Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Maximum Analog Output Voltage | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | No. of Bits | Maximum Settling Time | Maximum Supply Current | Maximum Linearity Error (EL) | Input Format | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Nominal Settling Time (tstl) | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Minimum Analog Output Voltage | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Ball |
144 |
HBGA |
Square |
Plastic/Epoxy |
.6 V |
Yes |
2500 MHz |
1 |
CMOS |
16 |
Parallel, Word |
.9 V |
Grid Array, Heat Sink/Slug |
10 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
e1 |
30 s |
260 °C (500 °F) |
-.5 V |
0.394 in (10 mm) |
Offset Binary, 2's Complement Binary |
||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Ball |
144 |
HBGA |
Square |
Plastic/Epoxy |
.6 V |
Yes |
2500 MHz |
1 |
CMOS |
16 |
Parallel, Word |
.9 V |
Grid Array, Heat Sink/Slug |
10 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
e1 |
30 s |
260 °C (500 °F) |
-.5 V |
0.394 in (10 mm) |
Offset Binary, 2's Complement Binary |
||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Commercial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
10 V |
Yes |
100 kHz |
1 |
16 |
10 µs |
25 mA |
0.0031 % |
Parallel, Word |
15 V |
±12/±15 V |
-15 V |
Small Outline |
SOP28,.4 |
Other Converters |
10 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G28 |
3 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
-10 V |
0.705 in (17.9 mm) |
2's Complement Binary |
|||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
16 |
SOP |
Rectangular |
Plastic/Epoxy |
2.5 V |
Yes |
4 |
BICMOS |
12 |
0.0732 % |
Serial |
5 V |
±5/±15 V |
-5 V |
Small Outline |
SOP16,.4 |
Other Converters |
8 µs |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G16 |
3 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
240 °C (464 °F) |
-2.5 V |
0.406 in (10.3 mm) |
Binary |
|||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
16 |
SOP |
Rectangular |
Plastic/Epoxy |
2.5 V |
Yes |
4 |
BICMOS |
12 |
0.0977 % |
Serial |
5 V |
±5/±15 V |
-5 V |
Small Outline |
SOP16,.4 |
Other Converters |
8 µs |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Dual |
R-PDSO-G16 |
3 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
30 s |
240 °C (464 °F) |
-2.5 V |
0.406 in (10.3 mm) |
Binary |
||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
4.095 V |
Yes |
1 |
CMOS |
12 |
0.0488 % |
Serial |
5 V |
Small Outline |
16 µs |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e0 |
0 V |
0.193 in (4.9 mm) |
Complementary Offset Binary |
||||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
93 kHz |
1 |
16 |
10 µs |
1.6 mA |
0.0987 % |
Serial |
3 V |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP16,.25 |
Other Converters |
10 µs |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G16 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.197 in (5 mm) |
Binary |
||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
1.25 V |
Yes |
1 |
CMOS |
14 |
30 mA |
0.0153 % |
Parallel, Word |
5 V |
5 V |
Small Outline |
SOP28,.4 |
Other Converters |
30 ns |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G28 |
2 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
-1 V |
0.705 in (17.9 mm) |
Binary |
|||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
No Lead |
24 |
HVQCCN |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
200 kHz |
1 |
18 |
5 µs |
1.5 mA |
0.0011 % |
Serial |
5 V |
2.7/5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC24,.16SQ,20 |
Other Converters |
5 µs |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQCC-N24 |
2 |
0.039 in (1 mm) |
0.157 in (4 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.157 in (4 mm) |
Binary, 2's Complement Binary |
||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
2 |
12 |
0.1343 % |
Serial |
3 V |
Small Outline |
14 µs |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.752 mm) |
0.154 in (3.899 mm) |
No |
e0 |
0 V |
0.193 in (4.9025 mm) |
Binary |
|||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
10 V |
No |
1 |
16 |
0.0061 % |
Serial |
5 V |
In-Line |
1 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDIP-T8 |
1 |
0.155 in (3.937 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
-10 V |
Binary, Offset Binary |
|||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
14 |
0.0488 % |
Serial |
3 V |
Small Outline, Thin Profile, Shrink Pitch |
