Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Maximum Analog Output Voltage | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | No. of Bits | Maximum Settling Time | Maximum Supply Current | Maximum Linearity Error (EL) | Input Format | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Nominal Settling Time (tstl) | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Minimum Analog Output Voltage | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
Digital to Analog converter |
Automotive |
No Lead |
8 |
HVSON |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
12 |
5 µs |
0.0244 % |
Serial |
5 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
5 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Dual |
S-PDSO-N8 |
2 |
0.031 in (0.8 mm) |
0.079 in (2 mm) |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.079 in (2 mm) |
Binary |
||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Automotive |
Ball |
16 |
VFBGA |
Square |
Plastic/Epoxy |
11 V |
Yes |
1 MHz |
1 |
14 |
5 µs |
6 mA |
0.0061 % |
Serial |
Grid Array, Very Thin Profile, Fine Pitch |
5 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B16 |
1 |
0.025 in (0.625 mm) |
0.094 in (2.39 mm) |
e1 |
30 s |
260 °C (500 °F) |
0 V |
0.094 in (2.39 mm) |
Binary |
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|
Texas Instruments |
Digital to Analog converter |
Industrial |
Gull Wing |
24 |
SSOP |
Rectangular |
Plastic/Epoxy |
10 V |
Yes |
1 |
16 |
5 µs |
0.0092 % |
Serial |
15 V |
5,±15 V |
-15 V |
Small Outline, Shrink Pitch |
SSOP24,.3 |
Other Converters |
3 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G24 |
3 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
-10 V |
0.323 in (8.2 mm) |
Binary, Offset Binary |
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|
Texas Instruments |
Digital to Analog converter |
Automotive |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
10 V |
Yes |
5 MHz |
1 |
CMOS |
12 |
200 ns |
5 μA |
0.0244 % |
Serial |
5 V |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
Other Converters |
200 ns |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Nickel/Palladium/Gold/Silver |
Dual |
S-PDSO-G10 |
2 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e4 |
260 °C (500 °F) |
-10 V |
0.118 in (3 mm) |
Binary |
||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
93 kHz |
1 |
16 |
10 µs |
400 μA |
0.098 % |
Serial |
3 V |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Other Converters |
10 µs |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold Silver |
Dual |
S-PDSO-G8 |
2 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
No Lead |
14 |
HVQCCN |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
16 |
20 μA |
0.0015 % |
Serial |
3 V |
3/5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC14/18,.14SQ,20 |
Other Converters |
1 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQCC-N14 |
2 |
0.039 in (1 mm) |
0.138 in (3.5 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
-5.5 V |
0.138 in (3.5 mm) |
Binary |
||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
4.096 V |
Yes |
1 |
CMOS |
16 |
0.0305 % |
Serial |
5 V |
Small Outline |
20 µs |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e0 |
0 V |
0.193 in (4.9 mm) |
Binary |
||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
14 |
HVSON |
Rectangular |
Plastic/Epoxy |
2.5 V |
Yes |
8 |
CMOS |
8 |
0.1953 % |
Serial |
3 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
3.5 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-N14 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.157 in (4 mm) |
Binary |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
12 |
0.0122 % |
Serial |
3 V |
Small Outline |
1 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
-2.5 V |
0.118 in (3 mm) |
Offset Binary |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
No Lead |
32 |
DIE |
Rectangular |
Yes |
1 |
CMOS |
16 |
0.0977 % |
Serial |
5 V |
-5 V |
Uncased Chip |
Upper |
R-XUUC-N32 |
Binary |
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|
Analog Devices |
Digital to Analog converter |
Automotive |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
10 V |
Yes |
1 |
CMOS |
12 |
0.0244 % |
Serial |
15 V |
-15 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
15.5 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-N32 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
e3 |
-10 V |
0.197 in (5 mm) |
Binary |
||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
No Lead |
40 |
HVQCCN |
Square |
15 V |
Yes |
1 |
CMOS |
16 |
28 µs |
37 mA |
0.0000457 % |
