Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Maximum Analog Output Voltage | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | No. of Bits | Maximum Settling Time | Maximum Supply Current | Maximum Linearity Error (EL) | Input Format | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Nominal Settling Time (tstl) | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Minimum Analog Output Voltage | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Maxim Integrated |
Digital to Analog converter |
Industrial |
Gull Wing |
16 |
SSOP |
Rectangular |
Plastic/Epoxy |
10 V |
Yes |
1 |
BICMOS |
12 |
0.0244 % |
Serial |
2.7 V |
Small Outline, Shrink Pitch |
10 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G16 |
1 |
0.078 in (1.99 mm) |
0.208 in (5.29 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
-10 V |
0.244 in (6.2 mm) |
Binary |
|||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Industrial |
Gull Wing |
16 |
SSOP |
Rectangular |
Plastic/Epoxy |
10 V |
Yes |
1 |
BICMOS |
12 |
0.0244 % |
Serial |
2.7 V |
Small Outline, Shrink Pitch |
10 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Dual |
R-PDSO-G16 |
0.078 in (1.99 mm) |
0.208 in (5.29 mm) |
No |
-10 V |
0.244 in (6.2 mm) |
Binary |
|||||||||||||||||||||||||
Microchip Technology |
Digital to Analog converter |
Automotive |
No Lead |
10 |
HVSON |
Square |
Plastic/Epoxy |
Yes |
1 |
8 |
720 μA |
0.0391 % |
Serial |
Small Outline, Heat Sink/Slug, Very Thin Profile |
SOLCC10,.12,20 |
16 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Dual |
S-PDSO-N10 |
0.039 in (1 mm) |
0.118 in (3 mm) |
0.118 in (3 mm) |
Binary |
||||||||||||||||||||||||||||
Microchip Technology |
Digital to Analog converter |
Automotive |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
Yes |
1 |
12 |
720 μA |
0.0244 % |
Serial |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.25 |
16 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Dual |
S-PDSO-G8 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
0.118 in (3 mm) |
Binary |
||||||||||||||||||||||||||||
|
Microchip Technology |
Digital to Analog converter |
Automotive |
Gull Wing |
8 |
TSSOP |
Rectangular |
Plastic/Epoxy |
5.46 V |
Yes |
1 |
TS 16949 |
12 |
700 μA |
0.1464 % |
Serial |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.25 |
6 µs |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G8 |
0.047 in (1.2 mm) |
0.118 in (3 mm) |
e3 |
.01 V |
0.173 in (4.4 mm) |
Binary |
|||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
5.499 V |
Yes |
1 |
CMOS |
8 |
8 µs |
375 μA |
0.1953 % |
Serial |
3 V |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Other Converters |
6 µs |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
.001 V |
0.118 in (3 mm) |
Binary |
||||||||||||||
Analog Devices |
Digital to Analog converter |
Automotive |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
5.2 V |
Yes |
1 |
CMOS |
8 |
160 ns |
5 μA |
0.0977 % |
Serial |
2.5 V |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
Other Converters |
90 ns |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
240 °C (464 °F) |
0 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
61.5 V |
Yes |
1 |
12 |
55 µs |
3 mA |
0.0732 % |
Serial |
30 V |
2.5/5,10/62 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP16,.25 |
Other Converters |
25 µs |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G16 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
.5 V |
0.197 in (5 mm) |
Binary |
|||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
4.5 V |
Yes |
1 |
CMOS |
14 |
1.1 mA |
0.0061 % |
Serial |
5 V |
5 V |
Small Outline |
SOP8,.25 |
Other Converters |
1 µs |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e0 |
240 °C (464 °F) |
0 V |
0.193 in (4.9 mm) |
Binary |
|||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Automotive |
Gull Wing |
6 |
TSSOP |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
10 |
10 µs |
100 μA |
0.0488 % |
Serial |
5 V |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP6,.08 |
Other Converters |
6 µs |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G6 |
1 |
0.043 in (1.1 mm) |
0.049 in (1.25 mm) |
No |
e4 |
260 °C (500 °F) |
0 V |
0.079 in (2 mm) |
Binary |
|||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
16 |
7 µs |
0.0183 % |
Serial |
5 V |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
Other Converters |
4 µs |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e4 |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
