Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Maximum Analog Output Voltage | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | No. of Bits | Maximum Settling Time | Maximum Supply Current | Maximum Linearity Error (EL) | Input Format | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Nominal Settling Time (tstl) | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Minimum Analog Output Voltage | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
28 |
DIE |
Rectangular |
Yes |
4 |
BICMOS |
12 |
12 mA |
0.024 % |
Parallel, Word |
15 V |
5/±15 V |
-15 V |
Uncased Chip |
DIE OR CHIP |
Other Converters |
6 µs |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Upper |
R-XUUC-N28 |
No |
e0 |
Binary |
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Analog Devices |
Digital to Analog converter |
No Lead |
16 |
DIE |
Rectangular |
15 V |
Yes |
1 |
CMOS |
12 |
1 µs |
2 mA |
0.024 % |
Parallel, Word |
5 V |
Uncased Chip |
380 ns |
Tin Lead |
Upper |
R-XUUC-N16 |
No |
e0 |
0 V |
Binary, Offset Binary |
|||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
24 |
DIE |
Rectangular |
4.095 V |
Yes |
2 |
Bipolar |
12 |
7 mA |
0.05 % |
Parallel, Word |
5 V |
5 V |
Uncased Chip |
DIE OR CHIP |
Other Converters |
16 µs |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Upper |
R-XUUC-N24 |
No |
e0 |
0 V |
Binary |
||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Commercial |
No Lead |
28 |
DIE |
Yes |
1 |
CMOS |
14 |
1.5 µs |
4 mA |
0.012 % |
Parallel, Word |
12/15,GND/-0.3 V |
Uncased Chip |
DIE OR CHIP |
Other Converters |
800 ns |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Upper |
X-XUUC-N28 |
No |
e0 |
Offset Binary, 2's Complement Binary |
|||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Other |
No Lead |
20 |
DIE |
Rectangular |
Yes |
1 |
CMOS |
MIL-STD-883 Class B (Modified) |
8 |
14 mA |
0.391 % |
Parallel, 8 Bits |
15 V |
15 V |
Uncased Chip |
DIE OR CHIP |
Other Converters |
3 µs |
25 °C (77 °F) |
25 °C (77 °F) |
Tin Lead |
Upper |
R-XUUC-N20 |
No |
e0 |
Binary |
|||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Commercial |
No Lead |
18 |
DIE |
Rectangular |
10 V |
Yes |
1 |
Bipolar |
11 |
0.2 % |
Parallel, Word |
15 V |
-15 V |
Uncased Chip |
1.5 µs |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Upper |
R-XUUC-N18 |
No |
e0 |
-10 V |
Binary |
|||||||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Other |
No Lead |
24 |
DIE |
Yes |
8 |
BICMOS |
8 |
7 µs |
20 mA |
0.7812 % |
Parallel, 8 Bits |
15 V |
12/15, GND/-5 V |
-5 V |
Uncased Chip |
DIE OR CHIP |
Other Converters |
85 °C (185 °F) |
-25 °C (-13 °F) |
Upper |
X-XUUC-N24 |
No |
Binary, Offset Binary |
|||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
No Lead |
24 |
DIE |
Rectangular |
10 V |
Yes |
1 |
CMOS |
12 |
1 µs |
0.0244 % |
Parallel, 8 Bits |
5 V |
Uncased Chip |
Upper |
R-XUUC-N24 |
No |
-10 V |
Binary, Offset Binary |
|||||||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
No Lead |
14 |
DIE |
Rectangular |
11.89 V |
Yes |
1 |
Bipolar |
6 |
Parallel, Word |
15 V |
-15 V |
Uncased Chip |
1.5 µs |
Tin Lead |
Upper |
R-XUUC-N14 |
No |
e0 |
-11.89 V |
Binary, 2's Complement Binary, 1's Complement Binary, Complementary Offset Binary |
|||||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Other |
No Lead |
18 |
DIE |
Rectangular |
18 V |
Yes |
1 |
8 |
12 mA |
Parallel, Word |
15 V |
-15 V |
Uncased Chip |
500 ns |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Upper |
R-XUUC-N18 |
No |
e0 |
-5 V |
Signed Binary |
||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Other |
No Lead |
24 |
DIE |
3 V |
Yes |
4 |
CMOS |
8 |
6 µs |
