DIE Digital-to-Analog Converters 280

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

DAC8412GBC

Analog Devices

Digital to Analog converter

Industrial

No Lead

28

DIE

Rectangular

Yes

4

BICMOS

12

12 mA

0.024 %

Parallel, Word

15 V

5/±15 V

-15 V

Uncased Chip

DIE OR CHIP

Other Converters

6 µs

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Upper

R-XUUC-N28

No

e0

Binary

PM7543G

Analog Devices

Digital to Analog converter

No Lead

16

DIE

Rectangular

15 V

Yes

1

CMOS

12

1 µs

2 mA

0.024 %

Parallel, Word

5 V

Uncased Chip

380 ns

Tin Lead

Upper

R-XUUC-N16

No

e0

0 V

Binary, Offset Binary

AD8582CHIPS

Analog Devices

Digital to Analog converter

Industrial

No Lead

24

DIE

Rectangular

4.095 V

Yes

2

Bipolar

12

7 mA

0.05 %

Parallel, Word

5 V

5 V

Uncased Chip

DIE OR CHIP

Other Converters

16 µs

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Upper

R-XUUC-N24

No

e0

0 V

Binary

AD7536ACHIPS

Analog Devices

Digital to Analog converter

Commercial

No Lead

28

DIE

Yes

1

CMOS

14

1.5 µs

4 mA

0.012 %

Parallel, Word

12/15,GND/-0.3 V

Uncased Chip

DIE OR CHIP

Other Converters

800 ns

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

X-XUUC-N28

No

e0

Offset Binary, 2's Complement Binary

DAC8426GBC

Analog Devices

Digital to Analog converter

Other

No Lead

20

DIE

Rectangular

Yes

1

CMOS

MIL-STD-883 Class B (Modified)

8

14 mA

0.391 %

Parallel, 8 Bits

15 V

15 V

Uncased Chip

DIE OR CHIP

Other Converters

3 µs

25 °C (77 °F)

25 °C (77 °F)

Tin Lead

Upper

R-XUUC-N20

No

e0

Binary

DAC210GR

Analog Devices

Digital to Analog converter

Commercial

No Lead

18

DIE

Rectangular

10 V

Yes

1

Bipolar

11

0.2 %

Parallel, Word

15 V

-15 V

Uncased Chip

1.5 µs

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N18

No

e0

-10 V

Binary

AD7228BCHIPS

Analog Devices

Digital to Analog converter

Other

No Lead

24

DIE

Yes

8

BICMOS

8

7 µs

20 mA

0.7812 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

Uncased Chip

DIE OR CHIP

Other Converters

85 °C (185 °F)

-25 °C (-13 °F)

Upper

X-XUUC-N24

No

Binary, Offset Binary

DAC8248G

Analog Devices

Digital to Analog converter

No Lead

24

DIE

Rectangular

10 V

Yes

1

CMOS

12

1 µs

0.0244 %

Parallel, 8 Bits

5 V

Uncased Chip

Upper

R-XUUC-N24

No

-10 V

Binary, Offset Binary

DAC01N

Analog Devices

Digital to Analog converter

No Lead

14

DIE

Rectangular

11.89 V

Yes

1

Bipolar

6

Parallel, Word

15 V

-15 V

Uncased Chip

1.5 µs

Tin Lead

Upper

R-XUUC-N14

No

e0

-11.89 V

Binary, 2's Complement Binary, 1's Complement Binary, Complementary Offset Binary

DAC-88N

Analog Devices

Digital to Analog converter

Other

No Lead

18

DIE

Rectangular

18 V

Yes

1

8

12 mA

Parallel, Word

15 V

-15 V

Uncased Chip

500 ns

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Upper

R-XUUC-N18

No

e0

-5 V

Signed Binary

DAC8840GBC

Analog Devices

Digital to Analog converter

Other

No Lead

24

DIE

3 V

Yes

4

CMOS

8

6 µs

26 mA

0.3906 %

Serial

5 V

±5 V

-5 V

Uncased Chip

DIE OR CHIP

Other Converters

3.5 µs

25 °C (77 °F)

25 °C (77 °F)

Tin Lead

Upper

X-XUUC-N24

No

e0

-3 V

Offset Binary

AD7837ACHIPS

Analog Devices

Digital to Analog converter

Industrial

No Lead

24

DIE

10 V

Yes

2

BICMOS

12

0.0244 %

Parallel, Word

15 V

-15 V

Uncased Chip

3 µs

85 °C (185 °F)

-40 °C (-40 °F)

