40 Digital-to-Analog Converters 168

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

PMADV7121KN80

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

No

3

CMOS

10

125 mA

0.2 %

5 V

5 V

In-Line

DIP40,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T40

No

e0

Binary

PMADV101KN50

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

No

3

CMOS

8

100 mA

0.39 %

5 V

5 V

In-Line

DIP40,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T40

No

e0

Binary

ADV453SQ66

Analog Devices

Digital to Analog converter

Military

Through-Hole

40

DIP

Rectangular

Ceramic

No

3

CMOS

38535Q/M;38534H;883B

8

5 V

5 V

In-Line

DIP40,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T40

No

e0

Binary

ADV7121JN30

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

No

3

CMOS

10

125 mA

0.293 %

Parallel, 8 Bits

5 V

5 V

In-Line

DIP40,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T40

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

Binary

ADV101KN50

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

No

3

CMOS

8

100 mA

0.3906 %

Parallel, 8 Bits

5 V

5 V

In-Line

DIP40,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T40

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

Binary

AD5347BCPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

40

VQCCN

Square

5.499 V

Yes

1

CMOS

10

0.3906 %

Parallel, Word

3 V

Chip Carrier, Very Thin Profile

7 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N40

3

0.039 in (1 mm)

0.236 in (6 mm)

No

e3

260 °C (500 °F)

.001 V

0.236 in (6 mm)

Binary

MAX5852ETL+T

Analog Devices

Digital to Analog converter

Industrial

No Lead

40

HVQCCN

Square

1.25 V

Yes

2

CMOS

8

0.0977 %

Parallel, 8 Bits

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

12 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

-1 V

0.236 in (6 mm)

Complementary Binary

MAX5851ETL+T

Analog Devices

Digital to Analog converter

Industrial

No Lead

40

HVQCCN

Square

1.25 V

Yes

2

CMOS

8

0.0977 %

Parallel, 8 Bits

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

12 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

-1 V

0.236 in (6 mm)

Complementary Binary

MAX5853ETL+T

Analog Devices

Digital to Analog converter

Industrial

No Lead

40

HVQCCN

Square

1.25 V

Yes

1

CMOS

10

46 mA

0.0977 %

Parallel, Word

3 V

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC40,.24SQ,20

Other Converters

12 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

-1 V

0.236 in (6 mm)

Binary

MAX5854ETL+T

Analog Devices

Digital to Analog converter

Industrial

No Lead

40

HVQCCN

Square

1.25 V

Yes

2

CMOS

10

0.0977 %

Parallel, Word

3 V

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC40,.24SQ,20

Other Converters

12 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

-1 V

0.236 in (6 mm)

Binary

MAX5852ETL+

Analog Devices

Digital to Analog converter

Industrial

No Lead

40

HVQCCN

Square

1.25 V

Yes

2

CMOS

8

0.0977 %

Parallel, 8 Bits

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

12 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

-1 V

0.236 in (6 mm)

Complementary Binary

MAX5853ETL+

Analog Devices

Digital to Analog converter

Industrial

No Lead

40

HVQCCN

Square

1.25 V

Yes

1

CMOS

10

46 mA

0.0977 %

Parallel, Word

3 V

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC40,.24SQ,20

Other Converters

12 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

-1 V

0.236 in (6 mm)

Binary

MAX5854ETL+

Analog Devices

Digital to Analog converter

Industrial

No Lead

40

HVQCCN

Square

1.25 V

Yes

2

CMOS

10

0.0977 %

Parallel, Word

3 V

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC40,.24SQ,20

Other Converters

12 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

-1 V

0.236 in (6 mm)

Binary

MAX5851ETL+

Analog Devices

Digital to Analog converter

Industrial

No Lead

40

HVQCCN

Square

1.25 V

Yes

2

CMOS

8

0.0977 %

Parallel, 8 Bits

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

12 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

-1 V

0.236 in (6 mm)

Complementary Binary

5962-8950901XX

Infineon Technologies

Digital to Analog converter

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

3

CMOS

8

0.3906 %

Parallel, 8 Bits

5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T40

0.22 in (5.588 mm)

0.6 in (15.24 mm)

No

e0

2.095 in (53.21 mm)

Binary

5962-8950901XA

Infineon Technologies

Digital to Analog converter

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

3

CMOS

MIL-STD-883

8

0.3906 %

Parallel, 8 Bits

5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T40

0.22 in (5.588 mm)

0.6 in (15.24 mm)

No

e0

2.095 in (53.21 mm)

Binary

MAX5851ETL-T

Maxim Integrated

Digital to Analog converter

Industrial

No Lead

40

HVQCCN

Square

1.25 V

Yes

2

CMOS

8

0.0977 %

Parallel, 8 Bits

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

12 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e0

-1 V

0.236 in (6 mm)

Complementary Binary

MAX5853ETL

Maxim Integrated

Digital to Analog converter

Industrial

No Lead

40

HVQCCN

Square

1.25 V

Yes

1

CMOS

10

46 mA

0.0977 %

Parallel, Word

3 V

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC40,.24SQ,20

Other Converters

12 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e0

245 °C (473 °F)

-1 V

0.236 in (6 mm)

Binary

MAX5854ETL-T

Maxim Integrated

Digital to Analog converter

Industrial

No Lead

40

HVQCCN

Square

1.25 V

Yes

2

CMOS

10

0.0977 %

Parallel, Word

3 V

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC40,.24SQ,20

Other Converters

12 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N40

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e0

-1 V

0.236 in (6 mm)

Binary

MAX5854ETL

Maxim Integrated

Digital to Analog converter

Industrial

No Lead

40

HVQCCN

Square

1.25 V

Yes

2

CMOS

10

0.0977 %

Parallel, Word

3 V

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC40,.24SQ,20

Other Converters

12 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e0

245 °C (473 °F)

-1 V

0.236 in (6 mm)

Binary

MAX5852ETL

Maxim Integrated

Digital to Analog converter

Industrial

No Lead

40

HVQCCN

Square

1.25 V

Yes

2

CMOS

8

0.0977 %

Parallel, 8 Bits

3 V

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC40,.24SQ,20

Other Converters

12 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e0

-1 V

0.236 in (6 mm)

Complementary Binary

MAX5853ETL-T

Maxim Integrated

Digital to Analog converter

Industrial

No Lead

40

HVQCCN

Square

1.25 V

Yes

2

CMOS

10

46 mA

0.0977 %

Parallel, Word

3 V

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC40,.24SQ,20

Other Converters

12 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N40

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e0

-1 V

0.236 in (6 mm)

Binary

MAX5852ETL-T

Maxim Integrated

Digital to Analog converter

Industrial

No Lead

40

HVQCCN

Square

1.25 V

Yes

2

CMOS

8

0.0977 %

Parallel, 8 Bits

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

12 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N40

0.031 in (0.8 mm)

0.236 in (6 mm)

No

-1 V

0.236 in (6 mm)

Complementary Binary

MAX5851ETL

Maxim Integrated

Digital to Analog converter

Industrial

No Lead

40

HVQCCN

Square

1.25 V

Yes

2

CMOS

8

0.0977 %

Parallel, 8 Bits

3 V

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC40,.24SQ,20

Other Converters

12 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e0

245 °C (473 °F)

-1 V

0.236 in (6 mm)

Complementary Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.