170 Digital-to-Analog Converters 14

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

LTC2000CY-16#PBF

Analog Devices

Digital to Analog converter

Commercial

Ball

170

LFBGA

Rectangular

Plastic/Epoxy

1 V

Yes

1

CMOS

16

790 mA

0.0061 %

Serial, Parallel, Word

1.8 V

Grid Array, Low Profile, Fine Pitch

BGA170,11X17,32

2.2 ns

0.031 in (0.8 mm)

70 °C (158 °F)

0 °C (32 °F)

Bottom

R-PBGA-B170

3

0.067 in (1.69 mm)

0.354 in (9 mm)

30 s

260 °C (500 °F)

-1 V

0.591 in (15 mm)

2's Complement Binary

LTC2000ACY-16#PBF

Analog Devices

Digital to Analog converter

Commercial

Ball

170

LFBGA

Rectangular

Plastic/Epoxy

1 V

Yes

1

CMOS

16

0.0061 %

Serial, Parallel, Word

1.86 V

Grid Array, Low Profile, Fine Pitch

2.2 ns

0.031 in (0.8 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

R-PBGA-B170

3

0.067 in (1.69 mm)

0.354 in (9 mm)

e1

-1 V

0.591 in (15 mm)

2's Complement Binary

LTC2000AIY-16#PBF

Analog Devices

Digital to Analog converter

Industrial

Ball

170

LFBGA

Rectangular

Plastic/Epoxy

1 V

Yes

1

CMOS

16

0.0061 %

Serial, Parallel, Word

1.86 V

Grid Array, Low Profile, Fine Pitch

2.2 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B170

3

0.067 in (1.69 mm)

0.354 in (9 mm)

e1

-1 V

0.591 in (15 mm)

2's Complement Binary

LTC2000ACY-14#PBF

Analog Devices

Digital to Analog converter

Commercial

Ball

170

LFBGA

Rectangular

Plastic/Epoxy

1 V

Yes

1

CMOS

14

0.0122 %

Serial, Parallel, Word

1.86 V

Grid Array, Low Profile, Fine Pitch

2.2 ns

0.031 in (0.8 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

R-PBGA-B170

3

0.067 in (1.69 mm)

0.354 in (9 mm)

e1

-1 V

0.591 in (15 mm)

2's Complement Binary

LTC2000AIY-14#PBF

Analog Devices

Digital to Analog converter

Industrial

Ball

170

LFBGA

Rectangular

Plastic/Epoxy

1 V

Yes

1

CMOS

14

0.0122 %

Serial, Parallel, Word

1.86 V

Grid Array, Low Profile, Fine Pitch

2.2 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B170

3

0.067 in (1.69 mm)

0.354 in (9 mm)

e1

-1 V

0.591 in (15 mm)

2's Complement Binary

LTC2000IY-16#PBF

Analog Devices

Digital to Analog converter

Industrial

Ball

170

LFBGA

Rectangular

Plastic/Epoxy

1 V

Yes

1

CMOS

16

790 mA

0.0061 %

Serial, Parallel, Word

1.8 V

Grid Array, Low Profile, Fine Pitch

BGA170,11X17,32

2.2 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

R-PBGA-B170

3

0.067 in (1.69 mm)

0.354 in (9 mm)

30 s

260 °C (500 °F)

-1 V

0.591 in (15 mm)

2's Complement Binary

LTC2000CY-11#PBF

Analog Devices

Digital to Analog converter

Commercial

Ball

170

LFBGA

Rectangular

Plastic/Epoxy

1 V

Yes

1

CMOS

11

790 mA

0.049 %

Serial, Parallel, Word

1.8 V

Grid Array, Low Profile, Fine Pitch

BGA170,11X17,32

2.2 ns

0.031 in (0.8 mm)

70 °C (158 °F)

0 °C (32 °F)

Bottom

R-PBGA-B170

3

0.067 in (1.69 mm)

0.354 in (9 mm)

30 s

260 °C (500 °F)

