32 Digital-to-Analog Converters 276

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

LTC2672HUH-16#TRPBF

Analog Devices

Digital to Analog Converter 16 bit

No Lead

32

HVQCCN

Square

Plastic/Epoxy

Yes

1

CMOS

16

5.3 mA

0.09765625 %

Serial

5 V

-3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

200 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N32

0.031 in (0.8 mm)

0.197 in (5 mm)

0.197 in (5 mm)

Binary

AD5762RCSUZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

32

TQFP

Square

Plastic/Epoxy

10.52 V

Yes

1

CMOS

16

10 µs

4.25 mA

0.0015 %

Serial

13.5 V

3/5,±12/±15 V

-13.5 V

Flatpack, Thin Profile

TQFP32,.35SQ,32

Other Converters

8 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G32

3

0.047 in (1.2 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

-10.52 V

0.276 in (7 mm)

Offset Binary, 2's Complement Binary

AD9744ACPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

32

VQCCN

Square

1.25 V

Yes

1

CMOS

14

0.0305 %

Parallel, Word

3.3 V

3.3 V

Chip Carrier, Very Thin Profile

LCC32,.2SQ,20

Other Converters

11 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N32

3

0.039 in (1 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

-1 V

0.197 in (5 mm)

Binary, 2's Complement Binary

MAX5113GTJ+

Analog Devices

Digital to Analog converter

Industrial

No Lead

32

HVQCCN

Square

2.3 V

Yes

1

14

600 μA

0.0061 %

Serial

3 V

-5.2 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

15 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

MAX5112GTJ+

Analog Devices

Digital to Analog converter

Automotive

No Lead

32

HVQCCN

Square

2.3 V

Yes

1

14

600 μA

0.0488 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

15 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

IMSG176J-50S

STMicroelectronics

Digital to Analog converter

Commercial

J Bend

32

QCCJ

Rectangular

Plastic/Epoxy

Yes

3

CMOS

6

20 ns

160 mA

0.78 %

5 V

5 V

Chip Carrier

LDCC32,.5X.6

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

R-PQCC-J32

No

e0

Binary

IMSG176J-40S

STMicroelectronics

Digital to Analog converter

Commercial

J Bend

32

QCCJ

Rectangular

Plastic/Epoxy

Yes

3

CMOS

6

25 ns

155 mA

0.78 %

5 V

5 V

Chip Carrier

LDCC32,.5X.6

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

R-PQCC-J32

No

e0

Binary

IMSG176J-40

STMicroelectronics

Digital to Analog converter

Commercial

J Bend

32

QCCJ

Rectangular

Plastic/Epoxy

Yes

3

CMOS

6

25 ns

155 mA

0.78 %

5 V

5 V

Chip Carrier

LDCC32,.5X.6

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

R-PQCC-J32

No

e0

Binary

IMSG176J-66S

STMicroelectronics

Digital to Analog converter

Commercial

J Bend

32

QCCJ

Rectangular

Plastic/Epoxy

Yes

3

CMOS

6

20 ns

0.78 %

5 V

5 V

Chip Carrier

LDCC32,.5X.6

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

R-PQCC-J32

No

e0

Binary

IMSG176J-50

STMicroelectronics

Digital to Analog converter

Commercial

J Bend

32

QCCJ

Rectangular

Plastic/Epoxy

Yes

3

CMOS

6

20 ns

160 mA

0.78 %

5 V

5 V

Chip Carrier

LDCC32,.5X.6

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

R-PQCC-J32

No

e0

Binary

5962R1621101V9X

STMicroelectronics

Digital to Analog converter

Military

No Lead

32

DIE

Rectangular

100k Rad(Si)

Yes

1

MIL-PRF-38535 Class V

16

0.0069 %

Uncased Chip

125 °C (257 °F)

-55 °C (-67 °F)

Upper

R-XUUC-N32

Yes

Binary

5962R1621101V9A

STMicroelectronics

Digital to Analog converter

Military

No Lead

32

DIE

Rectangular

100k Rad(Si)

Yes

1

MIL-PRF-38535 Class V

16

0.0069 %

Uncased Chip

125 °C (257 °F)

-55 °C (-67 °F)