Serial |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.24SQ,20 |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Quad |
S-XQCC-N40 |
1 |
0.031 in (0.8 mm) |
0.236 in (6 mm) |
30 s |
260 °C (500 °F) |
-15 V |
0.236 in (6 mm) |
Binary |
||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
44 |
SSOP |
Rectangular |
Plastic/Epoxy |
10 V |
Yes |
1 |
CMOS |
16 |
0.0031 % |
Serial |
5 V |
Small Outline, Shrink Pitch |
10 µs |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G44 |
1 |
0.104 in (2.64 mm) |
0.295 in (7.5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
-10 V |
0.702 in (17.83 mm) |
Binary |
|||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
5 V |
Yes |
4 |
CMOS |
8 |
10 mA |
Parallel, 8 Bits |
5 V |
5,GND/-5 V |
-5.5 V |
Small Outline |
SOP20,.4 |
Other Converters |
6 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G20 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
20 s |
245 °C (473 °F) |
-5.5 V |
0.504 in (12.8 mm) |
Binary |
||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
5 V |
Yes |
4 |
CMOS |
8 |
10 mA |
Parallel, 8 Bits |
5 V |
5,GND/-5 V |
-5.5 V |
Small Outline |
SOP20,.4 |
Other Converters |
6 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G20 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
-5.5 V |
0.504 in (12.8 mm) |
Binary |
|||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
5 V |
Yes |
2 |
BICMOS |
8 |
6 mA |
Serial |
5 V |
5 V |
Small Outline |
SOP8,.25 |
Other Converters |
6 µs |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e0 |
0 V |
0.193 in (4.9 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
5 V |
Yes |
2 |
BICMOS |
8 |
6 mA |
Serial |
5 V |
5 V |
Small Outline |
SOP8,.25 |
Other Converters |
6 µs |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.193 in (4.9 mm) |
Binary |
||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Industrial |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
4.98 V |
Yes |
1 |
BICMOS |
12 |
1.7 mA |
0.0977 % |
Serial |
5 V |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP16,.25 |
Other Converters |
5 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G16 |
1 |
0.043 in (1.1 mm) |
0.173 in (4.4 mm) |
No |
e0 |
.02 V |
0.197 in (5 mm) |
Binary |
||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
4.98 V |
Yes |
1 |
BICMOS |
12 |
0.0977 % |
Serial |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
5 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G16 |
1 |
0.043 in (1.1 mm) |
0.173 in (4.4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
.02 V |
0.197 in (5 mm) |
Binary |
|||||||||||||||||||
|
Microchip Technology |
Digital to Analog converter |
Automotive |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
12 |
1.4 mA |
0.3174 % |
Serial |
5 V |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
Other Converters |
6 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||||
Microchip Technology |
Digital to Analog converter |
Automotive |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
Yes |
1 |
10 |
720 μA |
0.0244 % |
Serial |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.25 |
16 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Dual |
S-PDSO-G8 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
0.118 in (3 mm) |
Binary |
||||||||||||||||||||||||||||
|
Microchip Technology |
Digital to Analog converter |
Automotive |
Gull Wing |
8 |
TSSOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
TS 16949 |
10 |
700 μA |
0.1465 % |
Serial |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.25 |
6 µs |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G8 |
1 |
0.047 in (1.2 mm) |
0.118 in (3 mm) |
e3 |
40 s |
260 °C (500 °F) |
0.173 in (4.4 mm) |
Binary |
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|
Texas Instruments |
Digital to Analog converter |
Industrial |
Gull Wing |
48 |
HTSSOP |
Rectangular |
Plastic/Epoxy |
8 V |
Yes |
1 |
24 |
110 mA |
Serial |
5 V |
3.3,5 V |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
TSSOP48,.3,20 |
Other Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G48 |
3 |
0.047 in (1.2 mm) |
0.24 in (6.1 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.492 in (12.5 mm) |
2's Complement Binary |
||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Commercial |
No Lead |
20 |
HVQCCN |
Square |
Plastic/Epoxy |
1.32 V |
Yes |
1 |
CMOS |
24 |
2.5 mA |
Serial |
2.4 V |
1.8/3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC20,.16SQ,20 |
Other Converters |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQCC-N20 |
1 |
0.039 in (1 mm) |
0.165 in (4.2 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.165 in (4.2 mm) |
2's Complement Binary |
|||||||||||||||||
Texas Instruments |
