18 Data Acquisition ADCs & DACs 13

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Maximum Analog Output Voltage Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Nominal Supply Voltage Minimum Negative Supply Voltage Maximum tracking rate Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Signal or Output Frequency Minimum Operating Temperature Terminal Finish Terminal Position Maximum Negative Supply Voltage JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Angular Accuracy Length

OSC1758400

Analog Devices

Excitation Oscillator

Military

Pin/Peg

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2.5 V

No

1

Hybrid

60 mA

15 V

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

10 kHz

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-P18

0.18 in (4.57 mm)

0.6 in (15.24 mm)

No

e0

0.975 in (24.765 mm)

DSC1706607

Analog Devices

Digital To Synchro Or Resolver

Other

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

225 mA

15 V

±15 V

-15 V

In-Line

DIP18/28,2.2,200

Position Converters

0.2 in (5.08 mm)

105 °C (221 °F)

-55 °C (-67 °F)

Dual

R-PDIP-T18

No

OSC1758400B

Analog Devices

Excitation Oscillator

Military

Pin/Peg

18

DIP

Rectangular

Metal

2.5 V

No

1

Hybrid

60 mA

15 V

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

10 kHz

-55 °C (-67 °F)

Tin Lead

Dual

R-MDIP-P18

0.18 in (4.58 mm)

0.6 in (15.24 mm)

No

e0

0.975 in (24.765 mm)

OSC1758500

Analog Devices

Excitation Oscillator

Commercial

Pin/Peg

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2.5 V

No

1

Hybrid

60 mA

15 V

-15 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

10 kHz

0 °C (32 °F)

Tin Lead

Dual

R-CDIP-P18

0.18 in (4.57 mm)

0.6 in (15.24 mm)

No

e0

0.975 in (24.765 mm)

DSC1706507

Analog Devices

Digital To Synchro Or Resolver

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

225 mA

15 V

±15 V

-15 V

In-Line

DIP18/28,2.2,200

Position Converters

0.2 in (5.08 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T18

No

OSC1758500B

Analog Devices

Excitation Oscillator

Commercial

Pin/Peg

18

DIP

Rectangular

Metal

No

1

15 V

-15 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-MDIP-P18

0.18 in (4.58 mm)

0.6 in (15.24 mm)

No

e0

0.975 in (24.765 mm)

5521/BVA

NXP Semiconductors

Signal Conditioner

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

20 V

1

10 V

In-Line

5 V

125 °C (257 °F)

1 kHz

-55 °C (-67 °F)

Dual

R-CDIP-T18

No

NE5521F

NXP Semiconductors

Signal Conditioner

Commercial

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

10 V

1

-2.5 V

In-Line

2.5 V

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

-10 V

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

0.898 in (22.82 mm)

SE5521F

NXP Semiconductors

Signal Conditioner

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

20 V

1

18 mA

10 V

In-Line

5 V

0.1 in (2.54 mm)

125 °C (257 °F)

20 kHz

-55 °C (-67 °F)

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

It can also operate from a ±2.5 V to ±10 V supply

0.898 in (22.82 mm)

SA5521N

NXP Semiconductors

Signal Conditioner

Industrial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

20 V

1

10 V

In-Line

5 V

0.1 in (2.54 mm)

85 °C (185 °F)

20 kHz

-40 °C (-40 °F)

Dual

R-PDIP-T18

0.16 in (4.06 mm)

0.3 in (7.62 mm)

No

It can also operate from a ±2.5 V to ±10 V supply

0.92 in (23.37 mm)

5962-9087901MVX

NXP Semiconductors

Signal Conditioner

Military

Through-Hole

18

DIP

Rectangular

No

1

MIL-STD-883

10 V

In-Line

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

5962-9087901MVA

NXP Semiconductors

Signal Conditioner

Military

Through-Hole

18

DIP

Rectangular

No

1

MIL-STD-883

10 V

In-Line

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

NE5521N

NXP Semiconductors

Signal Conditioner

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

20 V

1

10 V

In-Line

5 V

0.1 in (2.54 mm)

70 °C (158 °F)

20 kHz

0 °C (32 °F)

Dual

R-PDIP-T18

0.16 in (4.06 mm)

0.3 in (7.62 mm)

No

It can also operate from a ±2.5 V to ±10 V supply

0.92 in (23.37 mm)

Data Acquisition ADCs & DACs

Data acquisition (DAQ) ADCs and DACs are specialized analog-to-digital converters (ADCs) and digital-to-analog converters (DACs) used in data acquisition systems to measure and control analog signals. These devices play a critical role in collecting and processing data from sensors, transducers, and other sources, and in generating control signals for actuators, motors, and other devices.

DAQ ADCs convert analog signals into digital signals with high resolution and accuracy, and they often include features such as programmable gain, filtering, and signal conditioning, to improve the quality of the measured signal. DAQ DACs, on the other hand, convert digital signals into analog signals with high precision and stability, and they often include features such as voltage and current output ranges, programmable output settings, and output buffering.

DAQ ADCs and DACs are used in a wide range of applications, from industrial automation and process control, to scientific research and test and measurement systems. They can be integrated into DAQ systems, which typically include analog signal conditioning circuits, digital signal processing circuits, and data storage and communication interfaces.

DAQ ADCs and DACs are designed to provide high accuracy, low noise, and fast conversion rates, to meet the demands of real-time data acquisition and control applications. They may also include features such as hardware triggering, synchronous sampling, and signal averaging, to improve the performance and the flexibility of the DAQ system.