56 Digital-to-Analog Converters 100

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

AD5360BCPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

56

HVQCCN

Square

15.1 V

Yes

1

16

30 µs

0.0061 %

Serial

15 V

3/5,±12/±16.5 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N56

3

0.039 in (1 mm)

0.315 in (8 mm)

No

e3

260 °C (500 °F)

-15.1 V

0.315 in (8 mm)

2's Complement Binary

AD9911BCPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

56

HVQCCN

Square

2.39 V

Yes

1

10

Parallel, Word

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N56

3

0.039 in (1 mm)

0.315 in (8 mm)

No

e3

30 s

260 °C (500 °F)

1.21 V

0.315 in (8 mm)

Binary

AD5360BCPZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

56

HVQCCN

Square

15.1 V

Yes

1

16

30 µs

0.0061 %

Serial

15 V

3/5,±12/±16.5 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N56

3

0.039 in (1 mm)

0.315 in (8 mm)

No

e3

260 °C (500 °F)

-15.1 V

0.315 in (8 mm)

2's Complement Binary

DAC8728SRTQT

Texas Instruments

Digital to Analog converter

Industrial

No Lead

56

HVQCCN

Square

Plastic/Epoxy

15 V

Yes

66 kHz

1

16

15 µs

7 mA

0.0061 %

Parallel, Word

16.5 V

±4.5/±18/9/36,3/5 V

-16.5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

15 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQCC-N56

3

0.039 in (1 mm)

0.315 in (8 mm)

No

e4

30 s

260 °C (500 °F)

-15 V

0.315 in (8 mm)

Binary, 2's Complement Binary

AD5363BCPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

56

HVQCCN

Square

15.1 V

Yes

1

14

30 µs

0.0061 %

Serial

15 V

3/5,±12/±16.5 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N56

3

0.039 in (1 mm)

0.315 in (8 mm)

No

e3

260 °C (500 °F)

-15.1 V

0.315 in (8 mm)

2's Complement Binary

AD5363BCPZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

56

HVQCCN

Square

15.1 V

Yes

1

14

30 µs

0.0061 %

Serial

15 V

3/5,±12/±16.5 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N56

3

0.039 in (1 mm)

0.315 in (8 mm)

No

e3

260 °C (500 °F)

-15.1 V

0.315 in (8 mm)

2's Complement Binary

AD5361BCPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

56

HVQCCN

Square

15.1 V

Yes

1

14

30 µs

0.0061 %

Serial

15 V

3/5,±12/±16.5 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N56

3

0.039 in (1 mm)

0.315 in (8 mm)

No

e3

260 °C (500 °F)

-15.1 V

0.315 in (8 mm)

2's Complement Binary

MAX5734BUTN

Maxim Integrated

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

7.5 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

-3,3/5,5,8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e0

-2.5 V

0.315 in (8 mm)

Binary

MAX5734BUTN+

Analog Devices

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

7.5 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

-3,3/5,5,8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

30 s

260 °C (500 °F)

-2.5 V

0.315 in (8 mm)

Binary

MAX5735AUTN

Maxim Integrated

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

5 V

Yes

1

BICMOS

16

20 µs

0.0122 %

Serial

5 V

±5,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e0

-5 V

0.315 in (8 mm)

Binary

MAX5735AUTN+

Analog Devices

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

5 V

Yes

1

BICMOS

16

20 µs

0.0122 %

Serial

5 V

±5,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

30 s

260 °C (500 °F)

-5 V

0.315 in (8 mm)

Binary

MAX5734AUTN+

Maxim Integrated

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

7.5 V

Yes

1

BICMOS

16

20 µs

0.0122 %

Serial

5 V

-3,3/5,5,8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

30 s

260 °C (500 °F)

-2.5 V

0.315 in (8 mm)

Binary

MAX5734AUTN

Maxim Integrated

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

7.5 V

Yes

1

BICMOS

16

20 µs

0.0122 %

Serial

5 V

-3,3/5,5,8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e0

245 °C (473 °F)

-2.5 V

0.315 in (8 mm)

Binary

MAX5735BUTN

Maxim Integrated

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

5 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

±5,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e0

245 °C (473 °F)

-5 V

0.315 in (8 mm)

Binary

MAX5735BUTN+

Analog Devices

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

5 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

±5,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

30 s

260 °C (500 °F)

-5 V

0.315 in (8 mm)

Binary

AD5361BCPZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

56

HVQCCN

Square

15.1 V

Yes

1

14

30 µs

0.0061 %

Serial

15 V

3/5,±12/±16.5 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N56

3

0.039 in (1 mm)

0.315 in (8 mm)

No

e3

260 °C (500 °F)

