Digital To Synchro Or Resolver Data Acquisition ADCs & DACs 113

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Manufacturers
    • Analog Devices
    • Data Device
    • NXP Semiconductors
    • Renesas Electronics
    • Texas Instruments
Converter Type (1)
    • Digital To Synchro Or Resolver
    • D/A Converter
    • Excitation Oscillator
    • LVDT or RVDT to digital converter
    • Signal Conditioner
    • Synchro Or Resolver To Digital Converter
    • Synchro-Resolver Transformer
Temperature Grade
    • Automotive
    • Commercial
    • Industrial
    • Military
    • Other
Terminal Form
    • Flat
    • Gull Wing
    • J Bend
    • No Lead
    • Pin/Peg
    • Through-Hole
No. of Terminals
    • 10
    • 14
    • 16
    • 18
    • 20
    • 21
    • 23
    • 24
    • 28
    • 32
    • 36
    • 40
    • 44
    • 48
    • 5
    • 50
    • 64
    • 9
Package Code
    • DIE
    • DIP
    • DMA
    • HTFQFP
    • LFQFP
    • LQFP
    • QCCJ
    • QCCN
    • QFP
    • SOP
Package Shape
    • Rectangular
    • Square
Package Body Material
    • Ceramic
    • Ceramic, Glass-Sealed
    • Ceramic, Metal-Sealed Cofired
    • Metal
    • Plastic/Epoxy
Maximum Analog Output Voltage
    • 2 V
    • 2.5 V
    • 6.8 V
Surface Mount
    • No
    • Yes
Maximum Supply Voltage
    • 10 V
    • 12.6 V
    • 13.2 V
    • 15.75 V
    • 16 V
    • 17 V
    • 18 V
    • 20 V
    • 36 V
    • 5.25 V
    • 5.5 V
Maximum Analog Input Voltage
    • .2 V
    • 11.8 V
    • 117 V
    • 15 V
    • 2 V
    • 2.2 V
    • 2.3 V
    • 2.5 V
    • 26 V
    • 3.5 V
    • 3.96 V
    • 4 V
    • 90 V
    • 99 V
No. of Functions
    • 1
Technology
    • BICMOS
    • Bipolar
    • CMOS
    • Hybrid
Screening Level
    • 38535Q/M;38534H;883B
    • AEC-Q100
    • MIL-STD-883
    • MIL-STD-883 Class B
    • MIL-STD-883 Class B (Modified)
No. of Bits
    • 10
    • 11
    • 12
    • 14
    • 16
Maximum Settling Time
    • 100 µs
    • 120 µs
    • 130 µs
    • 150 µs
    • 180 µs
    • 20 µs
    • 25 µs
    • 30 µs
    • 35 µs
    • 350 µs
    • 36 µs
    • 40 µs
    • 50 µs
    • 60 µs
    • 72 µs
    • 75 µs
    • 95 µs
Maximum Supply Current
    • 10 mA
    • 100 mA
    • 12 mA
    • 120 mA
    • 125 mA
    • 156 mA
    • 16 mA
    • 18 mA
    • 184 mA
    • 185 mA
    • 22 mA
    • 225 mA
    • 23 mA
    • 25 mA
    • 30 mA
    • 32 mA
    • 35 mA
    • 55 mA
    • 56 mA
    • 60 mA
    • 61.5 mA
    • 9 mA
Nominal Supply Voltage
    • 10 V
    • 12 V
    • 15 V
    • 24 V
    • 5 V
Minimum Negative Supply Voltage
    • -10.8 V
    • -11.4 V
    • -11.5 V
    • -12 V
    • -14.25 V
    • -2.5 V
    • -4.75 V
    • -6.5 V
Maximum tracking rate
    • 10.5 rps
    • 1000 rps
    • 12 rps
    • 12.5 rps
    • 1200 rps
    • 1250 rps
    • 156.25 rps
    • 16.25 rps
    • 170 rps
    • 18 rps
    • 20 rps
    • 22.5 rps
    • 260 rps
    • 27 rps
    • 3 rps
    • 3125 rps
    • 36 rps
    • 42.5 rps
    • 48 rps
    • 5.5 rps
    • 50 rps
    • 500 rps
    • 630 rps
    • 680 rps
    • 90 rps
Power Supplies (V)
    • 24 V
    • 5 V
    • 5,±12 V
    • 5,±12/±15 V
    • 5,±15 V
    • 5/12,±12 V
    • 5/±15 V
    • ±15 V
    • ±5 V
    • ±5/±15 V
Nominal Negative Supply Voltage