Upper

X-XUUC-N24

No

-10 V

Binary, Offset Binary

AD5821A-WAFER

Analog Devices

Digital to Analog converter

Industrial

No Lead

8

DIE

Rectangular

5.5 V

Yes

1

10

0.3906 %

Serial

3 V

Uncased Chip

250 µs

85 °C (185 °F)

-40 °C (-40 °F)

Upper

R-XUUC-N8

0.06 in (1.515 mm)

No

.48 V

0.067 in (1.69 mm)

Binary

DAC8221GBC

Analog Devices

Digital to Analog converter

Industrial

No Lead

24

DIE

Rectangular

15 V

Yes

1

CMOS

MIL-STD-883 Class B (Modified)

12

1 µs

2 mA

0.0244 %

Parallel, Word

5 V

5/15 V

Uncased Chip

DIE OR CHIP

Other Converters

450 ns

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Upper

R-XUUC-N24

No

e0

0 V

Offset Binary

AD7808BCHIPS

Analog Devices

Digital to Analog converter

Industrial

No Lead

DIE

Yes

8

CMOS

10

Serial

3.3 V

Uncased Chip

4 µs

85 °C (185 °F)

-40 °C (-40 °F)

Upper

X-XUUC-N

No

Binary, Offset Binary, 2's Complement Binary

DAC312G

Analog Devices

Digital to Analog converter

No Lead

16

DIE

10 V

Yes

1

12

0.05 %

Parallel, Word

15 V

-15 V

Uncased Chip

250 ns

Tin Lead

Upper

X-XUUC-N16

No

e0

-5 V

Binary, Offset Binary, 2's Complement Binary

PM7628G

Analog Devices

Digital to Analog converter

No Lead

20

DIE

Rectangular

15.75 V

Yes

1

CMOS

8

0 ns

0.195 %

Parallel, 8 Bits

5 V

Uncased Chip

Tin Lead

Upper

R-XUUC-N20

No

e0

0 V

Binary, Offset Binary

DAC02G

Analog Devices

Digital to Analog converter

Commercial

No Lead

18

DIE

Rectangular

11.5 V

Yes

1

Bipolar

10

0.2 %

Parallel, Word

15 V

-15 V

Uncased Chip

2 µs

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N18

No

e0

Binary

DAC8222GBC

Analog Devices

Digital to Analog converter

Other

No Lead

24

DIE

15 V

Yes

1

CMOS

MIL-STD-883 Class B (Modified)

12

1 µs

2 mA

0.0122 %

Parallel, Word

5 V

5/15 V

Uncased Chip

DIE OR CHIP

Other Converters

25 °C (77 °F)

25 °C (77 °F)

Tin Lead

Upper

X-XUUC-N24

No

e0

0 V

Binary, Offset Binary

DAC8248GBC

Analog Devices

Digital to Analog converter

Other

No Lead

24

DIE

Rectangular

Yes

2

CMOS

MIL-STD-883 Class B (Modified)

12

1 µs

2 mA

0.0122 %

Parallel, Word

5 V

5/15 V

Uncased Chip

DIE OR CHIP

Other Converters

25 °C (77 °F)

25 °C (77 °F)

Tin Lead

Upper

R-XUUC-N24

No

e0

Binary, Offset Binary

AD561-000C

Analog Devices

Digital to Analog converter

Military

No Lead

16

DIE

Rectangular

Yes

1

MIL-PRF-38534 Class K

10

Parallel, Word

5 V

-15 V

Uncased Chip

125 °C (257 °F)

-55 °C (-67 °F)

Upper

R-XUUC-N16

0.106 in (2.69 mm)

0.153 in (3.88 mm)

Binary

DAR01G

Analog Devices

Digital to Analog converter

No Lead

5

DIE

Rectangular

Yes

1

10

0.5 %

Parallel, Word

15 V

-15 V

Uncased Chip

Tin Lead

Upper

R-XUUC-N5

No

e0

Complementary Binary

AD7111ABCHIPS

Analog Devices

Digital to Analog converter

Industrial

No Lead

DIE

Yes

1

BICMOS

8

Parallel, 8 Bits

5 V

Uncased Chip

85 °C (185 °F)

-40 °C (-40 °F)

Upper

X-XUUC-N

No

Binary

AD7840ACHIPS

Analog Devices

Digital to Analog converter

Other

No Lead

DIE

3 V

Yes

1

BICMOS

14

0.0122 %

Serial, Parallel, Word

5 V

-5 V

Uncased Chip

2.5 µs

85 °C (185 °F)

-25 °C (-13 °F)

