24 Digital-to-Analog Converters 2,191

Reset All
Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

AD7397ARU-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

24

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

10

70 µs

200 μA

0.1953 %

Parallel, Word

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP24,.25

Other Converters

70 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G24

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e0

0.307 in (7.8 mm)

Offset Binary

AD8842AR-REEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

3 V

Yes

8

CMOS

8

14 mA

0.3906 %

Serial

5 V

-5 V

Small Outline

5.4 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G24

3

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

240 °C (464 °F)

-3 V

0.606 in (15.4 mm)

Offset Binary

AD7845BR

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

12

5 µs

10 mA

0.0183 %

Parallel, Word

15 V

±15 V

-15 V

Small Outline

SOP24,.4

Other Converters

2.5 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G24

3

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

240 °C (464 °F)

-10 V

0.606 in (15.4 mm)

Binary, Offset Binary

M38510/12101BJX

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

MIL-PRF-38535 Class B

12

0.0122 %

Parallel, Word

15 V

-15 V

In-Line

1.5 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T24

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

Binary

AD7547BQ/883B

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Ceramic

No

2

CMOS

MIL-STD-883 Class B

12

1.5 µs

2 mA

0.0244 %

Parallel, Word

12 V

In-Line

DIP24,.3

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Dual

R-GDIP-T24

0.225 in (5.715 mm)

0.295 in (7.49 mm)

1.29 in (32.77 mm)

Binary

DAC8221AW/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

12

1 µs

2 mA

0.0122 %

Parallel, Word

In-Line

450 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

ADDAC85MILCBII8

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Hybrid

12

0.0183 %

Parallel, Word

15 V

-15 V

In-Line

5 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T24

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Binary

AD7937BRZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

Yes

2

CMOS

12

Parallel, 8 Bits

5 V

Small Outline

600 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G24

3

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

260 °C (500 °F)

0.606 in (15.4 mm)

Binary, Offset Binary

AD7245TQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

5 V

No

1

CMOS

12

0.0244 %

Parallel, Word

In-Line

10 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

-5 V

Binary

AD7237KR-REEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

5 V

Yes

2

CMOS

12

10 µs

15 mA

0.012 %

Parallel, Word

15 V

12/15,GND/-12/-15 V

-15 V

Small Outline

SOP24,.4

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G24

3

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

240 °C (464 °F)

-5 V

0.606 in (15.4 mm)

Offset Binary

AD5410BREZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

24

HTSSOP

Rectangular

Plastic/Epoxy

5.002 V

Yes

1

12

0.024 %

Serial

15 V

3/5,10.8/40 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

TSSOP24,.25

Other Converters

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G24

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

4.998 V

0.307 in (7.8 mm)

Binary

AD7537JN

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

2

BICMOS

12

2 µs

2 mA

0.0244 %

Parallel, 8 Bits

12 V

12/15 V

In-Line

DIP24,.3

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.2 in (30.48 mm)

Binary

AD565AJD/BIN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

12

0.018 %

Parallel, Word

15 V

-15 V

In-Line

250 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-CDIP-T24

0.3 in (7.62 mm)

e0

-1.5 V

1.2 in (30.48 mm)

Binary

DAC8248HP

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 V

No

1

CMOS

12

1 µs

2 mA

0.0244 %

Parallel, 8 Bits

5 V

5/15 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

-10 V

1.2 in (30.48 mm)

Binary, Offset Binary

DAC8221BIHS

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

0.0244 %

Parallel, Word

5 V

Small Outline

450 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G24

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.606 in (15.4 mm)

Offset Binary

AD565-000C

Analog Devices

Digital to Analog converter

Military

No Lead

24

DIE

Rectangular

Yes

1

Bipolar

38535V;38534K;883S

12

18 mA

0.0122 %

Parallel, Word

15 V

±15 V

-15 V

Uncased Chip

DIE OR CHIP

Other Converters

125 °C (257 °F)

-55 °C (-67 °F)

