28 Digital-to-Analog Converters 1,923

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

AD7225UE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

4

BICMOS

MIL-STD-883 Class B

8

7 µs

12 mA

0.1953 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

Chip Carrier

LCC28,.45SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

Binary

AD9712BTQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

Bipolar

12

183 mA

0.0427 %

Parallel, Word

-5.2 V

-5.2 V

In-Line

DIP28,.6

Other Converters

27 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

Binary

AD1859JR

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

18

30 mA

Serial

5 V

5 V

Small Outline

SOP28,.4

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

240 °C (464 °F)

0.705 in (17.9 mm)

2's Complement Binary

AD768AF/QMLR

Analog Devices

Digital to Analog converter

Military

Flat

28

QFF

Rectangular

100k Rad(Si)

Ceramic, Metal-Sealed Cofired

Yes

1

MIL-PRF-38535 Class V

16

0.0137 %

Parallel, Word

5 V

-5 V

Flatpack

35 ns

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-CDFP-F28

Binary

5962R0820102VZA

Analog Devices

Digital to Analog converter

Military

Flat

28

DFP

Rectangular

100K Rad(Si)

Ceramic, Metal-Sealed Cofired

Yes

1

MIL-PRF-38535 Class V

16

40 mA

0.0183 %

Parallel

5 V

-5 V

Flatpack

35 ns

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDFP-F28

Yes

e0

Binary

MDA-10Z-110

Analog Devices

Digital to Analog Converter 10 bit

Pin/Peg

28

DMA

Square

1.5 V

No

1

Hybrid

10

0.0488 %

Parallel, Word

15 V

-15 V

Microelectronic Assembly

300 ns

70 °C (158 °F)

0 °C (32 °F)

Dual

S-XDMA-P28

0.409 in (10.4 mm)

2.012 in (51.1 mm)

-10 V

2.012 in (51.1 mm)

Offset Binary

MDA-10Z-25

Analog Devices

Digital to Analog Converter 10 bit

Pin/Peg

28

DMA

Square

10 V

No

1

Hybrid

10

0.0488 %

Parallel, Word

15 V

-15 V

Microelectronic Assembly

5 µs

70 °C (158 °F)

0 °C (32 °F)

Dual

S-XDMA-P28

0.409 in (10.4 mm)

2.012 in (51.1 mm)

0 V

2.012 in (51.1 mm)

Binary

MX7537UE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Rectangular

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

MIL-STD-883 Class B

12

0.0122 %

Parallel, Word

15 V

Chip Carrier

125 °C (257 °F)

-55 °C (-67 °F)

Quad

R-CQCC-N28

No

Binary

MX7225LP+

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

4

CMOS

8

4 µs

10 mA

0.3906 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

Chip Carrier

LDCC28,.5SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e3

30 s

260 °C (500 °F)

0.453 in (11.505 mm)

Binary

MX7547TE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Rectangular

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

MIL-STD-883 Class B

12

0.0244 %

Parallel, Word

15 V

Chip Carrier

125 °C (257 °F)

-55 °C (-67 °F)

Quad

R-CQCC-N28

No

Binary

MAX5180BEEI+

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

.8 V

Yes

1

10

0.1953 %

Parallel, Word

3 V

Small Outline, Shrink Pitch

25 ns

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G28

1

0.068 in (1.73 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

-.3 V

0.389 in (9.89 mm)

Binary

MX7536KN+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

14

1.5 µs

4 mA

0.0061 %

Parallel, Word

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

800 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T28

1

0.175 in (4.445 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

1.45 in (36.83 mm)

Offset Binary

MX7537JP+

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

2

CMOS

12

1.5 µs

2 mA

0.0244 %

Parallel, Word

15 V

12/15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e3

245 °C (473 °F)

0.453 in (11.505 mm)