    • -12 V
    • -15 V
    • -5 V
Package Style (Meter)
    • Chip Carrier
    • Flatpack
    • Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch
    • Flatpack, Low Profile
    • Flatpack, Low Profile, Fine Pitch
    • In-Line
    • Microelectronic Assembly
    • Small Outline
    • Uncased Chip
Package Equivalence Code
    • DIE OR CHIP
    • DIP18/28,2.2,200
    • DIP20,.3
    • DIP20,.9
    • DIP20/28,2.2,200
    • DIP21/28,2.2,200
    • DIP23/28,2.2,200
    • DIP24,.3
    • DIP28,.6
    • DIP32,.9
    • DIP40,.6
    • DIP40,.9
    • LCC44,.65SQ
    • LDCC20,.4SQ
    • LDCC28,.5SQ
    • LDCC44,.7SQ
    • MODULE,23LEAD,2.2
    • QFP44,.47SQ,32
    • QFP48,.35SQ,20
    • SOP20,.4
    • TQFP48,.3SQ
Sub-Category
    • Position Converters
Minimum Supply Voltage
    • 10.8 V
    • 11.4 V
    • 11.5 V
    • 12 V
    • 13 V
    • 14.25 V
    • 2.5 V
    • 4.5 V
    • 4.75 V
    • 5 V
    • 6.5 V
Terminal Pitch
    • 0.02 in (0.5 mm)
    • 0.031 in (0.8 mm)
    • 0.05 in (1.27 mm)
    • 0.1 in (2.54 mm)
    • 0.2 in (5.08 mm)
Maximum Operating Temperature
    • 105 °C (221 °F)
    • 125 °C (257 °F)
    • 70 °C (158 °F)
    • 85 °C (185 °F)
Signal or Output Frequency
    • 1 kHz
    • 10 kHz
    • 11 kHz
    • 2 kHz
    • 2.6 kHz
    • 2.86 kHz
    • 20 kHz
    • 22 kHz
    • 3 kHz
    • 4.4 kHz
    • 40 kHz
    • 400 Hz
    • 440 Hz
    • 5 kHz
    • 60 Hz
Minimum Operating Temperature
    • -40 °C (-40 °F)
    • -55 °C (-67 °F)
    • 0 °C (32 °F)
Terminal Finish
    • Gold
    • Matte Tin
    • Matte Tin - annealed
    • Nickel Palladium Gold
    • Tin Lead
    • Tin/Lead
    • Tin/Lead (Sn85Pb15)
Terminal Position
    • Dual
    • Quad
    • Single
    • Upper
Maximum Negative Supply Voltage
    • -10 V
    • -12.6 V
    • -13.2 V
    • -15.75 V
    • -16 V
    • -17 V
    • -18 V
    • -5.25 V
JESD-30 Code
    • R-CDIP-P18
    • R-CDIP-P40
    • R-CDIP-T18
    • R-CDIP-T20
    • R-CDIP-T28
    • R-CDIP-T32
    • R-CDIP-T36
    • R-CDIP-T40
    • R-GDIP-T16
    • R-GDIP-T18
    • R-GDIP-T20
    • R-GDIP-T24
    • R-GDIP-T40
    • R-MDIP-P18
    • R-MDIP-P24
    • R-MDIP-P32
    • R-MDIP-P40
    • R-MDIP-T20
    • R-MDIP-T32
    • R-MDMA-P32
    • R-PDFP-F32
    • R-PDIP-T14
    • R-PDIP-T18
    • R-PDIP-T20
    • R-PDIP-T21
    • R-PDIP-T23
    • R-PDSO-G16
    • R-PDSO-G20
    • R-PSMA-P14
    • R-XDIP-T18
    • R-XDIP-T20
    • R-XDIP-T28
    • R-XDIP-T32
    • R-XDIP-T40
    • R-XDMA-P10
    • R-XDMA-P23
    • R-XDMA-P40
    • R-XUUC-N50
    • R-XXMA-P9
    • S-CDSO-G32
    • S-CQCC-N44
    • S-PQCC-J20
    • S-PQCC-J28
    • S-PQCC-J44
    • S-PQFP-G44
    • S-PQFP-G48
    • S-PQFP-G64
    • S-XQCC-N44
    • S-XQFP-G48
    • S-XXMA-P5
Moisture Sensitivity Level (MSL)
    • 1
    • 3
    • 5
Maximum Seated Height
    • 0.015 in (0.38 mm)
    • 0.047 in (1.2 mm)
    • 0.063 in (1.6 mm)
    • 0.1 in (2.54 mm)
    • 0.104 in (2.65 mm)
    • 0.16 in (4.06 mm)
    • 0.18 in (4.57 mm)
    • 0.18 in (4.58 mm)
    • 0.181 in (4.6 mm)
    • 0.185 in (4.7 mm)
    • 0.187 in (4.744 mm)
    • 0.19 in (4.826 mm)
    • 0.195 in (4.95 mm)
    • 0.2 in (5.08 mm)
    • 0.207 in (5.27 mm)
    • 0.225 in (5.72 mm)
    • 0.232 in (5.9 mm)