26 mA |
0.3906 % |
Serial |
5 V |
±5 V |
-5 V |
Uncased Chip |
DIE OR CHIP |
Other Converters |
3.5 µs |
25 °C (77 °F) |
25 °C (77 °F) |
Tin Lead |
Upper |
X-XUUC-N24 |
No |
e0 |
-3 V |
Offset Binary |
|||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
24 |
DIE |
10 V |
Yes |
2 |
BICMOS |
12 |
0.0244 % |
Parallel, Word |
15 V |
-15 V |
Uncased Chip |
3 µs |
85 °C (185 °F) |
-40 °C (-40 °F) |
Upper |
X-XUUC-N24 |
No |
-10 V |
Binary, Offset Binary |
|||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
8 |
DIE |
Rectangular |
5.5 V |
Yes |
1 |
10 |
0.3906 % |
Serial |
3 V |
Uncased Chip |
250 µs |
85 °C (185 °F) |
-40 °C (-40 °F) |
Upper |
R-XUUC-N8 |
0.06 in (1.515 mm) |
No |
.48 V |
0.067 in (1.69 mm) |
Binary |
|||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
24 |
DIE |
Rectangular |
15 V |
Yes |
1 |
CMOS |
MIL-STD-883 Class B (Modified) |
12 |
1 µs |
2 mA |
0.0244 % |
Parallel, Word |
5 V |
5/15 V |
Uncased Chip |
DIE OR CHIP |
Other Converters |
450 ns |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Upper |
R-XUUC-N24 |
No |
e0 |
0 V |
Offset Binary |
||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
DIE |
Yes |
8 |
CMOS |
10 |
Serial |
3.3 V |
Uncased Chip |
4 µs |
85 °C (185 °F) |
-40 °C (-40 °F) |
Upper |
X-XUUC-N |
No |
Binary, Offset Binary, 2's Complement Binary |
|||||||||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
No Lead |
16 |
DIE |
10 V |
Yes |
1 |
12 |
0.05 % |
Parallel, Word |
15 V |
-15 V |
Uncased Chip |
250 ns |
Tin Lead |
Upper |
X-XUUC-N16 |
No |
e0 |
-5 V |
Binary, Offset Binary, 2's Complement Binary |
||||||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
No Lead |
20 |
DIE |
Rectangular |
15.75 V |
Yes |
1 |
CMOS |
8 |
0 ns |
0.195 % |
Parallel, 8 Bits |
5 V |
Uncased Chip |
Tin Lead |
Upper |
R-XUUC-N20 |
No |
e0 |
0 V |
Binary, Offset Binary |
|||||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Commercial |
No Lead |
18 |
DIE |
Rectangular |
11.5 V |
Yes |
1 |
Bipolar |
10 |
0.2 % |
Parallel, Word |
15 V |
-15 V |
Uncased Chip |
2 µs |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Upper |
R-XUUC-N18 |
No |
e0 |
Binary |
||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Other |
No Lead |
24 |
DIE |
15 V |
Yes |
1 |
CMOS |
MIL-STD-883 Class B (Modified) |
12 |
1 µs |
2 mA |
0.0122 % |
Parallel, Word |
5 V |
5/15 V |
Uncased Chip |
DIE OR CHIP |
Other Converters |
25 °C (77 °F) |
25 °C (77 °F) |
Tin Lead |
Upper |
X-XUUC-N24 |
No |
e0 |
0 V |
Binary, Offset Binary |
||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Other |
No Lead |
24 |
DIE |
Rectangular |
Yes |
2 |
CMOS |
MIL-STD-883 Class B (Modified) |
12 |
1 µs |
2 mA |
0.0122 % |
Parallel, Word |
5 V |
5/15 V |
Uncased Chip |
DIE OR CHIP |
Other Converters |
25 °C (77 °F) |
25 °C (77 °F) |
Tin Lead |
Upper |
R-XUUC-N24 |
No |
e0 |
Binary, Offset Binary |
|||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
16 |
DIE |
Rectangular |
Yes |
1 |
MIL-PRF-38534 Class K |
10 |
Parallel, Word |
5 V |
-15 V |
Uncased Chip |
125 °C (257 °F) |
-55 °C (-67 °F) |
Upper |
R-XUUC-N16 |
0.106 in (2.69 mm) |
0.153 in (3.88 mm) |
Binary |
||||||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
No Lead |
5 |
DIE |
Rectangular |
Yes |
1 |
10 |
0.5 % |
Parallel, Word |
15 V |
-15 V |
Uncased Chip |
Tin Lead |
Upper |
R-XUUC-N5 |
No |
e0 |
Complementary Binary |
||||||||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
DIE |
Yes |
1 |
BICMOS |
8 |
Parallel, 8 Bits |
5 V |
Uncased Chip |
85 °C (185 °F) |
-40 °C (-40 °F) |
Upper |
X-XUUC-N |
No |
Binary |
||||||||||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Other |
No Lead |