-1 V

0.591 in (15 mm)

2's Complement Binary

LTC2000AIY-16

Analog Devices

Digital to Analog converter

Ball

170

LFBGA

Rectangular

Plastic/Epoxy

1 V

Yes

1

CMOS

16

870 mA

0.0061035 %

Serial, Parallel, Word

1.86 V

Grid Array, Low Profile, Fine Pitch

BGA170,10X17,32

2.2 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

R-PBGA-B170

0.067 in (1.69 mm)

0.354 in (9 mm)

e0

-1 V

0.591 in (15 mm)

2's Complement Binary

LTC2000ACY-11#PBF

Analog Devices

Digital to Analog converter

Commercial

Ball

170

LFBGA

Rectangular

Plastic/Epoxy

1 V

Yes

1

CMOS

11

0.0488 %

Serial, Parallel, Word

1.86 V

Grid Array, Low Profile, Fine Pitch

2.2 ns

0.031 in (0.8 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

R-PBGA-B170

3

0.067 in (1.69 mm)

0.354 in (9 mm)

e1

-1 V

0.591 in (15 mm)

2's Complement Binary

LTC2000CY-14#PBF

Analog Devices

Digital to Analog converter

Commercial

Ball

170

LFBGA

Rectangular

Plastic/Epoxy

1 V

Yes

1

CMOS

14

790 mA

0.012 %

Serial, Parallel, Word

1.8 V

Grid Array, Low Profile, Fine Pitch

BGA170,11X17,32

2.2 ns

0.031 in (0.8 mm)

70 °C (158 °F)

0 °C (32 °F)

Bottom

R-PBGA-B170

3

0.067 in (1.69 mm)

0.354 in (9 mm)

30 s

260 °C (500 °F)

-1 V

0.591 in (15 mm)

2's Complement Binary

LTC2000IY-11#PBF

Analog Devices

Digital to Analog converter

Industrial

Ball

170

LFBGA

Rectangular

Plastic/Epoxy

1 V

Yes

1

CMOS

11

790 mA

0.049 %

Serial, Parallel, Word

1.8 V

Grid Array, Low Profile, Fine Pitch

BGA170,11X17,32

2.2 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

R-PBGA-B170

3

0.067 in (1.69 mm)

0.354 in (9 mm)

30 s

260 °C (500 °F)

-1 V

0.591 in (15 mm)

2's Complement Binary

LTC2000AIY-11#PBF

Analog Devices

Digital to Analog converter

Industrial

Ball

170

LFBGA

Rectangular

Plastic/Epoxy

1 V

Yes

1

CMOS

11

0.0488 %

Serial, Parallel, Word

1.86 V

Grid Array, Low Profile, Fine Pitch

2.2 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B170

3

0.067 in (1.69 mm)

0.354 in (9 mm)

e1

-1 V

0.591 in (15 mm)

2's Complement Binary

LTC2000IY-14#PBF

Analog Devices

Digital to Analog converter

Industrial

Ball

170

LFBGA

Rectangular

Plastic/Epoxy

1 V

Yes

1

CMOS

14

790 mA

0.012 %

Serial, Parallel, Word

1.8 V

Grid Array, Low Profile, Fine Pitch

BGA170,11X17,32

2.2 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

R-PBGA-B170

3

0.067 in (1.69 mm)

0.354 in (9 mm)

30 s

260 °C (500 °F)

-1 V

0.591 in (15 mm)

2's Complement Binary

LTC2000IY-16

Analog Devices

Digital to Analog converter

Industrial

Ball

170

LFBGA

Rectangular

Plastic/Epoxy

1 V

Yes

1

CMOS

16

790 μA

0.0061035156 %

Serial

1.8 V

Grid Array, Low Profile, Fine Pitch

BGA170,10X17,32

2.2 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Bottom

R-PBGA-B170

0.067 in (1.69 mm)

0.354 in (9 mm)

e0

-1 V

0.591 in (15 mm)

2's Complement Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.