    • 0.31 in (7.874 mm)
    • 0.326 in (8.289 mm)
    • 0.41 in (10.41 mm)
    • 0.799 in (20.3 mm)
Width
    • 0.154 in (3.9 mm)
    • 0.276 in (7 mm)
    • 0.295 in (7.5 mm)
    • 0.3 in (7.62 mm)
    • 0.353 in (8.9662 mm)
    • 0.394 in (10 mm)
    • 0.453 in (11.505 mm)
    • 0.453 in (11.5062 mm)
    • 0.6 in (15.24 mm)
    • 0.65 in (16.51 mm)
    • 0.651 in (16.545 mm)
    • 0.653 in (16.5862 mm)
    • 0.9 in (22.86 mm)
    • 1 in (25.4 mm)
    • 1.12 in (28.45 mm)
    • 2.626 in (66.7 mm)
Qualification
    • No
    • Yes
Additional Features
    • 11.8 V reference input
    • 115 V reference input
    • 2 V reference input
    • 26 V reference input
    • Also requires a +5 V power supply
    • Also requires a 5 V logic supply
    • Also requires a 5 V logic supply; LG-MAX
    • Angular Accuracy And Tracking Rate Available With 10-Bit Mode
    • Built-in-Test
    • Built-in-Test; Programmable Resolution
    • It can also operate from a ±2.5 V to ±10 V supply
    • LG-MAX
    • Programmable Resolution
    • Programmable resolution; also requires a 5 V logic supply
    • Seated HGT-NOM
    • Tachogenerator
    • Two Channel
    • Two channel; Built-in-Test; 11.8 V reference input
    • Two channel; Built-in-Test; 115 V reference input
    • Two channel; Built-in-Test; 2 V reference input
    • Two channel; Built-in-Test; 26 V reference input
JESD-609 Code
    • e0
    • e3
    • e4
Maximum Time At Peak Reflow Temperature (s)
    • 30 s
    • 40 s
Peak Reflow Temperature (C)
    • 225 °C (437 °F)
    • 240 °C (464 °F)
    • 260 °C (500 °F)
Maximum Angular Accuracy
    • 1 arc min
    • 1.3 arc min
    • 1.5 arc min
    • 10 arc min
    • 11 arc min
    • 15.3 arc min
    • 15.9 arc min
    • 2 arc min
    • 2.5 arc min
    • 2.6 arc min
    • 2.64 arc min
    • 22 arc min
    • 25 arc min
    • 30 arc min
    • 4 arc min
    • 5.2 arc min
    • 5.3 arc min
    • 7 arc min
    • 8 arc min
    • 8.5 arc min
Length
    • 0.157 in (4 mm)
    • 0.276 in (7 mm)
    • 0.353 in (8.965 mm)
    • 0.353 in (8.9662 mm)
    • 0.394 in (10 mm)
    • 0.406 in (10.3 mm)
    • 0.453 in (11.505 mm)
    • 0.453 in (11.5062 mm)
    • 0.504 in (12.8 mm)
    • 0.65 in (16.51 mm)
    • 0.651 in (16.545 mm)
    • 0.653 in (16.5862 mm)
    • 0.752 in (19.09 mm)
    • 0.769 in (19.53 mm)
    • 0.898 in (22.82 mm)
    • 0.92 in (23.37 mm)
    • 0.975 in (24.765 mm)
    • 1 in (25.4 mm)
    • 1.064 in (27.035 mm)
    • 1.12 in (28.45 mm)
    • 1.37 in (34.8 mm)
    • 1.402 in (35.6 mm)
    • 1.49 in (37.85 mm)
    • 1.74 in (44.2 mm)
    • 2 in (50.8 mm)
    • 2.094 in (53.2 mm)
    • 2.096 in (53.24 mm)
    • 2.142 in (54.4 mm)
    • 2.245 in (57.02 mm)
    • 3.126 in (79.4 mm)
Reset All
Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Maximum Analog Output Voltage Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Nominal Supply Voltage Minimum Negative Supply Voltage Maximum tracking rate Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Signal or Output Frequency Minimum Operating Temperature Terminal Finish Terminal Position Maximum Negative Supply Voltage JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Angular Accuracy Length