Binary, Offset Binary, 2's Complement Binary

MX667JCWI

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

1

Bipolar

12

4 µs

12 mA

0.02 %

±12/±15 V

Small Outline

SOP28,.4

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G28

No

e0

Binary, Offset Binary

MX7535BQ

Analog Devices

Digital to Analog converter

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

1

CMOS

14

1.5 µs

4 mA

0.0061 %

Parallel, Word

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Binary, Offset Binary

MAX5012BEQI

Analog Devices

Digital to Analog converter

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

1

ECL

12

148 mA

0.0488 %

Parallel, Word

-5.2 V

-5.2 V

Chip Carrier

LDCC28,.5SQ

Other Converters

13 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e0

0.453 in (11.505 mm)

Binary

MAX514WI

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

4

CMOS

12

0.0122 %

Serial

5 V

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.705 in (17.9 mm)

Binary

MX7535KP+T

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

14

1.5 µs

4 mA

0.0061 %

Parallel, Word

12/15,GND/-0.3 V

Chip Carrier

LDCC28,.5SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-J28

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e3

0.453 in (11.505 mm)

Binary, Offset Binary

MX7535CWI

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

1

BICMOS

14

1.5 µs

4 mA

0.012 %

12/15,GND/-0.3 V

Small Outline

SOP28,.4

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G28

No

e0

Binary, Offset Binary

MX7547SE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Rectangular

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

MIL-STD-883 Class B

12

0.0244 %

Parallel, Word

15 V

Chip Carrier

125 °C (257 °F)

-55 °C (-67 °F)

Quad

R-CQCC-N28

No

Binary

MX767KP

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

1

Bipolar

12

4 µs

12 mA

0.01 %

±12/±15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

No

e0

Binary, Offset Binary

MX667BD

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

28

DIP

Rectangular

Ceramic

No

1

Bipolar

12

4 µs

12 mA

0.01 %

±12/±15 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-XDIP-T28

e0

Binary, Offset Binary

MAX5183BEEI+T

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

.8 V

Yes

1

10

0.1953 %

Parallel, Word

3 V

Small Outline, Shrink Pitch

25 ns

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G28

1

0.068 in (1.73 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

-.3 V

0.389 in (9.89 mm)

Binary

MX7537UE/883

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic

Yes

2

BICMOS

38535Q/M;38534H;883B

12

1.5 µs

2 mA

0.012 %

12/15 V

Chip Carrier

LCC28,.45SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-XQCC-N28

No

e0

Binary, Offset Binary

MAX5185BEEI+

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

.8 V

Yes

1

10

0.1953 %

Parallel, Word

3 V

Small Outline, Shrink Pitch

25 ns

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G28

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

-.3 V

0.389 in (9.89 mm)

Binary

MX7845KP+T

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 V

Yes

1

BICMOS

12

5 µs

10 mA

0.0183 %

Parallel, Word

15 V

±15 V

-15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

2.5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-J28

1

0.18 in (4.572 mm)

0.453 in (11.506 mm)

No

e3

-10 V

0.453 in (11.506 mm)

Binary

MX767KEQI

Analog Devices

Digital to Analog converter

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

1

Bipolar

12

4 µs

12 mA

0.01 %

±12/±15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

No

e0

Binary, Offset Binary

MX7845SE

Analog Devices

Digital to Analog converter

Industrial

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 V

Yes

1

BICMOS

12

5 µs

10 mA

0.0488 %

Parallel, Word

15 V

±15 V

-15 V

Chip Carrier

LCC28,.45SQ

Other Converters

2.5 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.451 in (11.4554 mm)

No

e0

-10 V

0.451 in (11.4554 mm)

Binary

MX7228LP

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 V

Yes

8

CMOS

8

5 µs

20 mA

0.1953 %

Parallel, 8 Bits

12/15, GND/-5 V

-5 V

Chip Carrier

LDCC28,.5SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e0

0 V

0.453 in (11.505 mm)

Binary

AD7535CWI

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

1

BICMOS

14

1.5 µs

4 mA

0.012 %

12/15,GND/-0.3 V

Small Outline

SOP28,.4

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G28

No

e0

Binary, Offset Binary

MAX5591AEUI+

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

2.625 V

Yes

1

BICMOS

12

6 µs

8 mA

0.0244 %

Serial

3 V

2/5,3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Other Converters

3 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G28

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.382 in (9.7 mm)