Upper

R-XUUC-N32

Yes

Binary

IMSG176J-65

STMicroelectronics

Digital to Analog converter

Commercial

J Bend

32

QCCJ

Rectangular

Plastic/Epoxy

Yes

3

CMOS

6

15.3 ns

190 mA

0.78 %

5 V

5 V

Chip Carrier

LDCC32,.5X.6

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

R-PQCC-J32

No

e0

Binary

TDA1547

NXP Semiconductors

Digital to Analog converter

Commercial

Through-Hole

32

SDIP

Rectangular

Plastic/Epoxy

1.15 V

No

2

BIMOS

1

63 mA

Serial

5 V

5,-3.5,±5 V

-5 V

In-Line, Shrink Pitch

SDIP32,.4

Other Converters

0.07 in (1.778 mm)

70 °C (158 °F)

-20 °C (-4 °F)

Tin/Nickel Palladium Gold

Dual

R-PDIP-T32

0.185 in (4.7 mm)

0.4 in (10.16 mm)

No

e3/e4

0 V

Binary

TDA1547P

NXP Semiconductors

Digital to Analog converter

Commercial

Through-Hole

32

SDIP

Rectangular

Plastic/Epoxy

No

2

BICMOS

1

46 mA

Serial

5 V

-5 V

In-Line, Shrink Pitch

0.07 in (1.778 mm)

70 °C (158 °F)

-20 °C (-4 °F)

Dual

R-PDIP-T32

0.185 in (4.7 mm)

0.4 in (10.16 mm)

No

Binary

UDA1328TD-T

NXP Semiconductors

Digital to Analog converter

Industrial

Gull Wing

32

SOP

Rectangular

Plastic/Epoxy

Yes

1

24

Serial

3.3 V

Small Outline

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Dual

R-PDSO-G32

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

0.807 in (20.5 mm)

Binary

TDA1547PN

NXP Semiconductors

Digital to Analog converter

Commercial

Through-Hole

32

SDIP

Rectangular

Plastic/Epoxy

No

2

BICMOS

1

46 mA

Serial

5 V

-5 V

In-Line, Shrink Pitch

0.07 in (1.778 mm)

70 °C (158 °F)

-20 °C (-4 °F)

Dual

R-PDIP-T32

0.185 in (4.7 mm)

0.4 in (10.16 mm)

No

Binary

935261617118

NXP Semiconductors

Digital to Analog converter

Industrial

Gull Wing

32

SOP

Rectangular

Plastic/Epoxy

Yes

1

24

Serial

3.3 V

Small Outline

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Dual

R-PDSO-G32

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

0.807 in (20.5 mm)

Binary

UDA1328T/N1

NXP Semiconductors

Digital to Analog converter

Industrial

Gull Wing

32

SOP

Rectangular

Plastic/Epoxy

Yes

1

24

Serial

3.3 V

Small Outline

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Dual

R-PDSO-G32

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

0.807 in (20.5 mm)

Binary

UDA1328TD

NXP Semiconductors

Digital to Analog converter

Industrial

Gull Wing

32

SOP

Rectangular

Plastic/Epoxy

Yes

1

24

Serial

3.3 V

Small Outline

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Dual

R-PDSO-G32

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

0.807 in (20.5 mm)

Binary

935261617112

NXP Semiconductors

Digital to Analog converter

Industrial

Gull Wing

32

SOP

Rectangular

Plastic/Epoxy

Yes

1

24

Serial

3.3 V

Small Outline

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Dual

R-PDSO-G32

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

0.807 in (20.5 mm)

Binary

UDA1328T

NXP Semiconductors

Digital to Analog converter

Industrial

Gull Wing

32

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

24

Serial

3.3 V

3.3 V

Small Outline

SOP32,.4

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Dual

R-PDSO-G32

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

0.807 in (20.5 mm)

Binary

MB88345PF

Infineon Technologies

Digital to Analog converter

Other

Gull Wing

32

LQFP

Square

Plastic/Epoxy

5.4 V

Yes

1

CMOS

8

100 µs

5.4 mA

0.5859375 %

Serial

5 V

Flatpack, Low Profile

QFP32,.28,32

0.031 in (0.8 mm)

85 °C (185 °F)

-20 °C (-4 °F)

Quad

S-PQFP-G32

0.067 in (1.7 mm)

0.276 in (7 mm)

0 V

0.276 in (7 mm)

Binary

MAX5650ETJ-T

Maxim Integrated

Digital to Analog converter

Industrial

No Lead

32

HVQCCN

Square

4.111 V

Yes

1

BICMOS

16

2 mA

0.0061 %

Parallel, Word

5 V

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Other Converters

2 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N32

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

0 V

0.197 in (5 mm)