DSC1705611

Analog Devices

Digital To Synchro Or Resolver

Other

Pin/Peg

23

DMA

Rectangular

No

15.75 V

1

Hybrid

14

15 V

-14.25 V

-15 V

Microelectronic Assembly

MODULE,23LEAD,2.2

14.25 V

0.2 in (5.08 mm)

105 °C (221 °F)

400 Hz

-55 °C (-67 °F)

Dual

-15.75 V

R-XDMA-P23

0.799 in (20.3 mm)

2.626 in (66.7 mm)

No

Seated HGT-NOM

4 arc min

3.126 in (79.4 mm)

DRC1746/LO2/B

Analog Devices

Digital To Synchro Or Resolver

Military

Pin/Peg

40

DIP

Rectangular

6.8 V

No

1

Hybrid

MIL-STD-883 Class B (Modified)

16

184 mA

15 V

5,±15 V

-15 V

Microelectronic Assembly

DIP40,.9

Position Converters

0.1 in (2.54 mm)

125 °C (257 °F)

2.6 kHz

-55 °C (-67 °F)

Tin Lead

Dual

R-XDMA-P40

0.185 in (4.7 mm)

0.9 in (22.86 mm)

No

e0

2 arc min

DRC1745/CT4

Analog Devices

Digital To Synchro Or Resolver

Military

Pin/Peg

40

DIP

Rectangular

6.8 V

No

1

Hybrid

14

120 mA

15 V

±15 V

-15 V

Microelectronic Assembly

DIP40,.9

Position Converters

0.1 in (2.54 mm)

125 °C (257 °F)

2.6 kHz

-55 °C (-67 °F)

Tin Lead

Dual

R-XDMA-P40

0.185 in (4.7 mm)

0.9 in (22.86 mm)

No

e0

4 arc min

AD2S66/511

Analog Devices

Digital To Synchro Or Resolver

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

6.8 V

No

15.75 V

1

Hybrid

16

32 mA

15 V

-14.25 V

±15 V

-15 V

In-Line

DIP32,.9

Position Converters

14.25 V

0.1 in (2.54 mm)

70 °C (158 °F)

2.6 kHz

0 °C (32 °F)

Tin Lead

Dual

-15.75 V

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

1 arc min

AD2S65/424B

Analog Devices

Digital To Synchro Or Resolver

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

6.8 V

No

15.75 V

1

Hybrid

38535Q/M;38534H;883B

14

32 mA

15 V

-14.25 V

±15 V

-15 V

In-Line

DIP32,.9

Position Converters

14.25 V

0.1 in (2.54 mm)

125 °C (257 °F)

2.6 kHz

-55 °C (-67 °F)

Tin Lead

Dual

-15.75 V

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

4 arc min

AD2S66/422

Analog Devices

Digital To Synchro Or Resolver

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

6.8 V

No

15.75 V

1

Hybrid

16

32 mA

15 V

-14.25 V

±15 V

-15 V

In-Line

DIP32,.9

Position Converters

14.25 V

0.1 in (2.54 mm)

125 °C (257 °F)

2.6 kHz

-55 °C (-67 °F)

Tin Lead

Dual

-15.75 V

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

2 arc min

DRC1765/CO2B

Analog Devices

Digital To Synchro Or Resolver

Military

Through-Hole

32

DIP

Rectangular

Metal

No

BICMOS

MIL-STD-883 Class B (Modified)

15 V

±15 V

-15 V

In-Line

DIP32,.9

Position Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-MDIP-T32

No

e0

DRC1746/CO4/B

Analog Devices

Digital To Synchro Or Resolver

Military

Pin/Peg

40

DIP

Rectangular

6.8 V

No

1

Hybrid

MIL-STD-883 Class B (Modified)

16

120 mA

15 V

±15 V

-15 V

Microelectronic Assembly

DIP40,.9

Position Converters

0.1 in (2.54 mm)

125 °C (257 °F)

2.6 kHz

-55 °C (-67 °F)

Tin Lead

Dual

R-XDMA-P40

0.185 in (4.7 mm)

0.9 in (22.86 mm)

No

e0

4 arc min

DRC1745/CO4

Analog Devices

Digital To Synchro Or Resolver

Military

Pin/Peg

40

DIP

Rectangular

6.8 V

No

1

Hybrid

14

120 mA

15 V

±15 V

-15 V

Microelectronic Assembly

DIP40,.9

Position Converters

0.1 in (2.54 mm)

