Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Maximum Analog Output Voltage | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | No. of Bits | Maximum Settling Time | Maximum Supply Current | Maximum Linearity Error (EL) | Input Format | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Nominal Settling Time (tstl) | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Minimum Analog Output Voltage | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
No |
1 |
Bipolar |
38535Q/M;38534H;883B |
12 |
4 µs |
23 mA |
0.024 % |
Parallel, Word |
15 V |
±12/±15 V |
-15 V |
In-Line |
DIP24,.3 |
Other Converters |
3 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T24 |
0.3 in (7.62 mm) |
Yes |
e0 |
1.2 in (30.48 mm) |
Binary |
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Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
2 |
CMOS |
MIL-STD-883 |
12 |
2 mA |
0.0122 % |
Parallel, Word |
5 V |
5/15 V |
In-Line |
DIP24,.3 |
Other Converters |
450 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
Yes |
e0 |
Binary, Offset Binary |
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Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
Bipolar |
8 |
0 ns |
7.8 mA |
0.1 % |
Parallel, 8 Bits |
15 V |
-15 V |
In-Line |
85 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T16 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.75 in (19.05 mm) |
Binary |
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Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
10 V |
No |
1 |
CMOS |
38535Q/M;38534H;883B |
16 |
0.024 % |
Parallel, Word |
15 V |
5,±15 V |
-15 V |
In-Line |
DIP28,.6 |
Other Converters |
7 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
Yes |
e0 |
-10 V |
1.49 in (37.85 mm) |
Binary, Offset Binary |
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Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
No |
1 |
Bipolar |
10 |
16 mA |
Parallel, Word |
15 V |
-15 V |
In-Line |
250 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T16 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.75 in (19.05 mm) |
Binary |
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Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
18 V |
No |
1 |
Bipolar |
MIL-M-38510 |
8 |
0 ns |
0.1 % |
Parallel, 8 Bits |
15 V |
-15 V |
In-Line |
85 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T16 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
-10 V |
0.75 in (19.05 mm) |
Offset Binary |
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Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
10 V |
No |
1 |
Bipolar |
12 |
Parallel, Word |
15 V |
-15 V |
In-Line |
250 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T24 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
-10 V |
Binary |
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|
Microchip Technology |
Digital to Analog converter |
Automotive |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
4.176 V |
No |
1 |
TS 16949 |
12 |
750 μA |
0.293 % |
Serial |
5 V |
3/5 V |
In-Line |
DIP8,.3 |
Other Converters |
4.5 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDIP-T8 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e3 |
0 V |
0.365 in (9.271 mm) |
Binary |
||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Commercial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
18 V |
No |
6.6 MHz |
1 |
Bipolar |
8 |
150 ns |
3.8 mA |
0.19 % |
Parallel, 8 Bits |
15 V |
±15 V |
-15 V |
In-Line |
DIP16,.3 |
Other Converters |
100 ns |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDIP-T16 |
1 |
0.17 in (4.318 mm) |
0.3 in (7.62 mm) |
No |
e3 |
-10 V |
0.75 in (19.05 mm) |
Offset Binary |
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|
Microchip Technology |
Digital to Analog converter |
Automotive |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
4.096 V |
No |
1 |
12 |
350 μA |
0.2929 % |
Serial |
5 V |
3/5 V |
In-Line |
DIP8,.3 |
Other Converters |
4.5 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDIP-T8 |
0.17 in (4.32 mm) |
0.3 in (7.62 mm) |
No |
e3 |
0 V |
0.372 in (9.46 mm) |
Binary |
|||||||||||||||||||
|
Microchip Technology |
Digital to Analog converter |
Automotive |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
4.176 V |
No |
1 |
12 |
400 μA |
0.2929 % |
Serial |
5 V |
3/5 V |
In-Line |
DIP8,.3 |
Other Converters |
4.5 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDIP-T8 |
0.17 in (4.32 mm) |
0.3 in (7.62 mm) |
No |
e3 |