16 |
7 µs |
0.0183 % |
Serial |
5 V |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
Other Converters |
4 µs |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e4 |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
5.005 V |
Yes |
1 |
16 |
0.0122 % |
Serial |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
5 µs |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Yes |
1 |
16 |
11 mA |
0.006 % |
Serial |
15 V |
3/5,5,15 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Other Converters |
15 µs |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
5 V |
Yes |
2 |
BICMOS |
12 |
8 µs |
15 mA |
0.0122 % |
Parallel, Word |
15 V |
12/15,GND/-12/-15 V |
-15 V |
Small Outline |
SOP24,.4 |
Other Converters |
5 µs |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G24 |
3 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
-5 V |
0.606 in (15.4 mm) |
Binary |
|||||||||||||
Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic |
No |
1 |
CMOS |
12 |
2 mA |
0.024 % |
15 V |
15 V |
In-Line |
DIP18,.3 |
Other Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin/Lead |
Dual |
R-XDIP-T18 |
e0 |
Binary, Offset Binary |
|||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
12 |
2 mA |
0.024 % |
Parallel, Word |
15 V |
15 V |
In-Line |
DIP18,.3 |
Other Converters |
600 ns |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-GDIP-T18 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
Binary, Offset Binary |
||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
18 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
1 |
CMOS |
12 |
2 mA |
0.0244 % |
Parallel, Word |
15 V |
15 V |
In-Line |
DIP18,.3 |
Other Converters |
600 ns |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T18 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.885 in (22.479 mm) |
Binary, Offset Binary |
|||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
18 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
1 |
CMOS |
12 |
2 mA |
0.024 % |
15 V |
15 V |
In-Line |
DIP18,.3 |
Other Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin/Lead |
Dual |
R-PDIP-T18 |
e0 |
Binary, Offset Binary |
|||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Commercial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
1 |
CMOS |
12 |
2 mA |
0.012 % |
Parallel, Word |
15 V |
15 V |
Chip Carrier |
LDCC20,.4SQ |
Other Converters |
600 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J20 |
1 |
0.18 in (4.57 mm) |
0.353 in (8.9662 mm) |
No |
e0 |
225 °C (437 °F) |
0.353 in (8.9662 mm) |
Binary, Offset Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Commercial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
1 |
CMOS |
12 |
2 mA |
0.012 % |
Parallel, Word |
15 V |
15 V |
Chip Carrier |
LDCC20,.4SQ |
Other Converters |
600 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J20 |
1 |
0.18 in (4.57 mm) |
0.353 in (8.9662 mm) |
No |
e0 |
225 °C (437 °F) |
0.353 in (8.9662 mm) |
Binary, Offset Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
1 |
CMOS |
12 |
2 mA |
0.012 % |
Parallel, Word |
15 V |
15 V |
Chip Carrier |
LDCC20,.4SQ |
Other Converters |
600 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J20 |
1 |
0.18 in (4.57 mm) |
0.353 in (8.9662 mm) |
No |
e3 |
260 °C (500 °F) |
0.353 in (8.9662 mm) |
Binary, Offset Binary |
||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
1 |
CMOS |
12 |
2 mA |
0.012 % |
Parallel, Word |
15 V |
15 V |
Chip Carrier |
LDCC20,.4SQ |
Other Converters |
600 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J20 |
1 |
0.18 in (4.57 mm) |
0.353 in (8.9662 mm) |
No |
e3 |
260 °C (500 °F) |
0.353 in (8.9662 mm) |
Binary, Offset Binary |
||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
18 |
SOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
CMOS |
12 |
2 mA |
0.0122 % |
Parallel, Word |
15 V |
15 V |
Small Outline |
SOP18,.4 |
Other Converters |
600 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G18 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
240 °C (464 °F) |
0.455 in (11.55 mm) |
Binary, Offset Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
12 |
2 mA |
0.024 % |
Parallel, Word |
15 V |
15 V |
In-Line |
DIP18,.3 |
Other Converters |
600 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T18 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
Binary, Offset Binary |
||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
1.25 V |
Yes |
1 |
CMOS |
14 |
15 mA |
0.0244 % |
Parallel, Word |
5 V |