12 µs |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
0 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
14 |
0.0488 % |
Serial |
3 V |
Small Outline, Thin Profile, Shrink Pitch |
12 µs |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Ball |
170 |
LFBGA |
Rectangular |
Plastic/Epoxy |
1 V |
Yes |
1 |
CMOS |
14 |
0.0122 % |
Serial, Parallel, Word |
1.86 V |
Grid Array, Low Profile, Fine Pitch |
2.2 ns |
0.031 in (0.8 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
R-PBGA-B170 |
3 |
0.067 in (1.69 mm) |
0.354 in (9 mm) |
e1 |
-1 V |
0.591 in (15 mm) |
2's Complement Binary |
||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
170 |
LFBGA |
Rectangular |
Plastic/Epoxy |
1 V |
Yes |
1 |
CMOS |
14 |
0.0122 % |
Serial, Parallel, Word |
1.86 V |
Grid Array, Low Profile, Fine Pitch |
2.2 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
R-PBGA-B170 |
3 |
0.067 in (1.69 mm) |
0.354 in (9 mm) |
e1 |
-1 V |
0.591 in (15 mm) |
2's Complement Binary |
||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
16 |
SSOP |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
16 |
0.0977 % |
Serial |
5 V |
Small Outline, Shrink Pitch |
10 µs |
0.025 in (0.635 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin/Lead |
Dual |
R-PDSO-G16 |
1 |
0.068 in (1.727 mm) |
0.154 in (3.9 mm) |
No |
e0 |
0 V |
0.193 in (4.89 mm) |
Binary |
|||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
16 |
SSOP |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
16 |
0.0977 % |
Serial |
5 V |
Small Outline, Shrink Pitch |
10 µs |
0.025 in (0.635 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G16 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.899 mm) |
No |
e0 |
0 V |
0.193 in (4.8895 mm) |
Binary |
||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
16 |
SSOP |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
16 |
0.0977 % |
Serial |
5 V |
Small Outline, Shrink Pitch |
10 µs |
0.025 in (0.635 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G16 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.899 mm) |
No |
e0 |
0 V |
0.193 in (4.8895 mm) |
Binary |
||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
No Lead |
16 |
HVQCCN |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
8 |
0.1953 % |
Serial |
3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
3.5 µs |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Quad |
S-PQCC-N16 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
12 |
0.0122 % |
Serial |
3 V |
Small Outline |
1 µs |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
-2.5 V |
0.118 in (3 mm) |
Offset Binary |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
16 |
0.0015 % |
Serial |
3 V |
Small Outline |
1 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
-2.5 V |
0.118 in (3 mm) |
Offset Binary |
||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
CMOS |
12 |
500 μA |
0.0122 % |
Serial |
5 V |
Small Outline |
250 ns |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin/Lead |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e0 |
20 s |
235 °C (455 °F) |
0.193 in (4.9 mm) |
Binary, Offset Binary |
|||||||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Commercial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
2 |
CMOS |
12 |
650 μA |
0.0122 % |
Serial |
5 V |
5 V |
In-Line |
DIP16,.3 |
Other Converters |
16 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDIP-T16 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.755 in (19.175 mm) |
Binary |
|||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Commercial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
2 |
CMOS |
12 |
650 μA |
0.0122 % |
Serial |
5 V |
5 V |
In-Line |
DIP16,.3 |
Other Converters |
16 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T16 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.755 in (19.175 mm) |
Binary |
||||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Commercial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
5 V |
No |
1 |
BICMOS |
8 |
3 mA |
Serial |
5 V |
5 V |
In-Line |
DIP8,.3 |
Other Converters |
6 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T8 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e0 |
245 °C (473 °F) |
0 V |
0.369 in (9.375 mm) |
Binary |
||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
5 V |
No |
1 |
BICMOS |
8 |
3 mA |
Serial |
5 V |
5 V |
In-Line |
DIP8,.3 |
Other Converters |
6 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