Digital to Analog converter |
Automotive |
No Lead |
8 |
HVSON |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
12 |
0.0244 % |
Serial |
5 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
5 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Dual |
S-PDSO-N8 |
0.031 in (0.8 mm) |
0.079 in (2 mm) |
0 V |
0.079 in (2 mm) |
Binary |
|||||||||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
3.2 V |
Yes |
1 |
CMOS |
12 |
20 µs |
1.35 mA |
0.0977 % |
Serial |
3 V |
3/5 V |
Small Outline |
SOP8,.25 |
Other Converters |
9 µs |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.193 in (4.9 mm) |
Binary |
||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Gull Wing |
14 |
SOP |
Rectangular |
Plastic/Epoxy |
Yes |
48 kHz |
1 |
8 |
10 µs |
2 mA |
0.3906 % |
Serial |
3.3 V |
3.3 V |
Small Outline |
SOP14,.25 |
Other Converters |
10 µs |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Dual |
R-PDSO-G14 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.905 mm) |
No |
e4 |
260 °C (500 °F) |
0.341 in (8.65 mm) |
Binary |
|||||||||||||||||
Texas Instruments |
Digital to Analog converter |
Automotive |
No Lead |
16 |
HVQCCN |
Square |
Plastic/Epoxy |
11 V |
Yes |
1 |
16 |
0.0015 % |
Serial |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
5 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Quad |
S-PQCC-N16 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
0 V |
0.118 in (3 mm) |
Binary |
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|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
5.499 V |
Yes |
1 |
CMOS |
8 |
8 µs |
900 μA |
0.2441 % |
Serial |
3 V |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
Other Converters |
6 µs |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
260 °C (500 °F) |
.001 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
52 |
LQFP |
Square |
Plastic/Epoxy |
15.1 V |
Yes |
1 |
14 |
30 µs |
0.0061 % |
Serial |
15 V |
3/5,±12/±16.5 V |
-15 V |
Flatpack, Low Profile |
QFP52,.47SQ |
Other Converters |
20 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G52 |
3 |
0.063 in (1.6 mm) |
0.394 in (10 mm) |
No |
e3 |
260 °C (500 °F) |
-15.1 V |
0.394 in (10 mm) |
2's Complement Binary |
||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
8 |
HVSON |
Square |
5.5 V |
Yes |
1 |
CMOS |
10 |
4 mA |
0.3906 % |
Serial |
5 V |
3/5 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
SOLCC8,.11,20 |
Other Converters |
250 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
S-XDSO-N8 |
3 |
0.035 in (0.9 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
.6 V |
0.118 in (3 mm) |
Binary |
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|
Analog Devices |
Digital to Analog converter |
Automotive |
No Lead |
40 |
HVQCCN |
Square |
2.5 V |
Yes |
1 |
CMOS |
12 |
120 ns |
10 μA |
0.0244 % |
Parallel, Word |
5 V |
3/5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.24SQ,20 |
Other Converters |
15 ns |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N40 |
3 |
0.039 in (1 mm) |
0.236 in (6 mm) |
No |
e3 |
260 °C (500 °F) |
0 V |
0.236 in (6 mm) |
Binary |
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Analog Devices |
Digital to Analog converter |
Automotive |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
5.2 V |
Yes |
1 |
CMOS |
8 |
10 μA |
0.0977 % |
Serial |
2.5 V |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
Other Converters |
90 ns |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
240 °C (464 °F) |
0 V |
0.118 in (3 mm) |
Binary |
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|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
61.5 V |
Yes |
1 |
12 |
55 µs |
3 mA |
0.0732 % |
Serial |
30 V |
2.5/5,10/62 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP16,.25 |
Other Converters |
25 µs |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G16 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
.5 V |
0.197 in (5 mm) |
Binary |
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|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
4.5 V |
Yes |
1 |
CMOS |
16 |
1.1 mA |
0.0031 % |
Serial |
3 V |
5 V |
Small Outline |
SOP8,.25 |
Other Converters |
1 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e3 |
260 °C (500 °F) |
0 V |
0.193 in (4.9 mm) |
Binary |
||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
14 |
SOP |
Rectangular |
Plastic/Epoxy |
4.5 V |
Yes |
1 |
CMOS |
16 |
1.1 mA |
0.0031 % |
Serial |
3 V |
5 V |
Small Outline |
SOP14,.25 |
Other Converters |
1 µs |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G14 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
-2.5 V |
0.341 in (8.65 mm) |
Binary |
