16 Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

LTC7543KSW#TR

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 mA

0.0122 %

Serial

5 V

Small Outline

250 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.406 in (10.3 mm)

Binary, Offset Binary

LTC1664IN

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

5.5 V

No

1

CMOS

10

0.2441 %

Serial

3 V

In-Line

19 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T16

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e0

0 V

0.77 in (19.558 mm)

Binary

LTC2609IGN#TRPBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

0.0977 %

Serial

5 V

Small Outline, Shrink Pitch

10 µs

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.899 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.193 in (4.8895 mm)

Binary

AD5429YRU-REEL7

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

8

100 ns

10 μA

0.1953 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

Other Converters

80 ns

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e0

240 °C (464 °F)

0 V

0.197 in (5 mm)

Binary

LTC1589CG

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

14

0.0061 %

Serial

5 V

Small Outline, Shrink Pitch

2 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.209 in (5.3 mm)

No

e0

-10 V

0.244 in (6.2 mm)

Binary

AD7542BQ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 µs

2.5 mA

0.0122 %

Parallel, 4 Bits

5 V

5 V

In-Line

DIP16,.3

Other Converters

250 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.05 mm)

Binary, Offset Binary

AD5628ACPZ-2-RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

5.5 V

Yes

1

CMOS

12

7 µs

2.25 mA

0.0977 %

Serial

5 V

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.16SQ,25

Other Converters

2.5 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N16

3

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

DAC100BBQ5/883

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

11.1 V

No

1

MIL-STD-883 Class B

10

0.1 %

Parallel, Word

15 V

-15 V

In-Line

375 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

10 V

0.75 in (19.05 mm)

Complementary Binary

LTC2609CGN-1#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

0.0977 %

Serial

5 V

Small Outline, Shrink Pitch

10 µs

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.899 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.193 in (4.8895 mm)

Binary

LTC2625IGN#TRPBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.0977 %

Serial

5 V

Small Outline, Shrink Pitch

7 µs

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.899 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.193 in (4.8895 mm)

Binary

LTC1596-1CISW

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

16

0.0061 %

Serial

5 V

Small Outline

1 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.104 in (2.642 mm)

0.295 in (7.5 mm)

No

e0

-10 V

0.405 in (10.2995 mm)

Binary, Offset Binary

LTC2636IMS-HMX10#PBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

8

CMOS

10

0.0977 %

Serial

5 V

Small Outline, Thin Profile, Shrink Pitch

4.3 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.159 in (4.039 mm)

Binary

AD7533BD

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

10

0.1 %

Parallel, Word

15 V

15 V

In-Line

DIP16,.3

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T16

0.3 in (7.62 mm)

No

e0

0.79 in (20.07 mm)

Binary, Offset Binary

AD5306BRUZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

5.499 V

Yes

1

CMOS

8

8 µs

900 μA

0.2441 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

Other Converters

6 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

.001 V

0.197 in (5 mm)

Binary

AD7543TD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

2 µs

0.012 %

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Binary

DAC312N

Analog Devices

Digital to Analog converter

No Lead

16

DIE

10 V

Yes

1

12

0.05 %

Parallel, Word

15 V

-15 V

Uncased Chip

250 ns

Tin Lead

Upper

X-XUUC-N16

No

e0

-5 V

Binary, Offset Binary, 2's Complement Binary

LTC2636CMS-LZ8#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

8

0.1953 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

3.4 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.159 in (4.039 mm)

Binary

LTC2637IMS-LZ12#PBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

12

0.061 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

4.5 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G16

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.159 in (4.039 mm)

Binary

AD1861N-J

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

3.12 V

No

1

BICMOS

18

15 mA

Serial

5 V

±5 V

-5 V

In-Line

DIP16,.3

Other Converters

1.5 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T16

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

-2.88 V

0.793 in (20.13 mm)

2's Complement Binary

AD7542BD

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

12

2 µs

2.5 mA

0.0122 %

Parallel, Word

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.05 mm)

Binary, Offset Binary

5962R8993202VFA

Analog Devices

Digital to Analog converter

Military

Flat

16

DFP

Rectangular

100k Rad(Si)

Ceramic, Metal-Sealed Cofired

18 V

Yes

1

Bipolar

MIL-PRF-38535 Class V

8

135 ns

8 mA

0.35 %

Parallel, 8 Bits

15 V

±15 V

-15 V

Flatpack

FL16,.3

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-CDFP-F16

Yes

-10 V

Binary

LTC2636IMS-LMI12#PBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

12

0.061 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

4.4 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.159 in (4.039 mm)

Binary

AD5570WRSZ

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

14 V

Yes

1

BICMOS

16

16 µs

5 mA

0.0031 %

Serial

12 V

±12/±15 V

-12 V

Small Outline, Shrink Pitch

SSOP16,.3

Other Converters

12 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

260 °C (500 °F)

-14 V

0.244 in (6.2 mm)

Binary

AD5323ARUZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

5.499 V

Yes

1

CMOS

12

10 µs

450 μA

0.3906 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

Other Converters

8 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

.001 V

0.197 in (5 mm)

