Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Maximum Analog Output Voltage | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | No. of Bits | Maximum Settling Time | Maximum Supply Current | Maximum Linearity Error (EL) | Input Format | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Nominal Settling Time (tstl) | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Minimum Analog Output Voltage | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
4.111 V |
No |
132 kHz |
1 |
BICMOS |
12 |
10 µs |
1 mA |
0.0488 % |
Serial |
5 V |
5 V |
In-Line |
DIP8,.3 |
Other Converters |
10 µs |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Dual |
R-PDIP-T8 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e4 |
4.079 V |
0.386 in (9.81 mm) |
Binary |
||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
4.103 V |
No |
132 kHz |
1 |
BICMOS |
12 |
10 µs |
1 mA |
0.0244 % |
Serial |
5 V |
5 V |
In-Line |
DIP8,.3 |
Other Converters |
10 µs |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Dual |
R-PDIP-T8 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e4 |
4.087 V |
0.386 in (9.81 mm) |
Binary |
||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
CMOS |
12 |
1 µs |
10 μA |
0.0244 % |
Serial |
5 V |
5 V |
Small Outline |
SOP8,.25 |
Other Converters |
1 µs |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.193 in (4.9 mm) |
Offset Binary |
||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
No Lead |
8 |
HVSON |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
16 |
10 µs |
400 μA |
0.098 % |
Serial |
3 V |
3/5 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
SOLCC8,.12,25 |
Other Converters |
12 µs |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Dual |
S-PDSO-N8 |
2 |
0.039 in (1 mm) |
0.118 in (3 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
No Lead |
8 |
HVSON |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
93 kHz |
1 |
16 |
10 µs |
400 μA |
0.098 % |
Serial |
3 V |
3/5 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
SOLCC8,.12,25 |
Other Converters |
10 µs |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Dual |
S-PDSO-N8 |
2 |
0.039 in (1 mm) |
0.118 in (3 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
16 |
10 µs |
250 μA |
0.0183 % |
Serial |
3 V |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Other Converters |
12 µs |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Dual |
S-PDSO-G8 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
0 V |
0.118 in (3 mm) |
Binary, 2's Complement Binary |
||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
4.145 V |
Yes |
1 |
CMOS |
12 |
650 μA |
0.0977 % |
Serial |
5 V |
Small Outline |
14 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e0 |
0 V |
0.193 in (4.9 mm) |
Binary |
|||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
4.145 V |
Yes |
1 |
CMOS |
12 |
650 μA |
0.0977 % |
Serial |
5 V |
Small Outline |
14 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin/Lead |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e0 |
0 V |
0.193 in (4.9 mm) |
Binary |
|||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
4.145 V |
Yes |
1 |
CMOS |
12 |
650 μA |
0.0977 % |
Serial |
5 V |
Small Outline |
14 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.193 in (4.9 mm) |
Binary |
||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
Yes |
1 |
CMOS |
10 |
0.3906 % |
Serial |
3 V |
Small Outline, Thin Profile, Shrink Pitch |
750 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
Binary |
|||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
10 |
0.2441 % |
Serial |
3 V |
Small Outline, Thin Profile, Shrink Pitch |
30 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Automotive |
Gull Wing |
8 |
TSSOP |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
12 |
600 μA |
0.036 % |
Parallel, Word |
3 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.1 |
4.4 µs |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G8 |
1 |
0.039 in (1 mm) |
0.064 in (1.625 mm) |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.114 in (2.9 mm) |
Binary |
||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
VSSOP |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
8 |
0.1953 % |
Serial |
5 V |
Small Outline, Very Thin Profile, Shrink Pitch |
3.7 µs |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G8 |
1 |
0.039 in (1 mm) |
0.064 in (1.625 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.114 in (2.9 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
CMOS |
12 |
500 μA |
0.0244 % |
Serial |
5 V |
Small Outline |
250 ns |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.193 in (4.9 mm) |
Binary, Offset Binary |
||||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
HTSSOP |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
12 |
0.0977 % |
Serial |
5 V |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
14 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
245 °C (473 °F) |
0 V |
0.118 in (3 mm) |
Binary, Offset Binary |
||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
Yes |
1 |
12 |
0.0977 % |