Upper

X-XUUC-N

No

-3 V

Binary, 2's Complement Binary

AD667-000C

Analog Devices

Digital to Analog converter

Military

No Lead

28

DIE

Rectangular

Yes

1

MIL-PRF-38534 Class K

12

0.0122 %

Parallel, Word

15 V

-15 V

Uncased Chip

125 °C (257 °F)

-55 °C (-67 °F)

Upper

R-XUUC-N28

Binary

PM7533G

Analog Devices

Digital to Analog converter

No Lead

16

DIE

Rectangular

15 V

Yes

2

CMOS

10

1 µs

2 mA

0.1 %

Parallel, Word

15 V

Uncased Chip

Tin Lead

Upper

R-XUUC-N16

No

e0

0 V

Binary, Offset Binary

PM7224GBC

Analog Devices

Digital to Analog converter

Other

No Lead

18

DIE

Rectangular

12.5 V

Yes

1

CMOS

MIL-STD-883 Class B (Modified)

8

5 µs

4 mA

0.391 %

Parallel, 8 Bits

12/15, GND/-5 V

-5 V

Uncased Chip

DIE OR CHIP

Other Converters

25 °C (77 °F)

25 °C (77 °F)

Tin Lead

Upper

R-XUUC-N18

No

e0

0 V

Binary

DAC08N

Analog Devices

Digital to Analog converter

No Lead

16

DIE

18 V

Yes

1

8

0 ns

0.1 %

Parallel, 8 Bits

15 V

-15 V

Uncased Chip

85 ns

Tin Lead

Upper

X-XUUC-N16

No

e0

-10 V

Binary, Offset Binary

AD8600CHIPS

Analog Devices

Digital to Analog converter

Industrial

No Lead

43

DIE

Rectangular

5 V

Yes

1

CMOS

8

0.3906 %

Parallel, 8 Bits

5 V

±5,5/5,5 V

-5 V

Uncased Chip

DIE OR CHIP

Other Converters

2 µs

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Upper

R-XUUC-N

No

e0

0 V

Binary

AD7547SCHIPS

Analog Devices

Digital to Analog converter

Industrial

No Lead

24

DIE

Rectangular

Yes

2

CMOS

12

Parallel, Word

12 V

Uncased Chip

85 °C (185 °F)

-40 °C (-40 °F)

Upper

R-XUUC-N24

No

Binary, Offset Binary

AD7225TCHIPS

Analog Devices

Digital to Analog converter

Military

No Lead

DIE

Yes

4

CMOS

8

7 µs

12 mA

0.7812 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

Uncased Chip

DIE OR CHIP

Other Converters

125 °C (257 °F)

-55 °C (-67 °F)

Upper

X-XUUC-N

No

Binary, Offset Binary

DAC8229GBC

Analog Devices

Digital to Analog converter

Other

No Lead

20

DIE

Rectangular

2.5 V

Yes

1

CMOS

MIL-STD-883 Class B (Modified)

8

5 µs

0.195 %

Parallel, 8 Bits

15.75 V

12/15,-5 V

-5 V

Uncased Chip

DIE OR CHIP

Other Converters

2 µs

25 °C (77 °F)

25 °C (77 °F)

Tin Lead

Upper

R-XUUC-N20

No

e0

-2.5 V

Binary, Offset Binary

AD5821D-WAFER

Analog Devices

Digital to Analog converter

Industrial

No Lead

8

DIE

Rectangular

5.5 V

Yes

1

10

0.3906 %

Serial

3.6 V

Uncased Chip

250 µs

85 °C (185 °F)

-40 °C (-40 °F)

Upper

R-XUUC-N8

No

.6 V

Binary

DAC-888N

Analog Devices

Digital to Analog converter

Other

No Lead

18

DIE

Rectangular

5 V

Yes

1

8

16 mA

0.1 %

Parallel, 8 Bits

5 V

-12 V

Uncased Chip

300 ns

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Upper

R-XUUC-N18

No

e0

-5 V

Binary

AD7111BCHIPS

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

DIE

Yes

1

BICMOS

8

Parallel, 8 Bits

5 V

Uncased Chip

85 °C (185 °F)

-40 °C (-40 °F)

Upper

X-XUUC-N16

No

Binary

DAC8222G

Analog Devices

Digital to Analog converter

No Lead

24

DIE

Rectangular

15 V

Yes

1

CMOS

12

1 µs

0.0244 %

Parallel, Word

5 V

Uncased Chip

Tin Lead

Upper

R-XUUC-N24

No

e0

0 V

Binary, Offset Binary

DAC312GBC

Analog Devices

Digital to Analog converter

Other

No Lead

20

DIE

Rectangular

10 V

Yes

1

Bipolar

MIL-STD-883 Class B (Modified)