125 °C (257 °F)

2.6 kHz

-55 °C (-67 °F)

Tin Lead

Dual

R-XDMA-P40

0.185 in (4.7 mm)

0.9 in (22.86 mm)

No

e0

4 arc min

STM1679522

Analog Devices

Digital To Synchro Or Resolver

Pin/Peg

14

Rectangular

Plastic/Epoxy

No

Microelectronic Assembly

Single

R-PSMA-P14

No

AD2S65/532

Analog Devices

Digital To Synchro Or Resolver

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

6.8 V

No

15.75 V

1

Hybrid

14

32 mA

15 V

-14.25 V

±15 V

-15 V

In-Line

DIP32,.9

Position Converters

14.25 V

0.1 in (2.54 mm)

70 °C (158 °F)

2.6 kHz

0 °C (32 °F)

Tin Lead

Dual

-15.75 V

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

2 arc min

DRC1746/CT2

Analog Devices

Digital To Synchro Or Resolver

Military

Pin/Peg

40

DIP

Rectangular

6.8 V

No

1

Hybrid

16

120 mA

15 V

±15 V

-15 V

Microelectronic Assembly

DIP40,.9

Position Converters

0.1 in (2.54 mm)

125 °C (257 °F)

2.6 kHz

-55 °C (-67 °F)

Tin Lead

Dual

R-XDMA-P40

0.185 in (4.7 mm)

0.9 in (22.86 mm)

No

e0

2 arc min

AD2S65/434B

Analog Devices

Digital To Synchro Or Resolver

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

6.8 V

No

15.75 V

1

Hybrid

38535Q/M;38534H;883B

14

32 mA

15 V

-14.25 V

±15 V

-15 V

In-Line

DIP32,.9

Position Converters

14.25 V

0.1 in (2.54 mm)

125 °C (257 °F)

2.6 kHz

-55 °C (-67 °F)

Tin Lead

Dual

-15.75 V

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

4 arc min

DRC1766/LO4B

Analog Devices

Digital To Synchro Or Resolver

Military

Through-Hole

32

DIP

Rectangular

Metal

No

BICMOS

MIL-STD-883 Class B (Modified)

5,±15 V

In-Line

DIP32,.9

Position Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-MDIP-T32

No

e0

AD2S66/414B

Analog Devices

Digital To Synchro Or Resolver

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

6.8 V

No

15.75 V

1

Hybrid

38535Q/M;38534H;883B

16

32 mA

15 V

-14.25 V

±15 V

-15 V

In-Line

DIP32,.9

Position Converters

14.25 V

0.1 in (2.54 mm)

125 °C (257 °F)

2.6 kHz

-55 °C (-67 °F)

Tin Lead

Dual

-15.75 V

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

4 arc min

DRC1745/LT4/B

Analog Devices

Digital To Synchro Or Resolver

Military

Pin/Peg

40

DIP

Rectangular

6.8 V

No

1

Hybrid

MIL-STD-883 Class B (Modified)

14

184 mA

15 V

5,±15 V

-15 V

Microelectronic Assembly

DIP40,.9

Position Converters

0.1 in (2.54 mm)

125 °C (257 °F)

2.6 kHz

-55 °C (-67 °F)

Tin Lead

Dual

R-XDMA-P40

0.185 in (4.7 mm)

0.9 in (22.86 mm)

No

e0

4 arc min

DRC1765/CO2

Analog Devices

Digital To Synchro Or Resolver

Military

Through-Hole

32

DIP

Rectangular

Metal

No

BICMOS

15 V

±15 V

-15 V

In-Line

DIP32,.9

Position Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-MDIP-T32

No

e0

DRC1765/LO2

Analog Devices

Digital To Synchro Or Resolver

Military

Through-Hole

32

DIP

Rectangular

Metal

No

BICMOS

5,±15 V

In-Line

DIP32,.9

Position Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-MDIP-T32

No

e0

DRC1745/CT4/B

Analog Devices

Digital To Synchro Or Resolver

Military

Pin/Peg

40

DIP

Rectangular

6.8 V

No

1

Hybrid

MIL-STD-883 Class B (Modified)

14

120 mA

15 V

±15 V

-15 V

Microelectronic Assembly

DIP40,.9

Position Converters

0.1 in (2.54 mm)

125 °C (257 °F)

2.6 kHz

-55 °C (-67 °F)

Tin Lead

Dual

R-XDMA-P40

0.185 in (4.7 mm)