Serial |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
14 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
Offset Binary |
||||||||||||||||||||||
Maxim Integrated |
Digital to Analog Converter 12 bit |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
Yes |
2 |
BICMOS |
12 |
5 μA |
0.1953 % |
Parallel, Word |
5 V |
2/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Other Converters |
660 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e4 |
245 °C (473 °F) |
0.118 in (3 mm) |
Binary, Offset Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
Yes |
2 |
BICMOS |
12 |
6 μA |
0.1953 % |
Parallel, Word |
5 V |
2/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Other Converters |
660 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
Binary, Offset Binary |
|||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
CMOS |
16 |
1.1 mA |
0.0244 % |
Serial |
5 V |
5 V |
Small Outline |
SOP8,.25 |
Other Converters |
1 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e0 |
0 V |
0.193 in (4.9 mm) |
Binary |
||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
CMOS |
16 |
1.1 mA |
0.0244 % |
Serial |
5 V |
5 V |
Small Outline |
SOP8,.25 |
Other Converters |
1 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.193 in (4.9 mm) |
Binary |
|||||||||||||||
|
Renesas Electronics |
Digital to Analog converter |
Other |
No Lead |
8 |
HVSON |
Square |
Plastic/Epoxy |
5.4 V |
Yes |
1 |
CMOS |
8 |
1.5 mA |
0.39 % |
Serial |
5 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
SOLCC8,.08,20 |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-30 °C (-22 °F) |
Dual |
S-PDSO-N8 |
0.031 in (0.8 mm) |
0.087 in (2.2 mm) |
.1 V |
0.087 in (2.2 mm) |
Binary |
||||||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
5.1 V |
Yes |
93 kHz |
1 |
CMOS |
10 |
10 µs |
2.5 mA |
0.0977 % |
Serial |
3 V |
3/5 V |
Small Outline |
SOP8,.25 |
Other Converters |
2.5 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.193 in (4.9 mm) |
Binary |
|||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Automotive |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
2.9 V |
Yes |
93 kHz |
1 |
CMOS |
12 |
10 µs |
2.3 mA |
0.0977 % |
Serial |
3 V |
3/5 V |
Small Outline |
SOP8,.25 |
Other Converters |
2.5 µs |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.193 in (4.9 mm) |
Binary |
|||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
2.9 V |
Yes |
233 kHz |
1 |
CMOS |
12 |
7 µs |
3.3 mA |
0.0977 % |
Serial |
3 V |
3/5 V |
Small Outline |
SOP8,.25 |
Other Converters |
1 µs |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.193 in (4.9 mm) |
Binary |
|||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
5.1 V |
Yes |
233 kHz |
1 |
CMOS |
12 |
7 µs |
5.2 mA |
0.0977 % |
Serial |
3 V |
3/5 V |
Small Outline |
SOP8,.25 |
Other Converters |
1 µs |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e4 |
260 °C (500 °F) |
0 V |
0.193 in (4.9 mm) |
Binary |
||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Automotive |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
5.1 V |
Yes |
233 kHz |
1 |
CMOS |
12 |
1 µs |
7 mA |
0.1465 % |
Serial |
3 V |
3/5 V |
Small Outline |
SOP8,.25 |
Other Converters |
1 µs |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.193 in (4.9 mm) |
Binary |
|||||||||||||
Maxim Integrated |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
3.5 V |
Yes |
1 |
CMOS |
12 |
300 μA |
0.0244 % |
Serial |
5 V |
5 V |
0 V |
Small Outline |
SOP8,.25 |
Other Converters |
25 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e0 |
20 s |
240 °C (464 °F) |
0 V |
0.193 in (4.9 mm) |
Binary |
|||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
2.6 V |
Yes |
1 |
CMOS |
12 |
300 μA |
0.0244 % |
Serial |
5 V |
5 V |
Small Outline |
SOP8,.25 |
Other Converters |
25 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.193 in (4.9 mm) |
Binary |
|||||||||||||||
|
Microchip Technology |
Digital to Analog converter |
Automotive |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
4.096 V |
Yes |
1 |
10 |
350 μA |
0.34179 % |
Serial |
5 V |
3/5 V |
Small Outline |
SOP8,.23 |
Other Converters |
4.5 µs |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.193 in (4.9 mm) |
Binary |
||||||||||||||||
|
Microchip Technology |
Digital to Analog converter |
Automotive |
Gull Wing |
8 |
SOP |
Square |
Plastic/Epoxy |
4.096 V |
Yes |
1 |
10 |
350 μA |
0.34179 % |
Serial |
5 V |
3/5 V |
Small Outline |
SOP8,.19 |
Other Converters |
4.5 µs |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
40 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
TSSOP |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
10 |
8 µs |
250 μA |
0.39 % |
Serial |
3 V |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Other Converters |
6 µs |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
5 V |
No |
1 |
CMOS |
12 |
10 µs |
10 mA |
0.0244 % |
Serial |
12 V |
±12/±15 V |
-12 V |
In-Line |
DIP8,.3 |
Other Converters |
5 µs |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDIP-T8 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e3 |
-5 V |
0.389 in (9.88 mm) |
2's Complement Binary |
||||||||||||||||
|