R-PDIP-T8 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.369 in (9.375 mm) |
Binary |
||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Industrial |
Gull Wing |
20 |
SSOP |
Rectangular |
Plastic/Epoxy |
3 V |
Yes |
1 |
CMOS |
12 |
980 μA |
0.0122 % |
Serial |
3 V |
3.3 V |
Small Outline, Shrink Pitch |
SSOP20,.3 |
Other Converters |
16 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G20 |
1 |
0.078 in (1.99 mm) |
0.208 in (5.29 mm) |
No |
e0 |
0 V |
0.283 in (7.2 mm) |
Binary, Offset Binary |
||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
20 |
SSOP |
Rectangular |
Plastic/Epoxy |
3 V |
Yes |
1 |
CMOS |
12 |
980 μA |
0.0122 % |
Serial |
3 V |
3.3 V |
Small Outline, Shrink Pitch |
SSOP20,.3 |
Other Converters |
16 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G20 |
1 |
0.078 in (1.99 mm) |
0.208 in (5.29 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.283 in (7.2 mm) |
Binary, Offset Binary |
|||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Industrial |
Gull Wing |
20 |
SSOP |
Rectangular |
Plastic/Epoxy |
3 V |
Yes |
1 |
CMOS |
12 |
980 μA |
0.0122 % |
Serial |
3 V |
3.3 V |
Small Outline, Shrink Pitch |
SSOP20,.3 |
Other Converters |
16 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G20 |
1 |
0.078 in (1.99 mm) |
0.208 in (5.29 mm) |
No |
e0 |
0 V |
0.283 in (7.2 mm) |
Binary, Offset Binary |
||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
20 |
SSOP |
Rectangular |
Plastic/Epoxy |
3 V |
Yes |
1 |
CMOS |
12 |
980 μA |
0.0122 % |
Serial |
3 V |
3.3 V |
Small Outline, Shrink Pitch |
SSOP20,.3 |
Other Converters |
16 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G20 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e3 |
0 V |
0.283 in (7.2 mm) |
Binary, Offset Binary |
|||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Commercial |
Gull Wing |
24 |
SSOP |
Rectangular |
Plastic/Epoxy |
2.25 V |
Yes |
8 |
BICMOS |
8 |
2 µs |
9 mA |
0.3906 % |
Serial |
12 V |
12,GND/-5 V |
-5 V |
Small Outline, Shrink Pitch |
SOP24,.4 |
Other Converters |
1 µs |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G24 |
1 |
0.078 in (1.99 mm) |
0.208 in (5.29 mm) |
No |
e0 |
245 °C (473 °F) |
0 V |
0.323 in (8.2 mm) |
Binary |
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|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
24 |
SSOP |
Rectangular |
Plastic/Epoxy |
2.25 V |
Yes |
8 |
BICMOS |
8 |
2 µs |
9 mA |
0.3906 % |
Serial |
12 V |
12,GND/-5 V |
-5 V |
Small Outline, Shrink Pitch |
SOP24,.4 |
Other Converters |
1 µs |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G24 |
1 |
0.078 in (1.99 mm) |
0.208 in (5.29 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.323 in (8.2 mm) |
Binary |
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Maxim Integrated |
Digital to Analog converter |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
5.1 V |
No |
1 |
CMOS |
12 |
300 μA |
0.0122 % |
Serial |
5 V |
5 V |
0 V |
In-Line |
DIP8,.3 |
Other Converters |
25 µs |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T8 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e0 |
245 °C (473 °F) |
0 V |
0.369 in (9.375 mm) |
Binary |
||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
5.1 V |
No |
1 |
CMOS |
12 |
300 μA |
0.0122 % |
Serial |
5 V |
5 V |
0 V |
In-Line |
DIP8,.3 |
Other Converters |
25 µs |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDIP-T8 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.369 in (9.375 mm) |
Binary |
||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Automotive |
Gull Wing |
10 |
TSSOP |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
BICMOS |
12 |
410 μA |
0.0244 % |
Serial |
3 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
6.3 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||||
Microchip Technology |
Digital to Analog converter |
Automotive |
No Lead |
10 |
HVSON |
Square |
Plastic/Epoxy |
Yes |
1 |
TS 16949 |
8 |
700 μA |
0.0391 % |
Serial |
5 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
SOLCC10,.12,20 |
16 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Dual |
S-PDSO-N10 |
0.039 in (1 mm) |
0.118 in (3 mm) |
0.118 in (3 mm) |
Binary |
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|
Microchip Technology |
Digital to Analog converter |
Automotive |
No Lead |
20 |
HVQCCN |
Square |
Plastic/Epoxy |
Yes |
1 |
8 |
2.5 mA |
0.1953125 % |
Serial |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC20,.20SQ,25 |
7.8 µs |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Quad |