Binary

LTC2637HMS-HZ12#TRPBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

8

CMOS

12

0.061 %

Serial

5 V

Small Outline, Thin Profile, Shrink Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G16

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.159 in (4.039 mm)

Binary

LTC2629IGN-1#TRPBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.0977 %

Serial

5 V

Small Outline, Shrink Pitch

7 µs

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.899 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.193 in (4.8895 mm)

Binary

PM7533EQ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

15 V

No

2

CMOS

10

1 µs

2 mA

0.05 %

Parallel, Word

15 V

15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-CDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

0.75 in (19.05 mm)

Binary, Offset Binary

LTC2636IMS-LMX8#TRPBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

8

0.1953 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

3.4 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.159 in (4.039 mm)

Binary

LTC2637HMS-HMX12#PBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

8

CMOS

12

0.061 %

Serial

5 V

Small Outline, Thin Profile, Shrink Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G16

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.159 in (4.039 mm)

Binary

5962-01-219-5097

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

Bipolar

8

3 µs

25 mA

0.2 %

5/15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T16

No

Binary

AD7243AR-REEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

5 V

Yes

1

CMOS

12

10 µs

10 mA

0.0244 %

Serial

12/15,GND/-12/-15 V

Small Outline

SOP16,.4

Other Converters

5 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

240 °C (464 °F)

-5 V

0.406 in (10.3 mm)

Binary, Offset Binary, 2's Complement Binary

AD1860R-K

Analog Devices

Digital to Analog converter

Other

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

3.12 V

Yes

1

BIMOS

18

15 mA

Serial

5 V

±5/±12 V

-5 V

Small Outline

SOP16,.4

Other Converters

1.5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-PDSO-G16

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e0

-3.12 V

0.39 in (9.9 mm)

2's Complement Binary

AD5695RBRUZ-RL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

5.005 V

Yes

1

CMOS

14

8 µs

1.3 mA

0.0061 %

Serial

3 V

2/5,3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

Other Converters

5 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

AD5530BRU-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

12

0.0244 %

Serial

15 V

±12/±15 V

-15 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

Other Converters

20 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e0

240 °C (464 °F)

-10 V

0.197 in (5 mm)

Binary

5962-8770003EX

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

MIL-STD-883

8

0.1953 %

Parallel, 8 Bits

5 V

In-Line

100 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

Yes

0.75 in (19.05 mm)

Binary

AD5629RARUZ-1-RL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

7 µs

2.5 mA

0.0977 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

Other Converters

2.5 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

DAC08EPZ

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

18 V

No

1

8

0 ns

0.19 %

Parallel, 8 Bits

15 V

-15 V

In-Line

85 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T16

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

-10 V

0.793 in (20.13 mm)

Binary

AD5697RBRUZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

5.005 V

Yes

1

12

7 µs

1.3 mA

0.024 %

Serial

5 V

2/5,3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

Other Converters

5 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

LTC2619CGN-1#TR

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

14

0.0977 %

Serial

5 V

Small Outline, Shrink Pitch

9 µs

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.899 mm)

No

e0

0 V

0.193 in (4.8895 mm)

Binary

AD7111TD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

8

4 mA

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Complementary Binary

LTC2635CUD-LMI12#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

16

HVQCCN

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

12

0.061 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.4 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2634IUD-HMI10#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

Plastic/Epoxy

4.096 V

Yes

1

CMOS

10

0.0977 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.2 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

PM7542AQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

15 V

No

2

CMOS

12

1 µs

2 mA

0.012 %

Parallel, 4 Bits

5 V

5 V

In-Line

DIP16,.3

Other Converters

250 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

0.75 in (19.05 mm)

Binary, Offset Binary

AD7533KN/+

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

10

800 ns

2 mA

0.1 %

15 V

15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDIP-T16

e0

Binary, Offset Binary

DAC08GTBC

Analog Devices

Digital to Analog converter

Other

No Lead

16

DIE

Rectangular

18 V

Yes

1

Bipolar

MIL-STD-883 Class B (Modified)

8

7.8 mA

0.19 %

Parallel, 8 Bits

15 V

±15 V

-15 V

Uncased Chip

DIE OR CHIP

Other Converters

85 ns

125 °C (257 °F)

25 °C (77 °F)

Tin Lead

Upper

R-XUUC-N16

No

e0

-10 V

Offset Binary

5962-01-213-0352

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

10

0.1 %

15 V

15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-XDIP-T16

No

Binary, Offset Binary

AD7243BN

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

5 V

No

1

CMOS

12

10 µs

10 mA

0.0122 %

Serial

12/15,GND/-12/-15 V

In-Line

DIP16,.3

Other Converters

5 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T16

0.215 in (5.46 mm)

0.3 in (7.62 mm)

No

e0

-5 V

Binary, Offset Binary, 2's Complement Binary

5962-01-232-6534

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

Bipolar

8

3 µs

25 mA

0.1 %

5/15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-XDIP-T16

No

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.