Binary

MAX514JI

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

4

CMOS

12

0.0122 %

Serial

5 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-GDIP-T28

0.23 in (5.842 mm)

0.6 in (15.24 mm)

No

e0

1.45 in (36.83 mm)

Binary

MX7538JP

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

14

1.5 µs

4 mA

0.0122 %

Parallel, Word

12/15,-0.3 V

Chip Carrier

LDCC28,.5SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e0

0.453 in (11.505 mm)

Binary

MAX514PI

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

4

CMOS

12

0.0122 %

Serial

5 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T28

0.175 in (4.445 mm)

0.6 in (15.24 mm)

No

e0

1.45 in (36.83 mm)

Binary

5962-89657013C

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Rectangular

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

MIL-STD-883

12

0.0244 %

Parallel, Word

15 V

Chip Carrier

125 °C (257 °F)

-55 °C (-67 °F)

Quad

R-CQCC-N28

No

Binary

MX7536KCWI+T

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

14

1.5 µs

4 mA

0.0061 %

Parallel, Word

12/15,GND/-0.3 V

Small Outline

SOP28,.4

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

0.705 in (17.9 mm)

Offset Binary

MX7537JP+T

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

2

CMOS

12

1.5 µs

2 mA

0.0244 %

Parallel, Word

15 V

12/15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e3

30 s

245 °C (473 °F)

0.453 in (11.505 mm)

Binary, Offset Binary, 2's Complement Binary

MX7845JP+T

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 V

Yes

1

BICMOS

12

5 µs

10 mA

0.0244 %

Parallel, Word

15 V

±15 V

-15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

2.5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-J28

1

0.18 in (4.572 mm)

0.453 in (11.506 mm)

No

e3

245 °C (473 °F)

-10 V

0.453 in (11.506 mm)

Binary

MX7537SE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Rectangular

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

MIL-STD-883 Class B

12

0.0122 %

Parallel, Word

15 V

Chip Carrier

125 °C (257 °F)

-55 °C (-67 °F)

Quad

R-CQCC-N28

No

Binary

MAX5593EUI+T

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

2.625 V

Yes

1

BICMOS

10

6 µs

8 mA

0.0977 %

Serial

3 V

2/5,3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Other Converters

2.5 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G28

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.382 in (9.7 mm)

Binary

MX7225LP+T

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

4

CMOS

8

4 µs

10 mA

0.3906 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

Chip Carrier

LDCC28,.5SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e3

0.453 in (11.505 mm)

Binary

MX7536KCWI+

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

14

1.5 µs

4 mA

0.0061 %

Parallel, Word

12/15,GND/-0.3 V

Small Outline

SOP28,.4

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

0.705 in (17.9 mm)

Offset Binary

AD7535KCWI

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

1

BICMOS

14

1.5 µs

4 mA

0.006 %

12/15,GND/-0.3 V

Small Outline

SOP28,.4

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G28

No

e0

Binary, Offset Binary

MAX5180BEEI+T

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

.8 V

Yes

1

10

0.1953 %

Parallel, Word

3 V

Small Outline, Shrink Pitch

25 ns

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G28

1

0.068 in (1.73 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

-.3 V

0.389 in (9.89 mm)

Binary

MX7547UE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Rectangular

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

MIL-STD-883 Class B

12

0.0244 %

Parallel, Word

15 V

Chip Carrier

125 °C (257 °F)

-55 °C (-67 °F)

Quad

R-CQCC-N28

No

Binary

MAX5182BEEI+T

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

.8 V

Yes

1

10

0.1953 %

Parallel, Word

3 V

Small Outline, Shrink Pitch

25 ns

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Dual

R-PDSO-G28

1

0.069 in (1.75 mm)

0.154 in (3.9116 mm)

No

-.3 V

0.39 in (9.9 mm)

Binary

MX767JEQI

Analog Devices

Digital to Analog converter

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

1

Bipolar

12

4 µs

12 mA

0.02 %

±12/±15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

No

e0

Binary, Offset Binary

MX667JN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

1

Bipolar

12

4 µs

12 mA

0.02 %

±12/±15 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T28

e0

Binary, Offset Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.