S-PQCC-N20 |
0.039 in (1 mm) |
0.197 in (5 mm) |
0.197 in (5 mm) |
Binary |
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|
Microchip Technology |
Digital to Analog converter |
Automotive |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
8 |
3 mA |
0.1953125 % |
Serial |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP20,.25 |
7.8 µs |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Dual |
R-PDSO-G20 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
0.256 in (6.5 mm) |
Binary |
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|
Microchip Technology |
Digital to Analog converter |
Automotive |
Gull Wing |
8 |
TSSOP |
Rectangular |
Plastic/Epoxy |
5.46 V |
Yes |
1 |
TS 16949 |
10 |
700 μA |
0.1464 % |
Serial |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.25 |
6 µs |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G8 |
1 |
0.047 in (1.2 mm) |
0.118 in (3 mm) |
e3 |
40 s |
260 °C (500 °F) |
.01 V |
0.173 in (4.4 mm) |
Binary |
||||||||||||||||||
|
Microchip Technology |
Digital to Analog converter |
Automotive |
Gull Wing |
8 |
TSSOP |
Rectangular |
Plastic/Epoxy |
5.46 V |
Yes |
1 |
TS 16949 |
10 |
700 μA |
0.1464 % |
Serial |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.25 |
6 µs |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G8 |
1 |
0.047 in (1.2 mm) |
0.118 in (3 mm) |
e3 |
40 s |
260 °C (500 °F) |
.01 V |
0.173 in (4.4 mm) |
Binary |
||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Gull Wing |
28 |
HTSSOP |
Rectangular |
Plastic/Epoxy |
3.75 V |
Yes |
1 |
CMOS |
24 |
80 mA |
Serial |
5 V |
3.3,5 V |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
TSSOP28,.25 |
Other Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G28 |
3 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.382 in (9.7 mm) |
2's Complement Binary |
|||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Gull Wing |
28 |
HTSSOP |
Rectangular |
Plastic/Epoxy |
3.75 V |
Yes |
1 |
CMOS |
AEC-Q100 |
24 |
80 mA |
Serial |
5 V |
3.3,5 V |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
TSSOP28,.25 |
Other Converters |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G28 |
4 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.382 in (9.7 mm) |
2's Complement Binary |
||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Commercial Extended |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
CMOS |
24 |
40 mA |
Serial |
5 V |
3.3,5 V |
Small Outline, Shrink Pitch |
SSOP28,.3 |
Other Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.402 in (10.2 mm) |
2's Complement Binary |
|||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Commercial Extended |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
CMOS |
24 |
40 mA |
Serial |
5 V |
3.3,5 V |
Small Outline, Shrink Pitch |
SSOP28,.3 |
Other Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.402 in (10.2 mm) |
2's Complement Binary |
|||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Commercial Extended |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
CMOS |
24 |
40 mA |
Serial |
5 V |
3.3,5 V |
Small Outline, Shrink Pitch |
SSOP28,.3 |
Other Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.402 in (10.2 mm) |
2's Complement Binary |
|||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Other |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
CMOS |
32 |
23 mA |
Serial |
5 V |
3.3,5 V |
Small Outline, Shrink Pitch |
SSOP28,.3 |
Other Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.402 in (10.2 mm) |
2's Complement Binary |
|||||||||||||||||||
Texas Instruments |
Digital to Analog converter |
Industrial |
Ball |
144 |
HBGA |
Square |
Plastic/Epoxy |
.6 V |
Yes |
1 |
16 |
Serial |
3.3 V |
Grid Array, Heat Sink/Slug |
10 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B144 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
-.5 V |
0.394 in (10 mm) |
Binary |
||||||||||||||||||||||||||||
|
Microchip Technology |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
4.3 V |
Yes |
1 |
TS 16949 |
8 |
500 μA |
0.7812 % |
Serial |
3.3 V |
3/5 V |
Small Outline |
SOP8,.23 |
Other Converters |
10 µs |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e3 |
260 °C (500 °F) |
0 V |
0.193 in (4.9 mm) |
Binary |
Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.
DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.
DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.
DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.