ROHM |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
LSOP |
Rectangular |
Plastic/Epoxy |
Yes |
2 |
CMOS |
16 |
6 mA |
Serial |
5 V |
5 V |
Small Outline, Low Profile |
SOP8,.25 |
Other Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-10 °C (14 °F) |
Tin/Tin Copper |
Dual |
R-PDSO-G8 |
0.063 in (1.6 mm) |
0.173 in (4.4 mm) |
No |
e3/e2 |
10 s |
260 °C (500 °F) |
0.197 in (5 mm) |
Binary |
||||||||||||||||||||
|
Microchip Technology |
Digital to Analog converter |
Automotive |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
4.096 V |
Yes |
1 |
8 |
350 μA |
0.3906 % |
Serial |
5 V |
3/5 V |
Small Outline |
SOP8,.23 |
Other Converters |
4.5 µs |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.193 in (4.9 mm) |
Binary |
||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Military |
Gull Wing |
8 |
TSSOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
CMOS |
16 |
10 μA |
0.0045 % |
5 V |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Other Converters |
0.025 in (0.635 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G8 |
1 |
e4 |
30 s |
260 °C (500 °F) |
Binary |
|||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
5 V |
Yes |
1 |
BICMOS |
14 |
80 μA |
0.0061 % |
Serial |
5 V |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
SSOP8,.19 |
Other Converters |
14 µs |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
2.54 V |
No |
1 |
CMOS |
12 |
0.0977 % |
Serial |
3 V |
In-Line |
14 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDIP-T8 |
1 |
0.155 in (3.937 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
Binary |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
TSSOP |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
12 |
0.1343 % |
Serial |
3 V |
Small Outline, Thin Profile, Shrink Pitch |
14 µs |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
4.145 V |
No |
1 |
CMOS |
12 |
0.0977 % |
Serial |
5 V |
In-Line |
14 µs |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDIP-T8 |
1 |
0.155 in (3.937 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
Binary |
||||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Commercial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
3.5 V |
No |
1 |
CMOS |
12 |
300 μA |
0.0122 % |
Serial |
5 V |
5 V |
0 V |
In-Line |
DIP8,.3 |
Other Converters |
25 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T8 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e0 |
245 °C (473 °F) |
0 V |
0.369 in (9.375 mm) |
Binary |
||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
3.5 V |
No |
1 |
CMOS |
12 |
300 μA |
0.0122 % |
Serial |
5 V |
5 V |
0 V |
In-Line |
DIP8,.3 |
Other Converters |
25 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDIP-T8 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.369 in (9.375 mm) |
Binary |
||||||||||||||
|
ROHM |
Digital to Analog converter |
Other |
Gull Wing |
8 |
VSSOP |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
8 |
100 µs |
800 μA |
0.5859 % |
Serial |
3 V |
3/5 V |
Small Outline, Very Thin Profile, Shrink Pitch |
TSSOP8,.16 |
Other Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-30 °C (-22 °F) |
Dual |
R-PDSO-G8 |
0.035 in (0.9 mm) |
0.11 in (2.8 mm) |
No |
2.6 V |
0.114 in (2.9 mm) |
Binary |
|||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
5.499 V |
Yes |
1 |
CMOS |
8 |
8 µs |
225 μA |
0.3906 % |
Serial |
3 V |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Other Converters |
6 µs |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
260 °C (500 °F) |
.001 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
TSSOP |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
10 |
8 µs |
250 μA |
0.39 % |
Serial |
3 V |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Other Converters |
6 µs |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
5.499 V |
Yes |
1 |
CMOS |
10 |
9 µs |
375 μA |
0.3906 % |
Serial |
3 V |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Other Converters |
7 µs |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
.001 V |
0.118 in (3 mm) |
Binary |
||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
5.499 V |
Yes |
1 |
CMOS |
12 |
10 µs |
375 μA |
0.1953 % |
Serial |
3 V |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Other Converters |
8 µs |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
260 °C (500 °F) |
.001 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
12 |
0.0244 % |
Serial |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
8 µs |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
LSSOP |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
16 |
10 µs |
650 mA |
0.0488 % |
Serial |
5 V |
3/5 V |
Small Outline, Low Profile, Shrink Pitch |
TSSOP8,.1 |
Other Converters |
8 µs |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G8 |
1 |
0.057 in (1.45 mm) |
0.063 in (1.6 mm) |
No |
e3 |
260 °C (500 °F) |
0 V |
0.114 in (2.9 mm) |
Binary |
Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.
DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.
DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.
DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.