0 V |
0.372 in (9.46 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
18 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
1 |
CMOS |
12 |
2 mA |
0.012 % |
Parallel, Word |
15 V |
15 V |
In-Line |
DIP18,.3 |
Other Converters |
600 ns |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDIP-T18 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e3 |
0.885 in (22.479 mm) |
Binary, Offset Binary |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
12 V |
No |
1 |
CMOS |
12 |
0.0854 % |
Serial |
5 V |
In-Line |
6 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDIP-T8 |
1 |
0.155 in (3.937 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.4 in (10.16 mm) |
Binary |
||||||||||||||||||||
|
Microchip Technology |
Digital to Analog converter |
Automotive |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
4.096 V |
No |
1 |
8 |
350 μA |
0.3906 % |
Serial |
5 V |
3/5 V |
In-Line |
DIP8,.3 |
Other Converters |
4.5 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDIP-T8 |
0.17 in (4.32 mm) |
0.3 in (7.62 mm) |
No |
e3 |
0 V |
0.372 in (9.46 mm) |
Binary |
|||||||||||||||||||
|
Microchip Technology |
Digital to Analog converter |
Automotive |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
4.176 V |
No |
1 |
10 |
400 μA |
0.34179 % |
Serial |
5 V |
3/5 V |
In-Line |
DIP8,.3 |
Other Converters |
4.5 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDIP-T8 |
0.17 in (4.32 mm) |
0.3 in (7.62 mm) |
No |
e3 |
0 V |
0.372 in (9.46 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
4.145 V |
No |
2 |
CMOS |
12 |
0.1221 % |
Serial |
5 V |
In-Line |
14 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDIP-T8 |
1 |
0.15 in (3.809 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
4.045 V |
Binary |
||||||||||||||||||||
Texas Instruments |
Digital to Analog converter |
Commercial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
18 V |
No |
1 |
Bipolar |
8 |
0.19 % |
Parallel, 8 Bits |
15 V |
±15 V |
-15 V |
In-Line |
DIP16,.3 |
Other Converters |
100 ns |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T16 |
1 |
0.17 in (4.318 mm) |
0.3 in (7.62 mm) |
No |
e0 |
-10 V |
0.75 in (19.05 mm) |
Offset Binary |
||||||||||||||||||
|
Microchip Technology |
Digital to Analog converter |
Automotive |
Through-Hole |
14 |
DIP |
Rectangular |
Plastic/Epoxy |
5.5 V |
No |
1 |
12 |
700 μA |
0.2929 % |
Serial |
5 V |
3/5 V |
In-Line |
DIP14,.3 |
Other Converters |
4.5 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDIP-T14 |
0.21 in (5.334 mm) |
0.3 in (7.62 mm) |
No |
e3 |
0 V |
0.75 in (19.05 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
4.145 V |
No |
2 |
CMOS |
12 |
0.1221 % |
Serial |
5 V |
In-Line |
14 µs |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDIP-T8 |
1 |
0.15 in (3.809 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
4.045 V |
Binary |
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|
Analog Devices |
Digital to Analog converter |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
5 V |
No |
1 |
BICMOS |
16 |
3 ms |
5.5 mA |
0.012 % |
Serial |
24 V |
24 V |
In-Line |
DIP24,.3 |
Other Converters |
2.5 ms |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDIP-T24 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e3 |
0 V |
1.25 in (31.75 mm) |
Binary |
|||||||||||||||||
Texas Instruments |
Digital to Analog converter |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
1 |
CMOS |
8 |
0.2 % |
Parallel, 8 Bits |
4.75 V |
5/15 V |
In-Line |
DIP20,.3 |
Other Converters |
1 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T20 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
1.026 in (26.073 mm) |
Binary |
|||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
18 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
1 |
CMOS |
12 |
2 mA |
0.0244 % |
Parallel, Word |
15 V |
15 V |
In-Line |
DIP18,.3 |
Other Converters |
600 ns |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDIP-T18 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e3 |
0.885 in (22.479 mm) |
Binary, Offset Binary |
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|
Texas Instruments |
Digital to Analog converter |
Commercial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
5.1 V |
No |
75 kHz |
1 |
CMOS |
10 |
12.5 µs |
350 μA |
0.0977 % |
Serial |
5 V |
5 V |
In-Line |
DIP8,.3 |
Other Converters |
12.5 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Nickel Palladium Gold |
Dual |