Upper

R-XUUC-N24

No

Binary

AD5722BREZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

24

TSSOP

Rectangular

Plastic/Epoxy

10.8 V

Yes

1

CMOS

12

10 µs

0.3906 %

Serial

5 V

3/5,±5/±15 V

-5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP24,.25

Other Converters

8 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G24

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

-10.8 V

0.307 in (7.8 mm)

Binary, Offset Binary, 2's Complement Binary

AD660BRZ-REEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

BICMOS

16

13 µs

18 mA

0.0031 %

Serial, Parallel, 8 Bits

15 V

5,±15 V

-15 V

Small Outline

SOP24,.4

Other Converters

2.5 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G24

5

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.606 in (15.4 mm)

Binary

AD7808BN

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

10

4 µs

0.293 %

Serial

3.3 V

3.3/5 V

In-Line

DIP24,.3

Other Converters

1.5 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.199 in (30.45 mm)

Offset Binary, 2's Complement Binary

AD3860KD

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

Hybrid

12

7 µs

0.012 %

5,±15 V

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-XDIP-T24

No

e0

Complementary Binary, Complementary Offset Binary

8300301JX

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

12

0.0183 %

Parallel, Word

15 V

-15 V

In-Line

3 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-CDIP-T24

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

-10 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

AD7538AQ

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

BICMOS

14

2 µs

4 mA

0.012 %

Parallel, Word

12/15,-0.3 V

In-Line

DIP24,.6

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

AD7245TD

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

5 V

No

1

CMOS

12

0.0244 %

Parallel, Word

12 V

-12 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

-5 V

Binary

AD7247BQ/883B

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

5 V

No

2

CMOS

MIL-STD-883 Class B

12

0.1221 %

Parallel, Word

15 V

-15 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Dual

R-GDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

-5 V

Offset Binary

DAC8212HP

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

15 V

No

1

CMOS

12

1 µs

2 mA

0.024 %

Parallel, Word

5 V

5/15 V

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0 V

1.2 in (30.48 mm)

Binary, Offset Binary

AD7538TQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

14

1.5 µs

4 mA

0.0061 %

Parallel, Word

12 V

12/15,-0.3 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1.28 in (32.51 mm)

Binary, Offset Binary

AD7547AQ/883B

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Ceramic

No

2

CMOS

MIL-STD-883 Class B

12

1.5 µs

2 mA

0.0244 %

Parallel, Word

12 V

In-Line

DIP24,.3

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Dual

R-GDIP-T24

0.225 in (5.715 mm)

0.295 in (7.49 mm)

1.29 in (32.77 mm)

Binary

5962-8980801LX

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

12

Parallel, Word

15 V

-15 V

In-Line

50 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

Yes

Binary

AD767BD

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Bipolar

12

4 µs

0.0122 %

Serial

15 V

-15 V

In-Line

DIP24,.3

3 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-10 V

1.2 in (30.48 mm)

Binary, Offset Binary, 2's Complement Binary

ADDAC85MILCBIV8

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Hybrid

12

0.0183 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP24,.6

Other Converters

5 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T24

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Binary

ADDAC80Z-CCD-V

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Hybrid

12

0.0122 %

Parallel, Word

15 V

5,±12/±15 V

-15 V

In-Line

DIP24,.6

Other Converters

5 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-CDIP-T24

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Binary Coded Decimal

DAC8841FSZ-REEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

3 V

Yes

8

CMOS

8

6 µs

26 mA

0.5859 %

Serial

5 V

5 V

Small Outline

SOP24,.4

Other Converters

3.5 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

40 s

260 °C (500 °F)

0 V

0.606 in (15.4 mm)

Binary

LTC1599BIG#TR

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

24

SSOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

16

0.0031 %

Parallel, Word

5 V

Small Outline, Shrink Pitch

1 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G24

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e0

-10 V

0.323 in (8.2 mm)