3.3/5 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Other Converters |
35 ns |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G48 |
3 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
-1 V |
0.276 in (7 mm) |
Binary |
|||||||||||||||
|
Cirrus Logic |
Digital to Analog converter |
Industrial |
Gull Wing |
14 |
LSOP |
Rectangular |
Plastic/Epoxy |
5.65 V |
Yes |
1 |
24 |
13 mA |
Serial |
5 V |
5 V |
Small Outline, Low Profile |
SOP14,.25 |
Other Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Dual |
R-PDSO-G14 |
0.061 in (1.549 mm) |
0.154 in (3.9 mm) |
No |
0 V |
0.341 in (8.66 mm) |
2's Complement Binary |
|||||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Automotive |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
2.5 MHz |
1 |
CMOS |
10 |
6 µs |
855 μA |
0.1953 % |
Serial |
3 V |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP16,.25 |
Other Converters |
6 µs |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G16 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.197 in (5 mm) |
Binary |
|||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Automotive |
No Lead |
6 |
HVSON |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
180 kHz |
1 |
CMOS |
12 |
8.5 µs |
500 μA |
0.1953 % |
Serial |
3 V |
3/5 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
SOLCC6,.1,25 |
Other Converters |
8.5 µs |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-N6 |
1 |
0.031 in (0.8 mm) |
0.087 in (2.2 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.098 in (2.5 mm) |
Binary |
|||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
No Lead |
16 |
HVQCCN |
Square |
Plastic/Epoxy |
Yes |
1 |
CMOS |
16 |
115 μA |
0.005 % |
Serial |
3/3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC16,.16SQ,20 |
Other Converters |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-N16 |
3 |
0.033 in (0.85 mm) |
0.157 in (4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.157 in (4 mm) |
Binary |
|||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Automotive |
Gull Wing |
6 |
TSSOP |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
83 kHz |
1 |
8 |
10 µs |
160 μA |
0.0977 % |
Serial |
3 V |
2/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP6,.08 |
Other Converters |
6 µs |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G6 |
1 |
0.043 in (1.1 mm) |
0.049 in (1.25 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.079 in (2 mm) |
Binary |
||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Gull Wing |
48 |
TFQFP |
Square |
Plastic/Epoxy |
1.25 V |
Yes |
275 MHz |
2 |
CMOS |
14 |
90 mA |
0.0244 % |
Parallel, Word |
3.3 V |
3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP48,.35SQ |
Other Converters |
20 ns |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G48 |
2 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
-1 V |
0.276 in (7 mm) |
Offset Binary |
||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Gull Wing |
48 |
TFQFP |
Square |
Plastic/Epoxy |
1.25 V |
Yes |
2 |
CMOS |
14 |
90 mA |
0.0244 % |
Parallel, Word |
3.3 V |
3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP48,.35SQ |
Other Converters |
20 ns |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G48 |
2 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
-1 V |
0.276 in (7 mm) |
Offset Binary |
|||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Automotive |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
100 kHz |
1 |
12 |
10 µs |
1.3 mA |
0.0183 % |
Serial |
3.6 V |
3/5 V |
Small Outline |
TSSOP10,.19,20 |
Other Converters |
7 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Dual |
S-PDSO-G10 |
2 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e4 |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Automotive |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
Yes |
83 kHz |
1 |
12 |
10 µs |
1.4 mA |
0.024 % |
Serial |
5 V |
3/5 V |
Small Outline |
TSSOP16,.25 |
Other Converters |
7 µs |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Dual |
R-PDSO-G16 |
3 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e4 |
260 °C (500 °F) |
0.197 in (5 mm) |
Binary |
|||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Gull Wing |
48 |
SSOP |
Rectangular |
Plastic/Epoxy |
10 V |
Yes |
89 kHz |
1 |
CMOS |
16 |
10 µs |
0.0061 % |
Serial |
15 V |
5,15/±15 V |
-15 V |
Small Outline, Shrink Pitch |
SSOP48,.4 |
Other Converters |
10 µs |
0.025 in (0.635 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G48 |
3 |
0.11 in (2.79 mm) |