DIE |
3 V |
Yes |
1 |
BICMOS |
14 |
0.0122 % |
Serial, Parallel, Word |
5 V |
-5 V |
Uncased Chip |
2.5 µs |
85 °C (185 °F) |
-25 °C (-13 °F) |
Upper |
X-XUUC-N |
No |
-3 V |
Binary, 2's Complement Binary |
|||||||||||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
28 |
DIE |
Rectangular |
Yes |
1 |
MIL-PRF-38534 Class K |
12 |
0.0122 % |
Parallel, Word |
15 V |
-15 V |
Uncased Chip |
125 °C (257 °F) |
-55 °C (-67 °F) |
Upper |
R-XUUC-N28 |
Binary |
||||||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
No Lead |
16 |
DIE |
Rectangular |
15 V |
Yes |
2 |
CMOS |
10 |
1 µs |
2 mA |
0.1 % |
Parallel, Word |
15 V |
Uncased Chip |
Tin Lead |
Upper |
R-XUUC-N16 |
No |
e0 |
0 V |
Binary, Offset Binary |
||||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Other |
No Lead |
18 |
DIE |
Rectangular |
12.5 V |
Yes |
1 |
CMOS |
MIL-STD-883 Class B (Modified) |
8 |
5 µs |
4 mA |
0.391 % |
Parallel, 8 Bits |
12/15, GND/-5 V |
-5 V |
Uncased Chip |
DIE OR CHIP |
Other Converters |
25 °C (77 °F) |
25 °C (77 °F) |
Tin Lead |
Upper |
R-XUUC-N18 |
No |
e0 |
0 V |
Binary |
|||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
No Lead |
16 |
DIE |
18 V |
Yes |
1 |
8 |
0 ns |
0.1 % |
Parallel, 8 Bits |
15 V |
-15 V |
Uncased Chip |
85 ns |
Tin Lead |
Upper |
X-XUUC-N16 |
No |
e0 |
-10 V |
Binary, Offset Binary |
|||||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
43 |
DIE |
Rectangular |
5 V |
Yes |
1 |
CMOS |
8 |
0.3906 % |
Parallel, 8 Bits |
5 V |
±5,5/5,5 V |
-5 V |
Uncased Chip |
DIE OR CHIP |
Other Converters |
2 µs |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Upper |
R-XUUC-N |
No |
e0 |
0 V |
Binary |
||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
24 |
DIE |
Rectangular |
Yes |
2 |
CMOS |
12 |
Parallel, Word |
12 V |
Uncased Chip |
85 °C (185 °F) |
-40 °C (-40 °F) |
Upper |
R-XUUC-N24 |
No |
Binary, Offset Binary |
||||||||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
DIE |
Yes |
4 |
CMOS |
8 |
7 µs |
12 mA |
0.7812 % |
Parallel, 8 Bits |
15 V |
12/15, GND/-5 V |
-5 V |
Uncased Chip |
DIE OR CHIP |
Other Converters |
125 °C (257 °F) |
-55 °C (-67 °F) |
Upper |
X-XUUC-N |
No |
Binary, Offset Binary |
|||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Other |
No Lead |
20 |
DIE |
Rectangular |
2.5 V |
Yes |
1 |
CMOS |
MIL-STD-883 Class B (Modified) |
8 |
5 µs |
0.195 % |
Parallel, 8 Bits |
15.75 V |
12/15,-5 V |
-5 V |
Uncased Chip |
DIE OR CHIP |
Other Converters |
2 µs |
25 °C (77 °F) |
25 °C (77 °F) |
Tin Lead |
Upper |
R-XUUC-N20 |
No |
e0 |
-2.5 V |
Binary, Offset Binary |
||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
8 |
DIE |
Rectangular |
5.5 V |
Yes |
1 |
10 |
0.3906 % |
Serial |
3.6 V |
Uncased Chip |
250 µs |
85 °C (185 °F) |
-40 °C (-40 °F) |
Upper |
R-XUUC-N8 |
No |
.6 V |
Binary |
|||||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Other |
No Lead |
18 |
DIE |
Rectangular |
5 V |
Yes |
1 |
8 |
16 mA |
0.1 % |
Parallel, 8 Bits |
5 V |
-12 V |
Uncased Chip |
300 ns |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Upper |
R-XUUC-N18 |
No |
e0 |
-5 V |
Binary |
|||||||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
16 |
DIE |
Yes |
1 |
BICMOS |
8 |
Parallel, 8 Bits |
5 V |
Uncased Chip |
85 °C (185 °F) |
-40 °C (-40 °F) |
Upper |
X-XUUC-N16 |
No |
Binary |
||||||||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
No Lead |
24 |
DIE |
Rectangular |
15 V |
Yes |
1 |
CMOS |
12 |
1 µs |
0.0244 % |
Parallel, Word |
5 V |
Uncased Chip |
Tin Lead |
Upper |
R-XUUC-N24 |
No |
e0 |
0 V |
Binary, Offset Binary |
|||||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Other |
No Lead |
20 |
DIE |