-15.1 V

0.315 in (8 mm)

2's Complement Binary

MAX5733BUTN

Maxim Integrated

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

10 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

3/5,5,10.5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e0

0 V

0.315 in (8 mm)

Binary

MAX5733BUTN+

Analog Devices

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

10 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

3/5,5,10.5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.315 in (8 mm)

Binary

AD5362BCPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

56

HVQCCN

Square

15.1 V

Yes

1

16

30 µs

0.0015 %

Serial

15 V

3/5,±12/±16.5 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N56

3

0.039 in (1 mm)

0.315 in (8 mm)

No

e3

260 °C (500 °F)

-15.1 V

0.315 in (8 mm)

2's Complement Binary

DAC8228SRTQT

Texas Instruments

Digital to Analog converter

Industrial

No Lead

56

HVQCCN

Square

Plastic/Epoxy

15 V

Yes

66 kHz

1

14

15 µs

7 mA

0.0061 %

Parallel, Word

16.5 V

±4.5/±18/9/36,3/5 V

-16.5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

15 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQCC-N56

3

0.039 in (1 mm)

0.315 in (8 mm)

No

e4

30 s

260 °C (500 °F)

-15 V

0.315 in (8 mm)

Binary, 2's Complement Binary

DAC8728SRTQR

Texas Instruments

Digital to Analog converter

Industrial

No Lead

56

HVQCCN

Square

Plastic/Epoxy

15 V

Yes

66 kHz

1

16

15 µs

7 mA

0.0061 %

Parallel, Word

16.5 V

±4.5/±18/9/36,3/5 V

-16.5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

15 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQCC-N56

3

0.039 in (1 mm)

0.315 in (8 mm)

No

e4

30 s

260 °C (500 °F)

-15 V

0.315 in (8 mm)

Binary, 2's Complement Binary

DAC8228SRTQR

Texas Instruments

Digital to Analog converter

Industrial

No Lead

56

HVQCCN

Square

Plastic/Epoxy

15 V

Yes

66 kHz

1

14

15 µs

7 mA

0.0061 %

Parallel, Word

16.5 V

±4.5/±18/9/36,3/5 V

-16.5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

15 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQCC-N56

3

0.039 in (1 mm)

0.315 in (8 mm)

No

e4

30 s

260 °C (500 °F)

-15 V

0.315 in (8 mm)

Binary, 2's Complement Binary

DAC7728SRTQR

Texas Instruments

Digital to Analog converter

Industrial

No Lead

56

HVQCCN

Square

Plastic/Epoxy

15 V

Yes

66 kHz

1

12

15 µs

7 mA

0.0244 %

Parallel, Word

16.5 V

±4.5/±18/9/36,3/5 V

-16.5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

15 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQCC-N56

3

0.039 in (1 mm)

0.315 in (8 mm)

No

e4

30 s

260 °C (500 °F)

-15 V

0.315 in (8 mm)

Binary, 2's Complement Binary

DAC7728SRTQT

Texas Instruments

Digital to Analog converter

Industrial

No Lead

56

HVQCCN

Square

Plastic/Epoxy

15 V

Yes

66 kHz

1

12

15 µs

7 mA

0.0244 %

Parallel, Word

16.5 V

±4.5/±18/9/36,3/5 V

-16.5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

15 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQCC-N56

3

0.039 in (1 mm)

0.315 in (8 mm)

No

e4

30 s

260 °C (500 °F)

-15 V

0.315 in (8 mm)

Binary, 2's Complement Binary

MAX5733BUTN+T

Analog Devices

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

10 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

3/5,5,10.5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.315 in (8 mm)

Binary

MAX5732BUTN+T

Analog Devices

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

5 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

3/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.315 in (8 mm)

Binary

MAX5733AUTN+T

Analog Devices

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

10 V

Yes

1

BICMOS

16

20 µs

0.0122 %

Serial

5 V

3/5,5,10.5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

0 V

0.315 in (8 mm)

Binary

MAX5734BUTN+T

Analog Devices

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

7.5 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

-3,3/5,5,8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

-2.5 V

0.315 in (8 mm)

Binary

MAX5732AUTN+T

Analog Devices

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

5 V

Yes

1

BICMOS

16

20 µs

0.0122 %

Serial

5 V

3/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

0 V

0.315 in (8 mm)

Binary

MAX5732BUTN+

Analog Devices

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

5 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

3/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.315 in (8 mm)

Binary

MAX5735AUTN+T

Analog Devices

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

5 V

Yes

1

BICMOS

16

20 µs

0.0122 %

Serial

5 V

±5,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

-5 V

0.315 in (8 mm)

