9014J-50

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Pin/Peg

37

Rectangular

1

No

1 V

10 MHz

1

Hybrid

14

0.009 %

5 V

Offset Binary

5,-5.2,±15 V

-5.2 V

Microelectronic Assembly

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Quad

R-XQMA-P37

No

e0

HAS-1202A

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Pin/Peg

32

DIP

Rectangular

Metal

1

No

5.12 V

641 kHz

1

Hybrid

12

232 mA

15 V

Binary, Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5.12 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

1.56 µs

R-MDIP-P32

0.2 in (5.08 mm)

0.9 in (22.86 mm)

No

e0

ADC1109

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Pin/Peg

25

Rectangular

1

No

1

Bipolar

10

0.0488 %

5 V

Binary, Offset Binary, 2's Complement Binary

Microelectronic Assembly

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Gold

Single

4 µs

R-XSMA-P25

No

e4

HAS-1202

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Pin/Peg

32

DIP

Rectangular

Metal

1

No

5.12 V

641 kHz

1

Hybrid

12

232 mA

15 V

Binary, Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5.12 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

2.86 µs

R-MDIP-P32

0.2 in (5.08 mm)

0.9 in (22.86 mm)

No

e0

ADC1105K

Analog Devices

Analog To Digital Converter, Dual-Slope

Commercial

Pin/Peg

72

Rectangular

1

No

10 V

1

14

15 V

Binary

-15 V

Microelectronic Assembly

50 °C (122 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Gold

Dual

R-XDMA-P72

No

e4

ADC1131J

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Pin/Peg

34

DIP

Rectangular

1

No

10 V

1

14

0.0061 %

15 V

Binary, Offset Binary, 2's Complement Binary

-15 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Serial, Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

12 µs

R-XDIP-P34

0.409 in (10.4 mm)

1.8 in (45.72 mm)

No

e0

DAS1158

Analog Devices

Analog To Digital Converter Subsystem

Other

Pin/Peg

32

Rectangular

1

No

10 V

1

CMOS

15

0.003 %

15 V

Binary, Offset Binary, 2's Complement Binary

-15 V

Microelectronic Assembly

85 °C (185 °F)

-10 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Sample

50 µs

R-XXMA-P32

No

e0

ADC1131K

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Pin/Peg

34

DIP

Rectangular

1

No

10 V

1

14

0.0061 %

15 V

Binary, Offset Binary, 2's Complement Binary

-15 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Serial, Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

12 µs

R-XDIP-P34

0.409 in (10.4 mm)

1.8 in (45.72 mm)

No

e0

DAS1159

Analog Devices

Analog To Digital Converter Subsystem

Other

Pin/Peg

32

DIP

Rectangular

1

No

10 V

1

CMOS

16

0.003 %

15 V

Binary, Offset Binary, 2's Complement Binary

5,±15 V

-15 V

Microelectronic Assembly

DIP34,1.8

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Sample

50 µs

R-XXMA-P32

No

e0

AD9007AM

Analog Devices

Analog To Digital Converter, Flash Method

Other

Pin/Peg

46

QIP

Rectangular

Metal

1

No

1.25 V

10.24 MHz

1

Hybrid

12

5 V

2's Complement Binary

5,-5.2 V

-5.2 V

In-Line

DIP46,1.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-1.25 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

97 ns

R-MDIP-P46

0.305 in (7.743 mm)

1.3 in (33.02 mm)

No

e0

ADC1130

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Pin/Peg

34

DIP

Rectangular

1

No

10 V

1

14

0.0061 %

15 V

Binary, Offset Binary, 2's Complement Binary

-15 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Serial, Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

25 µs

R-XDIP-P34

0.409 in (10.4 mm)

1.8 in (45.72 mm)

No

e0

HAS-1204SM

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Pin/Peg

40

DIP

Rectangular

Metal

1

No

5 V

500 kHz

1

Hybrid

12

177 mA

15 V

Complementary Binary, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP40,.9

Analog to Digital Converters

0.1 in (2.54 mm)

100 °C (212 °F)

-5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

2 µs

R-MDIP-P40

0.19 in (4.83 mm)

0.9 in (22.86 mm)

No

e0

MAX104

Maxim Integrated

Analog To Digital Converter, Flash Method

Pin/Peg

192

PGA

Square

1

No

1000 MHz

1

Bipolar

8

5 V

Binary

-5 V

Grid Array

Parallel, 8 Bits

Tin Lead

Track

Perpendicular

S-XPGA-P192

No

e0

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.