0.9 in (22.86 mm)

No

e0

4 arc min

AD2S66/412

Analog Devices

Digital To Synchro Or Resolver

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

6.8 V

No

15.75 V

1

Hybrid

16

32 mA

15 V

-14.25 V

±15 V

-15 V

In-Line

DIP32,.9

Position Converters

14.25 V

0.1 in (2.54 mm)

125 °C (257 °F)

2.6 kHz

-55 °C (-67 °F)

Tin Lead

Dual

-15.75 V

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

2 arc min

AD2S66/521

Analog Devices

Digital To Synchro Or Resolver

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

6.8 V

No

15.75 V

1

Hybrid

16

32 mA

15 V

-14.25 V

±15 V

-15 V

In-Line

DIP32,.9

Position Converters

14.25 V

0.1 in (2.54 mm)

70 °C (158 °F)

2.6 kHz

0 °C (32 °F)

Tin Lead

Dual

-15.75 V

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

1 arc min

AD2S65/422B

Analog Devices

Digital To Synchro Or Resolver

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

6.8 V

No

15.75 V

1

Hybrid

38535Q/M;38534H;883B

14

32 mA

15 V

-14.25 V

±15 V

-15 V

In-Line

DIP32,.9

Position Converters

14.25 V

0.1 in (2.54 mm)

125 °C (257 °F)

2.6 kHz

-55 °C (-67 °F)

Tin Lead

Dual

-15.75 V

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

2 arc min

DRC1765/LO4B

Analog Devices

Digital To Synchro Or Resolver

Military

Through-Hole

32

DIP

Rectangular

Metal

No

BICMOS

MIL-STD-883 Class B (Modified)

5,±15 V

In-Line

DIP32,.9

Position Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-MDIP-T32

No

e0

AD2S66/421B

Analog Devices

Digital To Synchro Or Resolver

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

6.8 V

No

15.75 V

1

Hybrid

38535Q/M;38534H;883B

16

32 mA

15 V

-14.25 V

±15 V

-15 V

In-Line

DIP32,.9

Position Converters

14.25 V

0.1 in (2.54 mm)

125 °C (257 °F)

2.6 kHz

-55 °C (-67 °F)

Tin Lead

Dual

-15.75 V

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

1 arc min

DRC1766/LO4

Analog Devices

Digital To Synchro Or Resolver

Military

Through-Hole

32

DIP

Rectangular

Metal

No

BICMOS

5,±15 V

In-Line

DIP32,.9

Position Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-MDIP-T32

No

e0

DRC1766/CO4

Analog Devices

Digital To Synchro Or Resolver

Military

Through-Hole

32

DIP

Rectangular

Metal

No

BICMOS

15 V

±15 V

-15 V

In-Line

DIP32,.9

Position Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-MDIP-T32

No

e0

DSC1705511

Analog Devices

Digital To Synchro Or Resolver

Commercial

Pin/Peg

23

DMA

Rectangular

No

15.75 V

1

Hybrid

14

15 V

-14.25 V

-15 V

Microelectronic Assembly

MODULE,23LEAD,2.2

14.25 V

0.2 in (5.08 mm)

70 °C (158 °F)

400 Hz

0 °C (32 °F)

Dual

-15.75 V

R-XDMA-P23

0.799 in (20.3 mm)

2.626 in (66.7 mm)

No

Seated HGT-NOM

4 arc min

3.126 in (79.4 mm)

AD2S65/432B

Analog Devices

Digital To Synchro Or Resolver

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

6.8 V

No

15.75 V

1

Hybrid

38535Q/M;38534H;883B

14

32 mA

15 V

-14.25 V

±15 V

-15 V

In-Line

DIP32,.9

Position Converters

14.25 V

0.1 in (2.54 mm)

125 °C (257 °F)

2.6 kHz

-55 °C (-67 °F)

Tin Lead

Dual

-15.75 V

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

2 arc min

AD2S66/411

Analog Devices

Digital To Synchro Or Resolver

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

6.8 V

No

15.75 V

1

Hybrid

16

32 mA

15 V

-14.25 V

±15 V

-15 V

In-Line

DIP32,.9

Position Converters

14.25 V

0.1 in (2.54 mm)

125 °C (257 °F)

2.6 kHz

-55 °C (-67 °F)

Tin Lead

Dual

-15.75 V

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

1 arc min

AD2S65/412B

Analog Devices

Digital To Synchro Or Resolver

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

6.8 V

No

15.75 V

1

Hybrid

38535Q/M;38534H;883B

14

32 mA

15 V

-14.25 V

±15 V

-15 V

In-Line

DIP32,.9

Position Converters

14.25 V

0.1 in (2.54 mm)