R-PDIP-T8 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e4 |
0 V |
0.386 in (9.81 mm) |
Binary |
||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
2.9 V |
No |
93 kHz |
1 |
CMOS |
12 |
10 µs |
2.3 mA |
0.0977 % |
Serial |
3 V |
3/5 V |
In-Line |
DIP8,.3 |
Other Converters |
2.5 µs |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Dual |
R-PDIP-T8 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e4 |
0 V |
0.386 in (9.81 mm) |
Binary |
||||||||||||||||
Texas Instruments |
Digital to Analog converter |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
10 V |
No |
1 |
Bipolar |
12 |
4 µs |
0.0122 % |
Parallel, Word |
15 V |
±12/±15 V |
-15 V |
In-Line |
DIP24,.6 |
Other Converters |
3 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Dual |
R-CDIP-T24 |
0.175 in (4.45 mm) |
0.62 in (15.75 mm) |
No |
-10 V |
1.2 in (30.48 mm) |
Complementary Binary, Complementary 2's Complement, Complementary Offset Binary |
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Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
10 V |
No |
4 |
Hybrid |
38535Q/M;38534H;883B |
12 |
8 µs |
120 mA |
0.0244 % |
Parallel, Word |
15 V |
±15 V |
-15 V |
In-Line |
DIP28,.6 |
Other Converters |
4 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
Yes |
-10 V |
Binary |
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Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
18 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
1 |
CMOS |
12 |
2 mA |
0.012 % |
15 V |
15 V |
In-Line |
DIP18,.3 |
Other Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin/Lead |
Dual |
R-PDIP-T18 |
e0 |
Binary, Offset Binary |
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Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
18 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
1 |
CMOS |
12 |
2 mA |
0.012 % |
Parallel, Word |
15 V |
15 V |
In-Line |
DIP18,.3 |
Other Converters |
600 ns |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T18 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.885 in (22.479 mm) |
Binary, Offset Binary |
|||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
10 V |
No |
1 |
Bipolar |
8 |
25 mA |
Parallel, 8 Bits |
5 V |
In-Line |
800 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T16 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0 V |
0.75 in (19.05 mm) |
Binary |
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|
Texas Instruments |
Digital to Analog converter |
Commercial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
.4 V |
No |
6.6 MHz |
1 |
Bipolar |
8 |
150 ns |
22 mA |
0.39 % |
Parallel, 8 Bits |
5 V |
5,-15 V |
-15 V |
In-Line |
DIP16,.3 |
Other Converters |
150 ns |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDIP-T16 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e3 |
-5 V |
0.856 in (21.755 mm) |
Binary |
||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Commercial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
5.5 V |
No |
1 |
CMOS |
8 |
1.3 mA |
0.7812 % |
Serial |
5 V |
5 V |
In-Line |
DIP16,.3 |
Other Converters |
8 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T16 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e0 |
245 °C (473 °F) |
0 V |
0.755 in (19.175 mm) |
Binary |
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|
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
5.5 V |
No |
1 |
CMOS |
8 |
1.3 mA |
0.7812 % |
Serial |
5 V |
5 V |
In-Line |
DIP16,.3 |
Other Converters |
8 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
R-PDIP-T16 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.755 in (19.175 mm) |
Binary |
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|
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
4.096 V |
No |
1 |
CMOS |
16 |
0.0305 % |
Serial |
5 V |
In-Line |
20 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDIP-T8 |
1 |
0.155 in (3.937 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
Binary |
||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
1 |
CMOS |
8 |
0.2 % |
Parallel, 8 Bits |
4.75 V |
5/15 V |
In-Line |
DIP20,.3 |
Other Converters |
1 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDIP-T20 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e3 |
1.026 in (26.073 mm) |
Binary |
||||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Commercial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
12.5 V |
No |
2 |
CMOS |
12 |
10 mA |
0.0122 % |
Serial |
15 V |
±12/±15 V |
-15 V |
In-Line |
DIP16,.3 |
Other Converters |