0.295 in (7.49 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
-10 V |
0.625 in (15.875 mm) |
Binary |
|||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Automotive |
No Lead |
14 |
VSON |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
200 kHz |
1 |
16 |
8 µs |
5.5 mA |
0.0015 % |
Serial |
Small Outline, Very Thin Profile |
5.8 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-N14 |
2 |
0.039 in (1 mm) |
0.118 in (3 mm) |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.157 in (4 mm) |
Binary |
|||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
2.5025 V |
Yes |
200 kHz |
1 |
16 |
10 µs |
1.5 mA |
0.0122 % |
Serial |
3 V |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP16,.25 |
Other Converters |
8 µs |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G16 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.197 in (5 mm) |
Binary, 2's Complement Binary |
||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
6 V |
Yes |
1 |
16 |
24 mA |
0.1 % |
Serial |
5 V |
±5 V |
-5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP16,.25 |
Other Converters |
650 ns |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G16 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
-3 V |
0.197 in (5 mm) |
2's Complement Binary |
|||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
4.096 V |
Yes |
1 |
CMOS |
16 |
0.0305 % |
Serial |
5 V |
Small Outline |
20 µs |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e3 |
0 V |
0.193 in (4.9 mm) |
Binary |
|||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
16 |
SSOP |
Rectangular |
Plastic/Epoxy |
Yes |
4 |
16 |
0.0977 % |
Serial |
3 V |
Small Outline, Shrink Pitch |
10 µs |
0.025 in (0.635 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G16 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.899 mm) |
No |
e0 |
0.193 in (4.8895 mm) |
Binary |
|||||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
16 |
0.0015 % |
Serial |
3 V |
Small Outline |
1 µs |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
-2.5 V |
0.118 in (3 mm) |
Offset Binary |
||||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
2.25 V |
No |
8 |
BICMOS |
8 |
2 µs |
9 mA |
0.3906 % |
Serial |
12 V |
12,GND/-5 V |
-5 V |
In-Line |
DIP20,.3 |
Other Converters |
1 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T20 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0 V |
1.03 in (26.16 mm) |
Binary |
||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
2.25 V |
No |
8 |
BICMOS |
8 |
2 µs |
9 mA |
0.3906 % |
Serial |
12 V |
12,GND/-5 V |
-5 V |
In-Line |
DIP20,.3 |
Other Converters |
1 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
R-PDIP-T20 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
1.03 in (26.16 mm) |
Binary |
|||||||||||||
|
Microchip Technology |
Digital to Analog converter |
Automotive |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
TS 16949 |
10 |
400 μA |
0.354 % |
Serial |
3 V |
3/5 V |
Small Outline, Low Profile, Shrink Pitch |
TSOP6,.11,37 |
Other Converters |
6 µs |
0.037 in (0.95 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G6 |
1 |
0.057 in (1.45 mm) |
0.061 in (1.55 mm) |
No |
e3 |
260 °C (500 °F) |
0.114 in (2.9 mm) |
Binary |
||||||||||||||||||
|
Microchip Technology |
Digital to Analog converter |
Automotive |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
12 |
1.4 mA |
0.3174 % |
Serial |
5 V |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
Other Converters |
6 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||||
Microchip Technology |
Digital to Analog converter |
Automotive |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
Yes |
1 |
12 |
620 μA |
0.0244 % |
Serial |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.25 |
16 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Dual |
S-PDSO-G8 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
0.118 in (3 mm) |
Binary |
||||||||||||||||||||||||||||
|
Microchip Technology |
Digital to Analog converter |
Automotive |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
4.176 V |
Yes |
1 |
12 |
400 μA |
0.2929 % |
Serial |
5 V |
3/5 V |
Small Outline |
SOP8,.23 |
Other Converters |
4.5 µs |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.193 in (4.9 mm) |
Binary |
Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.
DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.
DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.
DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.