125 °C (257 °F)

2.6 kHz

-55 °C (-67 °F)

Tin Lead

Dual

-15.75 V

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

2 arc min

DRC1765/LO4

Analog Devices

Digital To Synchro Or Resolver

Military

Through-Hole

32

DIP

Rectangular

Metal

No

BICMOS

5,±15 V

In-Line

DIP32,.9

Position Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-MDIP-T32

No

e0

DSC1706607

Analog Devices

Digital To Synchro Or Resolver

Other

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

225 mA

15 V

±15 V

-15 V

In-Line

DIP18/28,2.2,200

Position Converters

0.2 in (5.08 mm)

105 °C (221 °F)

-55 °C (-67 °F)

Dual

R-PDIP-T18

No

DRC1706518

Analog Devices

Digital To Synchro Or Resolver

Commercial

Through-Hole

21

DIP

Rectangular

Plastic/Epoxy

No

225 mA

15 V

±15 V

-15 V

In-Line

DIP21/28,2.2,200

Position Converters

0.2 in (5.08 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T21

No

AD2S65/432

Analog Devices

Digital To Synchro Or Resolver

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

6.8 V

No

15.75 V

1

Hybrid

14

32 mA

15 V

-14.25 V

±15 V

-15 V

In-Line

DIP32,.9

Position Converters

14.25 V

0.1 in (2.54 mm)

125 °C (257 °F)

2.6 kHz

-55 °C (-67 °F)

Tin Lead

Dual

-15.75 V

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

2 arc min

DRC1746/CO2/B

Analog Devices

Digital To Synchro Or Resolver

Military

Pin/Peg

40

DIP

Rectangular

6.8 V

No

1

Hybrid

MIL-STD-883 Class B (Modified)

16

120 mA

15 V

±15 V

-15 V

Microelectronic Assembly

DIP40,.9

Position Converters

0.1 in (2.54 mm)

125 °C (257 °F)

2.6 kHz

-55 °C (-67 °F)

Tin Lead

Dual

R-XDMA-P40

0.185 in (4.7 mm)

0.9 in (22.86 mm)

No

e0

2 arc min

AD2S65/412

Analog Devices

Digital To Synchro Or Resolver

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

6.8 V

No

15.75 V

1

Hybrid

14

32 mA

15 V

-14.25 V

±15 V

-15 V

In-Line

DIP32,.9

Position Converters

14.25 V

0.1 in (2.54 mm)

125 °C (257 °F)

2.6 kHz

-55 °C (-67 °F)

Tin Lead

Dual

-15.75 V

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

2 arc min

DSC1705607

Analog Devices

Digital To Synchro Or Resolver

Other

Pin/Peg

23

DMA

Rectangular

No

15.75 V

1

Hybrid

14

15 V

-14.25 V

-15 V

Microelectronic Assembly

MODULE,23LEAD,2.2

14.25 V

0.2 in (5.08 mm)

105 °C (221 °F)

60 Hz

-55 °C (-67 °F)

Dual

-15.75 V

R-XDMA-P23

0.799 in (20.3 mm)

2.626 in (66.7 mm)

No

Seated HGT-NOM

4 arc min

3.126 in (79.4 mm)

DSC1706511

Analog Devices

Digital To Synchro Or Resolver

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

225 mA

15 V

±15 V

-15 V

In-Line

DIP20/28,2.2,200

Position Converters

0.2 in (5.08 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T20

No

DRC1765/CO4B

Analog Devices

Digital To Synchro Or Resolver

Military

Through-Hole

32

DIP

Rectangular

Metal

No

BICMOS

MIL-STD-883 Class B (Modified)

15 V

±15 V

-15 V

In-Line

DIP32,.9

Position Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-MDIP-T32

No

e0

DRC1766/CO4B

Analog Devices

Digital To Synchro Or Resolver

Military

Through-Hole

32

DIP

Rectangular

Metal

No

BICMOS

MIL-STD-883 Class B (Modified)

15 V

±15 V

-15 V

In-Line

DIP32,.9

Position Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-MDIP-T32

No

e0

DRC1746/CT4

Analog Devices

Digital To Synchro Or Resolver

Military

Pin/Peg

40

DIP

Rectangular

6.8 V

No

1

Hybrid

16

120 mA

15 V

±15 V

-15 V

Microelectronic Assembly

DIP40,.9

Position Converters

0.1 in (2.54 mm)

125 °C (257 °F)