Binary

MAX5651ETJ

Maxim Integrated

Digital to Analog converter

Industrial

No Lead

32

HVQCCN

Square

4.111 V

Yes

1

BICMOS

16

2 mA

0.0061 %

Parallel, Word

5 V

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Other Converters

2 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

245 °C (473 °F)

0 V

0.197 in (5 mm)

Binary

MAX5652ETJ

Maxim Integrated

Digital to Analog converter

Industrial

No Lead

32

HVQCCN

Square

4.111 V

Yes

1

BICMOS

16

2 mA

0.0061 %

Parallel, Word

5 V

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Other Converters

2 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

245 °C (473 °F)

0 V

0.197 in (5 mm)

Binary

MAX11329ATJ+T

Maxim Integrated

Digital to Analog converter

No Lead

32

HVQCCN

Square

Yes

1

BICMOS

10

6.5 mA

0.039 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

Binary

MAX5650ETJ

Maxim Integrated

Digital to Analog converter

Industrial

No Lead

32

HVQCCN

Square

4.111 V

Yes

1

BICMOS

16

2 mA

0.0061 %

Parallel, Word

5 V

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Other Converters

2 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

245 °C (473 °F)

0 V

0.197 in (5 mm)

Binary

HI1177JCQ

Renesas Electronics

Digital to Analog converter

Industrial

Gull Wing

32

QFP

Square

Plastic/Epoxy

2.2 V

Yes

2

CMOS

8

0.9765 %

Parallel, 8 Bits

5 V

Flatpack

QFP32,.35SQ,32

85 °C (185 °F)

-40 °C (-40 °F)

Quad

S-PQFP-G32

1.9 V

Binary

KDA0476SPL-50

Samsung

Digital to Analog converter

Commercial

J Bend

32

QCCJ

Rectangular

Plastic/Epoxy

Yes

3

CMOS

6

200 mA

0.78 %

5 V

5 V

Chip Carrier

LDCC32,.5X.6

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

R-PQCC-J32

3

No

e0

Binary

KDA3310L-9

Samsung

Digital to Analog converter

Commercial

J Bend

32

QCCJ

Rectangular

Plastic/Epoxy

5.05 V

Yes

1

Bipolar

10

150 mA

0.0977 %

Parallel, Word

5 V

Chip Carrier

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Quad

R-PQCC-J32

0.138 in (3.5 mm)

0.45 in (11.43 mm)

No

4.95 V

0.55 in (13.97 mm)

Binary

KDA3310L-10

Samsung

Digital to Analog converter

Commercial

J Bend

32

QCCJ

Rectangular

Plastic/Epoxy

5.05 V

Yes

1

Bipolar

10

150 mA

0.0977 %

Parallel, Word

5 V

Chip Carrier

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Quad

R-PQCC-J32

0.138 in (3.5 mm)

0.45 in (11.43 mm)

No

4.95 V

0.55 in (13.97 mm)

Binary

KDA0476SPL-66

Samsung

Digital to Analog converter

Commercial

J Bend

32

QCCJ

Rectangular

Plastic/Epoxy

Yes

3

CMOS

6

200 mA

0.78 %

5 V

5 V

Chip Carrier

LDCC32,.5X.6

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

R-PQCC-J32

3

No

e0

Binary

KDA0476SPL-35

Samsung

Digital to Analog converter

Commercial

J Bend

32

QCCJ

Rectangular

Plastic/Epoxy

Yes

3

CMOS

6

220 mA

0.78 %

5 V

5 V

Chip Carrier

LDCC32,.5X.6

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

R-PQCC-J32

3

No

e0

Binary

KDA0476SPL-80

Samsung

Digital to Analog converter

Commercial

J Bend

32

QCCJ

Rectangular

Plastic/Epoxy

Yes

3

CMOS

6

200 mA

0.78 %

5 V

5 V

Chip Carrier

LDCC32,.5X.6

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

R-PQCC-J32

3

No

e0

Binary

KDA3310L-8

Samsung

Digital to Analog converter

Commercial

J Bend

32

QCCJ

Rectangular

Plastic/Epoxy

5.05 V

Yes

1

Bipolar

10

150 mA

0.1953 %

Parallel, Word

5 V

Chip Carrier

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Quad

R-PQCC-J32

0.138 in (3.5 mm)

0.45 in (11.43 mm)

No

4.95 V

0.55 in (13.97 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.