12

18 mA

0.05 %

Parallel, Word

15 V

±15 V

-15 V

Uncased Chip

DIE OR CHIP

Other Converters

250 ns

25 °C (77 °F)

25 °C (77 °F)

Tin Lead

Upper

R-XUUC-N20

No

e0

-5 V

Binary, Offset Binary, 2's Complement Binary

AD7945BCHIPS

Analog Devices

Digital to Analog converter

No Lead

DIE

Yes

1

12

0.0122 %

Parallel, Word

5 V

Uncased Chip

600 ns

Upper

X-XUUC-N

No

Binary, Offset Binary

DAC16GBC

Analog Devices

Digital to Analog converter

No Lead

24

DIE

Rectangular

Yes

1

Bipolar

16

30 mA

0.0061 %

Parallel, Word

5 V

5,-15 V

-15 V

Uncased Chip

DIE OR CHIP

Other Converters

500 ns

Tin Lead

Upper

R-XUUC-N24

No

e0

Binary

DAC08NT

Analog Devices

Digital to Analog converter

No Lead

16

DIE

18 V

Yes

1

8

0 ns

0.1 %

Parallel, 8 Bits

15 V

-15 V

Uncased Chip

85 ns

Tin Lead

Upper

X-XUUC-N16

No

e0

-10 V

Binary, Offset Binary

AD5398ZCSURF

Analog Devices

Digital to Analog converter

Automotive

No Lead

8

DIE

Rectangular

5.5 V

Yes

1

10

0.3906 %

Serial

5 V

Uncased Chip

250 µs

150 °C (302 °F)

-40 °C (-40 °F)

Upper

R-XUUC-N8

No

.6 V

Binary

AD7846ACHIPS

Analog Devices

Digital to Analog converter

Industrial

No Lead

28

DIE

Rectangular

10 V

Yes

1

CMOS

16

9 µs

0.0244 %

Parallel, Word

15 V

5,±15 V

-15 V

Uncased Chip

DIE OR CHIP

Other Converters

7 µs

85 °C (185 °F)

-40 °C (-40 °F)

Upper

R-XUUC-N28

No

-10 V

Binary, Offset Binary

DAC01G

Analog Devices

Digital to Analog converter

No Lead

14

DIE

Rectangular

11.89 V

Yes

1

Bipolar

6

Parallel, Word

15 V

-15 V

Uncased Chip

1.5 µs

Tin Lead

Upper

R-XUUC-N14

No

e0

-11.89 V

Binary, 2's Complement Binary, 1's Complement Binary, Complementary Offset Binary

DAC8012G

Analog Devices

Digital to Analog converter

No Lead

20

DIE

Rectangular

15 V

Yes

1

CMOS

12

1 µs

0.024 %

Parallel, Word

15 V

Uncased Chip

Tin Lead

Upper

R-XUUC-N20

No

e0

0 V

Binary, 2's Complement Binary

PM7541AG

Analog Devices

Digital to Analog converter

No Lead

18

DIE

Rectangular

15 V

Yes

2

CMOS

12

1 µs

2 mA

0.012 %

Parallel, Word

15 V

Uncased Chip

600 ns

Tin Lead

Upper

R-XUUC-N18

No

e0

0 V

Binary, Offset Binary

DAC312N

Analog Devices

Digital to Analog converter

No Lead

16

DIE

10 V

Yes

1

12

0.05 %

Parallel, Word

15 V

-15 V

Uncased Chip

250 ns

Tin Lead

Upper

X-XUUC-N16

No

e0

-5 V

Binary, Offset Binary, 2's Complement Binary

PM7226BGC

Analog Devices

Digital to Analog converter

No Lead

20

DIE

Rectangular

Yes

4

CMOS

8

5 µs

12 mA

0.391 %

Parallel, 8 Bits

-5 V

Uncased Chip

3 µs

Tin Lead

Upper

R-XUUC-N20

No

e0

Binary

DAC8408GBC

Analog Devices

Digital to Analog converter

Other

No Lead

28

DIE

Rectangular

Yes

4

CMOS

MIL-STD-883 Class B (Modified)

8

1 mA

0.0977 %

Parallel, 8 Bits

5 V

5 V

Uncased Chip

DIE OR CHIP

Other Converters

190 ns

25 °C (77 °F)

25 °C (77 °F)

Tin Lead

Upper

R-XUUC-N28

No

e0

Binary, Offset Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.