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|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
23 |
DIE |
Rectangular |
Yes |
1 |
16 |
0.0015 % |
Serial |
5 V |
Uncased Chip |
500 ns |
85 °C (185 °F) |
-40 °C (-40 °F) |
Upper |
R-XUUC-N23 |
0.012 in (0.305 mm) |
0.071 in (1.8 mm) |
0.096 in (2.44 mm) |
Binary |
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|
Analog Devices |
Digital to Analog converter |
Automotive |
Gull Wing |
6 |
VSSOP |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
10 |
10 µs |
100 μA |
0.0488 % |
Serial |
3 V |
3/5 V |
Small Outline, Very Thin Profile, Shrink Pitch |
TSSOP6,.08 |
Other Converters |
6 µs |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G6 |
1 |
0.039 in (1 mm) |
0.049 in (1.25 mm) |
No |
e4 |
260 °C (500 °F) |
0 V |
0.079 in (2 mm) |
Binary |
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|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
10 |
VSON |
Square |
5 V |
Yes |
1 |
CMOS |
12 |
4.5 µs |
1.1 mA |
0.0244 % |
Serial |
5 V |
3/3.3 V |
Small Outline, Very Thin Profile |
SOLCC10,.11,20 |
Other Converters |
3 µs |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
S-XDSO-N10 |
3 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Automotive |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
5 V |
Yes |
1 |
16 |
Serial |
3 V |
Small Outline, Thin Profile, Shrink Pitch |
5 µs |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G20 |
3 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.256 in (6.5 mm) |
Binary |
||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
32 |
TQFP |
Square |
Plastic/Epoxy |
10.5263 V |
Yes |
1 |
CMOS |
16 |
10 µs |
0.0031 % |
Serial |
13.5 V |
3/5,±12/±15 V |
-13.5 V |
Flatpack, Thin Profile |
QFP32,.35SQ,32 |
Other Converters |
8 µs |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G32 |
3 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
-10.5263 V |
0.276 in (7 mm) |
Offset Binary, 2's Complement Binary |
||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
16 |
SOP |
Rectangular |
Plastic/Epoxy |
Yes |
2 |
CMOS |
10 |
1 µs |
2 mA |
0.1 % |
Parallel, Word |
15 V |
15 V |
Small Outline |
SOP16,.4 |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G16 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.406 in (10.3 mm) |
Binary, Offset Binary |
||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
Yes |
4 |
BICMOS |
12 |
10 μA |
0.0244 % |
Serial |
5 V |
3.3/5 V |
Small Outline, Shrink Pitch |
SSOP28,.3 |
Other Converters |
3.5 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e0 |
240 °C (464 °F) |
0.402 in (10.2 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
Yes |
8 |
BICMOS |
12 |
3.5 mA |
0.0122 % |
Serial |
5 V |
5 V |
Flatpack |
QFP44,.57SQ,32 |
Other Converters |
500 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
0.096 in (2.45 mm) |
0.394 in (10 mm) |
No |
e3 |
260 °C (500 °F) |
0.394 in (10 mm) |
Binary |
||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
Yes |
8 |
BICMOS |
12 |
3.5 mA |
0.0122 % |
Serial |
5 V |
5 V |
Flatpack |
QFP44,.57SQ,32 |
Other Converters |
500 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
0.096 in (2.45 mm) |
0.394 in (10 mm) |
No |
e3 |
260 °C (500 °F) |
0.394 in (10 mm) |
Binary |
||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
10 V |
Yes |
1 |
CMOS |
16 |
9 µs |
0.0122 % |
Parallel, Word |
15 V |
5,±15 V |
-15 V |
Chip Carrier |
LDCC28,.5SQ |
Other Converters |
7 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
5 |
0.18 in (4.57 mm) |
0.453 in (11.505 mm) |
No |
e0 |
225 °C (437 °F) |
-10 V |
0.453 in (11.505 mm) |
Binary, Offset Binary |
||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
169 |
VFBGA |
Square |
Plastic/Epoxy |
Yes |
1 |
16 |
Serial |
1.2 V |
-1.2 V |
Grid Array, Very Thin Profile, Fine Pitch |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B169 |
3 |
0.037 in (0.95 mm) |
0.433 in (11 mm) |
e1 |
260 °C (500 °F) |
0.433 in (11 mm) |
2's Complement |
|||||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
28 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1.25 V |
Yes |
1 |
CMOS |
14 |
0.0305 % |
Parallel, Word |
3.3 V |
3.3 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP28,.25 |
Other Converters |
11 ns |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G28 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
-1 V |
0.382 in (9.7 mm) |
Binary, 2's Complement Binary |
Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.
DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.
DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.
DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.