Binary

LTC1450LCN#PBF

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

0.0977 %

Parallel, Word

3 V

In-Line

14 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T24

1

0.15 in (3.81 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

Binary

AD7840KNZ

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

3 V

No

1

BICMOS

14

4 µs

14 mA

0.0061 %

Serial, Parallel, Word

5 V

±5 V

-5 V

In-Line

DIP24,.3

Other Converters

2.5 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

-3 V

1.2 in (30.48 mm)

2's Complement Binary

AD7244SQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

BICMOS

MIL-STD-883 Class B

14

4 µs

28 mA

0.0122 %

Serial

5 V

±5 V

-5 V

In-Line

DIP24,.3

Other Converters

2.5 µs

0.11 in (2.79 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.225 in (5.71 mm)

0.295 in (7.49 mm)

No

e0

1.29 in (32.77 mm)

Binary

AD7547LR/883B

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

Yes

2

CMOS

MIL-STD-883 Class B

12

1.5 µs

2 mA

0.0244 %

Parallel, Word

12 V

Small Outline

SOP24,.4

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Dual

R-PDSO-G24

0.104 in (2.65 mm)

0.295 in (7.5 mm)

0.606 in (15.4 mm)

Binary

5962-8961701LX

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

Bipolar

12

Parallel, Word

15 V

-15 V

In-Line

3 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-CDIP-T24

0.3 in (7.62 mm)

Yes

1.2 in (30.48 mm)

Binary

HDM-1210-SD

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1.024 V

No

1

Bipolar

12

170 ns

72 mA

0.0244 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP24,.6

Other Converters

120 ns

0.1 in (2.54 mm)

100 °C (212 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T24

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

0 V

Binary

LTC1599BIG#PBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

24

SSOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

16

0.0031 %

Parallel, Word

5 V

Small Outline, Shrink Pitch

1 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G24

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

260 °C (500 °F)

-10 V

0.323 in (8.2 mm)

Binary

AD563KN/BIN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

5/15,-15 V

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T24

No

e0

Binary, Offset Binary

ADDAC72C-CSB-V

Analog Devices

Digital to Analog converter

Other

Pin/Peg

24

DIP

Rectangular

Metal

10 V

No

1

Bipolar

16

10 µs

55 mA

0.003 %

Parallel, Word

15 V

5,±15 V

-15 V

Microelectronic Assembly

DIP24,.6

Other Converters

5 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-MDMA-P24

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

0 V

Complementary Binary

5962-9078502MLX

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

5 V

No

2

CMOS

12

0.0122 %

Parallel, Word

15 V

-15 V

In-Line

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T24

Yes

-5 V

Binary

AD9703TDB

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

0 V

No

1

Bipolar

MIL-STD-883 Class B (Modified)

8

275 mA

0.2 %

Parallel, 8 Bits

-5.2 V

-5.2 V

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T24

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-.6375 V

Complementary Binary

AD7242AQ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

BICMOS

12

3 µs

27 mA

0.0244 %

Serial

5 V

±5 V

-5 V

In-Line

DIP24,.3

Other Converters

2 µs

0.11 in (2.79 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead (Sn63Pb37)

Dual

R-GDIP-T24

0.225 in (5.71 mm)

0.295 in (7.49 mm)

No

e0

1.29 in (32.77 mm)

Binary

HDG-0805BW

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

0 V

No

1

ECL

8

11 ns

140 mA

Parallel, 8 Bits

-5.2 V

-5.2 V

In-Line

DIP24,.6

Other Converters

9 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T24

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-.6375 V

Complementary Binary

HDS-1250TM/883B

Analog Devices

Digital to Analog converter

Military

Pin/Peg

24

DIP

Rectangular

Metal

.512 V

No

1

Hybrid

38535Q/M;38534H;883B

12

35 ns

54 mA

0.0366 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP24,.6

Other Converters

35 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-MDIP-P24

0.6 in (15.24 mm)

No

e0

-.512 V

1.272 in (32.3205 mm)

Binary, Offset Binary

DAC8221BIFP

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

0.0244 %

Parallel, Word

5 V

In-Line

450 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.199 in (30.45 mm)

Offset Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.