Rectangular |
10 V |
Yes |
1 |
Bipolar |
MIL-STD-883 Class B (Modified) |
12 |
18 mA |
0.05 % |
Parallel, Word |
15 V |
±15 V |
-15 V |
Uncased Chip |
DIE OR CHIP |
Other Converters |
250 ns |
25 °C (77 °F) |
25 °C (77 °F) |
Tin Lead |
Upper |
R-XUUC-N20 |
No |
e0 |
-5 V |
Binary, Offset Binary, 2's Complement Binary |
||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
No Lead |
DIE |
Yes |
1 |
12 |
0.0122 % |
Parallel, Word |
5 V |
Uncased Chip |
600 ns |
Upper |
X-XUUC-N |
No |
Binary, Offset Binary |
||||||||||||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
No Lead |
24 |
DIE |
Rectangular |
Yes |
1 |
Bipolar |
16 |
30 mA |
0.0061 % |
Parallel, Word |
5 V |
5,-15 V |
-15 V |
Uncased Chip |
DIE OR CHIP |
Other Converters |
500 ns |
Tin Lead |
Upper |
R-XUUC-N24 |
No |
e0 |
Binary |
||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
No Lead |
16 |
DIE |
18 V |
Yes |
1 |
8 |
0 ns |
0.1 % |
Parallel, 8 Bits |
15 V |
-15 V |
Uncased Chip |
85 ns |
Tin Lead |
Upper |
X-XUUC-N16 |
No |
e0 |
-10 V |
Binary, Offset Binary |
|||||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Automotive |
No Lead |
8 |
DIE |
Rectangular |
5.5 V |
Yes |
1 |
10 |
0.3906 % |
Serial |
5 V |
Uncased Chip |
250 µs |
150 °C (302 °F) |
-40 °C (-40 °F) |
Upper |
R-XUUC-N8 |
No |
.6 V |
Binary |
|||||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
28 |
DIE |
Rectangular |
10 V |
Yes |
1 |
CMOS |
16 |
9 µs |
0.0244 % |
Parallel, Word |
15 V |
5,±15 V |
-15 V |
Uncased Chip |
DIE OR CHIP |
Other Converters |
7 µs |
85 °C (185 °F) |
-40 °C (-40 °F) |
Upper |
R-XUUC-N28 |
No |
-10 V |
Binary, Offset Binary |
|||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
No Lead |
14 |
DIE |
Rectangular |
11.89 V |
Yes |
1 |
Bipolar |
6 |
Parallel, Word |
15 V |
-15 V |
Uncased Chip |
1.5 µs |
Tin Lead |
Upper |
R-XUUC-N14 |
No |
e0 |
-11.89 V |
Binary, 2's Complement Binary, 1's Complement Binary, Complementary Offset Binary |
|||||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
No Lead |
20 |
DIE |
Rectangular |
15 V |
Yes |
1 |
CMOS |
12 |
1 µs |
0.024 % |
Parallel, Word |
15 V |
Uncased Chip |
Tin Lead |
Upper |
R-XUUC-N20 |
No |
e0 |
0 V |
Binary, 2's Complement Binary |
|||||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
No Lead |
18 |
DIE |
Rectangular |
15 V |
Yes |
2 |
CMOS |
12 |
1 µs |
2 mA |
0.012 % |
Parallel, Word |
15 V |
Uncased Chip |
600 ns |
Tin Lead |
Upper |
R-XUUC-N18 |
No |
e0 |
0 V |
Binary, Offset Binary |
|||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
No Lead |
16 |
DIE |
10 V |
Yes |
1 |
12 |
0.05 % |
Parallel, Word |
15 V |
-15 V |
Uncased Chip |
250 ns |
Tin Lead |
Upper |
X-XUUC-N16 |
No |
e0 |
-5 V |
Binary, Offset Binary, 2's Complement Binary |
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Analog Devices |
Digital to Analog converter |
No Lead |
20 |
DIE |
Rectangular |
Yes |
4 |
CMOS |
8 |
5 µs |
12 mA |
0.391 % |
Parallel, 8 Bits |
-5 V |
Uncased Chip |
3 µs |
Tin Lead |
Upper |
R-XUUC-N20 |
No |
e0 |
Binary |
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Analog Devices |
Digital to Analog converter |
Other |
No Lead |
28 |
DIE |
Rectangular |
Yes |
4 |
CMOS |
MIL-STD-883 Class B (Modified) |
8 |
1 mA |
0.0977 % |
Parallel, 8 Bits |
5 V |
5 V |
Uncased Chip |
DIE OR CHIP |
Other Converters |
190 ns |
25 °C (77 °F) |
25 °C (77 °F) |
Tin Lead |
Upper |
R-XUUC-N28 |
No |
e0 |
Binary, Offset Binary |
Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.
DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.
DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.
DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.