2.5 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T16 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e0 |
245 °C (473 °F) |
-12.5 V |
0.755 in (19.175 mm) |
Binary |
||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
12.5 V |
No |
2 |
CMOS |
12 |
10 mA |
0.0122 % |
Serial |
15 V |
±12/±15 V |
-15 V |
In-Line |
DIP16,.3 |
Other Converters |
2.5 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
R-PDIP-T16 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
-12.5 V |
0.755 in (19.175 mm) |
Binary |
||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
3.12 V |
No |
1 |
BICMOS |
16 |
15 mA |
Serial |
5 V |
-5 V |
In-Line |
1.5 µs |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDIP-T16 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e3 |
-2.88 V |
0.793 in (20.13 mm) |
2's Complement Binary |
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Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
10 V |
No |
1 |
Hybrid |
12 |
8 µs |
100 mA |
0.0122 % |
Parallel, Word |
15 V |
±15 V |
-15 V |
In-Line |
DIP28,.6 |
Other Converters |
4 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
-10 V |
1.4 in (35.56 mm) |
Offset Binary |
|||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
3.12 V |
No |
1 |
BICMOS |
16 |
15 mA |
Serial |
5 V |
±5/±12 V |
-5 V |
In-Line |
DIP16,.3 |
Other Converters |
1.5 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDIP-T16 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e3 |
-2.88 V |
0.793 in (20.13 mm) |
2's Complement Binary |
||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
12 |
2 mA |
0.012 % |
Parallel, Word |
15 V |
15 V |
In-Line |
DIP18,.3 |
Other Converters |
600 ns |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-GDIP-T18 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
Binary, Offset Binary |
||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic |
No |
1 |
CMOS |
12 |
2 mA |
0.012 % |
15 V |
15 V |
In-Line |
DIP18,.3 |
Other Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin/Lead |
Dual |
R-XDIP-T18 |
e0 |
Binary, Offset Binary |
|||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
12 |
2 mA |
0.012 % |
Parallel, Word |
15 V |
15 V |
In-Line |
DIP18,.3 |
Other Converters |
600 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T18 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
Binary, Offset Binary |
||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic |
No |
1 |
CMOS |
12 |
2 mA |
0.024 % |
15 V |
15 V |
In-Line |
DIP18,.3 |
Other Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin/Lead |
Dual |
R-XDIP-T18 |
e0 |
Binary, Offset Binary |
|||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
12 |
2 mA |
0.024 % |
Parallel, Word |
15 V |
15 V |
In-Line |
DIP18,.3 |
Other Converters |
600 ns |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-GDIP-T18 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
Binary, Offset Binary |
||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
18 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
1 |
CMOS |
12 |
2 mA |
0.0244 % |
Parallel, Word |
15 V |
15 V |
In-Line |
DIP18,.3 |
Other Converters |
600 ns |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T18 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.885 in (22.479 mm) |
Binary, Offset Binary |
|||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
18 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
1 |
CMOS |
12 |
2 mA |
0.024 % |
15 V |
15 V |
In-Line |
DIP18,.3 |
Other Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin/Lead |
Dual |
R-PDIP-T18 |
e0 |
Binary, Offset Binary |
|||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
12 |
2 mA |
0.024 % |
Parallel, Word |
15 V |
15 V |
In-Line |
DIP18,.3 |
Other Converters |
600 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T18 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
Binary, Offset Binary |
||||||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
2.25 V |
No |
8 |
BICMOS |
8 |
2 µs |
9 mA |
0.3906 % |
Serial |
12 V |
12,GND/-5 V |
-5 V |
In-Line |
DIP20,.3 |
Other Converters |
1 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T20 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0 V |
1.03 in (26.16 mm) |
Binary |
Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.
DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.
DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.
DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.