2.6 kHz

-55 °C (-67 °F)

Tin Lead

Dual

R-XDMA-P40

0.185 in (4.7 mm)

0.9 in (22.86 mm)

No

e0

4 arc min

DRC1765/CO4

Analog Devices

Digital To Synchro Or Resolver

Military

Through-Hole

32

DIP

Rectangular

Metal

No

BICMOS

15 V

±15 V

-15 V

In-Line

DIP32,.9

Position Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-MDIP-T32

No

e0

DRC1745/CT2/B

Analog Devices

Digital To Synchro Or Resolver

Military

Pin/Peg

40

DIP

Rectangular

6.8 V

No

1

Hybrid

MIL-STD-883 Class B (Modified)

14

120 mA

15 V

±15 V

-15 V

Microelectronic Assembly

DIP40,.9

Position Converters

0.1 in (2.54 mm)

125 °C (257 °F)

2.6 kHz

-55 °C (-67 °F)

Tin Lead

Dual

R-XDMA-P40

0.185 in (4.7 mm)

0.9 in (22.86 mm)

No

e0

2 arc min

DSC1705518

Analog Devices

Digital To Synchro Or Resolver

Pin/Peg

14

Rectangular

Plastic/Epoxy

No

Microelectronic Assembly

Single

R-PSMA-P14

No

DRC1746/CO2

Analog Devices

Digital To Synchro Or Resolver

Military

Pin/Peg

40

DIP

Rectangular

6.8 V

No

1

Hybrid

16

120 mA

15 V

±15 V

-15 V

Microelectronic Assembly

DIP40,.9

Position Converters

0.1 in (2.54 mm)

125 °C (257 °F)

2.6 kHz

-55 °C (-67 °F)

Tin Lead

Dual

R-XDMA-P40

0.185 in (4.7 mm)

0.9 in (22.86 mm)

No

e0

2 arc min

DSC1705512

Analog Devices

Digital To Synchro Or Resolver

Commercial

Pin/Peg

23

DMA

Rectangular

No

15.75 V

1

Hybrid

14

15 V

-14.25 V

-15 V

Microelectronic Assembly

MODULE,23LEAD,2.2

14.25 V

0.2 in (5.08 mm)

70 °C (158 °F)

400 Hz

0 °C (32 °F)

Dual

-15.75 V

R-XDMA-P23

0.799 in (20.3 mm)

2.626 in (66.7 mm)

No

Seated HGT-NOM

4 arc min

3.126 in (79.4 mm)

AD2S66/514

Analog Devices

Digital To Synchro Or Resolver

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

6.8 V

No

15.75 V

1

Hybrid

16

32 mA

15 V

-14.25 V

±15 V

-15 V

In-Line

DIP32,.9

Position Converters

14.25 V

0.1 in (2.54 mm)

70 °C (158 °F)

2.6 kHz

0 °C (32 °F)

Tin Lead

Dual

-15.75 V

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

4 arc min

AD2S66/522

Analog Devices

Digital To Synchro Or Resolver

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

6.8 V

No

15.75 V

1

Hybrid

16

32 mA

15 V

-14.25 V

±15 V

-15 V

In-Line

DIP32,.9

Position Converters

14.25 V

0.1 in (2.54 mm)

70 °C (158 °F)

2.6 kHz

0 °C (32 °F)

Tin Lead

Dual

-15.75 V

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

2 arc min

Data Acquisition ADCs & DACs

Data acquisition (DAQ) ADCs and DACs are specialized analog-to-digital converters (ADCs) and digital-to-analog converters (DACs) used in data acquisition systems to measure and control analog signals. These devices play a critical role in collecting and processing data from sensors, transducers, and other sources, and in generating control signals for actuators, motors, and other devices.

DAQ ADCs convert analog signals into digital signals with high resolution and accuracy, and they often include features such as programmable gain, filtering, and signal conditioning, to improve the quality of the measured signal. DAQ DACs, on the other hand, convert digital signals into analog signals with high precision and stability, and they often include features such as voltage and current output ranges, programmable output settings, and output buffering.

DAQ ADCs and DACs are used in a wide range of applications, from industrial automation and process control, to scientific research and test and measurement systems. They can be integrated into DAQ systems, which typically include analog signal conditioning circuits, digital signal processing circuits, and data storage and communication interfaces.

DAQ ADCs and DACs are designed to provide high accuracy, low noise, and fast conversion rates, to meet the demands of real-time data acquisition and control applications. They may also include features such as hardware triggering, synchronous sampling, and signal averaging, to improve the performance and the flexibility of the DAQ system.