Binary

MAX5735BUTN+T

Analog Devices

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

5 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

±5,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

-5 V

0.315 in (8 mm)

Binary

MAX5733AUTN+

Analog Devices

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

10 V

Yes

1

BICMOS

16

20 µs

0.0122 %

Serial

5 V

3/5,5,10.5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.315 in (8 mm)

Binary

MAX5732AUTN+

Analog Devices

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

5 V

Yes

1

BICMOS

16

20 µs

0.0122 %

Serial

5 V

3/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.315 in (8 mm)

Binary

AD9911BCPZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

56

HVQCCN

Square

2.39 V

Yes

1

10

Parallel, Word

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N56

3

0.039 in (1 mm)

0.315 in (8 mm)

No

e3

30 s

260 °C (500 °F)

1.21 V

0.315 in (8 mm)

Binary

AD5362BCPZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

56

HVQCCN

Square

15.1 V

Yes

1

16

30 µs

0.0015 %

Serial

15 V

3/5,±12/±16.5 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N56

3

0.039 in (1 mm)

0.315 in (8 mm)

No

e3

260 °C (500 °F)

-15.1 V

0.315 in (8 mm)

2's Complement Binary

AD9152BCPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

56

HVQCCN

Square

Plastic/Epoxy

.347 V

Yes

1

16

Serial

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

e3

.23 V

0.315 in (8 mm)

Binary, 2's Complement Binary

AD9152BCPZRL

Analog Devices

Digital to Analog converter

Industrial

No Lead

56

HVQCCN

Square

Plastic/Epoxy

.347 V

Yes

1

16

Serial

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

e3

.23 V

0.315 in (8 mm)

Binary, 2's Complement Binary

DAC1628D1G25HN

NXP Semiconductors

Digital to Analog converter

Industrial

No Lead

56

QCCN

Square

Plastic/Epoxy

Yes

2

16

1.8,1.8/3.3 V

Chip Carrier

LCC56,.31SQ,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N56

No

Binary, 2's Complement Binary

MAX5753UTN-T

Maxim Integrated

Digital to Analog converter

Commercial Extended

No Lead

56

HVQCCN

Square

10 V

Yes

1

BICMOS

14

15 mA

0.0244 %

Serial

5 V

3/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N56

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e0

0 V

0.315 in (8 mm)

Binary

MAX5755UTN

Maxim Integrated

Digital to Analog converter

Commercial Extended

No Lead

56

HVQCCN

Square

5 V

Yes

1

BICMOS

14

15 mA

0.0244 %

Serial

5 V

3/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e0

245 °C (473 °F)

-5 V

0.315 in (8 mm)

Binary

MAX5734AUTN-T

Maxim Integrated

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

7.5 V

Yes

1

BICMOS

16

20 µs

0.0122 %

Serial

5 V

-3,3/5,5,8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N56

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e0

-2.5 V

0.315 in (8 mm)

Binary

MAX5735CETN

Maxim Integrated

Digital to Analog converter

Industrial

No Lead

56

HVQCCN

Square

5 V

Yes

1

BICMOS

16

20 µs

15 mA

0.0977 %

Serial

5 V

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N56

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e0

-5 V

0.315 in (8 mm)

Binary

MAX5755UTN+

Maxim Integrated

Digital to Analog converter

Commercial Extended

No Lead

56

HVQCCN

Square

5 V

Yes

1

BICMOS

14

15 mA

0.0244 %

Serial

5 V

3/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

-5 V

0.315 in (8 mm)

Binary

MAX5754UTN-T

Maxim Integrated

Digital to Analog converter

Commercial Extended

No Lead

56

HVQCCN

Square

7.5 V

Yes

1

BICMOS

14

15 mA

0.0244 %

Serial

5 V

3/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N56

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e0

-2.5 V

0.315 in (8 mm)

Binary

MAX5734ACTN

Maxim Integrated

Digital to Analog converter

Commercial

No Lead

56

HVQCCN

Square

7.5 V

Yes

1

BICMOS

16

20 µs

15 mA

0.0122 %

Serial

5 V

3/5,3/8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e0

245 °C (473 °F)

-2.5 V

0.315 in (8 mm)

Binary

MAX5734AUTN+T

Maxim Integrated

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

7.5 V

Yes

1

BICMOS

16

20 µs

0.0122 %

Serial

5 V

-3,3/5,5,8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

-2.5 V

0.315 in (8 mm)

Binary

MAX5732AETN

Maxim Integrated

Digital to Analog converter

Industrial

No Lead

56

HVQCCN

Square

5 V

Yes

1

BICMOS

16

20 µs

15 mA

0.0122 %

Serial

5 V

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e0

245 °C (473 °F)

0 V

0.315 in (8 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.